Supporting assembly, polishing head and chemical mechanical polishing equipment
By designing the retaining ring and the back film as a detachable split structure, the problem of the existing polishing head support assembly requiring overall replacement is solved, thereby achieving convenient parts replacement and cost reduction.
Patent Information
- Application Number
- CN202422357260.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The existing polishing head support assembly has an integrated structure of the back film and the retaining ring, so the entire assembly needs to be replaced when it is replaced, which increases production costs.
The retaining ring and the back membrane are designed as a detachable split structure, which is connected by threads or bolts, so that the retaining ring or the back membrane can be replaced separately, reducing replacement costs and improving operational convenience.
The convenience and cost reduction of the parts replacement of the supporting assembly are achieved, the firmness of the connection is ensured, and the use and maintenance costs are reduced.
Smart Images
Figure CN223326126U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a support component, a polishing head provided with the support component, and a chemical mechanical polishing device provided with the polishing head. Background Art
[0002] The polishing head is a key component in chemical mechanical polishing equipment. It is used to fix the wafer and apply a certain pressure to it to ensure close contact between the wafer and the polishing pad, thereby achieving efficient chemical mechanical polishing. An existing polishing head includes a base and a support assembly 9. The base is provided with a first buckling structure; the support assembly 9 is as shown in FIG. Figure 1 and Figure 2 As shown, it includes a backing film 91 and a retaining ring 92, wherein the backing film 91 and the retaining ring 92 are an integral structure, that is, the backing film 91 is embedded in the inner ring of the retaining ring 92; a wafer fixing cavity 90 is formed between the first end of the backing film 91 and the retaining ring 92, and a second snap-fit structure 921 is provided at the second end of the retaining ring 92. When the base and the support assembly 9 are assembled, the first snap-fit structure and the second snap-fit structure 921 are snap-fitted to fix the support assembly 9 on the base. The above-mentioned support assembly 9 has the disadvantage that, since the backing film 91 and the retaining ring 92 are an integral structure, when the backing film 91 or the retaining ring 92 needs to be replaced (for example, when the backing film 91 or the retaining ring 92 is worn, or when the backing film 91 of a specific material needs to be replaced, etc.), the support assembly 9 must be replaced as a whole, which increases production costs. Summary of the Invention
[0003] In order to solve the above problems, the main purpose of the present invention is to provide a support assembly that can reduce the cost of use.
[0004] Another object of the present invention is to provide a polishing head provided with the above-mentioned support assembly.
[0005] Another object of the present invention is to provide a chemical mechanical polishing device equipped with the above-mentioned polishing head.
[0006] In order to achieve the main purpose of the present invention, the present invention provides a support assembly, including a retaining ring and a back film, wherein the retaining ring includes a first ring body and a second ring body, the first ring body and the second ring body are detachably connected, a clamping and fixing position is formed between the first ring body and the second ring body, the back film is clamped and fixed in the clamping and fixing position, the retaining ring is arranged around the outer circumference of the back film, and a wafer fixing cavity is formed between the back film and the retaining ring.
[0007] As can be seen from the above, the retaining ring and the back film are arranged in a split and detachable structure, so that when the retaining ring or the back film is worn or the back film material needs to be replaced, the relevant components can be replaced in a targeted manner, thereby reducing the user's usage cost; in addition, the retaining ring is further arranged into a detachable split structure, which can further reduce the replacement cost of the retaining ring (such as only replacing the first ring body or the second ring body), and makes the disassembly and assembly between the back film and the retaining ring more convenient and easy to operate, while also ensuring the firmness of the connection between the back film and the retaining ring.
[0008] A further solution is that the first ring body is connected to the second ring body by threads; or the first ring body is connected to the second ring body by bolts.
[0009] As can be seen from the above, directly threading the first ring body to the second ring body can make the disassembly and assembly between the two more convenient and easy to operate, and can reduce the number of parts of the support assembly and reduce the production cost of the support assembly. At the same time, it can also ensure the firmness of the connection between the first ring body and the second ring body; and using bolts to connect the first ring body and the second ring body can also ensure the firmness of the connection between the first ring body and the second ring body.
[0010] A further solution is that when the first ring body is threadedly connected to the second ring body: an annular receiving groove and a first annular groove are provided at the first end of the first ring body, the first diameter of the annular receiving groove is greater than the second diameter of the inner ring of the first ring body, the first annular groove surrounds the outer circumference of the annular receiving groove, an annular protrusion is formed between the first annular groove and the annular receiving groove, the third diameter of the first annular groove is less than the fourth diameter of the outer ring of the first ring body, a second annular groove is provided at the first end of the second ring body, and the annular protrusion is inserted into the second annular groove; a first thread structure is provided on the first side wall of the first annular groove, the second annular groove has a second side wall arranged around the outer circumference of the first side wall, the second side wall is provided with a second thread structure threadedly connected to the first thread structure, a clamping and fixing position is formed between the second ring body and the annular receiving groove, or a third thread structure is provided on the third side wall of the annular receiving groove, the second annular groove has a fourth side wall at the annular receiving groove, the fourth side wall extends into the annular receiving groove, the fourth side wall is provided with a fourth thread structure threadedly connected to the third thread structure, and a clamping and fixing position is formed between the fourth side wall and the annular receiving groove.
[0011] As can be seen from the above, the above design can ensure the reliability of the first ring body and the second ring body in clamping and fixing the back film, and makes the disassembly and assembly between the first ring body and the second ring body more convenient and easy to operate.
[0012] A preferred solution is that when the first side wall is provided with a first threaded structure: the second annular groove is provided with a fifth side wall at the annular accommodating groove, the fifth side wall extends into the annular accommodating groove, and a clamping fixing position is formed between the fifth side wall and the annular accommodating groove.
[0013] As can be seen from the above, this design can further improve the reliability of the first ring body and the second ring body in clamping and fixing the back membrane.
[0014] Another preferred solution is that a wafer fixing cavity is formed between the second end of the first ring body and the back film; a first buckling structure is provided at the second end face of the second ring body, and / or a fifth thread structure is provided at the outer periphery of the second end of the second ring body, and / or a sixth thread structure is provided on the inner ring of the second ring body.
[0015] Another preferred solution is that a wafer fixing cavity is formed between the second end of the second ring body and the back film; a second buckling structure is provided at the second end face of the first ring body, and / or a seventh thread structure is provided at the outer periphery of the second end of the first ring body, and / or an eighth thread structure is provided on the inner ring of the first ring body.
[0016] As can be seen from the above, the first ring body or the second ring body can be configured to be assembled with the base of the polishing head so that the support assembly is fixed on the base; and there can be multiple ways of assembling the first ring body or the second ring body and the base to enhance the practicality of the support assembly and expand the scope of application of the support assembly.
[0017] A further solution is that the back film has a film body and a supporting ring body, the film body is integrally formed on the supporting ring body, the film body is provided with air holes passing through the film body, and the supporting ring body is in contact with the first ring body and the second ring body.
[0018] As can be seen from the above, the support ring is used to keep the film body taut, thereby ensuring the flatness of the film body, so that the film body can reliably adsorb and fix the wafer, and ensure the flatness of the wafer polishing. The setting of the support ring body also makes the assembly of the back film simpler and easier to operate, and also ensures that the film body can remain flat and taut after the back film and the retaining ring are assembled.
[0019] A further solution is that the membrane body is made of ethylene propylene rubber, polyurethane rubber or silicone rubber.
[0020] As can be seen from the above, the above design makes the membrane body have excellent strength and durability.
[0021] In order to achieve another purpose of the present invention, the present invention provides a polishing head, including a base, and further including the above-mentioned support assembly, wherein the retaining ring is installed on the base.
[0022] As can be seen from the above, the polishing head provided with the above-mentioned support assembly has lower use and maintenance costs, and is convenient for individual replacement of components such as the first ring body, the second ring body or the back film.
[0023] In order to achieve another purpose of the present invention, the present invention provides a chemical mechanical polishing device, which further includes the above-mentioned polishing head.
[0024] As can be seen from the above, the chemical mechanical polishing equipment has lower use and maintenance costs by providing the above-mentioned polishing head, and it is convenient to individually replace components such as the first ring body, the second ring body or the back film of the support assembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a structural diagram of the existing support assembly from a first perspective.
[0026] Figure 2 It is a structural diagram of the existing support assembly from a second perspective.
[0027] Figure 3 It is a cross-sectional schematic diagram of the first embodiment of the support assembly of the present utility model.
[0028] Figure 4 It is an exploded sectional view of the first embodiment of the support assembly of the present invention.
[0029] Figure 5 It is a structural schematic diagram of the first ring body of the first embodiment of the support assembly of the present utility model.
[0030] Figure 6 This is a schematic structural diagram of the second ring body of the first embodiment of the support assembly of the present invention from a first perspective.
[0031] Figure 7 This is a schematic structural diagram of the second ring body of the first embodiment of the support assembly of the present invention from a second perspective.
[0032] Figure 8 It is a schematic structural diagram of the back film of the first embodiment of the support assembly of the present invention.
[0033] Figure 9 It is an exploded cross-sectional view of the second embodiment of the support assembly of the present invention.
[0034] Figure 10 It is an exploded cross-sectional view of the third embodiment of the support assembly of the present invention.
[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION
[0036] Support assembly first embodiment
[0037] Reference Figure 3 and Figure 4The support assembly 100 includes a retaining ring 1 and a back film 2, and the retaining ring 1 and the back film 2 are detachably connected. By setting the retaining ring 1 and the back film 2 as a split and detachable structure, when the retaining ring 1 or the back film 2 is worn or the material of the back film 2 needs to be replaced, the relevant components can be replaced in a targeted manner, thereby reducing the user's usage cost.
[0038] The retaining ring 1 includes a first ring body 11 and a second ring body 12, which are detachably connected, and a clamping and fixing position 10 is formed between the first ring body 11 and the second ring body 12; the back film 2 is clamped and fixed in the clamping and fixing position 10, so that the retaining ring 1 is arranged around the outer periphery of the back film 2, and a wafer fixing cavity 210 is formed between the back film 2 and the retaining ring 1, wherein the wafer fixing cavity 210 is used to accommodate the wafer, and the back film 2 can adsorb and fix the wafer, and can apply pressure to the wafer during the polishing and grinding process of the wafer so that the wafer is in close contact with the polishing pad, thereby ensuring the polishing and grinding effect and polishing quality of the polishing pad on the wafer, and the retaining ring 1 surrounds the outer periphery of the wafer to prevent the wafer from detaching from the support assembly 100 and flying out during the polishing and grinding process. In addition, by setting the retaining ring 1 itself as a detachable split structure, the replacement cost of the retaining ring 1 can be further reduced (such as only replacing the first ring body 11 or the second ring body 12), and the disassembly and assembly between the back film 2 and the retaining ring 1 can be made more convenient and easy to operate, while also ensuring the firmness of the connection between the back film 2 and the retaining ring 1.
[0039] Preferably, the first ring body 11 and the second ring body 12 are threadedly connected, so that the first ring body 11 is directly threadedly connected to the second ring body 12, which can make the disassembly and assembly between the two more convenient and easy to operate, and can reduce the number of parts of the support assembly 100, reduce the production cost of the support assembly 100, and also ensure the firmness of the connection between the first ring body 11 and the second ring body 12. Of course, as another optional solution, the first ring body 11 and the second ring body 12 can also be connected by bolts. Using bolts to connect the first ring body 11 and the second ring body 12 also ensures the firmness of the connection between the first ring body 11 and the second ring body 12, but it will increase the tediousness of disassembly and assembly between the first ring body 11 and the second ring body 12 to a certain extent, and further reduce the replacement efficiency of the various parts of the support assembly 100 to a certain extent.
[0040] In this embodiment, the first ring body 11 and the second ring body 12 are threadedly connected. Figure 5 and Figure 6An annular receiving groove 111 and a first annular groove 12 are provided at the first end of the first ring body 11. The first diameter φ1 of the annular receiving groove 111 is greater than the second diameter φ2 of the inner ring of the first ring body 11. The first annular groove 12 surrounds the outer circumference of the annular receiving groove 111, forming an annular protrusion 113 between the first annular groove 12 and the annular receiving groove 111. The third diameter φ3 of the first annular groove 12 is less than the fourth diameter φ4 of the outer ring of the first ring body 11. The annular receiving groove 111 and the first annular groove 12 are recessed from the first end surface of the first ring body 11 into the first ring body 11 in the axial direction of the first ring body 11, resulting in a generally convex end surface of the first ring body 11. Furthermore, a first threaded structure 1121 is provided on the first sidewall of the first annular groove 12.
[0041] Combine Figure 7 A second annular groove 121 is provided at the first end of the second ring body 12. The second annular groove 121 is recessed in the axial direction of the first ring body 11 from the first end surface of the second ring body 12 into the second ring body 12 (i.e., recessed in the second ring body 12 away from the annular protrusion 113). The second annular groove 121 has a second sidewall 1211, and a second threaded structure 1212 is provided on the second sidewall 1211 to cooperate with the first threaded structure 1121. When the first ring body 11 and the second ring body 12 are assembled, the annular protrusion 113 is inserted into the second annular groove 121, so that the second sidewall 1211 surrounds the outer circumference of the first sidewall of the first annular groove 12, and the second threaded structure 1212 is threadedly connected to the first threaded structure 1121, thereby forming a clamping and fixing position 10 between the second ring body 12 and the annular receiving groove 111.
[0042] Preferably, the second annular groove 121 is provided with a fifth side wall 1213 at the annular accommodating groove 111, and the fifth side wall 1213 extends into the annular accommodating groove 111, so that a clamping and fixing position 10 is formed between the fifth side wall 1213 and the annular accommodating groove 111; by providing the fifth side wall 1213, the reliability of the first ring body 11 and the second ring body 12 in clamping and fixing the back membrane 2 is further improved. In addition, the first height of the annular accommodating groove 111 in the axial direction of the first ring body 11 is greater than the second height of the first annular groove 12 in the axial direction of the first ring body 11; and more preferably, the height difference between the first height and the second height is equal to the thickness value of the back film 2; wherein, the depth of the first annular groove 12 is equal to the height of the second side wall 1211, and the depth of the annular accommodating groove 111 is equal to the sum of the height of the fifth side wall 1213 and the thickness of the back film 2; of course, as other optional schemes, the depth of the first annular groove 12 can also be made smaller than the height of the second side wall 1211, and the depth of the annular accommodating groove 111 can be made smaller than the sum of the height of the fifth side wall 1213 and the thickness of the back film 2. This design is conducive to ensuring that the first ring body 11 and the second ring body 12 are reliably clamped and fixed to the retaining ring 1.
[0043] In addition, a wafer securing cavity 210 is formed between the second end of the first ring body 11 and the backing film 2; a first snap-fit structure 122 is provided at the second end surface of the second ring body 12, and / or a fifth threaded structure 123 is provided at the outer periphery of the second end of the second ring body 12, and / or a sixth threaded structure is provided on the inner ring of the second ring body 12. In this embodiment, the first snap-fit structure 122 is provided at the second end surface of the second ring body 12, and the fifth threaded structure 123 is provided at the outer periphery of the second end of the second ring body 12; wherein the first snap-fit structure 122, the fifth threaded structure 123, and the sixth threaded structure can all be used to connect to the base of the polishing head to securely mount the support assembly 100 to the base of the polishing head. Of course, in other embodiments, the second ring body 12 may also be provided with the first buckling structure 122, the fifth thread structure 123, and the sixth thread structure; or the second ring body 12 may be provided with the first buckling structure 122 and the sixth thread structure; or the second ring body 12 may be provided with the fifth thread structure 123 and the sixth thread structure; or the second ring body 12 may be provided with one of the first buckling structure 122, the fifth thread structure 123, and the sixth thread structure. Through the above design, a variety of assembly methods are possible between the first ring body 11 and the base, thereby improving the practicality of the support assembly 100 and expanding the scope of application of the support assembly 100.
[0044] Combine Figure 8 The backing film 2 comprises a film body 21 and a support ring body 22, wherein the film body 21 is integrally formed on the support ring body 22, and the support ring surrounds the outer circumference of the film body 21. The film body 21 is provided with air holes 211 running through it to facilitate adsorption and fixation of the wafer; the support ring body 22 is used to contact the first ring body 11 and the second ring body 12. Preferably, when the backing film 2 is installed in the clamping and fixing position 10 of the retaining ring 1, the support ring body 22 abuts against the bottom wall of the annular receiving groove 111 of the first ring body 11 and the fifth side wall 1213 of the second ring body 12. The support ring 22 is used to maintain tension on the film 21, thereby ensuring its flatness. This allows the film 21 to reliably adsorb and secure the wafer, ensuring the wafer's flatness during polishing. The support ring 22 also simplifies and facilitates assembly of the backing film 2, ensuring that the film 21 remains flat and taut after assembly with the retaining ring 1. Furthermore, the film 21 is made of ethylene propylene rubber, polyurethane rubber, or silicone rubber, providing it with excellent strength and durability.
[0045] In summary, it can be seen that through the design of the support assembly 100, when any one of the first ring body 11, the second ring body 12 and the back film 2 is damaged or worn, the damaged or worn object can be replaced in a targeted manner, or when it is necessary to study the influence of the material of the back film 2 on the grinding rate and uniformity, the back film 2 can also be replaced in a targeted manner, thereby making the disassembly, assembly and replacement of the parts of the support assembly 100 more convenient and the use cost lower.
[0046] Second embodiment of the support assembly
[0047] Reference Figure 9 The difference between this embodiment and the first embodiment of the support assembly is that, in this embodiment:
[0048] The first threaded structure provided on the first sidewall of the first annular groove 311 of the first ring body 31 is eliminated, and correspondingly, the second threaded structure provided on the second sidewall 3211 of the second annular groove 321 of the second ring body 32 is eliminated. Instead, a third threaded structure 3121 is provided on the third sidewall of the annular receiving groove 312 of the first ring body 31. The second annular groove 321 has a fourth sidewall 3212 (equivalent to the fifth sidewall in the first embodiment of the support assembly) at the annular receiving groove 312, and a fourth threaded structure 3213 is provided on the fourth sidewall 3212. When the first ring body 31 and the second ring body 32 are assembled, the fourth sidewall 3212 extends into the annular receiving groove 312, and the fourth threaded structure 3213 on the fourth sidewall 3212 is threadedly connected to the third threaded structure 3121 on the third sidewall of the annular receiving groove 312, forming a clamping and fixing position between the fourth sidewall 3212 and the annular receiving groove 312.
[0049] Support assembly third embodiment
[0050] Reference Figure 10 The difference between this embodiment and the other embodiments is that:
[0051] The first buckling structure, the fifth thread structure, and the sixth thread structure provided on the second ring body 42 are eliminated. Instead, a second buckling structure 411 is provided on the second end face of the first ring body 41, and / or a seventh thread structure 412 is provided on the outer periphery of the second end of the first ring body 41, and / or an eighth thread structure is provided on the inner ring of the first ring body 41. Correspondingly, the backing film and the second end of the first ring body 41 no longer form a wafer fixing cavity, but instead the backing film and the second end of the second ring body 42 form a wafer fixing cavity 410. In this embodiment, the second ring body 42 is no longer connected to the base of the polishing head, but is connected to the base of the polishing head via the second buckling structure 411, and / or the seventh thread structure 412, and / or the eighth thread structure of the first ring body.
[0052] Polishing head embodiment
[0053] The polishing head includes a base and a support assembly, wherein the support assembly is the support assembly described in any one of the first to third embodiments of the support assembly, and the retaining ring is installed on the base through a first ring body (such as the first ring body of the retaining ring described in the third embodiment of the support assembly) or a second ring body (such as the second ring body of the retaining ring described in the first embodiment of the support assembly or the second embodiment of the support assembly); by providing the above-mentioned support assembly, the polishing head has lower use and maintenance costs, and is convenient for individual replacement of components such as the first ring body, the second ring body or the backing film.
[0054] Chemical Mechanical Polishing Equipment Example
[0055] The chemical mechanical polishing equipment is provided with the polishing head described in the above-mentioned polishing head embodiment. By providing this polishing head, the use and maintenance costs of the chemical mechanical polishing equipment are lowered, and it is convenient to replace the first ring body, the second ring body or the back film and other components of the support assembly separately.
[0056] Finally, it should be emphasized that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A support assembly comprising a retaining ring and a backing film, characterized in that: The retaining ring includes a first ring body and a second ring body, the first ring body and the second ring body are detachably connected, a clamping fixing position is formed between the first ring body and the second ring body, the back film is clamped and fixed in the clamping fixing position, the retaining ring is arranged around the outer circumference of the back film, and a wafer fixing cavity is formed between the back film and the retaining ring.
2. The support assembly according to claim 1, wherein: The first ring body is threadedly connected to the second ring body; or The first ring body and the second ring body are connected by bolts.
3. The support assembly according to claim 2, wherein: When the first ring body is threadedly connected to the second ring body: An annular receiving groove and a first annular groove are provided at the first end of the first ring body. The first diameter of the annular receiving groove is larger than the second diameter of the inner ring of the first ring body. The first annular groove surrounds the outer circumference of the annular receiving groove. An annular protrusion is formed between the first annular groove and the annular receiving groove. The third diameter of the first annular groove is smaller than the fourth diameter of the outer ring of the first ring body. A second annular groove is provided at the first end of the second ring body. The annular protrusion is inserted into the second annular groove. The first side wall of the first annular groove is provided with a first thread structure, the second annular groove has a second side wall arranged around the outer periphery of the first side wall, the second side wall is provided with a second thread structure threadedly connected to the first thread structure, and the second ring body and the annular receiving groove form the clamping fixing position, or A third threaded structure is provided on the third side wall of the annular accommodating groove, and the second annular groove has a fourth side wall at the annular accommodating groove. The fourth side wall extends into the annular accommodating groove, and a fourth threaded structure is provided on the fourth side wall that is threadedly connected to the third threaded structure. The clamping fixing position is formed between the fourth side wall and the annular accommodating groove.
4. The support assembly according to claim 3, wherein: When the first side wall is provided with the first thread structure: The second annular groove is provided with a fifth side wall at the annular accommodating groove, and the fifth side wall extends into the annular accommodating groove, and the clamping and fixing position is formed between the fifth side wall and the annular accommodating groove.
5. The support assembly according to claim 3, wherein: The wafer fixing cavity is formed between the second end of the first ring body and the back film; The second end surface of the second ring body is provided with a first buckling structure, and / or A fifth thread structure is provided on the outer periphery of the second end of the second ring body, and / or The inner ring of the second ring body is provided with a sixth thread structure.
6. The support assembly according to claim 3, wherein: The wafer fixing cavity is formed between the second end of the second ring body and the back film; A second buckling structure is provided at the second end surface of the first ring body, and / or A seventh thread structure is provided on the outer periphery of the second end of the first ring body, and / or The inner ring of the first ring body is provided with an eighth thread structure.
7. The support assembly according to any one of claims 1 to 6, characterized in that: The back film comprises a film body and a supporting ring body. The film body is integrally formed on the supporting ring body. The film body is provided with air holes penetrating the film body. The supporting ring body is in contact with the first ring body and the second ring body.
8. The support assembly according to claim 7, characterized in that The membrane body is made of ethylene propylene rubber, polyurethane rubber or organic silicon rubber.
9. A polishing head, including a base, characterized in that Also includes: The support assembly according to any one of claims 1 to 8, wherein the retaining ring is mounted on the base.
10. Chemical mechanical polishing equipment, characterized in that Also included is the polishing head according to claim 9.