Steel mesh structure for PCB solder paste printing
The steel mesh structure driven by hydraulic cylinders and electric sliders solves the problem of low efficiency in PCB board position adjustment, achieves accurate and efficient solder paste application, and improves production efficiency.
Patent Information
- Application Number
- CN202423054081.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-12-11
AI Technical Summary
Existing PCB solder paste printing equipment is inefficient when adjusting the position of the PCB board, affecting production efficiency.
The steel mesh structure is driven by a hydraulic cylinder and an electric slider. The position of the PCB is adjusted by a lifting plate and a push plate to make it accurately correspond to the steel mesh holes, and the solder paste is evenly applied by a scraper.
The accuracy and efficiency of solder paste application on PCB boards are improved, ensuring the efficient production of large quantities of PCB boards.
Smart Images

Figure CN223327133U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of PCB solder paste printing, in particular to a steel mesh structure for PCB solder paste printing. Background Art
[0002] A stencil, also known as an SMT stencil, is a specialized SMT mold. Its primary function is to facilitate solder paste deposition, transferring the exact amount of solder paste to the precise location on a bare PCB. SMT stencils are typically made of stainless steel and feature numerous small holes in their surface, which are positioned precisely to align with the pads on the PCB. During the solder paste printing process, the stencil is placed over the PCB. A scraper evenly applies the solder paste through the stencil's holes, depositing it onto the pads. This results in an even layer of solder paste on each pad, providing a foundation for subsequent soldering.
[0003] Existing PCB solder paste printing equipment first transports the PCB to a designated position below the stencil, and then adjusts the position of the PCB to align the PCB and stencil. This makes it impossible to adjust the position of the PCB while transporting it, resulting in a slow application of solder paste to the PCB surface. This can affect PCB production efficiency when a large number of PCBs need to be coated with solder paste. Utility Model Content
[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a steel mesh structure for PCB solder paste printing.
[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0006] A steel mesh structure for PCB solder paste printing includes a concave body, L-shaped support frames are installed on the inner walls of both sides of the body, a placement plate is installed inside the body, both sides of the placement plate are respectively located inside the two support frames, a placement groove is opened on the top of the placement plate, a fixing hole is opened on the inner bottom of the placement groove, a steel mesh is installed on the inner top of the placement groove, slide grooves are opened on the inner walls of both sides of the body in the length direction, the slide grooves are located above the support frames, a connecting plate is slidably installed above the placement plate inside the body, electric sliders are installed at both ends of the connecting plate, the electric sliders are slidably installed inside the slide grooves, and a scraper is installed at the bottom of the connecting plate.
[0007] Preferably, fixed plates are installed on both sides of the inner bottom of the body in the length direction, a mounting groove is provided on the top of the fixed plate, a conveyor belt is installed inside the mounting groove, the top of the conveyor belt is located above the fixed plate, mounting shafts are installed at both ends of the inner part of the conveyor belt, and a rotating roller is installed on the outer wall of the mounting shaft.
[0008] Preferably, the outer wall of the rotating roller abuts against the inner wall of the conveyor belt, the end of the mounting shaft close to the inner wall of the machine body passes through the machine body, and is connected to the output shaft of the motor through a coupling, and the motor is mounted on the side of the machine body.
[0009] Preferably, a top plate is installed on the top of the body, the top plate is located above the connecting plate, a storage box is installed on the top of the body, a connecting pipe is installed on the top of the connecting plate, the top end of the connecting pipe passes through the top plate and is connected to the storage box.
[0010] Preferably, the inner bottom of the support frame is provided with a plurality of card slots along the length direction, and card blocks are installed on both sides of the bottom of the placement plate, and the card blocks are located inside the card slots.
[0011] Preferably, a lifting plate is installed inside the body between the two fixed plates, the lifting plate is located below the placement plate, and several first hydraulic cylinders are installed on the inner bottom of the body, and the top of the first hydraulic cylinder is installed on the bottom of the lifting plate.
[0012] Preferably, a second hydraulic cylinder is installed on the inner walls of both sides of the body below the support frame, and a push plate is installed at one end of the second hydraulic cylinder away from the inner wall of the body. The second hydraulic cylinder is located above the conveyor belt, and the lifting plate is located between the two push plates.
[0013] Compared with the prior art, the beneficial effects of the present invention are:
[0014] 1: In the present invention, the first hydraulic cylinder drives the lifting plate to move up and down repeatedly, thereby driving the PCB to the designated position for surface solder paste coating. The second hydraulic cylinder drives the push plate to move toward the PCB, so that the push plate pushes the PCB to adjust its position, so that the position on the top of the PCB to be coated with solder paste corresponds to the through-hole on the steel mesh. When in use, the conveyor belt can adjust the front and rear position of the PCB, and the push plate can adjust the left and right position of the PCB. When in use, the position on the PCB surface to be coated with solder paste can be accurately aligned with the through-hole on the steel mesh.
[0015] 2: In the present invention, the electric slider drives the connecting plate and the scraper to move on the top of the steel mesh. When in use, the solder paste inside the storage box enters the interior of the scraper through the connecting tube and the connecting plate. When the scraper moves on the top of the steel mesh, the solder paste can be smeared on the specified position on the top of the PCB board through the through-holes on the top of the steel mesh. When the solder paste is smeared on the surface of the PCB board, the first hydraulic cylinder drives the PCB board to move downward through the lifting plate until the two ends of the PCB board move down to the top of the two conveyor belts, and the two conveyor belts drive the PCB board with solder paste applied to the other direction of the machine body, and the first hydraulic cylinder pushes the lifting plate, so that the lifting plate drives the remaining PCB boards entering the interior of the machine body to move upward and smear the solder paste. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a three-dimensional diagram of a steel mesh structure for PCB solder paste printing proposed by the present invention;
[0017] Figure 2 This is a cross-sectional view of a steel mesh structure for PCB solder paste printing proposed by the present invention;
[0018] Figure 3 This is a schematic diagram of a placement plate structure for a stencil structure for PCB solder paste printing proposed by the present invention;
[0019] Figure 4 This is a schematic diagram of the fixed plate structure of a steel mesh structure for PCB solder paste printing proposed by the present invention.
[0020] In the figure: 1. Machine body; 2. Top plate; 3. Storage box; 4. Motor; 5. Fixed plate; 6. Support frame; 7. Slide; 8. Lifting plate; 9. First hydraulic cylinder; 10. Conveyor belt; 11. Connecting plate; 12. Scraper; 13. Mounting groove; 14. Connecting pipe; 15. Steel mesh; 16. Placement groove; 17. Fixing hole; 18. Push plate; 19. Electric slider; 20. Rotating roller; 21. Mounting shaft; 22. Card slot; 23. Card block; 24. Second hydraulic cylinder; 25. Placement plate. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0022] Reference Figure 1-4 A steel mesh structure for PCB solder paste printing includes a concave body 1, L-shaped support frames 6 are installed on the inner walls on both sides of the body 1, a placement plate 25 is installed inside the body 1, and the two sides of the placement plate 25 are respectively located inside the two support frames 6, a placement groove 16 is opened on the top of the placement plate 25, and a fixing hole 17 is opened at the inner bottom of the placement groove 16. A steel mesh 15 is installed on the inner top of the placement groove 16, and a slide groove 7 is opened on the inner walls on both sides of the body 1 in the length direction. The slide groove 7 is located above the support frame 6, and a connecting plate 11 is slidably installed above the placement plate 25 inside the body 1. Electric sliders 19 are installed at both ends of the connecting plate 11. The electric slider 19 is slidably installed inside the slide groove 7, and a scraper 12 is installed at the bottom of the connecting plate 11.
[0023] As a technical optimization solution of the present invention, fixed plates 5 are installed on both sides of the inner bottom of the body 1 in the length direction, and a mounting groove 13 is opened on the top of the fixed plate 5. A conveyor belt 10 is installed inside the mounting groove 13. The top of the conveyor belt 10 is located above the fixed plate 5. Mounting shafts 21 are installed at both ends of the inner part of the conveyor belt 10, and a rotating roller 20 is installed on the outer wall of the mounting shaft 21. When in use, the conveyor belt 10 can drive the PCB board to be used for transportation and move the PCB board to a specified position.
[0024] As a technical optimization solution of the present invention, the outer wall of the rotating roller 20 abuts against the inner wall of the conveyor belt 10, and the end of the mounting shaft 21 close to the inner wall of the body 1 passes through the body 1 and is connected to the output shaft of the motor 4 through a coupling. The motor 4 is installed on the side of the body 1; the motor 4 can drive the conveyor belt 10 to rotate when in use.
[0025] As a technical optimization solution of the present invention, a top plate 2 is installed on the top of the body 1, and the top plate 2 is located above the connecting plate 11. A storage box 3 is installed on the top of the body 1, and a connecting tube 14 is installed on the top of the connecting plate 11. The top end of the connecting tube 14 passes through the top plate 2 and is connected to the storage box 3. When in use, a certain amount of solder paste is stored inside the storage box 3, which is convenient for applying the solder paste to the specified position on the surface of the PCB board.
[0026] As a technical optimization solution of the present invention, a plurality of card slots 22 are opened on the inner bottom of the support frame 6 in the length direction, and card blocks 23 are installed on both sides of the bottom of the placement plate 25, and the card blocks 23 are located inside the card slots 22; when in use, the card blocks 23 can better fix the position of the placement plate 25 through the card slots 22.
[0027] As a technical optimization solution of the present invention, a lifting plate 8 is installed inside the body 1 between the two fixed plates 5, and the lifting plate 8 is located below the placement plate 25. Several first hydraulic cylinders 9 are installed at the inner bottom of the body 1, and the top of the first hydraulic cylinder 9 is installed at the bottom of the lifting plate 8; the first hydraulic cylinder 9 can lift the PCB board to the bottom of the steel mesh 15 through the lifting plate 8.
[0028] As a technical optimization solution of the present invention, a second hydraulic cylinder 24 is installed on the inner walls of both sides of the body 1 below the support frame 6, and a push plate 18 is installed on the end of the second hydraulic cylinder 24 away from the inner wall of the body 1. The second hydraulic cylinder 24 is located above the conveyor belt 10, and the lifting plate 8 is located between the two push plates 18; when in use, the second hydraulic cylinder 24 can push both sides of the PCB board so that the PCB board can be accurately moved to the specified position.
[0029] When using the present invention, a worker stores a certain amount of solder paste in the storage box 3 and places the steel mesh 15 to be used within the placement slot 16 at the top of the placement plate 25. The worker installs the placement plate 25 between the two L-shaped support frames 6, with both sides of the placement plate 25 located within the two support frames 6. At the same time, the clamping block 23 at the bottom of the placement plate 25 engages within the clamping slot 22. During use, the clamping block 23, through the clamping slot 22, effectively secures the placement plate 25 and the steel mesh 15 in place, making the steel mesh 15 more stable during use. The PCB board to be used is placed on top of the two conveyor belts 10, with both sides of the bottom of the PCB board located on top of the two conveyor belts 10. The output shaft of the motor 4 rotates via the mounting shaft 21 and the rotating roller 20. As the rotating roller 20 rotates, it drives the PCB board through the conveyor belt 10 toward the interior of the machine body 1, until the PCB board moves above the lifting plate 8.
[0030] The first hydraulic cylinder 9 drives the lifting plate 8 upward, and as it moves upward, the lifting plate 8 drives the PCB above it to move until the PCB moves to the bottom of the stencil 15. The second hydraulic cylinder 24 pushes the push plate 18 toward the PCB, causing the push plate 18 to push the PCB to adjust its position so that the position on the top of the PCB to be coated with solder paste corresponds to the through-holes on the stencil 15. The electric slider 19 drives the connecting plate 11 and scraper 12 to move on top of the stencil 15. During use, the solder paste inside the storage box 3 enters the interior of the scraper 12 through the connecting tube 14 and the connecting plate 11. When the scraper 12 moves on top of the stencil 15, the solder paste can be applied to the designated position on the top of the PCB through the through-holes on the top of the stencil 15.
[0031] After the solder paste is applied to the surface of the PCB, the first hydraulic cylinder 9 drives the PCB to move downward through the lifting plate 8 until both ends of the PCB move down to the top of the two conveyor belts 10. The two conveyor belts 10 drive the PCB with the solder paste applied to move toward the other direction of the machine body 1. The first hydraulic cylinder 9 pushes the lifting plate 8, causing the lifting plate 8 to drive the remaining PCBs entering the machine body 1 to move upward and apply solder paste.
[0032] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A steel mesh structure for PCB solder paste printing, comprising a concave body (1), characterized in that: L-shaped support frames (6) are installed on the inner walls of both sides of the body (1), a placement plate (25) is installed inside the body (1), and both sides of the placement plate (25) are respectively located inside the two support frames (6), a placement groove (16) is opened on the top of the placement plate (25), a fixing hole (17) is opened on the inner bottom of the placement groove (16), and a steel mesh (15) is installed on the inner top of the placement groove (16), and a slide groove (7) is opened on the inner walls of both sides of the body (1) in the length direction, and the slide groove (7) is located above the support frame (6), and a connecting plate (11) is slidably installed above the placement plate (25) inside the body (1), and electric sliders (19) are installed at both ends of the connecting plate (11), and the electric slider (19) is slidably installed inside the slide groove (7), and a scraper (12) is installed at the bottom of the connecting plate (11).
2. A steel mesh structure for PCB solder paste printing according to claim 1, characterized in that: Fixed plates (5) are installed on both sides of the inner bottom of the body (1) in the length direction, a mounting groove (13) is provided on the top of the fixed plate (5), a conveyor belt (10) is installed inside the mounting groove (13), the top of the conveyor belt (10) is located above the fixed plate (5), and mounting shafts (21) are installed at both ends of the inner part of the conveyor belt (10), and a rotating roller (20) is installed on the outer wall of the mounting shaft (21).
3. A steel mesh structure for PCB solder paste printing according to claim 2, characterized in that: The outer wall of the rotating roller (20) abuts against the inner wall of the conveyor belt (10), and one end of the mounting shaft (21) close to the inner wall of the machine body (1) passes through the machine body (1) and is connected to the output shaft of the motor (4) through a coupling. The motor (4) is mounted on the side of the machine body (1).
4. A steel mesh structure for PCB solder paste printing according to claim 1, characterized in that: A top plate (2) is installed on the top of the machine body (1), and the top plate (2) is located above the connecting plate (11). A storage box (3) is installed on the top of the machine body (1), and a connecting pipe (14) is installed on the top of the connecting plate (11). The top end of the connecting pipe (14) passes through the top plate (2) and is in communication with the storage box (3).
5. The steel mesh structure for PCB solder paste printing according to claim 1, characterized in that: The inner bottom of the support frame (6) is provided with a plurality of slots (22) along the length direction, and both sides of the bottom of the placement plate (25) are provided with clamping blocks (23), which are located inside the slots (22).
6. A steel mesh structure for PCB solder paste printing according to claim 2, characterized in that: A lifting plate (8) is installed between two fixed plates (5) inside the machine body (1), and the lifting plate (8) is located below the placement plate (25). A plurality of first hydraulic cylinders (9) are installed at the inner bottom of the machine body (1), and the top ends of the first hydraulic cylinders (9) are installed at the bottom of the lifting plate (8).
7. A steel mesh structure for PCB solder paste printing according to claim 6, characterized in that: A second hydraulic cylinder (24) is installed on both sides of the inner wall of the body (1) below the support frame (6), and a push plate (18) is installed at one end of the second hydraulic cylinder (24) away from the inner wall of the body (1). The second hydraulic cylinder (24) is located above the conveyor belt (10), and the lifting plate (8) is located between the two push plates (18).