Conductive connecting sheet, conductive connecting sheet array and packaging body

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a conductive connecting piece, a conductive connecting piece array and a packaging body. The conductive connecting piece provided by the utility model comprises a first connecting part, a middle connecting part and a second connecting part, the first connecting part is provided with a first through hole; the second connecting part is provided with a notch; the middle connecting part is provided with a second through hole; the first connecting part and the second connecting part are located on the first side and the second side, opposite to each other, of the middle connecting part, and the middle connecting part protrudes relative to the first connecting part and the second connecting part. Wherein the width of the first connecting part is the same as that of the second connecting part, and the first through hole of the first connecting part and the notch of the second connecting part both extend to the middle connecting part. According to the scheme, overflowing and exhausting of the soldering paste are facilitated, the short circuit phenomenon is avoided, the welding reliability is guaranteed, stress release is facilitated, meanwhile, packaging impedance and inductive reactance can be greatly reduced, and the application field is wide.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a conductive connecting piece, a conductive connecting piece array, and a packaging body. Background Art

[0002] In existing chip packaging, wires are often used to connect chip electrodes to pins, thereby achieving electrical connectivity between the chip and the outside world. However, this approach often limits the chip's electrical and thermal performance. Therefore, to improve the electrical and thermal performance of semiconductor devices and ensure their reliability, the technology of using conductive connecting sheets (clip frames) to replace wires has emerged.

[0003] In existing packaging processes, solder paste is typically used to solder conductive tabs to semiconductor devices, achieving both electrical and mechanical connections. However, due to inaccurate solder paste dosage, solder paste overflow is often unavoidable, leading to severe short circuits and negatively impacting yield.

[0004] The above problems have become issues that need to be solved urgently. Utility Model Content

[0005] The present application provides a conductive connecting sheet that can effectively solve the above or other potential technical problems.

[0006] The first aspect of the present application is to provide a conductive connecting sheet, including a first connecting portion, an intermediate connecting portion and a second connecting portion; the first connecting portion is provided with a first through hole; the second connecting portion is provided with a notch; the intermediate connecting portion is provided with a second through hole; the first connecting portion and the second connecting portion are located on a first side and a second side opposite to each other of the intermediate connecting portion, and the intermediate connecting portion protrudes compared to the first connecting portion and the second connecting portion; wherein the width of the first connecting portion is the same as the width of the second connecting portion, and the first through hole of the first connecting portion and the notch of the second connecting portion both extend to the intermediate connecting portion.

[0007] In an optional embodiment according to the first aspect, at least two first through holes are provided on the first connecting portion.

[0008] In an optional embodiment according to the first aspect, at least two notches are provided on the second connecting portion, and the at least two notches are evenly distributed on the second connecting portion, dividing the second connecting portion into a plurality of first connecting branches.

[0009] In an optional embodiment according to the first aspect, the first through hole is in an elongated strip shape.

[0010] In an optional embodiment according to the first aspect, the notch is a U-shaped hole.

[0011] In an optional embodiment according to the first aspect, the conductive connecting piece is rectangular as a whole.

[0012] In an optional embodiment according to the first aspect, a second through hole is provided on the intermediate connecting portion.

[0013] In an optional embodiment according to the first aspect, the first connecting portion, the middle connecting portion, and the second connecting portion are not on the same plane.

[0014] In an optional embodiment according to the first aspect, the length of the first connecting portion is greater than the length of the middle connecting portion, and the length of the middle connecting portion is greater than the length of the second connecting portion.

[0015] A second aspect of the present application further provides a conductive connecting piece array, comprising at least two of the above-mentioned conductive connecting pieces.

[0016] The third aspect of the present application also provides a package body, including a wafer, a frame and the above-mentioned conductive connecting piece, the wafer is arranged on the base island of the frame, the first connecting part is electrically connected to the wafer, and the second connecting part is electrically connected to the pin of the frame.

[0017] The conductive connecting sheet provided in the embodiment of the present application includes a first connecting portion, an intermediate connecting portion and a second connecting portion; the first connecting portion is provided with a first through hole; the second connecting portion is provided with a notch; the intermediate connecting portion is provided with a second through hole; the first connecting portion and the second connecting portion are located on a first side and a second side opposite to each other of the intermediate connecting portion, and the intermediate connecting portion protrudes compared to the first connecting portion and the second connecting portion; wherein the width of the first connecting portion is the same as the width of the second connecting portion, and the first through hole of the first connecting portion and the notch of the second connecting portion both extend to the intermediate connecting portion.

[0018] The solution of the present application facilitates solder paste overflow and exhaust, thereby avoiding short circuits and ensuring welding reliability. At the same time, it can greatly reduce package impedance and inductive reactance, and has a wide range of applications. On the other hand, the setting of through holes and notches in the present application can facilitate stress release. Beneficial effects

[0019] Advantages of additional aspects of the present application will be given in part in the following description, and in part will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other objects, features and advantages of the embodiments of the present application will become more readily understood through the following detailed description with reference to the accompanying drawings, in which various embodiments of the present application are illustrated by way of example and not limitation, wherein:

[0021] Figure 1A schematic diagram of the overall structure of the conductive connecting sheet provided in an embodiment of the present application at a first viewing angle;

[0022] Figure 2 A schematic diagram of the overall structure of the conductive connecting sheet provided in an embodiment of the present application at a second viewing angle;

[0023] Figure 3 A schematic diagram of a conductive connecting sheet array provided in an embodiment of the present application;

[0024] Figure 4 A schematic diagram of an expanded conductive connecting sheet array provided in an embodiment of the present application;

[0025] Figure 5 A schematic top view of an array of conductive connecting pieces provided in an embodiment of the present application;

[0026] Figure 6 A schematic top view of a curved assembly of a conductive connecting piece array provided in an embodiment of the present application;

[0027] Figure 7 A schematic front cross-sectional view of a curved assembly of a conductive connecting piece array provided in an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 10. Conductive connecting piece; 11. First connecting portion; 111. First through hole; 13. Second connecting portion; 131. Notch; 132. First connecting branch; 15. Intermediate connecting portion; 151. Second through hole; 20. Chip; 30. Pin; 200. Connecting strip; 100. Conductive connecting piece; 210. Bending component; 220. First positioning hole; 230. Second positioning hole; 240. Bending strip; 241. Bending angle. DETAILED DESCRIPTION

[0030] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0033] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0035] In existing packaging processes, solder paste is typically used to solder conductive tabs to semiconductor devices, achieving both electrical and mechanical connections. However, due to inaccurate solder paste dosage, this structure often experiences solder paste overflow, resulting in short circuits between chip electrodes and pins. Air can also be trapped, leading to unstable soldering and reduced yield. Furthermore, existing conductive tab structures are unsuitable for certain specific applications.

[0036] In view of this, the conductive connecting piece provided in the embodiment of the present application, by setting through holes and gaps, facilitates the overflow of solder paste and the discharge of air, thereby avoiding short circuit phenomena and facilitating the release of stress. At the same time, discharging the air in the solder can ensure the reliability of the package and improve the product yield; through the specific width, length and position design of the first connecting piece and the second connecting piece, the conductive connecting piece of the present application can be applied to specific packaging occasions, and at the same time, the package impedance and inductance can be greatly reduced.

[0037] Please refer to Figure 1 and Figure 2 The conductive connecting sheet 10 provided in the embodiment of the present application includes a first connecting portion 11, an intermediate connecting portion 15 and a second connecting portion 13; the first connecting portion 11 is provided with a first through hole 111; the second connecting portion 13 is provided with a notch 131; the intermediate connecting portion 15 is provided with a second through hole 151, and the intermediate connecting portion 15 is used to connect the first connecting portion 11 and the second connecting portion 13, and the intermediate connecting portion 15 is protruding compared to the first connecting portion 11 and the second connecting portion 13. Figure 1 As shown, the first connection portion 11 is disposed on a first side of the intermediate connection portion 15; and the second connection portion 13 is disposed on a second side of the intermediate connection portion 15. The first side and the second side are opposite sides.

[0038] See also Figure 1 , the width of the first connecting portion 11 is the same as the width of the second connecting portion 13 ( Figure 1 The first through hole 111 of the first connecting portion 11 and the notch 131 of the second connecting portion 13 both extend to the middle connecting portion 15 .

[0039] Preferably, the first connecting portion 11 , the second connecting portion 13 and the middle connecting portion 15 have the same width.

[0040] The first through hole 111 and the notch 131 facilitate solder paste overflow, thereby preventing short circuits and facilitating air exhaust, thereby ensuring soldering reliability and stability, guaranteeing chip packaging yield, and facilitating stress release. The position and width of the first connecting portion 11 and the second connecting portion 13 make the conductive connecting sheet 10 of the present application suitable for packaging small chips in a clip-cover design, particularly for various medium and high-power MOS tube packaging applications.

[0041] In an alternative exemplary embodiment, at least two first through holes 111 are provided on the first connecting portion 11 .

[0042] As an example, Figure 1 , two first through holes 111 are provided on the first connecting portion 11. Specifically, in this embodiment, the number of the first through holes 111 on the first connecting portion 11 is two. That is, the first through holes 111 are in the shape of a long strip inside the first connecting portion 11. Such a configuration does not affect the stability of the original connection, but also provides space for excess solder paste and residual air to overflow. Figure 1 As shown, the first through hole 111 is longer in the horizontal direction and shorter in the vertical direction.

[0043] It is understandable that the specific number of the through holes 111 is not limited here. In other specific embodiments, the number of the through holes 111 can also be set to three or more according to the specific needs of the user.

[0044] In an alternative exemplary embodiment, the second connecting portion 13 is provided with at least two notches 131, evenly distributed across the second connecting portion 13, dividing the second connecting portion 13 into a plurality of first connecting branches 132. The second connecting portion 13 is configured to have the same width as the first connecting portion 11 and the intermediate connecting portion 15. This configuration ensures the overall structural stability of the conductive connecting sheet 10. It should be understood that the number of notches 131 on the second connecting portion 13 is not limited herein; in other specific embodiments, other numbers of notches 131 may be provided based on user needs.

[0045] Figure 1 Taking two notches 131 as an example, the notches 131 divide the second connection portion 13 into three first connection branches 132. This arrangement does not affect the stability of the original connection and provides space for excess solder paste to overflow.

[0046] It is understandable that the specific number of the notches 131 is not limited here. In other specific embodiments, the number of the notches 131 can also be set to three or more according to the specific needs of the user.

[0047] In an optional exemplary embodiment, the first through hole 111 is in the shape of an elongated strip. It should be noted that, specifically, in this embodiment, the first through hole 111 is configured as an elongated strip. The elongated strip hole structure is simple and easy to process. At the same time, based on the smooth shape of the elongated strip structure itself, it can effectively reduce the risk of breakage under stress. It is understood that the specific shape of the first through hole 111 is not limited here. In other specific embodiments, the first through hole 111 can also be configured as other suitable shapes according to the specific needs of the user.

[0048] In an optional exemplary embodiment, the notch 131 is a U-shaped hole. It should be noted that, specifically, in this embodiment, the notch 131 is configured as a U-shaped hole. The U-shaped hole has a simple structure and is easy to process. Furthermore, the smooth shape of the U-shaped structure effectively reduces the risk of breakage under stress. It should be understood that the specific shape of the notch 131 is not limited here. In other embodiments, the notch 131 can be configured as other suitable shapes based on the user's specific needs.

[0049] In an alternative exemplary embodiment, the conductive connecting piece 10 is rectangular in shape as a whole.

[0050] In an alternative exemplary embodiment, a second through hole 151 is provided on the intermediate connecting portion 15 .

[0051] It should be noted that, specifically, a second through hole 151 is provided on the middle connecting portion 15. The provision of the second through hole 151 can effectively release stress, that is, avoid stress concentration causing the conductive connecting sheet 10 to tear during the pulling process. The second through hole 151 is shorter in the horizontal direction and longer in the vertical direction (see Figure 1 ).

[0052] In an alternative exemplary embodiment, as Figure 1-Figure 2 As shown, the first connection portion 11 , the middle connection portion 15 and the second connection portion 13 are not on the same plane, and the middle connection portion 15 protrudes compared to the first connection portion 11 and the second connection portion 13 . The second connection portion 13 protrudes compared to the first connection portion 11 .

[0053] Specifically, in an optional exemplary embodiment, the first connection portion 11 is bonded to the chip 20 via a conductive adhesive (or soldered); the second connection portion 13 is bonded to the pin 30 via a conductive adhesive (or soldered). Conductive adhesive bonding is stable and easy to operate.

[0054] In an alternative exemplary embodiment, the length of the first connecting portion 11 is greater than the length of the intermediate connecting portion 15 , and the length of the intermediate connecting portion 15 is greater than the length of the second connecting portion 13 .

[0055] In an optional exemplary embodiment, the conductive connecting sheet 10 provided in the present application is a copper sheet with excellent heat dissipation performance.

[0056] The present application also provides a conductive connecting piece array 100 , comprising at least two of the above-mentioned conductive connecting pieces 10 .

[0057] like Figures 3 to 7 As shown, an embodiment of the present application further provides a conductive connecting piece array 100 , comprising a plurality (at least two) of the above-mentioned conductive connecting pieces 10 .

[0058] As an example, the conductive connecting piece array 100 includes a plurality of conductive connecting pieces 10 and a plurality of curved assemblies 210. The plurality of conductive connecting pieces 10 are arranged in an array, and the body of each conductive connecting piece 10 is connected to the connecting bar 200 via a connecting rib. A plurality of curved assemblies 210 are provided on the connecting bar 200, and the plurality of curved assemblies 210 are provided in a one-to-one correspondence with the plurality of conductive connecting pieces 10. Each curved assembly 210 is provided between the bodies of adjacent conductive connecting pieces 10 along the length of the conductive connecting piece array 100.

[0059] like Figure 3 The conductive connecting sheet array 100 is a roll structure, and the bending component 210 acts as a spacer between layers at the frame to prevent the conductive connecting sheet 10 from deforming. In addition, the bending component 210 also has the function of positioning and facilitating the dragging of materials.

[0060] Each bending assembly 210 includes at least one bending bar 240. The first end of the bending bar 240 is connected to the connecting bar 200, and the second end of the bending bar 240 is a free end, that is, the second end of the bending bar 240 is no longer connected to the connecting bar 200, so that the bending bar 240 has a certain degree of elasticity.

[0061] As an example, the included angle between the first end of the bending strip and the connecting strip 200 is 120 degrees, the bending angle 241 of the bending strip itself is 68 degrees, and the bending angle of the bending strip is set toward the bending component 210 .

[0062] The plurality of conductive connecting sheets 10 are arranged in rows on the connecting bar 200. The rows may be one, two or more rows as required. In this embodiment, two rows are used as an example for description.

[0063] A plurality of first positioning holes 220 are provided on the connecting bar 200. The first positioning holes 220 are located at the edge of the connecting bar 200. The number of the first positioning holes 220 is the same as the number of the conductive connecting sheets 10 in a row.

[0064] The connecting bar 200 is further provided with a second positioning hole 230, which is located in the middle of the connecting bar. At least two conductive connecting pieces 10 are provided between each two adjacent second positioning holes 230, and the number of conductive connecting pieces 10 between two adjacent second positioning holes 230 is equal.

[0065] The present application also provides a package body, including a wafer, a frame and the above-mentioned conductive connecting piece 10, the wafer is arranged on the base island of the frame, the first connecting part 11 is electrically connected to the wafer, and the second connecting part 13 is electrically connected to the pin 30 of the frame.

[0066] The package provided in the embodiment of the present application includes the above-mentioned conductive connecting piece 10, and therefore also has the above-mentioned technical effects of facilitating air discharge, avoiding short circuits, facilitating stress release, reducing the overall weight of the conductive connecting piece 10, reducing package impedance and inductance, improving connection reliability, having good solderability, and having a wide range of applications.

[0067] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned implementation modes, ordinary technicians in this field should understand that they can still modify the technical solutions described in the aforementioned implementation modes, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the implementation modes of the present application.

[0068] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not further describe various possible combinations.

Claims

1. A conductive connecting sheet, characterized in that: comprising a first connecting portion, an intermediate connecting portion and a second connecting portion; The first connecting portion is provided with a first through hole; The second connecting portion is provided with a notch; The middle connecting portion is provided with a second through hole; the first connecting portion and the second connecting portion are located on a first side and a second side opposite to the middle connecting portion, and the middle connecting portion protrudes compared to the first connecting portion and the second connecting portion; The width of the first connecting portion is the same as that of the second connecting portion, and the first through hole of the first connecting portion and the notch of the second connecting portion both extend to the middle connecting portion.

2. The conductive connecting sheet according to claim 1, wherein: At least two first through holes are provided on the first connecting portion.

3. The conductive connecting sheet according to claim 2, wherein: At least two notches are provided on the second connecting portion, and the at least two notches are evenly distributed on the second connecting portion.

4. The conductive connecting sheet according to claim 1, wherein: The first through hole is in a long strip shape.

5. The conductive connecting sheet according to claim 1, wherein: The notch is a U-shaped hole.

6. The conductive connecting sheet according to claim 1, wherein: The conductive connecting piece is rectangular as a whole.

7. The conductive connecting sheet according to any one of claims 1 to 6, characterized in that: The first connecting portion, the middle connecting portion and the second connecting portion are not on the same plane.

8. The conductive connecting sheet according to claim 7, wherein: The length of the first connecting portion is greater than that of the middle connecting portion, and the length of the middle connecting portion is greater than that of the second connecting portion.

9. A conductive connecting sheet array, characterized in that: The method comprises at least two conductive connecting sheets according to any one of claims 1 to 8.

10. A package, characterized in that: It comprises a wafer, a frame and a conductive connecting piece according to any one of claims 1 to 8, wherein the wafer is arranged on a base island of the frame, the first connecting portion is electrically connected to the wafer, and the second connecting portion is electrically connected to a pin of the frame.

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