Micro-channel water cooling module for four-pass slab laser amplification system

Abstract

The utility model discloses a micro-channel water cooling module for a four-pass slab laser amplification system, relates to the technical field of laser heat dissipation, and solves the problems that in the prior art, temperature measurement is inaccurate, and the interior of a liquid cooling structure is closed and cannot be overhauled. The device comprises a base body, two micro-channel heat dissipation blocks are detachably arranged on the base body in parallel, a gap between the two micro-channel heat dissipation blocks is used for arranging a lath laser crystal, a temperature detection unit used for being matched with the lath laser crystal is arranged on the base body, and a shading structure used for being matched with the temperature detection unit is arranged on the base body. Heat sink liquid inlet and outlet blocks are detachably arranged on the outer sides of the micro-channel heat dissipation blocks, liquid inlet and outlet structures are arranged on the heat sink liquid inlet and outlet blocks, and the liquid inlet and outlet structures are connected with heat exchange structures arranged on the micro-channel heat dissipation blocks. The micro-channel heat dissipation blocks are arranged in parallel, and the shading structure is arranged in the gap between the micro-channel heat dissipation blocks, so that the temperature monitoring unit can be prevented from absorbing pump light, and the temperature measurement error is reduced; meanwhile, the components are detachably connected, so that disassembly and assembly are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of laser heat dissipation, in particular to a microchannel water cooling module for a four-pass slab laser amplification system. Background Art

[0002] Diode-pumped solid-state lasers have many advantages, including high efficiency, small size, and good output beam quality. They have been widely used in industry, scientific research, military, and medical fields. Compared with diode-side-pumped solid-state lasers, the thermal effect of the laser medium is more serious. This is because in end-pumped solid-state lasers, the pump light is concentrated in a very small area within the laser crystal, with a beam waist diameter generally less than 1mm. Its power density is much higher than that of side-pumped solid-state lasers. The high power density inevitably leads to a large amount of waste heat accumulating in a small area. If this waste heat cannot be removed in a timely and efficient manner, it will cause more serious thermal effects.

[0003] Traditional heat dissipation methods include large-channel circulating water cooling or semiconductor refrigeration. These two cooling methods each have their own advantages and disadvantages. When building a solid-state laser, they can improve the impact of thermal effects on the laser crystal. As the laser power increases, it becomes increasingly difficult to meet the heat dissipation needs of the laser. At the same time, it will also cause problems such as uneven temperature distribution inside the laser crystal, leading to serious thermal effect problems. Traditional microchannel heat sinks use a welding method to weld the microchannel layer and the water inlet layer together. When the microchannel layer is blocked, it cannot be effectively cleaned. In addition, measuring the temperature of the crystal has always been a major engineering problem, because the thermocouple probe may interfere with the laser beam, and the thermocouple may leave scratches when it contacts the crystal surface. Even if the temperature is measured, the temperature is not accurate due to the strong infrared radiation of the fluorescence.

[0004] The Chinese utility model patent with publication number CN218569487U discloses a laser crystal temperature control device. A laser crystal temperature control device includes a crystal cooling seat, the top surface of which is provided with an inwardly concave cooling groove; a circulating water path, which is connected to the cooling groove and provided with a speed regulating valve for regulating the water flow rate; and a laser crystal fixture, the bottom surface of which is connected to the crystal cooling seat and covers the cooling groove. The present application discloses a laser crystal temperature control device, wherein a speed regulating valve for regulating the water flow rate is provided on the circulating water path. The speed regulating valve is used to adjust the water flow rate according to different heat dissipation requirements. During the flow of water in the cooling groove, the water will contact the bottom surface of the laser crystal fixture. The cooling water exchanges heat with the laser crystal fixture in the circulating water path, quickly removing the waste heat generated during the operation of the laser crystal.

[0005] In this solution, the laser crystal is mainly clamped and fixed and heat-conducted by the laser crystal clamp. The heat obtained by the clamp is directly exchanged with the water in the cooling tank through the bottom surface. However, the bottom surface is only a flat structure with limited contact area and one-sided heat dissipation. Therefore, the heat transfer capacity is limited, and when the heat generation is large, poor heat dissipation effect is likely to occur.

[0006] Secondly, to accurately measure the real-time temperature of the laser crystal, a temperature sensor must typically be placed close to the laser crystal or mounted on a fixture for temperature measurement. When placed close together, the thermistor is exposed to the pump light in the optical path, absorbing additional heat and resulting in inaccurate temperature measurements. Furthermore, the thermistor, when mounted in a fixture, is still some distance from the laser crystal and cannot accurately reflect the laser crystal's temperature in real time. Utility Model Content

[0007] In view of the deficiencies in the above-mentioned background technology, the present invention proposes a microchannel water cooling module for a four-pass slab laser amplification system, which solves the problems of inaccurate temperature measurement and limited heat dissipation capacity in the prior art.

[0008] The technical solution of the present utility model is achieved as follows: a microchannel water-cooling module for a four-pass slab laser amplification system includes a base body, two microchannel heat dissipation blocks are detachably provided in parallel on the base body, the gap between the two microchannel heat dissipation blocks is used to set the slab laser crystal, a temperature detection unit for cooperating with the slab laser crystal is provided on the base body, and a shading structure for cooperating with the temperature monitoring unit is provided on the base body; a heat sink inlet and outlet liquid block is detachably provided on the outer side of the microchannel heat dissipation block, a liquid inlet and outlet structure is provided on the heat sink inlet and outlet liquid block, and the liquid inlet and outlet structure is connected to the heat exchange structure provided on the microchannel heat dissipation block.

[0009] Preferably, the base includes two parallel and corresponding heat sink fixing plates, and a plurality of long waist holes are opened on the heat sink fixing plates. The heat sink fixing plates and the microchannel heat dissipation block and / or the heat sink fixing plates and the heat sink inlet and outlet blocks are connected by bolts passing through the long waist holes.

[0010] Preferably, at least one through hole is formed on the heat sink fixing plate, and the light-shielding structure includes baffles fixedly arranged on both sides of the through hole along the length direction.

[0011] Preferably, the microchannel heat dissipation block is connected to the heat sink inlet and outlet block by bolts, and the slab laser crystal is fixed to the microchannel heat dissipation block by indium welding.

[0012] Preferably, the heat exchange structure comprises strip-shaped microchannels arranged in parallel on the microchannel heat sink block, with adjacent microchannels separated by fins. The microchannels are arranged along the length direction of the slab laser crystal.

[0013] Preferably, the liquid inlet and outlet structure includes a liquid inlet and a liquid outlet provided on the heat sink liquid inlet and outlet block along the length direction of the slab laser crystal. The liquid inlets are arranged in pairs and are located on both sides of the liquid outlet.

[0014] Preferably, the liquid inlet and the liquid outlet both include a connected rectangular hole segment and a circular hole segment, the rectangular hole segment is arranged on the inner side of the heat sink inlet and outlet block, and the circular hole segment is arranged on the outer side of the heat sink inlet and outlet block, the rectangular hole segment is used to cooperate with a plurality of microchannels, and the circular hole segment is used to connect the inlet and outlet pipes.

[0015] Preferably, a waterproof rubber ring is provided between the heat sink liquid inlet and outlet block and the microchannel heat dissipation block, and a gasket is provided on the side wall between the rectangular hole sections of adjacent liquid inlets and outlets.

[0016] Beneficial effects of the utility model:

[0017] 1: By setting up a base, an installation support foundation is provided for the setting of the entire water-cooling module. By setting up parallel microchannel heat sinks, the gap between the two is used to provide space for the placement of the slab laser crystal, and a heat-conducting structure can be formed on both sides of the slab laser crystal, thereby improving the heat dissipation effect. At the same time, it can also provide space for the layout of the temperature monitoring unit. By setting up a shading structure, it can prevent the temperature monitoring unit from absorbing pump light and reduce the temperature measurement error. Secondly, heat dissipation is achieved by setting up a heat exchange structure in conjunction with the inlet and outlet liquid structure, thereby improving the heat dissipation capacity and effect. At the same time, the base, microchannel heat sink, and heat sink inlet and outlet liquid blocks are detachably connected, which is convenient for assembly during use and for maintenance after use or in case of failure, and is easy to disassemble and assemble.

[0018] 2. The entire water-cooling module of this utility model dissipates heat by sandwiching a slab-shaped laser crystal between two microchannel heat sinks. Both sides of the slab-shaped laser crystal are in contact with the microchannel heat sinks, increasing the heat dissipation area and enabling sufficient heat dissipation from the slab-shaped laser crystal. This module also features a compact structure and ensures full contact between the sides of the slab-shaped laser crystal and the microchannel heat sinks, enabling uniform cooling of the slab-shaped laser crystal and preventing thermal effects caused by uneven heating.

[0019] 3. The utility model divides the heat dissipation structure into a heat sink inlet and outlet block and a microchannel heat dissipation block, which are fixed in a detachable manner. This is different from the welding fixing method used in other conventional heat sinks. When the microchannel is blocked, it can be disassembled and cleaned.

[0020] 4. The present invention provides a plurality of through holes on the substrate, in which temperature monitoring units can be placed to measure the temperature of the slab-shaped laser crystal. In order to prevent the temperature monitoring units from absorbing pump light, baffles are provided before and after each temperature monitoring unit, thereby reducing the error in temperature measurement.

[0021] 5. The utility model dissipates heat from the slab-shaped laser crystal by water cooling. The exposed surface of the slab-shaped laser crystal is the incident surface of both the seed light and the amplified light in the actual optical path. By setting water inlets and liquid inlets at both ends, the heat dissipation capacity at both ends of the slab-shaped laser crystal can be increased, so that the slab-shaped laser crystal is heated evenly. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0024] Figure 2 This is a structural diagram of the heat sink inlet and outlet blocks of the utility model from one perspective;

[0025] Figure 3 This is a structural diagram of the heat sink inlet and outlet blocks from another perspective of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the microchannel heat dissipation block of the utility model;

[0027] Figure 5 This is a schematic diagram of the structure of the heat sink fixing plate of the utility model;

[0028] Figure 6 This is a schematic diagram of the structure of the slab laser crystal of the utility model;

[0029] Figure 7 This is a schematic diagram of the position of the slab laser crystal in the optical path diagram of the present invention;

[0030] In the figure: 1: substrate, 2: microchannel heat sink, 3: slat laser crystal, 4: shading structure, 5: heat sink inlet and outlet block, 6: liquid inlet and outlet structure, 7: heat exchange structure, 11: heat sink fixing plate, 12: long waist hole, 13: through hole, 41: baffle, 71: microchannel, 72: fin, 61: liquid inlet, 62: liquid outlet, 621: rectangular hole section, 622: circular hole section, 63: waterproof rubber ring, 64: gasket. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] like Figure 1 、 2 As shown, Example 1, a microchannel water-cooling module for a four-pass slab laser amplification system, includes a base 1, which provides an installation support foundation for the entire water-cooling module. Two microchannel heat sinks 2 are detachably mounted in parallel on the base 1. The gap between the two microchannel heat sinks 2 is used to mount a slab laser crystal 3. The base 1 is provided with a temperature detection unit for cooperating with the slab laser crystal 3, and the base 1 is provided with a light-shielding structure 4 for cooperating with the temperature monitoring unit. The parallel arrangement of the microchannel heat sinks not only utilizes the gap between the two to provide space for the placement of the slab laser crystal, but also forms a heat-conducting structure on both sides of the slab laser crystal, thereby improving the heat dissipation effect. At the same time, it also provides space for the layout of the temperature monitoring unit. The provision of a light-shielding structure can prevent the temperature monitoring unit from absorbing pump light, thereby reducing temperature measurement errors.

[0033] In addition, the outer side of the microchannel heat sink block 2 is detachably provided with a heat sink inlet and outlet block 5, and the heat sink inlet and outlet block 5 is provided with an inlet and outlet structure 6, which is connected to the heat exchange structure 7 provided on the microchannel heat sink block 2. By arranging the heat exchange structure and the inlet and outlet structure, heat dissipation is achieved, thereby improving the heat dissipation capacity and effect. In this embodiment, by detachably connecting the base, the microchannel heat sink block, and the heat sink inlet and outlet block, it is convenient to assemble during use and to repair after use or in case of failure, and disassembly and assembly are convenient. At the same time, Figure 1 、 6 As shown in Figures 7 and 8, the slab laser crystal 3 is a long strip structure, and the light enters and exits along the length direction in the optical path. The utility model can ensure the continuous stability of the heat dissipation performance in the four-pass amplification optical path, and has a good use effect. At the same time, the compact structure is also conducive to the systematization and integration of the overall structure of the laser. It can also make the side of the slab laser crystal fully contact with the microchannel heat dissipation block, which can achieve uniform cooling of the slab laser crystal and prevent the thermal effect caused by uneven heating from affecting the slab laser crystal.

[0034] Example 2, based on Example 1, Figure 1 、 5As shown, the base 1 includes two parallel heat sink fixing plates 11. The two heat sink fixing plates are symmetrically arranged in the upper and lower parts. The thickness of the heat sink fixing plates 11 is 8 mm. A number of long waist holes 12 are provided on the heat sink fixing plates 11. The heat sink fixing plates 11 and the microchannel heat sink block 2 and / or the heat sink fixing plates 11 and the heat sink inlet and outlet block 5 are connected by bolts passing through the long waist holes 12. In this embodiment, the long waist holes are arranged along the width direction of the heat sink fixing plates, and four long waist holes are symmetrically arranged. Two bolts are passed through each long waist hole for connection with the threaded holes on the top or bottom surface of the microchannel heat sink block 2 and the heat sink inlet and outlet block 5 respectively. The long waist holes are provided to facilitate fine-tuning of the position during the connection process. In addition, four connecting holes are provided on each of the microchannel heat sink block 2 and the heat sink inlet and outlet block 5, and the two are detachably connected by bolts provided in the connecting holes. During assembly, the microchannel heat sink block and the heat sink inlet and outlet blocks are first secured together using bolts and connection holes to form a heat sink assembly. The slab laser crystal 3 is then welded to the microchannel heat sink blocks 2 on either side using indium solder. Finally, the heat sink assembly is bolted to the heat sink fixing plates 11 at the top and bottom. The symmetrical arrangement of the heat sink inlet and outlet blocks and the microchannel heat sink blocks ensures even heat conduction and heat dissipation from both sides of the slab laser crystal 3.

[0035] As a further embodiment, the heat sink fixture 11 is provided with at least one through-hole 13. In this embodiment, three through-holes are provided, corresponding to three temperature detection units disposed within these through-holes. These temperature detection units employ thermistors, which pass through the through-holes and rest against the slab laser crystal 3. The light-shielding structure 4 includes baffles 41 fixed along the length of each through-hole 13. In this embodiment, the baffles are 2 mm thick and 12 mm long, relative to the top view of the heat sink fixture. Baffles 41 shield light along the length of the slab laser, preventing the temperature detection units from directly absorbing the pump light and causing inaccurate temperature measurements.

[0036] As a further optional implementation, a pair of baffles are additionally provided outside the baffles 41 on both sides to improve the light shielding capability and the anti-interference effect.

[0037] Example 3, based on Example 2, Figure 4As shown, the heat exchange structure 7 includes strip-shaped microchannels 71 arranged in parallel on the microchannel heat sink block 2, and adjacent microchannels 71 are separated by fins 72. The microchannels 71 are arranged along the length direction of the slab laser crystal 3. In this embodiment, the thickness of the two microchannel heat sink blocks 2 is 5 mm, the thickness of the heat sink inlet and outlet blocks is 10 mm, and both the microchannel heat sink block 2 and the heat sink inlet and outlet blocks are rectangular parallelepiped structures, wherein the length of the microchannel is 64.8 mm, the width is 1 mm, and the depth is 2.5 mm. The thickness of the fins between adjacent microchannels is 0.8 mm. The number of microchannels is set to 21. The provision of multiple microchannels increases the contact area with the liquid medium flowing through, which is beneficial to heat transfer, thereby achieving efficient heat dissipation.

[0038] In addition, the liquid inlet and outlet structure 6 includes a liquid inlet 61 and a liquid outlet 62 provided on the heat sink liquid inlet and outlet block 5 along the length of the slab laser crystal 3. In this embodiment, the liquid inlets 61 are provided in pairs and are located on both sides of the liquid outlet 62. Specifically, each heat sink liquid inlet and outlet block is provided with two liquid inlets 61 and one liquid outlet, and the liquid inlets are located on both sides of the liquid outlet. Specifically, in this embodiment, the liquid inlets are distributed on both sides of the liquid outlet, and the slab laser crystal is cooled by water cooling. The exposed surface of the slab laser crystal is the incident surface of both the seed light and the amplified light in the actual optical path. The liquid inlets are correspondingly provided at both ends of the slab laser crystal. As the liquid medium flows, the heat at both ends is taken away. Such an arrangement can effectively increase the heat dissipation capacity of the two ends of the slab crystal, so that the slab laser crystal is heated evenly.

[0039] As a further embodiment, Figure 2 、 3 As shown, the liquid inlet 61 and the liquid outlet 62 each include a connected rectangular hole segment 621 and a circular hole segment 622. The rectangular hole segment 621 is located inside the heat sink inlet and outlet block 5, while the circular hole segment 622 is located outside the heat sink inlet and outlet block 5. The rectangular hole segment 621 is used to cooperate with multiple microchannels, while the circular hole segment 622 is used to connect the inlet and outlet pipes. The provision of the circular hole segment facilitates connection. The rectangular hole segment can simultaneously connect with multiple microchannels, allowing the liquid medium flowing through the circular hole segment to evenly and smoothly enter the two ends of the microchannel, flow from the ends to the middle of the microchannel, and finally flow out through the rectangular hole segment in the middle.

[0040] In this embodiment, the inlet and outlet pipes are used to connect the pump body and the liquid reservoir. The pump body drives the liquid medium in the liquid reservoir through the liquid inlet into the microchannel and then returns to the liquid reservoir through the liquid outlet. In addition, as a further embodiment, the liquid reservoir is also connected to a conventional heat exchanger or air-cooled radiator to dissipate heat and exchange heat with the liquid medium returning to the liquid reservoir, thereby reducing the temperature of the liquid medium.

[0041] Example 4, based on Example 3, features a waterproof rubber ring 63 between the heat sink inlet and outlet block 5 and the microchannel heat sink block 2. A gasket 64 is provided on the sidewall between the rectangular hole sections 621 of the adjacent liquid inlet 61 and outlet 62. In this example, both the waterproof rubber ring and the gasket can be made of rubber. The waterproof rubber ring provides a seal to prevent water leakage, while the gasket 64 fills the gap between the heat sink inlet and outlet block and the microchannel heat sink block, preventing fluid medium from interflowing between the microchannels, which could disrupt the flow path and reduce heat dissipation.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A microchannel water cooling module for a four-pass slab laser amplification system, characterized by: The invention comprises a base body (1), two microchannel heat dissipation blocks (2) are detachably provided on the base body (1), a gap between the two microchannel heat dissipation blocks (2) is used to set a slab laser crystal (3), a temperature detection unit for cooperating with the slab laser crystal (3) is provided on the base body (1), and a light shielding structure (4) for cooperating with the temperature monitoring unit is provided on the base body (1); A heat sink inlet and outlet block (5) is detachably provided on the outer side of the microchannel heat dissipation block (2), and a liquid inlet and outlet structure (6) is provided on the heat sink inlet and outlet block (5). The liquid inlet and outlet structure (6) is connected to a heat exchange structure (7) provided on the microchannel heat dissipation block (2).

2. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 1, characterized in that: The base (1) comprises two parallel and corresponding heat sink fixing plates (11), a plurality of long waist holes (12) are provided on the heat sink fixing plates (11), and the heat sink fixing plates (11) and the microchannel heat dissipation block (2) and / or the heat sink fixing plates (11) and the heat sink inlet and outlet block (5) are connected by bolts passing through the long waist holes (12).

3. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 2, characterized in that: At least one through hole (13) is provided on the heat sink fixing plate (11), and the light-shielding structure (4) comprises baffles (41) fixedly arranged on both sides of the through hole (13) along the length direction.

4. The microchannel water cooling module for a four-pass slab laser amplification system according to any one of claims 1 to 3, characterized in that: The microchannel heat dissipation block (2) is connected to the heat sink inlet and outlet block (5) via bolts, and the slab laser crystal (3) is fixed to the microchannel heat dissipation block (2) via indium welding.

5. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 4, characterized in that: The heat exchange structure (7) comprises strip-shaped microchannels (71) arranged in parallel on the microchannel heat dissipation block (2), and adjacent microchannels (71) are separated by fins (72).

6. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 5, characterized in that: The microchannel (71) is opened along the length direction of the slab laser crystal (3).

7. The microchannel water cooling module for a four-pass slab laser amplification system according to any one of claims 1 to 3, 5 or 6, characterized in that: The liquid inlet and outlet structure (6) comprises a liquid inlet (61) and a liquid outlet (62) provided on the heat sink liquid inlet and outlet block (5) along the length direction of the slab laser crystal (3).

8. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 7, characterized in that: The liquid inlets (61) are arranged in pairs and are respectively located on both sides of the liquid outlet (62).

9. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 8, characterized in that: The liquid inlet (61) and the liquid outlet (62) both comprise a rectangular hole section (621) and a circular hole section (622) that are connected to each other. The rectangular hole section (621) is arranged on the inner side of the heat sink liquid inlet and outlet block (5), and the circular hole section (622) is arranged on the outer side of the heat sink liquid inlet and outlet block (5). The rectangular hole section (621) is used to cooperate with a plurality of microchannels, and the circular hole section (622) is used to connect to the liquid inlet and outlet pipes.

10. The microchannel water cooling module for a four-pass slab laser amplification system according to claim 9, characterized in that: A waterproof rubber ring (63) is provided between the heat sink liquid inlet and outlet block (5) and the microchannel heat dissipation block (2), and a gasket (64) is provided on the side wall between the rectangular hole sections (621) of the adjacent liquid inlet (61) and liquid outlet (62).

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