Semiconductor part coating device

Abstract

The utility model discloses a semiconductor part coating device, and relates to the technical field of semiconductor part processing, the semiconductor part coating device comprises a workbench, the top end of the workbench is fixedly connected with a processing box, one side of the top end of the processing box is rotatably connected with a box cover, and the bottom end of the box cover is fixedly connected with a sealing strip; a fixed rotating mechanism is arranged in the processing box and comprises a first motor, a gear is fixedly connected to the output end of the first motor, a rack is connected to the outer surface of the gear in a meshed mode, a through long groove is formed in the top end of the workbench, and a connecting plate is fixedly connected to the top end of the rack; and the top end of the connecting plate penetrates through the long groove and is fixedly connected with a moving plate, one end of the moving plate is rotationally connected with a rotating plate, and by arranging the fixed rotating device, all-directional rotation of the semiconductor part in the coating process is achieved, and therefore the problem that the thickness distribution of a coating is not uniform is effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor parts processing, and in particular to a semiconductor parts coating device. Background Art

[0002] As the cornerstone of the modern information technology industry, the semiconductor industry plays a vital role in many fields such as communications, computers, consumer electronics, and automotive electronics. Semiconductor parts are the basic units that make up semiconductor devices. Their performance and quality directly affect the overall performance and reliability of semiconductor products. With the continuous development of semiconductor technology, chip integration is becoming increasingly higher, and the manufacturing process is becoming more complex. The requirements for the precision, purity, and stability of semiconductor parts are also becoming increasingly stringent. In the semiconductor manufacturing process, a series of complex process steps are required, such as photolithography, etching, deposition, spraying, ion implantation, etc. Each step has specific requirements for the quality and performance of semiconductor parts. However, spraying for semiconductor parts is still a challenging problem. Therefore, there is an urgent need for a semiconductor parts coating device in the market.

[0003] After checking the announcement number: CN 221288320 U, a surface coating device for semiconductor parts is disclosed. This technology discloses "including a base column and a spray box, the top of the base plate is fixedly connected to a material box, the inner wall of the material box is fixedly connected to a feed pipe A, and through the technical solutions such as the clamping block, the placement plate, the limiting block, the A axis, the power motor, the clamping motor, the threaded rod, the moving block, the base column, and the limiting groove, it has a simple structure and high efficiency, and avoids the equipment spraying the front and back of the semiconductor parts, which is too cumbersome and inefficient. Through the air outlet, the suction pipe, the exhaust fan, the filter, the ultraviolet lamp, and the activated carbon net, it has the technical effect of purifying harmful substances, avoiding the highly dispersed paint mist and the volatilized solvent from becoming fine particles during the spraying operation, which are easily inhaled into the human lungs and endangering health."

[0004] Regarding the above-mentioned related technologies, the inventors believe that most of the existing semiconductor parts coating devices cannot rotate when fixing the semiconductor parts. Since the parts cannot rotate, the coating material can only be sprayed or deposited from a specific direction and angle, which can easily lead to uneven distribution of coating thickness on the surface of the parts. Secondly, most of the existing semiconductor parts spraying devices do not have exhaust gas filtering devices, resulting in the exhaust gas generated during processing being inhaled into the body by the workers, affecting the workers' work comfort and breathing safety.

[0005] In view of the above-mentioned related technologies, the inventor believes that a semiconductor component coating device is needed to solve the above-mentioned problems. Utility Model Content

[0006] The purpose of this application is to provide a semiconductor component coating device to improve the problem that the coating thickness distribution on the component surface is uneven and affects the working comfort and breathing safety of the staff.

[0007] The semiconductor parts coating device provided in this application adopts the following technical solution:

[0008] The top of the workbench is fixedly connected to a processing box, one side of the top of the processing box is rotatably connected to a box cover, and the bottom end of the box cover is fixedly connected to a sealing strip, and a fixed rotating mechanism is provided inside the processing box. The fixed rotating mechanism includes a first motor, an output end of the first motor is fixedly connected to a gear, and the outer surface of the gear is meshed with a rack, a through-type long slot is opened at the top of the workbench, and the top of the rack is fixedly connected to a connecting plate, the top of the connecting plate passes through the long slot and is fixedly connected to a movable plate, one end of the movable plate is rotatably connected to the rotating plate, and one side inner wall of the processing box is rotatably connected to a rotating block, one end of the processing box is fixedly connected to a second motor, the second motor passes through one end of the processing box and is fixedly connected to the rotating block, and the top of the workbench is fixedly connected to a filtering mechanism.

[0009] By adopting the above technical solution, before performing the coating operation, the box cover on the top of the processing box is opened, and the semiconductor parts to be coated are placed between the rotating plate and the rotating block, and then the first motor is started. The output end of the first motor can drive the gear to rotate. Since the gear is engaged with the rack, and the sliding bar at one end of the rack cooperates with the sliding groove on the slide rod, the rack can move horizontally stably, and the rack can drive the moving plate to move through the connecting plate, so that the rotating plate is close to the rotating block and clamps the semiconductor parts. After that, the second motor is started. The first motor can drive the rotating block to rotate. Since the centers of the rotating plate and the rotating block are on the same horizontal line, and the semiconductor parts are clamped by the two, the parts can rotate stably with them, and then the semiconductor parts can be sprayed.

[0010] Optionally, the filtering mechanism includes a raw material box, one end of the raw material box is fixedly connected to a connecting pipe, one end of the connecting pipe passes through the processing box and is fixedly connected to an output hose, one end of the output hose is fixedly connected to a spray gun, the bottom end of the spray gun is slidably connected to an electric slide rail, the bottom end of the electric slide rail is fixedly connected to the top of the workbench, one end of the processing box is fixedly connected to an exhaust pipe, one end of the exhaust pipe is fixedly connected to a filter box, three filter frames are fixedly connected to the inner surface of the filter box, the inner surfaces of the three filter frames are respectively provided with an activated carbon fiber filter layer, a zeolite molecular sieve filter layer and a chemical absorbent filter layer, one end of the filter box is fixedly connected to a fan, and the bottom end of the fan is fixedly connected to the top of the workbench.

[0011] By adopting the above technical solution, while the semiconductor parts are rotating, the coating raw materials in the raw material box are transported to the spray gun through the connecting pipe and the retractable polytetrafluoroethylene output hose. The spray gun moves horizontally driven by the electric slide rail, and can evenly coat the rotating semiconductor parts. The exhaust gas generated during the coating process will enter the filter box through the exhaust pipe. The three filter racks of the same size and equal spacing in the filter box, the activated carbon fiber filter layer, the zeolite molecular sieve filter layer and the chemical absorbent filter layer inside the filter box work in turn to effectively filter and treat harmful substances in the exhaust gas. Finally, the treated gas is discharged under the action of the fan.

[0012] Optionally, the bottom end of the first motor is fixedly connected to a support frame, and the top end of the support frame is fixedly connected to the top end of the workbench.

[0013] By adopting the above technical solution, stable support can be provided for the first motor, reducing vibration and shaking of the motor during operation, thereby ensuring the stability and accuracy of the motor operation.

[0014] Optionally, a slide rod is fixedly connected to the bottom end of the workbench, a slide groove is provided at one end of the slide rod, and a slide bar used in conjunction with the slide groove is fixedly connected to one end of the rack.

[0015] By adopting the above technical solution, the rack can be made smoother and more accurate during movement, reducing movement deviation and jamming.

[0016] Optionally, the centers of the rotating plate and the rotating block are on the same horizontal line.

[0017] By adopting the above technical solution, the coaxiality of rotation is guaranteed, the rotation process is made smoother, the additional wear and energy loss caused by misalignment is reduced, and the service life and operating efficiency of the device are improved.

[0018] Optionally, a sealing rod is fixedly connected to one end of the connecting plate, and a sealing groove for cooperating with the sealing rod is opened on an inner wall of one side of the long groove.

[0019] By adopting the above technical solution, the sealing performance of the device can be effectively enhanced, the leakage of coating materials or the entry of external impurities can be prevented, and the coating work can be ensured to be carried out in a relatively closed and pure environment, thereby improving the coating quality.

[0020] Optionally, the three filter racks are distributed at equal intervals, and the three filter racks have the same size.

[0021] By adopting the above technical solution, filter racks with equal spacing and the same size can ensure the uniformity of the filtering effect, making the quality of the filtered material more stable, and also facilitating maintenance and replacement.

[0022] Optionally, the output hose is a retractable hose and is made of polytetrafluoroethylene.

[0023] By adopting the above technical solutions, the retractable design increases the flexibility of operation and facilitates position adjustment in different work scenarios. The polytetrafluoroethylene material has good corrosion resistance and high temperature resistance, and can adapt to the transportation needs of various coating materials.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. This application sets up a fixed rotating mechanism, in which the first motor and the second motor cooperate to enable the device to fix and rotate the semiconductor parts, so that the semiconductor parts can achieve all-round rotation during the coating process, thereby effectively reducing the problem of uneven coating thickness distribution.

[0026] 2. This application uses a filtering mechanism in which three filters filter the exhaust gas generated internally, so that the filtered exhaust gas reduces pollution to the working environment, protects the health of the operators, and thus improves work comfort and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of this application.

[0028] Figure 2 It is a schematic cross-sectional view of the processing box of this application.

[0029] Figure 3 It is a schematic diagram of the bottom of the workbench of this application.

[0030] Figure 4 It is a cross-sectional schematic diagram of the filter box of this application.

[0031] Figure 5 It is a schematic diagram of the box cover of this application.

[0032] Figure 6 It is a schematic diagram of the long groove and sealing rod of this application.

[0033] In the figure, 1. workbench; 2. fixed rotating mechanism; 3. processing box; 4. connecting pipe; 5. raw material box; 6. box cover; 7. filter box; 8. filter mechanism; 11. exhaust pipe; 12. movable plate; 13. rotating plate; 14. electric slide rail; 15. long groove; 16. spray gun; 17. output hose; 18. second motor; 19. rotating block; 21. slide bar; 22. slide rod; 23. rack; 24. first motor; 25. gear; 26. slide groove; 27. support frame; 31. fan; 32. filter frame; 41. sealing strip; 42. sealing groove; 43. sealing rod; 44. connecting plate. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1 -Attached Figure 6 , further details of this application are given. Example

[0035] A semiconductor parts coating device includes a workbench 1. A processing box 3, a raw material box 5 and a filter box 7 are provided on the upper part of the workbench 1. The processing box 3, the raw material box 5 and the filter box 7 are welded to the workbench 1 to facilitate improving the stability of the device. A box cover 6 is rotatably connected to one side of the upper part of the processing box 3. A sealing strip 41 is provided at the lower part of the box cover 6, which can effectively prevent internal exhaust gas leakage. A fixed rotating mechanism 2 is provided inside the processing box 3, and a filter mechanism 8 is provided on the upper part of the workbench 1.

[0036] The fixed rotating mechanism 2 includes a first motor 24, a support frame 27 is provided at the lower part of the first motor 24, the upper part of the support frame 27 is welded to the lower part of the workbench 1, and the output end of the first motor 24 is fixedly connected to a gear 25, one side of the gear 25 is meshed with a rack 23, one side of the rack 23 is provided with a slide bar 21, and the lower part of the workbench 1 is provided with a slide bar 22, and a slide groove 26 is opened on one side of the slide bar 22, and the slide groove 26 is slidably connected to the slide bar 21.

[0037] A long groove 15 is provided on the upper part of the workbench 1, and a connecting plate 44 is installed on the upper part of the rack 23. A sealing rod 43 is provided on one side of the connecting plate 44, and a sealing groove 42 is provided on one side of the long groove 15, which is used to seal the entire processing box 3 and seal exhaust gas leakage. A movable plate 12 is provided on the upper part of the connecting plate 44, and a rotating plate 13 is rotatably connected to one side of the movable plate 12. A rotating block 19 is rotatably connected to one side of the processing box 3. A second motor 18 is provided on one side of the workbench 1, and the output end of the second motor 18 is fixedly connected to one side of the rotating block 19. The center of the rotating plate 13 and the rotating block 19 are on the same horizontal line, which ensures the coaxiality of the rotation, makes the rotation process smoother, reduces the additional wear and energy loss caused by different axes, and improves the service life and operation efficiency of the device.

[0038] The filtering mechanism 8 includes a raw material box 5 and a filter box 7. The raw material box 5 is connected to the processing box 3 through a connecting pipe 4. One side of the connecting pipe 4 passes through the processing box 3 and is installed to the output hose 17. The output hose 17 is a retractable hose and is made of polytetrafluoroethylene. The retractable design increases the flexibility of operation and is convenient for adjusting the position in different working scenarios. Polytetrafluoroethylene material has good corrosion resistance and high temperature resistance, and can adapt to the transportation requirements of various coating materials. A spray gun 16 is provided on one side of the output hose 17, and an electric slide rail 14 is provided at the lower part of the spray gun 16, and is slidably connected to the electric slide rail 14. The electric slide rail 14 is welded to the upper part of the workbench 1, and one side of the filter box 7 is connected to the processing box 3 through an exhaust pipe 11.

[0039] Three filter racks 32 are provided inside the filter box 7. The interiors of the three filter racks 32 are respectively provided with a carbon fiber filter layer, a zeolite molecular sieve filter layer and a chemical absorbent filter layer. These three filter layers work together to more comprehensively and efficiently remove various pollutants in the exhaust gas generated during the coating process of semiconductor parts, thereby achieving the purpose of purifying the air and protecting the environment. The three filter racks 32 are distributed at equal intervals and have the same size. A fan 31 is provided on the other side of the filter box 7, and the lower part of the fan 31 is fixed to the workbench 1 by bolts.

[0040] Working principle: Before the coating operation, open the box cover 6 at the top of the processing box 3, place the semiconductor parts to be coated between the rotating plate 13 and the rotating block 19, and then start the first motor 24. The output end of the first motor 24 can drive the gear 25 to rotate. Since the gear 25 is engaged with the rack 23, and the slide bar 21 at one end of the rack 23 cooperates with the slide groove 26 on the slide bar 22, the rack 23 can move horizontally stably. The rack 23 can drive the moving plate 12 to move through the connecting plate 44, so that the rotating plate 13 is close to the rotating block 19 and the semiconductor parts are clamped and fixed. After that, start the second motor 18 to drive the rotating block 19 to rotate. Since the centers of the rotating plate 13 and the rotating block 19 are on the same horizontal line and the semiconductor parts are clamped by the two, the parts can rotate stably with them, and then the semiconductor parts can be sprayed;

[0041] While the semiconductor parts are rotating, the coating raw materials in the raw material box 5 are transported to the spray gun 16 through the connecting pipe 4 and the retractable polytetrafluoroethylene output hose 17. The spray gun 16 moves horizontally driven by the electric slide 14, and can evenly coat the rotating semiconductor parts. The exhaust gas generated during the coating process will enter the filter box 7 through the exhaust pipe 11. The three filter racks 32 of the same size and distributed at equal intervals in the filter box 7, the activated carbon fiber filter layer, the zeolite molecular sieve filter layer and the chemical absorbent filter layer inside the filter box 7 work in turn to effectively filter and treat harmful substances in the exhaust gas. Finally, the treated gas is discharged under the action of the fan 31.

[0042] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A semiconductor component coating device, comprising a workbench (1), characterized in that: The top of the workbench (1) is fixedly connected to a processing box (3), one side of the top of the processing box (3) is rotatably connected to a box cover (6), the bottom end of the box cover (6) is fixedly connected to a sealing strip (41), and a fixed rotating mechanism (2) is provided inside the processing box (3); The fixed rotating mechanism (2) includes a first motor (24), an output end of the first motor (24) is fixedly connected to a gear (25), an outer surface of the gear (25) is meshedly connected to a rack (23), a top end of the workbench (1) is provided with a through-type long slot (15), a top end of the rack (23) is fixedly connected to a connecting plate (44), a top end of the connecting plate (44) passes through the long slot (15) and is fixedly connected to a movable plate (12), one end of the movable plate (12) is rotatably connected to the rotating plate (13), an inner wall of one side of the processing box (3) is rotatably connected to a rotating block (19), one end of the processing box (3) is fixedly connected to a second motor (18), the second motor (18) passes through one end of the processing box (3) and is fixedly connected to the rotating block (19), and a top end of the workbench (1) is fixedly connected to a filtering mechanism (8).

2. A semiconductor component coating device according to claim 1, characterized in that: The filtering mechanism (8) comprises a raw material box (5), one end of the raw material box (5) is fixedly connected to a connecting pipe (4), one end of the connecting pipe (4) passes through the processing box (3) and is fixedly connected to an output hose (17), one end of the output hose (17) is fixedly connected to a spray gun (16), the bottom end of the spray gun (16) is slidably connected to an electric slide rail (14), the bottom end of the electric slide rail (14) is fixedly connected to the top of the workbench (1), one end of the processing box (3) is fixedly connected to an exhaust pipe (11), one end of the exhaust pipe (11) is fixedly connected to a filter box (7), the inner surface of the filter box (7) is fixedly connected to three filter racks (32), the inner surfaces of the three filter racks (32) are respectively provided with an activated carbon fiber filter layer, a zeolite molecular sieve filter layer and a chemical absorbent filter layer, one end of the filter box (7) is fixedly connected to a fan (31), and the bottom end of the fan (31) is fixedly connected to the top of the workbench (1).

3. The semiconductor component coating device according to claim 1, characterized in that: The bottom end of the first motor (24) is fixedly connected to a support frame (27), and the top end of the support frame (27) is fixedly connected to the top end of the workbench (1).

4. The semiconductor component coating device according to claim 1, characterized in that: The bottom end of the workbench (1) is fixedly connected to a slide bar (22), one end of the slide bar (22) is provided with a slide groove (26), and one end of the rack (23) is fixedly connected to a slide bar (21) used in conjunction with the slide groove (26).

5. The semiconductor component coating device according to claim 1, characterized in that: The centers of the rotating plate (13) and the rotating block (19) are on the same horizontal line.

6. The semiconductor component coating device according to claim 1, characterized in that: One end of the connecting plate (44) is fixedly connected to a sealing rod (43), and an inner wall of one side of the long slot (15) is provided with a sealing slot (42) used in conjunction with the sealing rod (43).

7. The semiconductor component coating device according to claim 2, characterized in that: The three filter racks (32) are distributed at equal intervals, and the three filter racks (32) have the same size.

8. The semiconductor component coating device according to claim 2, characterized in that: The output hose (17) is a retractable hose and is made of polytetrafluoroethylene.

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