High-power IGBT (Insulated Gate Bipolar Translator) cold plate two-phase direct-cooling heat exchanger
By introducing microchannel flow channels, cooling fins and cooling fans into the IGBT cold plate two-phase direct cooling heat exchanger, and combining convection and phase change cooling methods, the heat dissipation problem during IGBT high-power operation is solved, achieving efficient and low-cost heat dissipation effects.
Patent Information
- Application Number
- CN202422629887.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-30
AI Technical Summary
Existing two-phase direct cooling heat exchangers have difficulty dissipating heat in a timely manner when IGBTs are operating at high power, and cannot effectively meet transient cooling needs.
A high-power IGBT cold plate two-phase direct cooling heat exchanger was designed, which includes microchannel flow channels, heat exchange fins, heat dissipation fins, air guide shells and cooling fans. The heat dissipation efficiency is enhanced by using the phase change heat dissipation method of direct blowing of the cooling fan and evaporation and gasification of the refrigerant, combined with convection heat dissipation. The operating power of the cooling fan is regulated by a temperature sensor.
It achieves efficient heat dissipation under transient cooling requirements, improves heat dissipation efficiency, reduces energy consumption, simplifies structure and reduces costs.
Smart Images
Figure CN223345991U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation fans, in particular to a high-power IGBT cold plate two-phase direct cooling heat exchanger. Background Art
[0002] A cold plate is typically a structure used to transfer heat from an IGBT or other power component to a cooling medium. It is usually made of metal (such as aluminum or copper) and is in contact with a cooling liquid. A two-phase direct cooling heat exchanger uses a fluid during a phase change (such as liquid to gas) to exchange heat. This is usually done by absorbing heat and evaporating the fluid in the cooling channel to reduce the operating temperature of the IGBT. Existing two-phase direct cooling heat exchangers generally dissipate heat directly through the phase change process of the refrigerant. When the IGBT starts running at high power, its heat generation increases suddenly. The phase change process takes time, making it difficult to respond to instantaneous thermal changes, resulting in poor heat dissipation under transient cooling needs. Utility Model Content
[0003] In view of the shortcomings of the existing technology, the utility model provides a high-power IGBT cold plate two-phase direct cooling heat exchanger, which solves the technical problem that the existing two-phase direct cooling heat exchanger is difficult to dissipate heat in time when the IGBT starts to run at high power.
[0004] To solve the above technical problems, the present invention provides the following technical solutions: a high-power IGBT cold plate two-phase direct cooling heat exchanger, comprising a cold plate, a microchannel flow channel provided in the cold plate, a cover plate fixedly provided on the front of the cold plate, a lower connecting pipe fixedly provided on the top of the cold plate, a plurality of heat exchange fins fixedly provided on the lower connecting pipe, an upper sealing pipe fixedly provided on the top of the heat exchange fin, a sealing cover fixedly provided at both ends of the lower connecting pipe and the upper sealing pipe, a heat dissipation fin fixedly provided on the back of the cold plate, the heat dissipation fins being located in an air guide housing fixedly provided on the back of the cold plate, a mounting plate fixedly provided on the bottom of the air guide housing, a plurality of heat dissipation fans distributed at equal intervals fixedly provided on the mounting plate;
[0005] The microchannel flow channel includes multiple heat exchange chambers 1 and 2 distributed inside the cold plate. A connecting port is provided between the heat exchange chambers 1 and 2. Both the heat exchange chambers 1 and 2 are connected to two aggregate flow channels through the flow channel outlets. The two aggregate flow channels are provided with through holes and connected to the interior of the lower connecting pipe.
[0006] Preferably, a plurality of protrusions are provided in both the first heat exchange chamber and the second heat exchange chamber, and the second heat exchange chamber has a serpentine structure.
[0007] Preferably, the cover plate is provided with a plurality of heat-conducting parts corresponding to the positions of the heat exchange cavity 1 and the heat exchange cavity 2, and the heat-conducting parts protrude from the surface of the cover plate.
[0008] Preferably, a plurality of channels are provided inside the heat exchange fins.
[0009] Preferably, the side wall of the air guide shell is provided with mounting holes for accommodating heat dissipation fins.
[0010] Preferably, the top of the air guide shell is arc-shaped and closed, and air guide holes are provided on the side wall of the top of the air guide shell facing the heat exchange fins.
[0011] Preferably, a ring-shaped magnetic strip is fixedly provided at the bottom of the mounting plate, and a metal mesh is magnetically connected to the magnetic strip.
[0012] Preferably, the cold plate is embedded with multiple temperature sensors corresponding to the positions of heat exchange chamber 1 and heat exchange chamber 2. The multiple temperature sensors are electrically connected to the speed regulator installed at the bottom of the cold plate through wires, and the speed regulator is also electrically connected to the cooling fan.
[0013] By means of the above technical solution, the utility model provides a high-power IGBT cold plate two-phase direct cooling heat exchanger, which has at least the following beneficial effects:
[0014] 1. This high-power IGBT cold plate two-phase direct cooling heat exchanger is equipped with heat exchange fins, heat dissipation fins, air guide shells and heat dissipation fans. When the IGBT starts to run at high power, its heat generation increases greatly, causing the refrigerant inside the microchannel flow channel to heat up. However, since it takes a certain amount of time for it to reach the evaporation temperature, the heat is transferred to the heat dissipation fins at this time and dissipated by direct blowing of the heat dissipation fan. When the refrigerant reaches the evaporation temperature, the refrigerant evaporates and gasifies and can be dissipated through the heat exchange fins. It can respond to instantaneous thermal changes and has a good heat dissipation effect under transient cooling requirements. It has two heat dissipation modes: convection heat dissipation and phase change heat dissipation, which greatly improves the heat dissipation efficiency of existing two-phase direct cooling heat exchangers.
[0015] 2. This high-power IGBT cold plate two-phase direct cooling heat exchanger can enhance the local heat dissipation effect by setting up micro-channel flow channels, and can cool and dissipate heat for multiple IGBTs at the same time. It is more efficient than traditional water cooling and does not require additional water pumps and pipeline connections. The overall design is simpler and the cost is lower.
[0016] 3. This high-power IGBT cold plate two-phase direct cooling heat exchanger is equipped with a temperature sensor and a speed regulator. Under the action of the temperature sensor, the local temperature changes in the microchannel flow channel are used to monitor the operation of the IGBT, and then the operating power of the cooling fan can be adjusted according to the number of operating IGBTs, which has the advantage of reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:
[0018] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;
[0019] Figure 2 This is a schematic diagram of the structure of the utility model after disassembly;
[0020] Figure 3 This is a schematic diagram of the structure of the components on the cold plate of the utility model;
[0021] Figure 4 This is a schematic diagram of the structure of the connection between the lower connecting pipe, the heat exchange fins and the upper sealing pipe of the utility model;
[0022] Figure 5 This is a schematic diagram of the structure of the heat exchange fin of the utility model from a top view;
[0023] Figure 6 This is a schematic structural diagram of the internal cross-section of the cold plate of the utility model;
[0024] Figure 7 This is a schematic structural diagram of the air guide shell of the utility model;
[0025] Reference numerals:
[0026] 1. Cold plate; 101. Microchannel flow channel; 1011. Heat exchange chamber 1; 1012. Heat exchange chamber 2; 1013. Connecting port; 1014. Flow channel outlet; 1015. Aggregating flow channel; 1016. Through hole; 1017. Protrusion; 2. Cover plate; 3. Heat conduction part; 4. Lower connecting pipe; 5. Heat exchange fin; 501. Channel; 6. Upper sealing pipe; 7. Cover; 8. Heat dissipation fin; 9. Air guide shell; 901. Mounting hole; 902. Air guide hole; 10. Mounting plate; 11. Cooling fan; 12. Magnetic strip; 13. Metal mesh; 14. Temperature sensor; 15. Wire; 16. Speed regulator. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0028] IGBT, also known as insulated gate bipolar transistor, is a high-efficiency switching device widely used in power electronic devices such as inverters and motor drives. It can handle high currents and high voltages while having low switching losses. IGBTs generate a lot of heat when working. The design of cold plate 1 allows it to be in close contact with the IGBT, thereby effectively transferring heat to the coolant. The coolant is usually in liquid form (such as water or some coolant). When it flows through cold plate 1, it absorbs heat and begins to evaporate, thereby carrying away the heat. This process involves a phase change from liquid to gas and has a high heat transfer efficiency. The gaseous coolant is then directed into the cooling system, further cooled, and then circulated back to cold plate 1, thereby continuously exchanging heat.
[0029] Example 1:
[0030] Based on the technical defects of the existing technology that it is difficult to dissipate heat in time when the IGBT starts to operate at high power, please refer to Figure 1-Figure 7 The utility model provides a high-power IGBT cold plate two-phase direct cooling heat exchanger, which can respond to instantaneous thermal changes, has a good heat dissipation effect under transient cooling requirements, and has two heat dissipation methods: convection heat dissipation and phase change heat dissipation, which greatly improves the heat dissipation efficiency of the existing two-phase direct cooling heat exchanger. The heat exchanger includes a cold plate 1, a microchannel flow channel 101 is provided in the cold plate 1, a cover plate 2 is fixed on the front of the cold plate 1, a lower connecting pipe 4 is fixed on the top of the cold plate 1, a plurality of heat exchange fins 5 are fixed on the lower connecting pipe 4, an upper sealing pipe 6 is fixed on the top of the heat exchange fin 5, and both ends of the lower connecting pipe 4 and the upper sealing pipe 6 are fixed with a sealing cover 7, and the back of the cold plate 1 is fixed with a heat dissipation fin 8, and the heat dissipation fin 8 is located in the air guide shell. 9, the air guide shell 9 is fixed on the back of the cold plate 1, and a mounting plate 10 is fixed on the bottom of the air guide shell 9, and a plurality of equidistantly distributed heat dissipation fans 11 are fixed on the mounting plate 10; when the IGBT starts to run at high power, its heat generation increases greatly, which will cause the refrigerant inside the microchannel flow channel 101 to become hot, but since it takes a certain amount of time to reach the evaporation temperature, the heat is conducted to the heat dissipation fins 8 at this time, and the heat is dissipated by direct blowing of the heat dissipation fan 11. When the refrigerant reaches the evaporation temperature, the refrigerant evaporates and gasifies and can enter the heat exchange fins 5. Then, under the action of the air guide shell 9, the wind blown by the heat dissipation fan 11 can take away the heat on the heat exchange fins 5, thereby liquefying the refrigerant and flowing back into the cold plate 1.
[0031] To achieve rapid heating of the refrigerant, please refer to Figure 3The microchannel flow channel 101 includes a plurality of heat exchange chambers 1011 and heat exchange chambers 1012 distributed inside the cold plate 1. A connecting port 1013 is provided between the heat exchange chamber 1011 and the heat exchange chamber 2 1012. The heat exchange chamber 1 1011 and the heat exchange chamber 2 1012 are both connected to the two summary flow channels 1015 through the flow channel outlet 1014. The two summary flow channels 1015 are provided with through holes 1016 and are connected to the interior of the lower connecting pipe 4. The refrigerant can flow with each other under the action of the heat exchange chamber 1011 and the heat exchange chamber 2 1012, so that the heat distribution is more uniform. When the refrigerant is heated and evaporated, the gaseous refrigerant can enter the lower connecting pipe 4 through the summary flow channel 1015, and rise from the lower connecting pipe 4 to the heat exchange fins 5 for heat dissipation.
[0032] In order to increase the contact area between the refrigerant and the cold plate 1, multiple protrusions 1017 are provided in the heat exchange chamber 1 1011 and the heat exchange chamber 2 1012, and the heat exchange chamber 2 1012 has a serpentine structure; the setting of the protrusions 1017 can increase the contact area between the refrigerant and the cold plate 1, thereby making the refrigerant heat up and vaporize faster, and the setting of the serpentine structure can make the refrigerant flow path longer, so that the refrigerant will stay in the heating part for a longer time.
[0033] In order to facilitate the contact between the cold plate 1 and the IGBT, a plurality of heat-conducting parts 3 corresponding to the positions of the heat exchange cavity 1 1011 and the heat exchange cavity 2 1012 are provided on the cover plate 2, and the heat-conducting parts 3 protrude from the surface of the cover plate 2; because the heat-conducting parts 3 protrude from the surface of the cover plate 2, the heat-conducting parts 3 can just fit on the IGBT, thereby conducting the heat generated when the IGBT is running.
[0034] In order to improve the liquefaction efficiency of the gaseous refrigerant, a plurality of channels 501 are provided inside the heat exchange fins 5 ; the provision of the channels 501 can increase the inner surface area of the heat exchange fins 5 , thereby improving the heat dissipation effect of the heat exchange fins 5 .
[0035] In order to facilitate the installation of the heat dissipation fins 8 into the air guide shell 9 , a mounting hole 901 for accommodating the heat dissipation fins 8 is provided on the side wall of the air guide shell 9 .
[0036] In order to achieve the purpose of optimizing the air duct, the top of the air guide shell 9 is arc-shaped and closed, and an air guide hole 902 is provided on the side wall of the top of the air guide shell 9 facing the heat exchange fins 5; when the heat dissipation fan 11 is running, the air blowing can act on the heat dissipation fins 8 and the heat exchange fins 5 at the same time, thereby having a good heat dissipation effect.
[0037] To prevent dust or other debris from affecting the operation of the cooling fan 11, a ring-shaped magnetic strip 12 is fixed at the bottom of the mounting plate 10, and a metal mesh 13 is magnetically connected to the magnetic strip 12; the metal mesh 13 can be magnetically mounted on the outside of the cooling fan 11, which is convenient for disassembly and assembly, and also has a good dustproof protection effect.
[0038] Example 2:
[0039] Since the first embodiment is for heat dissipation of multiple IGBTs, but the multiple IGBTs do not necessarily all operate at the same time, when only one or a few of them are working, the heat dissipation fan 11 does not need to operate at high speed. Therefore, based on the first embodiment, a plurality of temperature sensors 14 corresponding to the positions of the heat exchange chamber 1 1011 and the heat exchange chamber 2 1012 are embedded in the cold plate 1, and the plurality of temperature sensors 14 are electrically connected to the speed regulator 16 installed at the bottom of the cold plate 1 through the wire 15. The speed regulator 16 is also electrically connected to the heat dissipation fan 11; under the action of the temperature sensor 14, the operation status of the IGBT is monitored by the local temperature change in the micro-channel flow channel 101. For example, when only one IGBT is working, the local temperature of the heat exchange chamber 1 1011 or the heat exchange chamber 2 1012 near this position will be higher than the local temperature at other positions, thereby judging that the IGBT at this position is in the working state. By knowing that several IGBTs are in the operating state, the operating power of the heat dissipation fan 11 can be adjusted under the action of the speed regulator 16.
[0040] It can be seen from the above embodiments that: when the IGBT starts to operate at high power, its heat generation increases greatly, which will cause the refrigerant inside the microchannel flow channel 101 to become hot. However, since it takes a certain amount of time for it to reach the evaporation temperature, the heat is conducted to the heat dissipation fins 8 at this time, and the heat is dissipated by direct blowing of the heat dissipation fan 11. When the refrigerant reaches the evaporation temperature, the refrigerant evaporates and gasifies and can enter the heat exchange fins 5. Then, under the action of the air guide shell 9, the wind blown by the heat dissipation fan 11 can take away the heat on the heat exchange fins 5, thereby liquefying the refrigerant and flowing back to the cold plate 1.
[0041] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements that are inherent to such process, method, article or apparatus.
[0042] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-power IGBT cold plate two-phase direct cooling heat exchanger, comprising a cold plate (1), characterized in that: The cold plate (1) is provided with a microchannel flow passage (101), a cover plate (2) is fixedly provided on the front of the cold plate (1), a lower connecting tube (4) is fixedly provided on the top of the cold plate (1), a plurality of heat exchange fins (5) are fixedly provided on the lower connecting tube (4), an upper sealing tube (6) is fixedly provided on the top of the heat exchange fins (5), both ends of the lower connecting tube (4) and the upper sealing tube (6) are fixedly provided with a sealing cover (7), a heat dissipation fin (8) is fixedly provided on the back of the cold plate (1), the heat dissipation fin (8) is located in an air guide shell (9), the air guide shell (9) is fixedly provided on the back of the cold plate (1), a mounting plate (10) is fixedly provided on the bottom of the air guide shell (9), and a plurality of heat dissipation fans (11) distributed at equal intervals are fixedly provided on the mounting plate (10); The microchannel flow channel (101) includes a plurality of heat exchange chambers (1011) and heat exchange chambers (1012) distributed inside the cold plate (1). A communication port (1013) is provided between the heat exchange chambers (1011) and the heat exchange chambers (1012). Both the heat exchange chambers (1011) and the heat exchange chambers (1012) are connected to two aggregate flow channels (1015) through flow channel outlets (1014). The two aggregate flow channels (1015) are provided with through holes (1016) and are connected to the interior of the lower connecting pipe (4).
2. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: A plurality of protrusions (1017) are provided in both the heat exchange chamber 1 (1011) and the heat exchange chamber 2 (1012), and the heat exchange chamber 2 (1012) is a serpentine structure.
3. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The cover plate (2) is provided with a plurality of heat-conducting parts (3) corresponding to the positions of the first heat exchange cavity (1011) and the second heat exchange cavity (1012), and the heat-conducting parts (3) protrude from the surface of the cover plate (2).
4. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: A plurality of channels (501) are provided inside the heat exchange fin (5).
5. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The side wall of the air guide shell (9) is provided with a mounting hole (901) for accommodating the heat dissipation fins (8).
6. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The top of the air guide shell (9) is arc-shaped and closed, and an air guide hole (902) is provided on the side wall of the top of the air guide shell (9) facing the heat exchange fins (5).
7. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: A ring-shaped magnetic strip (12) is fixedly provided at the bottom of the mounting plate (10), and a metal mesh (13) is magnetically connected to the magnetic strip (12).
8. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The cold plate (1) is embedded with a plurality of temperature sensors (14) corresponding to the positions of the heat exchange chamber 1 (1011) and the heat exchange chamber 2 (1012). The plurality of temperature sensors (14) are electrically connected to a speed regulator (16) installed at the bottom of the cold plate (1) through a wire (15). The speed regulator (16) is also electrically connected to the heat dissipation fan (11).