Silicon wafer transfer box

Abstract

The utility model discloses a silicon wafer transfer box which comprises a silicon wafer box, a box cover is buckled at the top end of the silicon wafer box, a box groove is formed in the silicon wafer box, separation structures are arranged in the box groove, placing clamping grooves are formed between the separation structures, installation structures are installed on the separation structures, and point contact structures are installed on the installation structures. An adjusting structure is slidably connected to the mounting structure in a damping mode. The silicon wafer box has the beneficial effects that silicon wafers can be effectively clamped and placed in the box grooves of the silicon wafer box through the separation structures, meanwhile, the clamping and placing effect on the silicon wafers can be improved through the cooperation of the installation structures and the point contact structures, and the clamping force can be further improved through the adjusting structures; and meanwhile, silicon wafers with different thicknesses can be placed according to actual requirements, so that the silicon wafer box has diversified functions.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer transportation, in particular to a silicon wafer transfer box. Background Art

[0002] Silicon wafers are the raw materials for making transistors and integrated circuits. They are generally slices of single-crystal silicon. Silicon wafers are an important material for making integrated circuits. Through photolithography, ion implantation, and other methods, they can be made into various semiconductor devices. Silicon wafer transfer boxes, also known as wafer boxes or silicon wafer boxes, are specialized containers used to store and transport semiconductor wafers and silicon wafers. They play a vital role in the semiconductor manufacturing process. Existing silicon wafer transfer boxes can generally only accommodate silicon wafers of a fixed thickness, and the clamping force after placement cannot be adjusted, resulting in poor functionality. Utility Model Content

[0003] In view of the problems in the related art, the present invention proposes a silicon wafer transfer box to overcome the above technical problems existing in the existing related art.

[0004] To this end, the specific technical solutions adopted in this utility model are as follows:

[0005] A silicon wafer transfer box includes a silicon wafer box, a box cover is buckled on the top of the silicon wafer box, a box slot is opened in the silicon wafer box, a partition structure is provided in the box slot, a clamping groove is provided between the partition structures, a mounting structure is installed on the partition structure, a touch structure is installed on the mounting structure, and an adjustment structure is provided on the mounting structure for damping sliding connection.

[0006] Furthermore, the partition structure includes a partition block, a first plug-in slot, and a first through-connection slot, and one side of the partition block is provided with the first plug-in slot.

[0007] Furthermore, first connecting grooves are opened on both sides of the dividing block, and the dividing blocks are evenly divided and installed in the box groove.

[0008] Furthermore, the mounting structure includes a mounting block, a second through-connection groove, and a second plug-in groove, and the second through-connection grooves are opened on both sides of the mounting block.

[0009] Furthermore, a second plug-in slot is provided on one side of the mounting block, and the mounting block is installed in the first plug-in slot with damping sliding.

[0010] Furthermore, the touch structure includes a touch block, an umbrella-shaped support pad, and a connecting rubber strip. One side end of the touch block is fixedly connected to the umbrella-shaped support pad, and the touch block is connected to the connecting rubber strip.

[0011] Furthermore, the contact blocks are connected by connecting rubber strips, and the connecting rubber strips are bonded in the second connecting grooves.

[0012] Furthermore, the adjustment structure includes an adjustment block, a fitting groove, a fixed block, and an elastic rope. Fitting grooves are provided on both sides of the adjustment block. One side of the adjustment block is fixedly connected to a fixed block. An elastic rope is connected between the fixed blocks. The adjustment block is damped and slidably installed in the second plug-in slot.

[0013] The beneficial effects of the present invention are as follows: the silicon wafer box of the present invention can effectively clamp and place the silicon wafers through the partition structure provided in the box slot, and the installation structure provided in combination with the touch structure can improve the clamping and placement effect of the silicon wafers, and the adjustment structure can further increase the clamping force. At the same time, silicon wafers of different thicknesses can be placed according to actual needs, making the silicon wafer box function diversified. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 This is a schematic diagram of the main structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of a box slot of a silicon wafer transfer box according to an embodiment of the present utility model;

[0017] Figure 3 This is a schematic diagram of a placement clamping groove of a silicon wafer transfer box according to an embodiment of the present utility model;

[0018] Figure 4 This is one of the schematic diagrams of the partition structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0019] Figure 5 This is a second schematic diagram of a partition structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0020] Figure 6 This is one of the schematic diagrams of the installation structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0021] Figure 7 This is a second schematic diagram of the installation structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0022] Figure 8 This is a schematic diagram of a touch structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0023] Figure 9This is an enlarged view of the touch structure of a silicon wafer transfer box according to an embodiment of the present utility model;

[0024] Figure 10 It is a schematic diagram of the adjustment structure of a silicon wafer transfer box according to an embodiment of the present utility model.

[0025] In the picture:

[0026] 1. Wafer box; 2. Box cover; 3. Box slot; 4. Partition structure; 401. Partition block; 402. First plug-in slot; 403. First through-connection slot; 5. Placement clip slot; 6. Mounting structure; 601. Mounting block; 602. Second through-connection slot; 603. Second plug-in slot; 7. Touch structure; 701. Touch block; 702. Umbrella-shaped support pad; 703. Connecting rubber strip; 8. Adjustment structure; 801. Adjustment block; 802. Fitting slot; 803. Fixing block; 804. Elastic rope. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] According to an embodiment of the present utility model, a silicon wafer transfer box is provided.

[0029] Embodiment 1;

[0030] like Figure 1-10 As shown, the silicon wafer transfer box according to the embodiment of the present invention includes a silicon wafer box 1, a box cover 2 is buckled on the top of the silicon wafer box 1, a box slot 3 is opened in the silicon wafer box 1, a placement clamping groove 5 is provided between the partition structures 4, a placement clamping groove 5 is formed between the partition structures 4 fixedly installed in the box slot 3, and the placement clamping groove 5 is used to place silicon wafers, a partition structure 4 is provided in the box slot 3, a mounting structure 6 is installed on the partition structure 4, a touch structure 7 is installed on the mounting structure 6, and an adjustment structure 8 is provided on the mounting structure 6 for damping sliding connection, and the mounting structure 6 and the touch structure 7 introduced in the partition structure 4 can improve the clamping and fixing effect of the silicon wafer, and the clamping force can be further improved by adjusting the structure 8, and silicon wafers with smaller thickness can also be clamped, thereby improving the utilization rate of the silicon wafer box 1.

[0031] The partition structure 4 includes a partition block 401, a first plug-in slot 402, and a first through-connection slot 403. The first plug-in slot 402 is opened on one side of the partition block 401. The partition blocks 401 of the partition structure 4 are evenly separated and installed in the box slot 3. A placement clamping slot 5 is formed between the partition blocks 401. The installation structure 6 is overall damped and slid into the first plug-in slot 402. First through-connection slots 403 are opened on both sides of the partition block 401. The partition block 401 is evenly separated and installed in the box slot 3. The contact block 701 of the contact structure 7 will pass through the first through-connection slot 403 and then contact the silicon wafer to play a contact fixation role. The contact block 701 and the umbrella-shaped support pad 702 are both flexible colloids, wherein the umbrella-shaped support pad 702 is supported on the inner side of the second through-connection slot 602, and because the connecting rubber strip 703 is fixedly bonded to the second through-connection slot 602, the umbrella-shaped support pad 702 can provide a certain support force to the contact block 701, thereby maintaining a better silicon wafer clamping force.

[0032] The contact structure 7 includes a contact block 701, an umbrella-shaped support pad 702, and a connecting rubber strip 703. One side end of the contact block 701 is fixedly connected to the umbrella-shaped support pad 702. The contact block 701 is connected to the connecting rubber strip 703. The contact blocks 701 are connected by the connecting rubber strip 703. The connecting rubber strip 703 is bonded to the second penetration groove 602. The adjustment structure 8 includes an adjustment block 801, a fitting groove 802, a fixed block 803, and an elastic rope 804. Fitting grooves 802 are provided on both sides of the adjustment block 801. A fixed block 803 is fixedly connected to one side of the adjustment block 801. An elastic rope 804 is connected between the fixed blocks 803. The adjustment block 801 is damped and slidingly installed in the second plug-in groove 603. The mounting structure 6 includes a mounting block 601, The second through-connection groove 602 and the second plug-in groove 603 are provided on both sides of the mounting block 601, and the second plug-in groove 603 is provided on one side of the mounting block 601. The mounting block 601 is damped and slidably mounted in the first plug-in groove 402. After the adjustment block 801 of the adjustment structure 8 is damped and slidably pressed in the second plug-in groove 603, its fitting groove 802 will fit in the position of the umbrella-shaped support pad 702 to play a certain fixing effect, and at the same time, the umbrella-shaped support pad 702 will be squeezed to move its contact block 701 outward, thereby clamping thinner silicon wafers and providing greater clamping force for silicon wafers of normal thickness. The adjustment block 801 can be easily pulled out through the elastic rope 804, thereby improving the convenience of installation and disassembly.

[0033] In order to facilitate understanding of the above technical solutions of the present invention, the working principle or operation method of the present invention in actual process is described in detail below.

[0034] The partitioning blocks 401 of the partitioning structure 4 are evenly distributed and installed in the box groove 3. A placement groove 5 is formed between the partitioning blocks 401. The mounting structure 6 is damped and slidably introduced into the first plug-in groove 402. The contact block 701 of the touch structure 7 will pass through the first penetration groove 403 and then contact the silicon wafer to play a contact fixation role. The contact block 701 and the umbrella-shaped support pad 702 are both flexible colloids, wherein the umbrella-shaped support pad 702 is supported on the inner side of the second penetration groove 602, and because the connecting strip 703 is fixedly bonded to the second penetration groove 602, the umbrella-shaped support pad 702 can contact the touch Block 701 provides a certain supporting force, which can maintain a good silicon wafer clamping force. After the adjustment block 801 of the adjustment structure 8 is damped and slidably pressed in the second plug-in slot 603, its fitting groove 802 will fit with the position of the umbrella-shaped support pad 702 to play a certain fixing effect. At the same time, the umbrella-shaped support pad 702 will be squeezed to move its contact block 701 outward, thereby clamping thinner silicon wafers and providing greater clamping force for silicon wafers of normal thickness. The adjustment block 801 can be easily pulled out through the elastic rope 804, thereby improving the convenience of installation and disassembly.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A silicon wafer transfer box, characterized in that: The invention comprises a silicon wafer box (1), wherein a box cover (2) is buckled on the top of the silicon wafer box (1), a box slot (3) is provided in the silicon wafer box (1), a partition structure (4) is provided in the box slot (3), a placement clamping groove (5) is provided between the partition structures (4), a mounting structure (6) is installed on the partition structure (4), a contact structure (7) is installed on the mounting structure (6), and an adjustment structure (8) is connected to the mounting structure (6) in a damping sliding manner.

2. The silicon wafer transfer box according to claim 1, characterized in that: The partition structure (4) comprises a partition block (401), a first plug-in slot (402), and a first through-connection slot (403). One side of the partition block (401) is provided with the first plug-in slot (402).

3. The silicon wafer transfer box according to claim 2, characterized in that: First connecting grooves (403) are provided on both sides of the partition block (401), and the partition blocks (401) are evenly spaced and installed in the box slot (3).

4. The silicon wafer transfer box according to claim 3, characterized in that: The mounting structure (6) comprises a mounting block (601), a second through-connection slot (602), and a second plug-in slot (603). The second through-connection slots (602) are provided on both sides of the mounting block (601).

5. The silicon wafer transfer box according to claim 4, characterized in that: A second plug-in slot (603) is provided on one side of the installation block (601), and the installation block (601) is installed in the first plug-in slot (402) in a damping sliding manner.

6. The silicon wafer transfer box according to claim 5, characterized in that: The touch structure (7) comprises a touch block (701), an umbrella-shaped support pad (702), and a connecting rubber strip (703); one side end of the touch block (701) is fixedly connected to the umbrella-shaped support pad (702); and the touch block (701) is connected to the connecting rubber strip (703).

7. The silicon wafer transfer box according to claim 6, characterized in that: The contact blocks (701) are connected via the connecting adhesive strip (703), and the connecting adhesive strip (703) is bonded in the second connecting groove (602).

8. The silicon wafer transfer box according to claim 7, characterized in that: The adjustment structure (8) comprises an adjustment block (801), a fitting groove (802), a fixed block (803), and an elastic rope (804); the fitting grooves (802) are provided on both sides of the adjustment block (801); one side of the adjustment block (801) is fixedly connected to the fixed block (803); an elastic rope (804) is connected between the fixed blocks (803); and the adjustment block (801) is damped and slidably installed in the second plug-in groove (603).

Images