LED pre-cutting substrate separating device
By combining the automatic squeezing mechanism and the fixing mechanism, the automatic separation of the LED pre-cut substrate is achieved, which solves the time-consuming and labor-intensive problems in the prior art and improves the separation efficiency.
Patent Information
- Application Number
- CN202422662448.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-31
AI Technical Summary
In the prior art, the process of separating LED pre-cut substrates is time-consuming and labor-intensive, and requires manual operation.
The LED pre-cut substrate separation device adopts an automatic squeezing mechanism and a fixing mechanism. The automatic squeezing mechanism applies force to the edge of the pre-cut substrate to break the pre-cut line. The airbag and the fixing wall fix the substrate to achieve automatic separation of the substrate.
It realizes the rapid separation of LED pre-cut substrates, reduces manual operations and improves work efficiency.
Smart Images
Figure CN223349019U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED pre-cut substrate separation, in particular to an LED pre-cut substrate separation device. Background Art
[0002] The LED unit production process is as follows: a pre-cut substrate motherboard with multiple rows and columns of chip packaging areas is taken, and an LED chip is placed on each chip packaging area to form the LED pre-cut substrate motherboard; then, the pre-cut LED substrate motherboard is encapsulated using an encapsulation material such as glass or plastic. After encapsulation, the pre-cut LED substrate motherboard is manually broken into multiple daughter boards along the pre-cut lines between each pair of adjacent chip packaging areas. Each daughter board is then processed individually and manually broken into multiple LED units along the pre-cut lines between each pair of adjacent chip packaging areas. The entire process is time-consuming and labor-intensive. Utility Model Content
[0003] The technical problem to be solved by the utility model is to provide a device for separating LED pre-cut substrates, which can be used to separate a whole pre-cut substrate into a plurality of LED units, thereby saving time and labor in operation.
[0004] In order to solve the above technical problems, the LED pre-cut substrate separation device of the present invention is provided with a placement rack for placing the LED pre-cut substrate encapsulated with multiple rows and columns of LED chips. The placement rack is provided with a substrate extension opening for allowing a row of chip encapsulation areas on the edge of the LED pre-cut substrate to extend longitudinally out of the placement rack; an automatic squeezing and breaking mechanism is provided to apply horizontal force to the row of chip encapsulation areas on the edge of the LED pre-cut substrate that has extended out of the placement rack until the horizontal pre-cut line connecting the chip encapsulation areas is squeezed off, thereby separating the chip encapsulation areas from the substrate.
[0005] Furthermore, the placement rack is specifically a vertical placement rack for vertically placing the LED pre-cut substrate. The substrate extension port is opened at the bottom of the placement rack, allowing a row of chip packaging areas at the bottom edge of the LED pre-cut substrate to vertically extend to the bottom of the placement rack. The automatic squeezing and breaking mechanism is specifically arranged under the placement rack, and applies horizontal force to the row of chip packaging areas at the bottom edge of the LED pre-cut substrate that has extended to the bottom of the placement rack.
[0006] Furthermore, the placement rack is provided with a fixing mechanism for fixing the LED pre-cut substrate when the automatic squeezing and breaking mechanism applies a force laterally to the LED pre-cut substrate.
[0007] Furthermore, the fixing mechanism includes relative airbags and fixed walls, and a substrate placement position for placing the LED pre-cut substrate is reserved between the airbag and the fixed wall; the positioning mechanism also includes an air cylinder, which pumps gas into the airbag to expand the airbag toward the fixed wall until the airbag and the fixed wall jointly clamp the LED pre-cut substrate placed in the substrate placement position to fix it.
[0008] Furthermore, the air pump is driven to inflate by an automatic squeeze-off mechanism.
[0009] Furthermore, the automatic squeezing and breaking mechanism drives the air cylinder to inflate the LED pre-cut substrate synchronously when applying lateral force to the substrate.
[0010] Furthermore, the automatic squeezing and breaking mechanism includes a lateral pushing block and a driving unit connected to the lateral pushing block. The piston of the gas cylinder is fixedly connected to the lateral pushing block. The driving unit drives the lateral pushing block to move laterally to push the edge of the LED pre-cut substrate that has extended out of the placement rack. The chip packaging area of a row is then synchronously driven by the lateral pushing block to move the piston of the gas cylinder to inject gas into the airbag.
[0011] Furthermore, a supporting pad is provided under the placement rack for supporting a row of chip packaging areas at the bottom edge.
[0012] Furthermore, the supporting pad is specifically a conveyor belt, which transports the separated chip packaging area away from under the placement rack.
[0013] Furthermore, a conveying mechanism is provided at the substrate extension port to transport the separated chip packaging area away.
[0014] When using this device, a whole LED pre-cut substrate motherboard with multiple rows and columns of LED chips is first divided into multiple daughter boards, and then the multiple daughter boards are divided into multiple LED units. The specific operation is as follows:
[0015] (1) Divide a whole LED pre-cut substrate motherboard encapsulating multiple rows and columns of LED chips into multiple daughter boards.
[0016] The pre-cut LED substrate motherboard is placed lengthwise on the rack, with the chip packaging area extending out of the rack through the substrate extension opening. The automatic breaking mechanism applies lateral force to the chip packaging area extending out of the rack, until the lateral pre-cut line connecting the chip packaging area is severed, separating the chip packaging area from the motherboard to form a daughter board. The daughter board is collected, and the automatic breaking mechanism resets. The chip packaging area is again allowed to extend out of the rack, and the automatic breaking mechanism applies lateral force to this row of chip packaging, separating it from the motherboard. This process repeats until the automatic breaking mechanism separates the last two rows of chip packaging from the motherboard.
[0017] (2) Divide multiple sub-boards into multiple LED units.
[0018] The method is similar to the above (1), except that: in the above (1), the entire motherboard is placed longitudinally on the placement rack, and a row of chip packaging areas on the edge of the motherboard extends out of the placement rack, and the automatic squeezing mechanism applies a horizontal force to this row of chip packaging areas to separate it from the motherboard to form a daughter board; in (2), each LED pre-cut substrate daughter board is placed longitudinally on the placement rack in a multi-row single column state, and multiple daughter boards are arranged in parallel to form an LED pre-cut substrate encapsulated with multiple rows and columns of LED chips, and a row of chip packaging areas on the edges of multiple daughter boards extend out of the placement rack in parallel, and the automatic squeezing mechanism applies a horizontal force to this row of chip packaging areas to separate it from the multiple daughter boards to form multiple LED units.
[0019] This device uses an automatic squeezing mechanism to first separate the entire LED pre-cut substrate motherboard into multiple LED substrate daughterboards, and then separate the multiple LED pre-cut substrate daughterboards into multiple LED units. This eliminates the need to manually break the LED pre-cut substrates, saving effort. During (2) operation, the automatic squeezing mechanism only needs to apply force horizontally once to separate a row of chip packaging areas on the edges of the multiple LED pre-cut substrate daughterboards to form multiple LED units. In other words, this device can process multiple daughterboards simultaneously, rather than processing each one individually, resulting in high work efficiency (i.e., time saving). BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of an LED pre-cut substrate separation device.
[0021] Figure 2 It is a schematic diagram of placing an LED pre-cut substrate motherboard on a placement rack of an LED pre-cut substrate separation device.
[0022] Figure 3 It is a cross-sectional view of an LED pre-cut substrate separation device.
[0023] Figure 4 It is a cross-sectional view of the LED pre-cut substrate separation device pushing the LED pre-cut substrate motherboard laterally.
[0024] Figure 5 This is a schematic diagram of seven LED pre-cut substrate daughter boards placed on a placement rack of an LED pre-cut substrate separation device. In the figure, the LED pre-cut substrate separation device pushes the seven chip packaging areas at the bottom edges of the seven LED pre-cut substrate daughter boards. DETAILED DESCRIPTION
[0025] The present invention is further described in detail below in conjunction with specific embodiments.
[0026] LED pre-cut substrate separation device Figure 1 , including a base 6, the front portion 61 of the base 6 is equipped with a vertical placement rack 2 on top and a horizontal conveying mechanism 1 on the bottom. Figure 3 , including two rotating shafts 11 (one in front and one in the back) Figure 3 Only the rear rotation shaft 11 is shown in the figure, which is respectively rotatably mounted on the front portion 61 of the base 6; the outer sides of the two rotation shafts 11 are covered with a transverse conveyor belt 13 in the front and rear directions. Figure 2 and Figure 3 The vertical placement rack 2 is a longitudinal placement rack, which has a vertical placement slot 20 extending vertically through it. The lower notch 21 of the vertical placement slot 20 is located at the bottom of the placement rack 2, facing downwardly towards the rear end 131 of the conveyor belt 13. An automatic breaking mechanism 4 is mounted on the rear portion 62 of the base 6. The mechanism includes an electric push rod 42, the rod body 421 of which faces forward and is equipped with a transverse pushing block 41. The transverse pushing block 41 is located between the placement rack 2 and the rear end 131 of the conveyor belt 13 and below and behind the lower notch 21 of the placement slot 20. The rear inner wall of the placement rack 2, i.e., the rear wall 201 of the placement slot 20, has a mounting slot 203. A deflated airbag 51 is mounted in the mounting slot 203, facing the front wall 202 of the placement slot 20, with a substrate placement position 50 left between the mounting slot 203 and the front wall 202 of the placement slot 20. An air cylinder 53 is mounted on the outer wall of the rear side of the placement rack 2. The piston 531 of the air cylinder 53 is located at the rear end of the cylinder cavity 535 of the air cylinder 53 and is connected to the connecting rack 532 as shown in FIG. Figure 1 As shown, the cylinder 53 is fixedly connected to the transverse pushing block 41 , and the cylinder body 530 of the air cylinder 53 extends forward to have an air outlet pipe 532 connected to the air bag 51 .
[0027] When using, see Figure 2 and Figure 5 First, a whole LED pre-cut substrate motherboard 3 encapsulating 7 rows and 7 columns of LED chips 31 is divided into 7 daughter boards 30, and then the 7 daughter boards 30 are divided into 49 LED units 5. The specific operations are as follows:
[0028] (1) A whole LED pre-cut substrate motherboard 3 encapsulating 7 rows and 7 columns of LED chips 31 is divided into 7 daughter boards 30 .
[0029] See Figure 2 and Figure 3, vertically place the LED pre-cut substrate motherboard 3 into the placement slot 20 of the placement rack 2. The lower notch 21 of the placement slot 20 serves as the substrate extension port. The first row of chip packaging area 321 of the LED pre-cut substrate motherboard 3 is located at the bottom edge. As a row of chip packaging areas at the bottom edge, this row of chip packaging areas 321 extends vertically from the lower notch 21 to the bottom of the placement rack 2. Its top is connected to the second row of chip packaging areas 322 via a transverse pre-cutting line 33. The conveyor belt 13 also serves as a supporting pad, supporting the first row of chip packaging areas 321 of the LED pre-cut substrate motherboard 3. In this state, the second and third rows of chip packaging areas 322 and 323 of the LED pre-cut substrate motherboard 3 are located at the substrate placement position 50 of the placement rack 2. See Figure 4 , controlling the electric push rod 42 to extend the rod body 421 forward. The electric push rod 42 acts as a driving unit, driving the lateral pushing block 41 to move forward and lateral push the first row of chip packaging areas 321 of the LED pre-cut substrate motherboard 3, thereby applying lateral force to this row of chip packaging areas 321 until the lateral pre-cut line 33 connecting this row of chip packaging areas 321 is squeezed and severed, thereby separating this row of chip packaging areas 321 from the LED pre-cut substrate motherboard 3 to form a daughter board 30. During the process of extending the rod body 421 of the electric push rod 42 forward, the lateral pushing block 41 synchronously drives the piston 531 of the gas cylinder 53 to move forward, injecting the gas in the cylinder body 530 into the air bag 51, causing the air bag 51 to expand forward. When the rod body 421 of the electric push rod 42 extends forward by 5 mm, the horizontal pushing block 41 just squeezes the horizontal pre-cutting line 33 of the LED pre-cut substrate motherboard 3, and the piston 531 of the air cylinder 53 just moves to the front end of the cylinder cavity 535. In this state, the front groove wall 202 of the placement groove 20 serves as a fixed wall, which together with the air bag 51 forms a fixing mechanism, and together clamps the second and third row chip packaging areas 322 and 323 of the LED pre-cut substrate motherboard 3, thereby fixing the LED pre-cut substrate motherboard 3.
[0030] See Figure 4 , manually move the conveyor belt 13, and send the separated sub-boards 30 from the bottom of the placement rack 2 to the front end of the conveyor belt 13, and then collect the sub-boards 30. Control the electric push rod 42 to retract its rod body 421 backward to drive the lateral pushing block 41 to move backward and reset. During this process, the electric push rod 42 drives the piston 531 to move backward through the lateral pushing block 41 to draw the gas in the airbag 51 back into the cylinder 530 of the cylinder 53, so that the airbag 51 becomes deflated. The deflated airbag 51 no longer clamps the LED pre-cut substrate motherboard 3. Since the bottom of the LED pre-cut substrate motherboard 3 loses support and is no longer clamped, it naturally moves downward under the action of gravity. The original second row of chip packaging area 322 is now located at the bottom edge of the LED pre-cut substrate motherboard 3. As a row of chip packaging areas at the bottom edge, this row of chip packaging areas 322 extends from the lower notch 21 to the bottom of the placement rack 2. See Figure 4, the electric push rod 42 is controlled to extend forward again, and its rod body 421 drives the lateral pushing block 41 to move forward and lateral push the original second row chip packaging area 322 of the LED pre-cut substrate motherboard 3, thereby applying lateral force to it to separate it from the LED pre-cut substrate motherboard 3 to form the daughter board 30. During the extension process, the rod body 421 of the electric push rod 42 drives the piston 531 of the gas cylinder 53 again to move forward, pumping the gas in the cylinder body 530 of the gas cylinder 53 into the gas bag 51, so that the gas bag 51 and the front groove wall 202 of the placement groove 20 once again clamp the LED pre-cut substrate motherboard 3. This process is repeated until the electric push rod 42 drives the lateral pushing block 41 to push horizontally for the sixth time, separating the last two rows of chip packaging areas of the LED pre-cut substrate motherboard 3 to form the last two daughter boards 30. Then the electric push rod 42 drives the lateral pushing block 41 to return to its original position, and the last two daughter boards 30 can be collected.
[0031] (2) Divide the 7 sub-boards 30 into 49 LED units 5.
[0032] The method is similar to (1) above, except that:
[0033] See above (1) Figure 2 The entire motherboard 3 is placed vertically on the placement rack 2. The first row of chip packaging areas 321 of the motherboard 3 extends below the placement rack 2. The horizontal pushing block 41 pushes the chip packaging area 321 horizontally, thereby applying a horizontal force to separate it from the motherboard 3 to form a daughter board 30. The electric push rod 42 drives the horizontal pushing block 41 to push horizontally six times in total, separating the motherboard 3 into seven daughter boards 30.
[0034] (2) See Figure 5 Each sub-board 30 is placed vertically on the placement rack 2 in a single row of seven rows. The seven sub-boards 30 are arranged side by side to form a pre-cut LED substrate encapsulated with seven rows and seven columns of LED chips 31. The seven chip packaging areas 301 at the bottom edges of the seven sub-boards 30 form a row of chip packaging areas at the bottom edge, extending side by side below the placement rack 2. The electric push rod 42 drives the lateral pushing block 41 to push these seven chip packaging areas 301 laterally, thereby applying lateral force to these seven chip packaging areas 301, separating these seven chip packaging areas 301 from the seven sub-boards 30 to form seven LED units 5. The electric push rod 42 drives the lateral pushing block 41 to repeatedly push laterally six times, separating the seven sub-boards 30 into 49 LED units 5.
[0035] This embodiment sees Figure 3 and Figure 4The automatic extrusion mechanism is driven by an electric push rod 42. The lateral pushing block 41 is mounted on a rod body 421 of the electric push rod 42. The electric push rod 42 is connected to the lateral pushing block 41 in this manner, driving the lateral pushing block 41 to push the LED pre-cut substrate forward laterally. Other embodiments may utilize other drive units, such as a pneumatic cylinder. In other embodiments, the automatic squeezing mechanism can be changed to be arranged in front of the placement rack 2, and the lateral pushing block 41 can be changed to a negative pressure vacuum suction cup, and the piston 531 of the air cylinder 53 can be changed to a rod body 421 connected to the electric push rod 42; the rod body 421 of the electric push rod 42 extends backward to drive the negative pressure vacuum suction cup to suck backward a row of chip packaging areas at the bottom edge of the LED pre-cut substrate, and then the rod body 421 of the electric push rod 42 retracts forward to drive the negative pressure vacuum suction cup to move forward to suck away this row of chip packaging areas, thereby applying lateral force to it, and squeezing off the horizontal pre-cut line connecting the chip packaging areas. During this process, the rod body 421 of the electric push rod 42 synchronously drives the air cylinder 53 to inflate the airbag 51.
[0036] In this embodiment, the electric push rod 42 of the automatic extrusion mechanism 4 is manually controlled to achieve semi-automatic operation. In other embodiments, the controller can be used to achieve fully automatic operation. Specifically, the controller controls the electric push rod 42 to extend its rod body 421 forward by 5 mm to separate a row of chip packaging areas (a sub-board 30 or 7 LED units 5) at the bottom edge of the LED pre-cut substrate. The controller then controls the electric push rod 42 to stop for 3 seconds. The operator removes the separated chip packaging area within these 3 seconds. After 3 seconds, the controller controls the electric push rod 42 to retract its rod body 421 and then controls the electric push rod 42 to extend its rod body 421 forward by 5 mm again. This process is repeated.
[0037] The above is only an embodiment of the present invention and does not limit the scope of patent protection. Those skilled in the art can make non-substantial changes or substitutions based on the present invention and still fall within the scope of patent protection.
Claims
1. LED pre-cut substrate separation device, characterized by: A placement rack is provided for placing LED pre-cut substrates encapsulated with multiple rows and columns of LED chips. The placement rack is provided with a substrate extension opening for allowing a chip encapsulation area of a row at the edge of the LED pre-cut substrate to extend longitudinally out of the placement rack; an automatic squeezing and breaking mechanism is provided to apply horizontal force to the chip encapsulation area of a row at the edge of the LED pre-cut substrate that has extended out of the placement rack until the horizontal pre-cut line connecting the chip encapsulation area is squeezed off, thereby separating the chip encapsulation area from the substrate.
2. The LED pre-cut substrate separation device according to claim 1, characterized in that: The placement rack is specifically a vertical placement rack for vertically placing LED pre-cut substrates. The substrate extension opening is opened at the bottom of the placement rack, allowing a row of chip packaging areas at the bottom edge of the LED pre-cut substrate to extend vertically to the bottom of the placement rack. The automatic squeezing and breaking mechanism is specifically arranged under the placement rack, and applies horizontal force to a row of chip packaging areas at the bottom edge of the LED pre-cut substrate that has extended to the bottom of the placement rack.
3. The LED pre-cut substrate separation device according to claim 1 or 2, characterized in that: The placement rack is provided with a fixing mechanism for fixing the LED pre-cut substrate when the automatic squeezing and breaking mechanism applies a force laterally to the LED pre-cut substrate.
4. The LED pre-cut substrate separation device according to claim 3, characterized in that: The fixing mechanism includes relative airbags and fixed walls, with a substrate placement position for placing the LED pre-cut substrate between the airbag and the fixed wall; the positioning mechanism also includes an air cylinder, which pumps gas into the airbag to expand the airbag toward the fixed wall until the airbag and the fixed wall jointly clamp the LED pre-cut substrate placed in the substrate placement position to fix it.
5. The LED pre-cut substrate separation device according to claim 4, characterized in that: The air pump is driven to inflate by an automatic squeezing mechanism.
6. The LED pre-cut substrate separation device according to claim 5, characterized in that: The automatic extrusion mechanism specifically drives the air cylinder to inflate air synchronously when applying lateral force to the LED pre-cut substrate.
7. The LED pre-cut substrate separation device according to claim 6, characterized in that: The automatic squeezing and breaking mechanism includes a lateral pushing block and a driving unit connected to the lateral pushing block. The piston of the gas cylinder is fixedly connected to the lateral pushing block. The driving unit drives the lateral pushing block to move laterally to push the edge of the LED pre-cut substrate that has extended out of the placement rack to form a row of chip packaging areas. The lateral pushing block then synchronously drives the piston of the gas cylinder to move to pump gas into the airbag.
8. The LED pre-cut substrate separation device according to claim 2, characterized in that: A supporting pad is provided under the placement rack for supporting a row of chip packaging areas at the bottom edge.
9. The LED pre-cut substrate separation device according to claim 8, characterized in that: The supporting pad is specifically a conveyor belt, which conveys the separated chip packaging area away from under the placement rack.
10. The LED pre-cut substrate separation device according to claim 1, characterized in that: A conveying mechanism is provided at the substrate extension port to transport the separated chip packaging area away.