Hot melting device for photovoltaic equipment processing
Through the positioning and temperature control of the hot melt device used in photovoltaic equipment processing, the problems of micro cracks and damage after silicon wafer cutting are solved, and high-precision and efficient hot melt processing is achieved.
Patent Information
- Application Number
- CN202422870059.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-25
AI Technical Summary
During the production of solar cells, microcracks and damage may occur on the silicon wafers after they are cut, which affects product performance.
A hot melt device for photovoltaic equipment processing is used. The touch panel limits the silicon wafer, and the driver drives the silicon wafer to move to the bottom of the hot melter for heating and slow advancement. The cooling fan is used for cooling, thus achieving precise temperature control and an automated hot melt process.
The precision and efficiency of hot melt processing are improved, the defective product rate is reduced, and the production cycle is shortened.
Smart Images

Figure CN223373305U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of photovoltaic equipment processing, and in particular to a hot melt device for photovoltaic equipment processing. Background Art
[0002] The photovoltaic industry refers to the entire industry chain related to solar photovoltaic power generation, including the manufacturing, installation, maintenance of solar panels and related R&D, design, manufacturing and sales activities. This industry covers the entire process from the production of solar cells to end-user use. The development of the photovoltaic industry can create a large number of employment opportunities, including R&D, manufacturing, installation, maintenance and operation. As the global demand for renewable energy increases, the photovoltaic industry is developing rapidly and has become an important driving force for global energy transformation.
[0003] In the context of the development of the photovoltaic industry, the production efficiency and quality of solar cells are crucial to reducing costs and improving conversion efficiency. However, during the production of solar cells, microcracks and damage may occur on the edges of the silicon wafers after they are cut, which will affect the performance of the final product. Utility Model Content
[0004] The purpose of the present utility model is to provide a hot melt device for processing photovoltaic equipment to solve the problems raised in the above background technology.
[0005] The embodiments of this application adopt the following technical solutions:
[0006] The top of the base is fixedly connected to the base, and the bottom of the base is fixedly connected to the base. The left side of the base is provided with an air inlet, the inner wall of the base is provided with a groove, the inner wall of the groove is fixedly connected to the driver, the upper surface of the driver is fixedly connected to the base, the upper surface of the base is fixedly connected to the limit drive frame, the inner wall of the limit drive frame is slidably connected to two groups of limit arms, the upper surfaces of the two groups of limit arms are fixedly connected to the limit plate, the left side wall of the base and the right side wall of the base are fixedly connected to the hydraulic adjustment frame, the two hydraulic adjustment frames are fixedly connected to the structural plate on the side close to each other, the front of the structural plate is fixedly connected to two adapter frames, the bottom surface of one of the adapter frames is fixedly connected to two cooling fans, and the bottom surface of the other adapter frame is fixedly connected to the hot melt, the back of the base is fixedly connected to an exhaust fan, the back of the exhaust fan is fixedly connected to an air duct, the back of the base is fixedly connected to a filter, and the end of the air duct away from the exhaust fan is connected to the filter.
[0007] Preferably, two supporting legs are fixedly connected to the bottom surface of the base, and a positioning hole is formed on the upper surface of each supporting leg.
[0008] Preferably, a touch panel is fixedly connected to the front of the device body, a circuit board is fixedly connected to the front of the device body, and a group of display lights is fixedly connected to the front of the circuit board.
[0009] Preferably, two protective doors are snap-fitted to the front of the device body, and buckle slots are provided on the front of the two protective doors.
[0010] Preferably, an identification plate is provided on the back of the device body, and the front of the identification plate is fixedly connected to the back of the device body.
[0011] Preferably, the back side of the filter is fixedly connected with an adapter sleeve.
[0012] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:
[0013] First, the device can activate the limit drive frame through the touch panel to limit the silicon wafer according to the processing requirements, ensuring the accurate position of the silicon wafer during the hot melt process, improving the accuracy of the hot melt processing, and at the same time avoiding manual operation errors and reducing the defective product rate during the processing process.
[0014] Secondly, the device can drive the base to move the silicon wafer to the bottom of the heat melter through the driver, and use the heat melter to generate heat to make the silicon wafer reach a predetermined temperature. The temperature of the silicon wafer can be accurately controlled according to needs to ensure the quality of the hot melt processing. When heating, the driver is used to drive the silicon wafer to advance slowly. After reaching the preset temperature, the driver is used to drive the silicon wafer to move it to the bottom of the heat dissipation fan to blow air to lower the temperature, which can shorten the production cycle and thus improve the production efficiency of photovoltaic equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the hot-melt device for processing photovoltaic equipment of the present invention;
[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model of the hot melt device for photovoltaic equipment processing from a rear perspective;
[0018] Figure 3 : A schematic diagram of the three-dimensional structure of a limit drive frame in a hot melt device for processing photovoltaic equipment according to the present invention;
[0019] Figure 4 Schematic diagram of the three-dimensional structure of the hot melt device in the hot melt device for processing photovoltaic equipment of the present invention.
[0020] In the figure: 1. Base; 2. Device body; 3. Touch panel; 4. Protective door; 5. Buckle slot; 6. Circuit board; 7. Display light; 8. Support foot; 9. Positioning hole; 10. Identification plate; 11. Air inlet; 12. Exhaust fan; 13. Air duct; 14. Filter; 15. Adapter sleeve; 16. Groove; 17. Driver; 18. Base; 19. Limit drive frame; 20. Limit arm; 21. Limit plate; 22. Hydraulic adjustment frame; 23. Structural plate; 24. Adapter frame; 25. Cooling fan; 26. Fuser. DETAILED DESCRIPTION
[0021] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0022] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.
[0023] See also Figure 1-4 , the utility model provides a technical solution for a hot melt device for processing photovoltaic equipment:
[0024] A hot melt device for processing photovoltaic equipment includes a base 1, the upper surface of the base 1 is fixedly connected to a device body 2, the left side of the device body 2 is provided with an air inlet 11, the inner wall of the device body 2 is provided with a groove 16, the inner wall of the groove 16 is fixedly connected to a driver 17, the upper surface of the driver 17 is fixedly connected to a base 18, the upper surface of the base 18 is fixedly connected to a limited drive frame 19, the inner wall of the limited drive frame 19 is slidably connected to two groups of limit arms 20, the upper surfaces of the two groups of limit arms 20 are fixedly connected to a limit plate 21, the left side wall of the device body 2 and the right side wall of the device body 2 are fixedly connected to a hydraulic adjustment frame 22, the side of the two hydraulic adjustment frames 22 close to each other are fixedly connected to a structural plate 23, the front of the structural plate 23 is fixedly connected to two adapter frames 24, one of which is fixedly connected to a limit plate 21. Two cooling fans 25 are fixedly connected to the bottom surface, a heat melter 26 is fixedly connected to the bottom surface of another adapter frame 24, an exhaust fan 12 is fixedly connected to the back surface of the device body 2, an air duct 13 is fixedly connected to the back surface of the exhaust fan 12, a filter 14 is fixedly connected to the back surface of the device body 2, and the end of the air duct 13 away from the exhaust fan 12 is connected to the filter 14. The base 18 is driven by the driver 17 to move the silicon wafer to the bottom of the heat melter 26, and the heat is generated by the heat melter 26 to make the silicon wafer reach a predetermined temperature. During heating, the driver 17 is used to drive the silicon wafer to slowly advance. After reaching the preset temperature, the driver 17 is used to drive the silicon wafer to move to the bottom of the cooling fan 25 to blow air to lower the temperature, so that the hot melting process is highly automatic, the workload of manual operation is reduced, the production efficiency is improved, and the accuracy of the hot melting processing is increased.
[0025] In this embodiment, two supporting feet 8 are fixedly connected to the bottom surface of the base 1, and a positioning hole 9 is provided on the upper surface of each supporting foot 8. The provided supporting feet 8 and positioning holes 9 can facilitate the installation of the device by the staff. The front of the device body 2 is fixedly connected to a touch panel 3, the front of the device body 2 is fixedly connected to a circuit board 6, and the front of the circuit board 6 is fixedly connected to a group of display lights 7. The provided touch panel 3 can facilitate the operation of the device by the staff. Two protective doors 4 are snap-connected to the front of the device body 2, and the front of the two protective doors 4 are provided with buckle grooves 5. The provided buckle grooves 5 can facilitate the opening and closing of the protective doors 4 by the staff.
[0026] In this embodiment, an identification plate 10 is provided on the back of the device body 2, and the front of the identification plate 10 is fixedly connected to the back of the device body 2. The setting of the identification plate 10 can improve the recognition of the device. The back of the filter 14 is fixedly connected to the adapter sleeve 15. The setting of the adapter sleeve 15 can facilitate the staff to connect the exhaust pipe to the filter 14.
[0027] Working principle: When the hot melt device for processing photovoltaic equipment is used, the user first moves the device to the place of use, installs it through the support legs 8 and positioning holes 9 and connects it to the power supply, then loads the silicon wafer to be processed into the limit drive frame 19, and then operates the touch panel 3 to limit the silicon wafer according to the processing requirements, and then starts the driver 17 to drive the base 18 to move the silicon wafer to the bottom of the hot melt 26. The hot melt 26 generates heat to make the silicon wafer reach a predetermined temperature. During heating, the driver 17 is used to drive the silicon wafer to slowly advance. After reaching the preset temperature, the driver 17 is used to drive the silicon wafer to move to the bottom of the cooling fan 25 to blow air to lower the temperature, thereby completing the hot melt process.
[0028] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.
[0029] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.
Claims
1. A hot melt device for processing photovoltaic equipment, comprising a base (1), characterized in that: The upper surface of the base (1) is fixedly connected to the device body (2), the left side of the device body (2) is provided with an air inlet (11), the inner wall of the device body (2) is provided with a groove (16), the inner wall of the groove (16) is fixedly connected to a driver (17), the upper surface of the driver (17) is fixedly connected to a base (18), the upper surface of the base (18) is fixedly connected to a limit drive frame (19), the inner wall of the limit drive frame (19) is slidably connected to two groups of limit arms (20), the upper surfaces of the two groups of limit arms (20) are fixedly connected to the limit plate (21), the left side wall of the device body (2) and the right side wall of the device body (2) are fixedly connected to a liquid The hydraulic adjustment frame (22) is fixedly connected to a structural plate (23) on one side of the two hydraulic adjustment frames (22) close to each other, and the front of the structural plate (23) is fixedly connected to two adapter frames (24), the bottom surface of one of the adapter frames (24) is fixedly connected to two cooling fans (25), and the bottom surface of the other adapter frame (24) is fixedly connected to a heat fuser (26), the back of the device body (2) is fixedly connected to an exhaust fan (12), the back of the exhaust fan (12) is fixedly connected to an air duct (13), the back of the device body (2) is fixedly connected to a filter (14), and the end of the air duct (13) away from the exhaust fan (12) is connected to the filter (14).
2. A hot melt device for photovoltaic equipment processing according to claim 1, characterized in that: Two supporting legs (8) are fixedly connected to the bottom surface of the base (1), and a positioning hole (9) is provided on the upper surface of each supporting leg (8).
3. The hot melt device for photovoltaic equipment processing according to claim 1, characterized in that: A touch panel (3) is fixedly connected to the front of the device body (2), a circuit board (6) is fixedly connected to the front of the device body (2), and a group of display lights (7) is fixedly connected to the front of the circuit board (6).
4. The hot melt device for photovoltaic equipment processing according to claim 1, characterized in that: Two protective doors (4) are snap-fitted to the front of the device body (2), and buckle slots (5) are provided on the front of the two protective doors (4).
5. The hot melt device for photovoltaic equipment processing according to claim 1, characterized in that: An identification plate (10) is provided on the back of the device body (2), and the front of the identification plate (10) is fixedly connected to the back of the device body (2).
6. The hot melt device for photovoltaic equipment processing according to claim 1, characterized in that: The back side of the filter (14) is fixedly connected to an adapter sleeve (15).