Driving plate and blower

Abstract

The utility model relates to the technical field of motors, and discloses a driving plate and a blower, the driving plate is provided with a connecting part, and the connecting part is used for being connected to an air outlet of a high-speed motor; the driving board comprises a half-bridge inversion module, an external power supply terminal, an external control terminal and an MCU (Microprogrammed Control Unit), the half-bridge inversion module, the external power supply terminal, the external control terminal and the MCU are divided into a bottom layer circuit layout and a top layer circuit layout, and the bottom layer circuit layout and the top layer circuit layout are in layered triangular staggered distribution and are overlapped to form hexagonal distribution. The driving plate is arranged at the air outlet of the motor body, so that air flow at the air outlet can be fully utilized for heat dissipation, and the heat dissipation performance of the driving plate is effectively improved; meanwhile, the driving board adopts a layered structure of a bottom layer and a top layer, is distributed in a layered triangular staggered manner, and is overlapped to form hexagonal distribution, so that the problem of electromagnetic interference is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of motors, in particular to a driving plate and a hair dryer. Background Art

[0002] High-speed hair dryers have become increasingly popular in the market in recent years, with the high-speed motor, their core component, playing a key role. High-speed motors, with their compact size and extremely high speed, can generate greater air volume through high-speed boost, achieving rapid drying.

[0003] Traditional high-speed motor drive boards are usually set separately from the motor body, which not only increases the volume of the overall structure, but may also cause the motor phase line connection stroke to be longer, thereby increasing the phase line parasitic inductance, which has an adverse effect on conduction and radiation, and is also not conducive to the heat dissipation of the drive board. This not only increases costs, but may also take up a large space. Utility Model Content

[0004] The utility model provides a driving plate and a hair dryer to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A drive plate comprises a motor body and a drive plate, wherein the motor body is provided with an air outlet, and the drive plate is provided with a connecting portion, wherein the connecting portion is used to be connected to the air outlet of the high-speed motor;

[0007] The driving board includes a half-bridge inverter module, an external power supply terminal, an external control terminal and an MCU. The half-bridge inverter module, the external power supply terminal, the external control terminal and the MCU are divided into a bottom circuit layout and a top circuit layout. The bottom circuit layout and the top circuit layout are distributed in a layered triangular staggered manner.

[0008] Optionally, the bottom circuit layout includes a half-bridge inverter module, and the half-bridge inverter module includes three half-bridge units distributed in a triangle; the top circuit layout includes external power terminals, external control terminals and an MCU distributed in a triangle;

[0009] The bottom layer circuit layout and the top layer circuit layout are staggered and overlapped to form a hexagonal distribution.

[0010] Optionally, the half-bridge inverter module is located on the air flow channel of the air outlet.

[0011] Optionally, the bottom circuit layout further includes a phase line output terminal connected to the half-bridge inverter module, and the phase line output terminal is located at the center of the bottom circuit layout.

[0012] Optionally, the bottom circuit layout includes three phase line output terminals, and the three phase line output terminals are connected to the three half-bridge units in a one-to-one correspondence.

[0013] Optionally, the half-bridge inverter module is packaged in the form of PQFN or QFN.

[0014] Optionally, the MCU has an internal integrated operational amplifier and a comparator, and the MCU samples the current signal through a single resistor or two resistors.

[0015] Optionally, the drive plate is fixed to the motor air outlet by welding or terminal self-locking fastening.

[0016] Optionally, the diameter of the driving plate is smaller than the diameter of the high-speed motor.

[0017] The utility model also provides a hair dryer, comprising the driving plate as described in any one of the above items.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The utility model provides a driving board and a hair dryer, in which the driving board is arranged at the air outlet of the motor body, and the airflow at the air outlet can be fully utilized for heat dissipation, thereby effectively improving the heat dissipation performance of the driving board; at the same time, because the driving board adopts a layered structure of a bottom layer and a top layer, and is distributed in a layered triangular staggered manner, the problem of electromagnetic interference is solved.

[0020] The present invention has other features and advantages, which will be apparent from the accompanying drawings and subsequent detailed descriptions incorporated herein, or will be described in detail in the accompanying drawings and subsequent detailed descriptions incorporated herein, which together serve to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 It is a structural diagram of a high-speed motor in the prior art;

[0023] Figure 2 This is a schematic structural diagram of a driver board after installation provided by the first embodiment of the present invention;

[0024] Figure 3This is another structural diagram of a driver board after installation provided by the first embodiment of the present utility model;

[0025] Figure 4 This is another structural diagram of a driver board after installation provided by the first embodiment of the present utility model;

[0026] Figure 5 This is a circuit block diagram of a driver board provided in Example 1 of the present utility model;

[0027] Figure 6 This is a circuit schematic diagram of a driver board provided in Example 1 of the present utility model;

[0028] Figure 7 This is a schematic diagram of a top-layer circuit layout of a driver board provided in the first embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the bottom layer circuit layout of a driver board provided in Example 1 of the present utility model.

[0030] Figure numerals: 10, motor body; 20, phase line output terminal; 21, drive board; 211, half-bridge inverter module; 2111, half-bridge unit; 212, external power terminal; 213, external control terminal; 214, MCU. DETAILED DESCRIPTION

[0031] In order to explain in detail the possible application scenarios, technical principles, specific solutions that can be implemented, and the purpose and effects of this application, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of this application and are therefore only examples and are not intended to limit the scope of protection of this application.

[0032] References to "embodiments" herein mean that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the word "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the embodiments can be combined in any manner to form a corresponding implementable technical solution.

[0033] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0034] In the description of this application, the term "and / or" is used to describe a logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and both A and B exist. In addition, the character " / " in this document generally indicates that the objects before and after are in a logical "or" relationship.

[0035] In this application, terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, priority or sequence relationship between these entities or operations.

[0036] Without further limitations, in this application, the words "include", "comprise", "have" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those defined elements, but also other elements not explicitly listed, or elements inherent to such process, method or product.

[0037] Consistent with the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceed" are understood to exclude the number itself; expressions such as "above," "below," and "within" are understood to include the number itself. Furthermore, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this manner, such as "multiple groups," "multiple times," etc., unless otherwise specifically defined.

[0038] In the description of the embodiments of the present application, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it should not be understood as a limitation on the embodiments of the present application.

[0039] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms "installed", "connected", "connected", "fixed", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art of the present application, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0040] In the existing technology, the diameter of high-speed motors is usually 28.8mm. Due to the small size of high-speed motors, the usual motor driver board solutions, such as Figure 1 As shown, by separating the high-speed motor driver board from the high-speed motor, the motor driver board is externalized and integrated with the rest of the control system to form the complete control system board. The motor and high-speed motor driver board are then connected via wires. Furthermore, structural heat dissipation design must be considered, using structural air ducts, negative pressure, or a radiator to cool the control system board.

[0041] To solve the aforementioned technical problems, this application provides the following technical solutions.

[0042] Example 1

[0043] Please refer to Figures 2 to 4 The embodiment of the present invention provides a driving plate 21, which can be applied to a high-speed motor. The following describes this embodiment using a high-speed motor as an example application scenario.

[0044] The high-speed motor includes a motor body 10, an air outlet is opened on the motor body 10, and a drive plate 21 is provided with a connecting portion, which is used to connect to the air outlet of the high-speed motor; the drive plate 21 is arranged at the air outlet of the motor body 10, which can fully utilize the airflow of the air outlet for heat dissipation, thereby effectively improving the heat dissipation performance of the drive plate 21.

[0045] In addition, the driving board 21 includes a half-bridge inverter module 211, an external power supply terminal 212, an external control terminal 213 and an MCU214 (micro control unit). The half-bridge inverter module 211, the external power supply terminal 212, the external control terminal 213 and the MCU214 are divided into a bottom circuit layout and a top circuit layout. The bottom circuit layout and the top circuit layout are distributed in a layered triangular staggered manner.

[0046] Please refer to Figure 5 and Figure 6 , Figure 5 is a circuit block diagram of the driving board 21 in this embodiment, Figure 6FIG. 2 is a circuit diagram of the driving board 21 in this embodiment. Figure 6 Due to size limitations, the driver board 21 in this embodiment is designed with a four-layer board layout, where the top layer circuit layout is as follows: Figure 7 As shown, the layout of the bottom circuit layout is as follows Figure 8 shown.

[0047] Specifically, the bottom circuit layout includes a half-bridge inverter module 211, and the half-bridge inverter module 211 includes three half-bridge units 2111 distributed in a triangular pattern; the top circuit layout includes an external power terminal 212, an external control terminal 213 and an MCU 214 distributed in a triangular pattern; the bottom circuit layout and the top circuit layout are staggered and overlapped to form a hexagonal distribution.

[0048] It is understandable that in this embodiment, sensitive components such as the external power terminals 212, external control terminals 213, and MCU 214 are arranged separately from the half-bridge inverter module 211. By arranging components with different functions on the bottom and top layers, and distributing them in a triangular staggered pattern to form a hexagon, the generation of electromagnetic interference can be reduced. Based on this, this embodiment solves the problem of electromagnetic interference caused by the shortened distance between the drive board 21 and the motor body 10, and realizes the placement of the drive board 21 at the air outlet of the motor body 10, which is conducive to miniaturizing the high-speed motor and improving the heat dissipation performance.

[0049] Specifically, the driving board 21 is divided into a bottom circuit layout and a top circuit layout, wherein the bottom circuit layout and the top circuit layout are arranged in a layered triangular staggered manner.

[0050] The bottom circuit layout includes a half-bridge inverter module 211, which is composed of three half-bridge units 2111 distributed in a triangle. Figure 7 As shown in U1, U2 and U3 in .

[0051] In this embodiment, the half-bridge inverter module 211 is packaged in the form of PQFN (Power Quad Flat No-lead) or QFN (Quad Flat No-lead), which has the advantages of small size and good heat dissipation performance.

[0052] Furthermore, the underlying circuit layout also includes a phase line output terminal 20 connected to the half-bridge inverter module 211. The phase line output terminal 20 is located at the center of the underlying circuit layout. This arrangement makes the phase line connection of the high-speed motor simpler, reduces the phase line parasitic inductance, and reduces the impact of conducted radiation.

[0053] like Figure 7As shown, in this embodiment, the bottom circuit layout includes three phase line output terminals 20, namely U, V and W in the figure, which are connected to the three half-bridge units 2111U1, U2 and U3 in a one-to-one correspondence.

[0054] In this embodiment, the half-bridge inverter module 211 is located on the air flow channel of the air outlet, which can fully utilize the air flow of the high-speed motor outlet for heat dissipation, and use the air flow to quickly take away the heat generated by the half-bridge inverter module 211, thereby ensuring that the half-bridge inverter module 211 operates within a safe temperature range and improving its working stability and reliability.

[0055] Furthermore, in this embodiment, MCU214 has an internal integrated operational amplifier and comparator, and MCU214 samples the current signal through a single resistor or dual resistors to implement sensorless FOC (Field Oriented Control) sinusoidal drive of the high-speed motor. By integrating the operational amplifier and comparator within MCU214, the circuit structure of the entire high-speed motor can be made more compact, which is conducive to miniaturization of the high-speed motor. It is understood that in actual applications, a configurable current sampling module can be set in MCU214, so that single-resistor or dual-resistor sampling methods can be selected according to different application requirements. In addition, by configuring the MCU214 through software and setting different parameters and modes, it is possible to control a three-phase motor or a single-phase motor.

[0056] Furthermore, the drive plate 21 is fixed to the motor air outlet by welding or terminal self-locking fastening, so that the drive plate 21 and the motor air outlet form a firm connection, and the connection stability of the drive plate 21 can be ensured even if subjected to vibration and impact.

[0057] Furthermore, the diameter of the drive plate 21 is smaller than the diameter of the motor body 10, so that the drive plate 21 can better adapt to the motor body 10, realizing the integrated design of the high-speed motor without increasing the overall volume, making the structure of the entire high-speed motor more compact.

[0058] Example 2

[0059] Based on the first embodiment, the present invention provides a hair dryer, comprising a high-speed motor and a driving plate 21 as in the above embodiment.

[0060] In this embodiment, since the drive plate 21 is located at the motor outlet, it can fully utilize the airflow generated by the motor to dissipate heat, allowing the hair dryer to maintain a low temperature even during long-term use, thereby improving the reliability and service life of the product. In addition, good heat dissipation performance can also reduce safety hazards caused by overheating, ensuring user safety.

[0061] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concepts of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A driving plate, characterized in that: Applicable to high-speed motors, comprising a drive plate, wherein the drive plate is provided with a connecting portion, and the connecting portion is used to connect to the air outlet of the high-speed motor; The driving board includes a half-bridge inverter module, an external power supply terminal, an external control terminal and an MCU. The half-bridge inverter module, the external power supply terminal, the external control terminal and the MCU are divided into a bottom circuit layout and a top circuit layout. The bottom circuit layout and the top circuit layout are distributed in a layered triangular staggered manner.

2. The driving plate according to claim 1, wherein: The bottom circuit layout includes a half-bridge inverter module, which includes three half-bridge units distributed in a triangle; the top circuit layout includes external power terminals, external control terminals and an MCU distributed in a triangle; The bottom layer circuit layout and the top layer circuit layout are staggered and overlapped to form a hexagonal distribution.

3. The driving plate according to claim 1 or 2, characterized in that: The half-bridge inverter module is located on the air flow channel of the air outlet.

4. The driving plate according to claim 2, characterized in that: The bottom circuit layout further includes a phase line output terminal connected to the half-bridge inverter module, and the phase line output terminal is located at the center of the bottom circuit layout.

5. The driving plate according to claim 4, characterized in that: The bottom circuit layout includes three phase line output terminals, and the three phase line output terminals are connected to the three half-bridge units in a one-to-one correspondence.

6. The driving plate according to claim 1, wherein: The half-bridge inverter module is packaged in the form of PQFN or QFN.

7. The driving plate according to claim 2, characterized in that: The MCU has an internal integrated operational amplifier and a comparator, and the MCU samples the current signal through a single resistor or a double resistor.

8. The driving plate according to claim 1, wherein: The driving plate is fixed to the air outlet of the motor by welding or self-locking fastening of terminals.

9. The driving plate according to claim 1, wherein: The diameter of the driving plate is smaller than the diameter of the high-speed motor.

10. A hair dryer, characterized in that: The drive plate comprises the drive plate according to any one of claims 1 to 9.

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