Normalizing device and detection equipment
Through the coordination of the positioning components and driving parts of the regularization device, the problem of silicon wafer offset during the detection process was solved, and the accuracy of photovoltaic cell square resistance detection was improved.
Patent Information
- Application Number
- CN202422817588.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-19
AI Technical Summary
During the inspection process of photovoltaic cells, the position of the silicon wafer shifts, resulting in inaccurate test results.
A regular device is used, including a carrier, a positioning assembly and a driving part. Through the sliding and clamping mechanism of the positioning part, the silicon wafer is ensured to be accurately positioned at the preset position to prevent deviation.
The accuracy of photovoltaic cell square resistance detection is improved, ensuring that the test component can accurately contact the silicon wafer and obtain high-quality test results.
Smart Images
Figure CN223390529U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of photovoltaic cell detection, and specifically to a regularization device and detection equipment. Background Art
[0002] Photovoltaic cell manufacturers basically produce square cells. Sheet resistance refers to the electrical resistance of a film material with a certain thickness, length, and width. It is an important parameter that indicates the total amount of impurities diffused into the semiconductor. Therefore, sheet resistance testing is an indispensable part of the photovoltaic cell manufacturing process.
[0003] In the related art, a testing device moves toward a silicon wafer through a testing component to test the square resistance of the silicon wafer. However, the silicon wafer is prone to positional displacement, which affects the accuracy of the test results. Utility Model Content
[0004] In view of this, it is necessary to provide a regularization device and a detection device that can prevent the silicon wafer from shifting, so as to improve the accuracy of the test results.
[0005] One embodiment of the present application provides a tidying device, including a carrier, a positioning assembly, and a driving member. The carrier includes a carrying surface, and the carrying surface is used to carry a silicon wafer. The positioning assembly includes two or more first positioning members and two or more second positioning members. The two or more first positioning members are respectively arranged on opposite sides of the carrier along the first direction, and at least one first positioning member is slidably connected to the carrier; the two or more second positioning members are respectively arranged on opposite sides of the carrier along the second direction, and the two or more second positioning members are slidably connected to at least one first positioning member. The second direction and the first direction are two horizontal directions perpendicular to each other. The driving member is connected to at least one first positioning member. In the process of the driving member driving the first positioning member to abut the silicon wafer along the first direction, at least one first positioning member drives the two or more second positioning members to approach to abut the silicon wafer along the second direction.
[0006] In some embodiments of the present application, two guide grooves are provided on one of the first positioning members or two first positioning members are respectively provided with guide grooves, each second positioning member is provided with a slide, and each slide is provided in a corresponding guide groove; the mid-perpendicular line between the two slides is defined as the reference line, and along the clamping direction of the first positioning member, the distance between the guide groove provided on the first positioning member and the reference line gradually increases, so that the two second positioning members are close to each other along the second direction.
[0007] In some embodiments of the present application, the tidying device also includes a base, which is arranged below the carrier, with a gap between the base and the carrier, and a first guide rail located in the gap is provided on the base, and the extension direction of the first guide rail is parallel to the second direction. The first guide rail is used to slideably connect the second positioning member to guide the second positioning member to move along the second direction.
[0008] In some embodiments of the present application, the tidying device also includes a base, which is arranged below the carrier, and a second guide rail is provided on the side of the base facing away from the carrier, and the extension direction of the second guide rail is parallel to the first direction. The second guide rail is used to slideably connect the first positioning member to guide the first positioning member to move along the first direction under the drive of the driving member.
[0009] In some embodiments of the present application, the tidying device also includes a base, which is arranged below the carrier, and at least one first positioning member includes a connecting portion and a positioning portion connected to each other, the positioning portion is used to abut the silicon wafer, the connecting portion is arranged below the base and is slidably connected to the base, the base is provided with a notch, and the second positioning member partially passes through the notch and is slidably connected to the connecting portion.
[0010] In some embodiments of the present application, the driving member is arranged on the side of the base facing away from the supporting member and is connected to the connecting part. The connecting part is provided with an avoidance groove extending along the first direction and corresponding to the driving member. When the driving member drives the connecting part to abut against the silicon wafer, the driving member is accommodated in the avoidance groove.
[0011] In some embodiments of the present application, the tidying device further includes a stopper, which is arranged opposite to the first positioning member to limit the first positioning member.
[0012] In some embodiments of the present application, the carrier also includes a first adsorption groove and / or a second adsorption groove that passes through the carrier surface, so that the carrier can adsorb the silicon wafer on the carrier surface; more than two first adsorption grooves are arranged at intervals along the first direction, and more than two second adsorption grooves are arranged at intervals along the second direction.
[0013] One embodiment of the present application provides a detection device, which includes a transfer component, a test component and a tidying device as described in any of the above embodiments. The transfer component includes a first movable member and a suction cup connected to each other, the suction cup is used to adsorb the silicon wafer, the first movable member is used to drive the suction cup to move the silicon wafer along a first direction, the tidying device is used to receive the silicon wafer adsorbed by the suction cup, and the test component includes a second movable member and a test piece connected to each other, the second movable member is used to drive the test piece to move in a vertical direction, so that the test piece moves toward the tidying device to contact and test the silicon wafer.
[0014] In some embodiments of the present application, the detection device also includes a third movable member, which includes a slide rail, the extension direction of the slide rail is parallel to the first direction, and the slide rail is used to connect the regularization device so that the regularization device can move along the first direction.
[0015] In the present application, the silicon wafer is moved to the carrying surface of the tidying device by a transfer assembly, and the tidying device drives the first positioning member to move along the first direction through the driving member, so that two or more first positioning members are close to each other to position and clamp the opposite sides of the silicon wafer along the first direction, and the first positioning member can drive two or more second positioning members to approach each other along the second direction to position and clamp the opposite sides of the silicon wafer along the second direction, so that the silicon wafer on the carrying surface is adjusted and positioned at a preset position by the positioning assembly, and the test assembly drives the test member to move toward the preset position through the second moving member to contact and test the silicon wafer at the preset position. The silicon wafer positioned at the preset position will not be offset, which is conducive to the test member aligning the silicon wafer and making the test result have higher accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.
[0017] Figure 1 A schematic diagram of the structure of a detection device provided in one embodiment of the present application.
[0018] Figure 2 for Figure 1 Schematic diagram of the structure of the regularization device in the detection equipment.
[0019] Figure 3 for Figure 2 A schematic structural diagram of a regular device from a top-down perspective.
[0020] Figure 4 for Figure 1 Schematic diagram of the structure of the regular device when looking from an upward perspective.
[0021] Figure 5 for Figure 1 Schematic diagram of the structure of the transfer component in the detection equipment.
[0022] Figure 6 for Figure 1 Schematic diagram of the structure of the test component in the detection equipment.
[0023] Description of main component symbols:
[0024] 100, regularization device; 10, bearing member; 11, bearing surface; 12, first limiting surface; 111, first adsorption groove; 112, second adsorption groove; 20, positioning assembly; 21, first positioning member; 2102, guide groove; 211, positioning portion; 212, connecting portion; 2121, avoidance groove; 22, second positioning member; 221, sliding member; 30, driving member; 31, connecting block; 40, base; 401, notch; 41 , first guide rail; 42, second guide rail; 50, stopper; 51, fixing part; 52, stopper; 60, air blow pipe; 200, detection equipment; 201, transfer assembly; 2011, first movable part; 2012, suction cup; 202, test assembly; 2021, test piece; 2022, second movable part; 203, third movable part; 2031, slide rail; 2032, bottom plate; 204, mounting bracket; a, reference line. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0027] In the description of this application, it should be noted that the definition of "first direction" and "second direction" is for the convenience of describing the relative positional relationship of related structures, and does not mean that "first direction" and "second direction" need to rely on the related structures involved in the above definitions.
[0028] The orientation or position relationship indicated by terms such as "upper", "lower", "vertical", and "horizontal" are based on the orientation or position relationship shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the present application.
[0029] Furthermore, the terms "first," "second," "third," etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance.
[0030] The term "perpendicular" is used to describe an ideal relationship between two components. In actual production or use, two components can be approximately perpendicular to each other. Two components described as "perpendicular" need not be absolutely straight lines or planes; they can be roughly straight lines or planes. From a macroscopic perspective, a component is considered "straight" or "planar" if its overall extension is a straight line or plane.
[0031] The term "parallel" is used to describe an ideal state between two components. In actual production or use, two components can be approximately parallel. Two components described as "parallel" do not necessarily need to be absolutely straight lines or planes; they can be roughly straight lines or planes. From a macroscopic perspective, a component is considered "straight" or "planar" if its overall extension is a straight line or plane.
[0032] It should be noted that when an element is considered to be “connected” to another element, it may be directly connected to the other element or there may be an intermediate element. When an element is considered to be “disposed on” another element, it may be directly disposed on the other element or there may be an intermediate element.
[0033] In the present application, the relatively fixed arrangement of the two does not mean that they cannot be disassembled, but is intended to indicate that the relatively fixed two can move together when the transmission mechanism, the operating device and the self-moving device are in use.
[0034] Photovoltaic cell manufacturers typically produce square cells. Sheet resistance refers to the electrical resistance of a film material with a certain thickness, length, and width. It is a key parameter that indicates the amount of impurities that diffuse into a semiconductor. Therefore, sheet resistance testing is an essential step in the photovoltaic cell manufacturing process. In related technologies, testing equipment moves a test assembly toward the silicon wafer to measure its sheet resistance. However, the wafer is prone to positional shifting, affecting the accuracy of the test results.
[0035] In related technologies, when testing the square resistance of a silicon wafer, a test assembly must contact the surface of the wafer to obtain the measured square resistance. If the wafer shifts relative to the test assembly, such as when it rotates or moves relative to a preset position, the wafer will shift relative to the test assembly. When the test assembly is testing the wafer, the wafer may be partially exposed, preventing measurement of that portion of the wafer, resulting in inaccurate square resistance test results.
[0036] An embodiment of the present application provides a tidying device that can prevent silicon wafers from shifting to improve the accuracy of test results. The tidying device includes a carrier, a positioning assembly and a driving member. The carrier includes a carrying surface, and the carrying surface is used to carry the silicon wafer. The positioning assembly includes two or more first positioning members and two or more second positioning members, the two or more first positioning members are respectively arranged on opposite sides of the carrier along the first direction, and at least one first positioning member is slidably connected to the carrier; the two or more second positioning members are respectively arranged on opposite sides of the carrier along the second direction, and the two or more second positioning members are slidably connected to at least one first positioning member, and the second direction and the first direction are two horizontal directions perpendicular to each other. The driving member is connected to at least one first positioning member, and in the process of the driving member driving the first positioning member to abut the silicon wafer along the first direction, at least one first positioning member drives the two or more second positioning members to approach to abut the silicon wafer along the second direction.
[0037] In the present application, the silicon wafer is moved to the carrying surface of the tidying device by a transfer assembly, and the tidying device drives the first positioning member to move along the first direction through the driving member, so that two or more first positioning members are close to each other to position and clamp the opposite sides of the silicon wafer along the first direction, and the first positioning member can drive two or more second positioning members to approach each other along the second direction to position and clamp the opposite sides of the silicon wafer along the second direction, so that the silicon wafer on the carrying surface is adjusted and positioned at a preset position by the positioning assembly, and the test assembly drives the test member to move toward the preset position through the second moving member to contact and test the silicon wafer at the preset position. The silicon wafer positioned at the preset position will not be offset, which is conducive to the test member aligning the silicon wafer and making the test result have higher accuracy.
[0038] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features of the embodiments may be combined with each other.
[0039] See Figure 1 One embodiment of the present application provides a testing device 200 for testing silicon wafers. Specifically, the testing device 200 tests the square resistance of a silicon wafer. The silicon wafer may be a silicon wafer or a silicon carbide wafer used to make a solar cell.
[0040] In some embodiments, the inspection apparatus 200 includes a tidying device 100, a transfer assembly 201, and a testing assembly 202. The transfer assembly 201 is used to absorb and move the silicon wafer. The tidying device 100 can receive the silicon wafer from the transfer assembly 201. The tidying device 100 is used to carry and position the silicon wafer in a predetermined position. The testing assembly 202 is used to test the silicon wafer positioned in the predetermined position of the tidying device 100.
[0041] See Figures 1 to 4In some embodiments, the tidying device 100 includes a carrier 10, a positioning assembly 20 and a driving member 30. The carrier 10 includes a carrying surface 11. The carrying surface 11 is used to carry silicon wafers. The positioning assembly 20 includes two or more first positioning members 21 and two or more second positioning members 22. The two or more first positioning members 21 are respectively arranged on opposite sides of the carrier 10 along the first direction. At least one first positioning member 21 is slidably connected to the carrier 10. The two or more second positioning members 22 are respectively arranged on opposite sides of the carrier 10 along the second direction. The two or more second positioning members 22 are slidably connected to at least one first positioning member 21, so that the two or more second positioning members 22 can move relative to the carrier 10 along the second direction. The driving member 30 is connected to at least one first positioning member 21. When the driving member 30 drives the connected first positioning member 21 to move along the first direction, the two first positioning members 21 can position and clamp the opposite sides of the silicon wafer along the first direction. The movement of the first positioning member 21 along the first direction can also drive two or more second positioning members 22 to approach each other, so that the two second positioning members 22 can position and clamp the opposite sides of the silicon wafer along the second direction.
[0042] In some embodiments, the second direction and the first direction are two horizontal directions perpendicular to each other. It is understood that when the tidying device 100 is in use, the carrying surface 11 is a horizontal surface.
[0043] In the illustrated embodiment, the first direction is parallel to the X-axis, and the second direction is parallel to the Y-axis.
[0044] The silicon wafer is moved to the carrying surface 11 of the aligning device 100 by the transfer assembly 201. The aligning device 100 drives the first positioning member 21 to move along the first direction through the driving member 30, so that two or more first positioning members 21 are brought close to each other to position and clamp the two opposite sides of the silicon wafer along the first direction. The first positioning member 21 can drive two or more second positioning members 22 to approach each other along the second direction to position and clamp the two opposite sides of the silicon wafer along the second direction, so that the silicon wafer on the carrying surface 11 is adjusted and positioned at a preset position by the positioning assembly 20. The testing assembly 202 drives the testing member 2021 to move toward the preset position through the second moving member 2022 to contact and test the silicon wafer at the preset position. The silicon wafer positioned at the preset position will not be offset, which is conducive to the alignment of the testing member 2021 with the silicon wafer, so that the test results have higher accuracy.
[0045] In some embodiments, the silicon wafer is in a rectangular shape so that two or more first positioning members 21 and two or more second positioning members 22 can clamp the four sides of the silicon wafer to clamp and position the silicon wafer so that the silicon wafer is fixed at a preset position on the supporting surface 11.
[0046] See Figure 2 and Figure 4In some embodiments, one of the first positioning members 21 is provided with two guide grooves 2102 spaced apart from each other. Each second positioning member 22 is provided with a slider 221, each slider 221 being positioned within a corresponding guide groove 2102. The first positioning member 21 and the two second positioning members 22 are slidably connected via the guide grooves 2102 and the sliders 221, thereby enabling the first positioning member 21 to guide the two second positioning members 22 relative to the carrier 10 in the second direction via the two guide grooves 2102. A perpendicular midline between the two sliders 221 is defined as a reference line a. Along the clamping direction of the first positioning member 21, the distance between the guide groove 2102 provided on the first positioning member 21 and the reference line a gradually increases. This allows the first positioning member 21 to move in the first direction until the two first positioning members 21 clamp the silicon wafer, and the two second positioning members 22 to move toward each other in the second direction. In this manner, the first positioning member 21 and the two second positioning members 22 can simultaneously move toward or away from the silicon wafer to clamp or release the silicon wafer. The clamping direction is the direction in which the first positioning member 21 abuts against the silicon wafer along the first direction.
[0047] The other first positioning member 21 and one of the first positioning members 21 are respectively disposed on opposite sides of the carrier 10 along the first direction. Because one of the first positioning members 21 can simultaneously guide the movement of two second positioning members 22 disposed on opposite sides of the carrier 10 along the second direction, the other first positioning member 21 can be fixedly disposed on the carrier 10. The other first positioning member 21 can form a first limiting surface 12. The first limiting surface 12 is perpendicular to the carrier surface 11. See Figure 2 When the driver 30 drives one of the first positioning members 21 to move in the first direction to position the silicon wafer on the first limiting surface 12, the two second positioning members 22 approach to clamp two pairs of sides of the silicon wafer along the second direction. The first limiting surface 12, the first positioning member 21, and the two second positioning members 22 can respectively clamp the four sides of the rectangular silicon wafer to securely position the wafer in a predetermined position on the support surface 11.
[0048] The preset position is the position of the silicon wafer on the carrying surface 11 when the first positioning member 21 positions the silicon wafer to the first limiting surface 12 .
[0049] It can be understood that when the sizes of silicon wafers carried on the carrying surface 11 are different, the distance between one of the first positioning members 21 and the two second positioning members 22 and the carrying member 10 can be adjusted so that the first limiting surface 12, the first positioning member 21 and the two second positioning members 22 can clamp and position the silicon wafer on the carrying surface 11.
[0050] In some embodiments, the two first positioning members 21 are each provided with a guide groove 2102. The guide groove 2102 on each first positioning member 21 is used to guide the movement of a second positioning member 22. The two first positioning members 21 are driven toward each other by the driving member 30 to move toward each other, thereby guiding the two second positioning members 22 toward each other. At this time, the two first positioning members 21 clamp the silicon wafer on opposite sides along the first direction, and the two second positioning members 22 clamp the silicon wafer on opposite sides along the second direction.
[0051] See Figure 4 In some embodiments, the angle α formed by the extension directions of the two guide grooves 2102 is 90°. The two guide grooves 2102 are symmetrically arranged along the reference line a, so that the distance moved by the first positioning member 21 in the first direction is the same as the distance moved by the second positioning member 22 in the second direction.
[0052] In other embodiments, depending on the length-to-width ratio of the silicon wafer or the shape of the silicon wafer, the angle α formed by the extension directions of the two guide grooves 2102 may also be greater than or less than 90°.
[0053] See Figure 2 In some embodiments, the sliding member 221 is a roller, which is fixedly connected to the second positioning member 22 , and the roller is passed through the guide groove 2102 so that the second positioning member 22 can move relative to the guide groove 2102 .
[0054] In some embodiments, the tidying device 100 further includes a base 40. The base 40 is used to mount the carrier 10 so as to secure the carrier 10. The base 40 is disposed below the carrier 10. A gap is provided between the base 40 and the carrier 10, and a first guide rail 41 is provided on the base 40 to be located in the gap. The provision of the gap allows space for the installation of the first guide rail 41, thereby facilitating the installation of the two second positioning members 22. The extension direction of the first guide rail 41 is parallel to the second direction, and the first guide rail 41 is used to slidably connect to the second positioning member 22 to guide the second positioning member 22 to move along the second direction.
[0055] The first guide rail 41 restricts the movement of the second positioning members 22, forcing them to move only in the second direction. This prevents the two second positioning members 22 from deviating from the second direction or shaking during movement. The two second positioning members 22 can simultaneously move the same distance in the second direction under the action of the guide groove 2102 to clamp opposite sides of the silicon wafer.
[0056] In some embodiments, there are two first guide rails 41 , which are spaced apart along the first direction. The two first guide rails 41 are respectively connected to both ends of the second positioning member 22 , so that the second positioning member 22 can move more smoothly along the second direction.
[0057] See Figure 4In some embodiments, a second guide rail 42 is provided on a side of the base 40 facing away from the first guide rail 41. The second guide rail 42 extends parallel to the first direction. The second guide rail 42 is configured to be slidably connected to the first positioning member 21 to guide the first positioning member 21 to move along the first direction when driven by the driving member 30.
[0058] The second guide rail 42 limits the moving direction of the first positioning member 21 so that the first positioning member 21 can and can only move along the first direction under the drive of the driving member 30 to prevent the first positioning member 21 from deviating from the first direction or shaking under the drive of the driving member 30.
[0059] In some embodiments, there are two second guide rails 42, and the two second guide rails 42 are spaced apart on opposite sides of the driving member 30 along the second direction. The two second guide rails 42 are both connected to the first positioning member 21, so that the second positioning member 22 moves more smoothly along the first direction.
[0060] See Figure 2 and Figure 4 In some embodiments, the first positioning member 21 includes a connecting portion 212 and a positioning portion 211 that are connected to each other. The connecting portion 212 is provided below the base 40 and is slidably connected to the second guide rail 42. The positioning portion 211 is used to clamp the opposite sides of the silicon wafer along the first direction together with the first limiting surface 12. A notch 401 is provided on the base 40, which passes through the notch 401 in the vertical direction. The second positioning member 22 partially passes through the notch 401 and is slidably connected to the connecting portion 212. By providing the notch 401 on the base 40, the sliding member 221 below the second positioning member 22 can pass through the notch 401 and be connected to the guide groove 2102 on the connecting portion 212. Since the connecting portion 212 is connected to the positioning portion 211, when the connecting portion 212 moves along the second guide rail 42, the positioning portion 211 moves closer to or away from the carrier 10 along the first direction, so that the first positioning member 21 can move toward the first limiting surface 12.
[0061] See Figure 4 In some embodiments, the connecting portion 212 and the base 40 are both flat, and the connecting portion 212 is parallel to the base 40 so that the connecting portion 212 is connected to the second guide rail 42 and moves along the second guide rail 42. The positioning portion 211 is in the shape of a vertical plate, so as to move close to the first limiting surface 12 and position the silicon wafer on the first limiting surface 12.
[0062] In some embodiments, the driving member 30 is disposed on a side of the base 40 facing away from the carrier 10 and connected to the connecting portion 212. The connecting portion 212 is provided with an escape groove 2121 extending along the first direction and corresponding to the driving member 30. When the driving member 30 drives the connecting portion 212 toward the first limiting surface 12, the driving member 30 is accommodated by the escape groove 2121, thereby saving the area of the base 40.
[0063] It is understood that the driver 30 is mounted on the side of the base 40 facing away from the carrier 10, and the side of the base 40 facing away from the carrier 10 is slidably connected to the connecting portion 212 via the second guide rail 42. If the connecting portion 212 were not provided with the avoidance groove 2121, a larger base 40 would be required to avoid the connecting portion 212 in order to mount the driver 30. However, providing the avoidance groove 2121 on the connecting portion 212 allows the avoidance groove 2121 to accommodate the driver 30 without affecting the movement of the first positioning member 21 and the second positioning member 22, thereby saving the area of the base 40.
[0064] In some embodiments, the driving member 30 is a cylinder, and a working end of the cylinder is connected to the connecting portion 212 through a connecting block 31 to drive the connecting portion 212 to move along the second guide rail 42 .
[0065] In some embodiments, the tidying device 100 further includes a stopper 50. The stopper 50 is disposed on a side of the base 40 close to the second guide rail 42, and is located on a side of the first positioning member 21 facing the first limiting surface 12 to limit the first positioning member 21 and prevent the first positioning member 21 from excessively moving toward the first limiting surface 12.
[0066] The stopper 50 limits the distance between the first limiting surface 12 and the first positioning member 21, thereby preventing the first limiting surface 12 and the first positioning member 21 from pinching the material and preventing the first positioning member 21 from continuously moving toward the first limiting surface 12 and damaging the slide 221 and the guide groove 2102.
[0067] In some embodiments, the number of the stoppers 50 is two, and the two stoppers 50 are spaced apart on the base 40 along the second direction to more stably limit the movement of the connecting portion 212 .
[0068] In some embodiments, the stopper 50 includes a fixing portion 51 and a stopper 52. The fixing portion 51 is fixedly connected to the base 40. The stopper 52 is used to limit the position of the first positioning member 21. The stopper 52 can move relative to the fixing portion 51 in a first direction to adjust the position of the stopper 52, thereby adjusting the movable range of the first positioning member 21. As an illustrative example, the stopper 52 is threadedly connected to the fixing portion 51.
[0069] See Figure 2 and Figure 3 In some embodiments, the carrier 10 further includes a first adsorption groove 111 and / or a second adsorption groove 112 that penetrates the carrier surface 11. The first adsorption groove 111 and the second adsorption groove 112 are both provided on the carrier surface 11, so that the carrier surface 11 can adsorb the silicon wafer on the carrier surface 11 through the first adsorption groove 111 and the second adsorption groove 112.
[0070] In some embodiments, the number of the first adsorption grooves 111 is two, and the number of the second adsorption grooves 112 is two. The two first adsorption grooves 111 are spaced apart along the first direction. The two second adsorption grooves 112 are spaced apart along the second direction. The two second adsorption grooves 112 are arranged between the two first adsorption grooves 111, so that the carrier 10 can adsorb the silicon wafer on the carrier surface 11. It can be understood that by providing negative pressure to the first adsorption groove 111 and the second adsorption groove 112, the first adsorption groove 111 and the second adsorption groove 112 can adsorb the silicon wafer on the carrier surface 11. In other embodiments, the number of the first adsorption groove 111 and the second adsorption groove 112 can also be more than two, which is not limited here.
[0071] In some embodiments, the first adsorption groove 111 and the second adsorption groove 112 are both long strips. The second adsorption groove 112 is arranged between the two first adsorption grooves 111, and the extension direction of the first adsorption groove 111 is perpendicular to the extension direction of the second adsorption groove 112. It can adapt to sheet-shaped and rectangular silicon wafers. By adsorbing multiple areas of the silicon wafer, the carrier 10 can stably adsorb the silicon wafer on the carrying surface 11.
[0072] It is understood that since the positioning assembly 20 can move toward and away from the carrier 10, the carrier surface 11 can carry silicon wafers of different sizes. The silicon wafer is moved to a preset position by the positioning assembly 20 and is positioned at the preset position under the cooperation of the positioning assembly 20 and the first limiting surface 12. Figure 3 The two adsorption grooves are arranged near the center of the two first adsorption grooves 111 in the second direction, so that the carrier 10 can adsorb silicon wafers of different sizes.
[0073] See Figure 1 In some embodiments, the sizing device 100 further includes a blowing member connected to a blow pipe 60. The blow pipe 60 is disposed on one side of the carrier 10. The blow pipe 60 is deformable, and the blowing member blows air toward the carrier surface 11 through the blow pipe 60 to remove impurities on the carrier surface 11 and prevent them from affecting the accuracy of silicon wafer testing. As an example, the blowing member is a blower.
[0074] See Figure 1 and Figure 5In some embodiments, the transfer assembly 201 includes a first movable member 2011 and a suction cup 2012 connected to each other. The suction cup 2012 is used to absorb the silicon wafer. The first movable member 2011 is used to drive the suction cup 2012 to move the silicon wafer along a first direction. The transfer assembly 201 absorbs the silicon wafer and moves the silicon wafer, so that the silicon wafer can be loaded and unloaded. Before the test of the silicon wafer begins, the transfer assembly 201 absorbs the silicon wafer and moves the silicon wafer to move the silicon wafer to complete the loading of the silicon wafer. After the test of the silicon wafer is completed, the transfer assembly 201 absorbs the silicon wafer and moves the silicon wafer to remove the silicon wafer from the carrying surface 11 to complete the unloading of the silicon wafer.
[0075] In some embodiments, the suction cup 2012 is a Bernoulli suction cup.
[0076] See Figure 1 and Figure 6 In some embodiments, the test assembly 202 includes a second movable member 2022 and a test member 2021 connected thereto. The second movable member 2022 is configured to drive the test member 2021 to move vertically, causing the test member 2021 to move toward the aligning device 100 to contact and test the silicon wafer. It will be appreciated that the second movable member 2022 limits the movement of the test member 2021 to the vertical direction and can position the test member 2021 horizontally, thereby driving the test member 2021 toward a predetermined silicon wafer position.
[0077] See Figure 1 , in some implementations, the vertical direction is parallel to the Z axis.
[0078] In some embodiments, the detection device 200 also includes a third movable member 203. The third movable member 203 includes a slide rail 2031. The extension direction of the slide rail 2031 is parallel to the first direction. The slide rail 2031 is used to connect the tidying device 100 so that the tidying device 100 can move along the first direction. In detail, the tidying device 100 is moved to the bottom of the test assembly 202 so that it is located at a preset position facing the test piece 2021. In this way, the test piece 2021 is driven downward by the second movable member 2022, so that the test piece 2021 contacts the silicon wafer, thereby completing the test of the silicon wafer.
[0079] It is understood that the position of the first limiting surface 12 relative to the carrier 10 and the base 40 is fixed, and therefore the preset position is also relatively fixed. During use, after the aligning device 100 positions the silicon wafer, the aligning device 100 is moved a predetermined distance in the first direction by the third movable member 203 to align the preset position with the test piece 2021. The test piece 2021 is moved a predetermined distance in the vertical direction by the second movable member 2022 to contact the silicon wafer at the preset position for testing.
[0080] See Figure 1 and Figure 2 In some implementations, a bottom plate 2032 is slidably connected to the slide rail 2031. The bottom plate 2032 is spaced apart from the base 40, allowing the aligning device 100 to move the silicon wafer along the slide rail 2031. The connecting portion 212, the second guide rail 42, the stopper 50, and the driving member 30 are all disposed between the base 40 and the bottom plate 2032.
[0081] See Figure 1 In some embodiments, the detection device 200 includes a mounting frame 204, and the first movable member 2011, the second movable member 2022 and the third movable member 203 are all connected to the mounting frame 204, so that the transfer component 201, the test component 202 and the regularization device 100 are all installed and fixed through the mounting frame 204.
[0082] In some implementations, the first moving member 2011 , the second moving member 2022 , and the third moving member 203 are all linear slides to guide the suction cup 2012 , the test piece 2021 , and the tidying device 100 to move linearly.
[0083] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of disclosure of the present application.
Claims
1. A regularizing device, characterized in that: include: A carrier, comprising a carrying surface, wherein the carrying surface is used to carry the silicon wafer; A positioning assembly comprising two or more first positioning members and two or more second positioning members, wherein the two or more first positioning members are respectively disposed on opposite sides of the carrier along a first direction, and at least one of the first positioning members is slidably connected to the carrier; and the two or more second positioning members are respectively disposed on opposite sides of the carrier along a second direction, and the two or more second positioning members are slidably connected to at least one of the first positioning members, wherein the second direction and the first direction are two horizontal directions perpendicular to each other. A driving member is connected to at least one of the first positioning members. When the driving member drives the first positioning member to abut against the silicon wafer along the first direction, at least one of the first positioning members drives two or more of the second positioning members to approach each other so as to abut against the silicon wafer along the second direction.
2. The tidying device according to claim 1, characterized in that: One of the first positioning members is provided with two guide grooves at intervals or two of the first positioning members are provided with the guide grooves respectively, each of the second positioning members is provided with a slide, and each of the slides is provided in a corresponding guide groove; the mid-perpendicular line between the two slides is defined as the reference line, and along the clamping direction of the first positioning member, the distance between the guide groove provided on the first positioning member and the reference line gradually increases, so that the two second positioning members are close to each other along the second direction.
3. The tidying device according to claim 1 or 2, characterized in that: The tidying device also includes a base, which is arranged below the supporting member. There is a gap between the base and the supporting member. The base is provided with a first guide rail located in the gap. The extension direction of the first guide rail is parallel to the second direction. The first guide rail is used to slideably connect the second positioning member to guide the second positioning member to move along the second direction.
4. The tidying device according to claim 1, characterized in that: The tidying device also includes a base, which is arranged below the supporting member. A second guide rail is provided on the side of the base facing away from the supporting member. The extension direction of the second guide rail is parallel to the first direction. The second guide rail is used to slideably connect the first positioning member to guide the first positioning member to move along the first direction under the drive of the driving member.
5. The tidying device according to claim 1, characterized in that: The tidying device also includes a base, which is arranged below the carrier. At least one of the first positioning members includes a connecting portion and a positioning portion that are connected to each other. The positioning portion is used to abut the silicon wafer. The connecting portion is arranged below the base and is slidably connected to the base. A notch is provided through the base, and the second positioning member partially passes through the notch and is slidably connected to the connecting portion.
6. The tidying device according to claim 5, characterized in that: The driving member is arranged on a side of the base away from the supporting member and connected to the connecting part. The connecting part is provided with an avoidance groove extending along the first direction and corresponding to the driving member. When the driving member drives the connecting part to abut against the silicon wafer, the driving member is accommodated in the avoidance groove.
7. The tidying device according to claim 1, characterized in that: The tidying device further includes a stopper, which is arranged opposite to the first positioning member to limit the first positioning member.
8. The tidying device according to claim 1, characterized in that: The carrier further comprises a first adsorption groove and / or a second adsorption groove penetrating the carrier surface, so that the carrier can adsorb the silicon wafer on the carrier surface; The two or more first adsorption grooves are arranged at intervals along the first direction, and the two or more second adsorption grooves are arranged at intervals along the second direction.
9. A detection device, characterized in that: It includes a transfer component, a test component and a tidying device as described in any one of claims 1 to 8, the transfer component includes a first movable member and a suction cup connected together, the suction cup is used to adsorb the silicon wafer, the first movable member is used to drive the suction cup to move the silicon wafer along the first direction, the tidying device is used to receive the silicon wafer adsorbed by the suction cup, the test component includes a second movable member and a test piece connected together, the second movable member is used to drive the test piece to move in a vertical direction, so that the test piece moves toward the tidying device to contact and test the silicon wafer.
10. The detection device according to claim 9, characterized in that: The detection device also includes a third movable member, which includes a slide rail. The extension direction of the slide rail is parallel to the first direction. The slide rail is used to connect the tidying device so that the tidying device can move along the first direction.