Automatic grain picking device for chip wafers

Abstract

The utility model relates to the field of wafer grain picking machines, and discloses an automatic grain picking device for chip wafers, the automatic grain picking device comprises a control box and a grain picking box, the top of the control box is fixedly provided with an adjusting frame, one end of the adjusting frame is fixedly connected with an ion gun, and the top of the control box is rotatably provided with a placing disc; a rotating motor is fixedly connected to the surface of the grain picking box, rotating blades are fixedly mounted at the output end of the rotating motor, and the surfaces of the rotating blades are rotationally connected with the inner wall of the grain picking box; the grain picking box is installed at the top of the control box, the rotating motor is installed on the surface of the grain picking box, the rotating blades are installed at the output end of the rotating motor, the surfaces of the rotating blades are rotationally connected with the inner wall of the grain picking box, and one end of the grain picking box communicates with the suction pipe, so that the rotating blades are controlled to rotate by means of the rotating motor; and negative-pressure air flow is generated on the inner wall of the grain picking box, so that materials are sucked from one end of the suction pipe, and the working efficiency of the grain picking mechanism is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of wafer particle pickers, and in particular to an automatic particle picker for chip wafers. Background Art

[0002] A wafer picker is an automated equipment used in the semiconductor manufacturing process. It is mainly used to pick up tube cores of specified surface quality from blue film and place them in a wafer box. This equipment is suitable for tube cores of various sizes and wafer boxes of various specifications. It supports classification and picking functions, and has an efficient visual inspection system that can perform chip identification and positioning and surface defect detection. The design of the wafer picker is to improve the degree of automation and efficiency, while ensuring high-precision and high-efficiency sorting to meet the needs of the semiconductor manufacturing process. When a conventional wafer picker is in use, after the control box is installed stably, an adjustment frame and a placement tray are installed on the top of the control box, and an ion gun is installed at one end of the adjustment frame. The material to be inspected is placed on the upper end of the placement tray, and the static charge and dust on the surface of the material are removed with the help of the ion gun, and the defective products are separated with the help of a robotic arm.

[0003] Regarding the above-mentioned related technologies, the inventor believes that when conventionally using a robotic arm to pick particles for large-scale testing, the robotic arm has a limited moving speed, resulting in a long time required to screen out defective products, making it difficult to effectively complete large-scale testing, thereby affecting the particle picking efficiency of the material.

[0004] The above information disclosed in this background technology is only used to increase the understanding of the background technology of this application. Therefore, it may contain information that does not constitute the prior art known to ordinary technicians in this field. Utility Model Content

[0005] In order to solve the problem that conventional wafer particle picking is slow in efficiency and difficult to adapt to mass production, the present application provides an automatic particle picking device for chip wafers.

[0006] The present application provides an automatic particle sorting device for chip wafers using the following technical solutions:

[0007] An automatic particle picking device for chip wafers comprises a control box and a particle picking box, an adjustment frame fixedly mounted on the top of the control box, an ion gun fixedly connected to one end of the adjustment frame, a placement plate rotatably mounted on the top of the control box, a rotating motor fixedly connected to the surface of the particle picking box, a rotating blade fixedly mounted on the output end of the rotating motor, the surface of the rotating blade being rotatably connected to the inner wall of the particle picking box, a suction pipe connected to one end of the particle picking box, the bottom end of the particle picking box being fixedly mounted to the top of the control box, and the particle picking box being in a "Z" shape, and the center of the rotating blade and the center of the rotating motor being on the same straight line.

[0008] Preferably, the bottom end of the suction pipe is fixedly connected to a base frame, and two telescopic rods are fixedly installed between the base frame and the grain picking box, and the two telescopic rods are symmetrically distributed with the base frame as the axis.

[0009] Preferably, a cleaning groove is provided on the inner wall of the grain picking box, a shielding disk is clamped on the inner wall of the cleaning groove, two auxiliary rings are fixedly connected to the surface of the shielding disk, the size specifications of the auxiliary ring surface are interference fit with the size specifications of the inner wall of the cleaning groove, and the auxiliary ring is a rubber ring.

[0010] Preferably, a transmission frame is fixedly installed at one end of the control box, and the transmission frame is composed of a frame body, a transmission belt and two rotating shafts, and a control motor is fixedly connected to the inner wall of the transmission frame, the output end of the control motor is fixedly installed at one end of the rotating shaft, and one end of the control motor is electrically connected to one end of the control box by means of a wire.

[0011] Preferably, a mounting frame is fixedly mounted on the top of the transmission frame, and a detector is slidably connected to the surface of the mounting frame.

[0012] In summary, this application has the following beneficial technical effects:

[0013] 1. The particle picking box is installed on the top of the control box, a rotating motor is installed on the surface of the particle picking box, a rotating blade is installed on the output end of the rotating motor, the surface of the rotating blade is rotatably connected to the inner wall of the particle picking box, and one end of the particle picking box is connected to a suction pipe, so that the rotating blade is controlled to rotate by the rotating motor, so that the inner wall of the particle picking box generates a negative pressure airflow, thereby sucking the material from one end of the suction pipe, avoiding the low efficiency when picking large quantities of chip wafers. The bottom end of the suction pipe is fixedly connected to the base frame, and a telescopic The rod can be used to adjust the suction pipe after adjusting its own length with the help of the telescopic rod, so that the suction pipe can be used to absorb the material on the upper end of the placement plate. A cleaning groove is provided on the inner wall of the grain picking box, and a blocking disk is clamped on the inner wall of the cleaning groove. An auxiliary ring of rubber material is installed on the surface of the blocking disk to facilitate the removal of the blocking disk from the cleaning groove, so that the blocking disk can be opened for processing when the grain picking box is blocked by materials, and the sealing effect of the blocking disk is improved with the help of the auxiliary ring of rubber material. Compared with the existing technology, the working efficiency of the grain picking mechanism is effectively improved.

[0014] 2. A transmission rack can also be installed at one end of the control box. The transmission rack is operated with the help of a control motor, so that the material sucked into the particle box can be received by the transmission rack, and the material can be transported to the recycling equipment, so as to facilitate the collection and recycling of defective products. The top of the transmission rack is fixedly connected to a mounting rack, and the surface of the mounting rack is slidably connected to a detector, so that the detector can be adjusted to a suitable height with the help of the mounting rack. The material on the top of the transmission rack is photographed with the help of the detector, and uploaded to the computer for inspection, so as to perform a secondary inspection on the selected material, avoid misoperation of the machine, and select materials without quality problems; effectively improve the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of an automatic particle picking device for chip wafers according to an embodiment of the application;

[0016] Figure 2 This is a schematic diagram of the structure of the grain picking box according to an embodiment of the application;

[0017] Figure 3 is a side structural schematic diagram of an embodiment of the application;

[0018] Figure 4 It is a structural diagram of location A of the application embodiment.

[0019] Explanation of the accompanying symbols: 1. Control box; 2. Adjustment frame; 3. Ion gun; 4. Placement tray; 5. Particle picking box; 6. Rotating blade; 7. Rotating motor; 8. Suction pipe; 9. Base frame; 10. Telescopic rod; 11. Cleaning trough; 12. Shielding plate; 13. Transfer frame; 14. Control motor; 15. Mounting frame; 16. Detector. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1 —4 Provide further details of this application.

[0021] The present application discloses an automatic particle picking device for chip wafers, referring to Figure 1 - Figure 2, including a control box 1. When in use, after the control box 1 is installed and stabilized, an adjustment frame 2 and a placement tray 4 are installed on the top of the control box 1. An ion gun 3 is installed at one end of the adjustment frame 2. The material to be tested is placed on the upper end of the placement tray 4. The static charge and dust on the surface of the material are removed by the ion gun 3, and the defective products are separated by the robotic arm. The particle picking box 5 is installed on the top of the control box 1. A rotating motor 7 is installed on the surface of the particle picking box 5. A rotating blade 6 is installed at the output end of the rotating motor 7. The surface of the rotating blade 6 is rotatably connected to the inner wall of the particle picking box 5, and one end of the particle picking box 5 is connected to a suction pipe 8. The rotating blade 6 is controlled to rotate by the rotating motor 7, so that a negative pressure airflow is generated on the inner wall of the particle picking box 5, thereby sucking the material from one end of the suction pipe 8, effectively improving the working efficiency of the particle picking mechanism, and avoiding the low efficiency when picking large quantities of chip wafers.

[0022] Reference Figure 2 The bottom end of the suction pipe 8 is fixedly connected to the base frame 9, and a telescopic rod 10 is installed between the base frame 9 and the grain picking box 5. The suction pipe 8 is adjusted by adjusting its own length with the telescopic rod 10, so that the suction pipe 8 can be used to suck the material on the upper end of the placement plate 4, thereby improving the accuracy of material picking. A cleaning groove 11 is provided on the inner wall of the grain picking box 5, and a blocking plate 12 is clamped on the inner wall of the cleaning groove 11. An auxiliary ring of rubber material is installed on the surface of the blocking plate 12. The blocking plate 12 is removed from the cleaning groove 11, which is convenient for opening the blocking plate 12 when the grain picking box 5 is blocked by materials, and the blocked materials in the cleaning groove 11 are processed, and the sealing effect of the blocking plate 12 is improved with the help of the auxiliary ring of rubber material.

[0023] Reference Figure 3 - Figure 4 A transmission frame 13 is installed at one end of the control box 1. The transmission frame 13 is operated with the help of a control motor 14. The material sucked into the particle box 5 is received through the transmission frame 13 and the material is transported to the recycling equipment, which is convenient for collecting and recycling defective products. The top of the transmission frame 13 is fixedly connected to a mounting frame 15. The surface of the mounting frame 15 is slidably connected to a detector 16. The detector 16 is adjusted to a suitable height with the help of the mounting frame 15. The material on the top of the transmission frame 13 is photographed with the help of the detector 16, and uploaded to the computer for inspection, so as to perform a secondary inspection on the selected material, avoid machine misoperation, and select materials without quality problems.

[0024] The implementation principle of an automatic particle picking device for chip wafers in the embodiment of the present application is as follows: a particle picking box 5 is installed on the top of the control box 1, a rotating motor 7 is installed on the surface of the particle picking box 5, and a rotating blade 6 is installed on the output end of the rotating motor 7. The surface of the rotating blade 6 is rotatably connected to the inner wall of the particle picking box 5, and one end of the particle picking box 5 is connected to a suction pipe 8, so that the rotating blade 6 can be controlled to rotate by means of the rotating motor 7 to generate a negative pressure airflow on the inner wall of the particle picking box 5, thereby sucking the material from one end of the suction pipe 8, avoiding the low efficiency when picking large quantities of chip wafers. The bottom end of the suction pipe 8 is fixedly connected to It is connected to a base frame 9, and a telescopic rod 10 is installed between the base frame 9 and the grain picking box 5, so that the suction pipe 8 can be adjusted after adjusting its own length with the help of the telescopic rod 10, so that the suction pipe 8 can be used to adsorb the material on the upper end of the placement plate 4. A cleaning groove 11 is provided on the inner wall of the grain picking box 5, and a baffle plate 12 is clamped on the inner wall of the cleaning groove 11. An auxiliary ring made of rubber is installed on the surface of the baffle plate 12 to facilitate the removal of the baffle plate 12 from the cleaning groove 11, so that the baffle plate 12 can be opened for processing when the grain picking box 5 is blocked by materials, and the sealing effect of the baffle plate 12 is improved with the help of the auxiliary ring made of rubber.

[0025] A transmission frame 13 can also be installed at one end of the control box 1. The transmission frame 13 is operated with the help of a control motor 14, so that the material sucked into the particle box 5 can be received by the transmission frame 13, and the material can be transported to the recycling equipment, so as to facilitate the collection and recycling of defective products. The top of the transmission frame 13 is fixedly connected to a mounting frame 15, and the surface of the mounting frame 15 is slidably connected to a detector 16, so that the detector 16 can be adjusted to a suitable height with the help of the mounting frame 15. The material on the top of the transmission frame 13 is photographed with the help of the detector 16, and uploaded to the computer for inspection, so as to perform a secondary inspection on the selected material, avoid machine misoperation, and select materials without quality problems.

[0026] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An automatic particle sorting device for chip wafers, comprising a control box (1) and a particle sorting box (5), characterized in that: An adjusting frame (2) is fixedly mounted on the top of the control box (1), one end of the adjusting frame (2) is fixedly connected to an ion gun (3), a placing plate (4) is rotatably mounted on the top of the control box (1), a rotating motor (7) is fixedly connected to the surface of the grain picking box (5), a rotating blade (6) is fixedly mounted on the output end of the rotating motor (7), the surface of the rotating blade (6) is rotatably connected to the inner wall of the grain picking box (5), and one end of the grain picking box (5) is connected to a suction pipe (8).

2. The automatic particle sorting device for chip wafers according to claim 1, characterized in that: The bottom end of the grain picking box (5) is fixedly mounted on the top of the control box (1), and the grain picking box (5) is in a "Z"-shaped structure. The center of the rotating blade (6) and the center of the rotating motor (7) are on the same straight line.

3. The automatic particle sorting device for chip wafers according to claim 1, characterized in that: The bottom end of the suction pipe (8) is fixedly connected to a base frame (9), and two telescopic rods (10) are fixedly installed between the base frame (9) and the grain picking box (5), and the two telescopic rods (10) are symmetrically distributed with the base frame (9) as the axis.

4. The automatic particle sorting device for chip wafers according to claim 1, characterized in that: The inner wall of the grain picking box (5) is provided with a cleaning groove (11), the inner wall of the cleaning groove (11) is clamped with a shielding plate (12), and the surface of the shielding plate (12) is fixedly connected with two auxiliary rings, the size specifications of the auxiliary ring surface are interference fit with the size specifications of the inner wall of the cleaning groove (11), and the auxiliary ring is a rubber ring.

5. The automatic particle sorting device for chip wafers according to claim 1, characterized in that: A transmission frame (13) is fixedly mounted on one end of the control box (1), and the transmission frame (13) is composed of a frame body, a transmission belt and two rotating shafts. A control motor (14) is fixedly connected to the inner wall of the transmission frame (13), and an output end of the control motor (14) is fixedly mounted on one end of the rotating shaft, and one end of the control motor (14) is electrically connected to one end of the control box (1) by means of a wire.

6. The automatic particle sorting device for chip wafers according to claim 5, characterized in that: A mounting frame (15) is fixedly mounted on the top of the transmission frame (13), and a detector (16) is slidably connected to the surface of the mounting frame (15).

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