Pressing plate of LED full-automatic wire welding machine

Abstract

The utility model discloses an LED full-automatic wire welding machine pressing plate which is used for pressing and fixing an LED support and comprises a pressing plate body, a wire welding area is arranged in the middle of the pressing plate body, and 14 columns and 24 rows of welding through holes which are arranged longitudinally and transversely are formed in the wire welding area. In order to solve the technical problems that in the using process of an existing pressing plate, the number of material pulling times of a material claw is large, and the number of PR scanning times of a welding head is large, the LED full-automatic wire welding machine pressing plate is provided. The welding through holes are arranged in 14 columns in the longitudinal direction and 24 rows in the transverse direction, 336 LED supports can be processed at most at a time, for a single LED support comprising 960 LED supports, material claw pulling and welding head PR scanning only need three times respectively, and the wire welding efficiency of a machine table is improved.

Description

Technical Field

[0001] The utility model relates to the field of equipment for wire bonding machines, in particular to a pressing plate for an LED wire bonding machine. Background Art

[0002] The LED wire bonding machine pressure plate is mainly used to press and fix the LED bracket to ensure the stable position of the LED bracket during the welding process and avoid poor welding due to movement.

[0003] Chinese utility model patent specification CN212095045U discloses an anti-deformation welding wire pressure plate, including a pressure plate body, the middle part of the pressure plate body is a welding wire area, the welding wire area is provided with a plurality of welding through holes arranged in a criss-cross pattern, positioning holes for positioning the pressure plate are opened at both ends of the working surface of the pressure plate body, and a slot hole structure is provided between the positioning holes and the welding through holes to reduce the stress on the welding wire area... The welding through holes are modified into 6 rows, resulting in a large number of material pulling times by the welding machine claws and a large number of PR scanning times by the welding head, resulting in low machine efficiency.

[0004] Therefore, there is an urgent need to provide a pressing plate for an LED fully automatic wire bonding machine to solve the above-mentioned technical problems existing in the prior art. Utility Model Content

[0005] In order to solve the technical problems of the existing pressing plate in the process of using the material claws to pull the material many times and the welding head PR scanning many times, the utility model provides a pressing plate for LED fully automatic wire bonding machine. The utility model is realized by the following technical solutions:

[0006] A pressing plate of an LED fully automatic wire bonding machine is used to press and fix an LED bracket, comprising a pressing plate body, a welding area being provided in the middle of the pressing plate body, and welding through holes arranged in fourteen columns and twenty-four rows vertically and horizontally being provided in the welding area.

[0007] As described above, in a fully automatic LED wire bonding machine pressure plate, the welding through holes are grouped into two columns, and a total of seven groups of through holes are provided in the welding wire area. The spacing between each two groups of through holes is greater than the spacing between the two columns of through holes in each group. The spacing between each two groups of through holes is 1.45mm to 1.55mm, preferably 1.5mm, and the spacing between the two columns of through holes in each group is 0.95mm to 1.05mm, preferably 1mm. The horizontal length of the welding wire area is 58.5mm to 59.5mm, preferably 59mm, the longitudinal length of the welding wire area is 74.5mm to 75.5mm, preferably 75mm, and the thickness of the welding wire area is 4.75mm to 4.85mm, preferably 4.8mm.

[0008] As described above, a pressure plate of an LED fully automatic wire bonding machine is provided with positioning holes for positioning the pressure plate at both ends of the working surface of the pressure plate body, and a slot hole structure is provided between the positioning hole and the welding through hole to reduce the stress on the welding wire area. The slot hole structure is a C-shaped groove running through the upper and lower sides of the pressure plate body, and the C-shaped grooves at both ends are symmetrically arranged with the welding wire area as the center, and the notch of the C-shaped groove faces the welding through hole. After the C-shaped groove is provided, the stress on the middle of the pressure plate is reduced after the stress on the two ends of the pressure plate is applied, thereby avoiding deformation of the welding wire area of ​​the pressure plate.

[0009] As described above, the pressing plate of the fully automatic LED wire bonding machine has grooves on both sides of the wire bonding area, and the C-shaped groove is provided on the grooves.

[0010] In the above-mentioned LED full-automatic wire bonding machine pressure plate, the welding through hole is in an inverted trapezoidal shape, the inner side wall of the welding through hole is provided with an inclined surface, and the opening of the welding through hole gradually decreases from the upper end to the lower end of the through hole.

[0011] Compared with the prior art, the utility model has the following advantages:

[0012] 1. The welding through holes proposed in this utility model are arranged in 14 columns vertically and 24 rows horizontally, and can process up to 336 LED brackets at a time. For a single LED bracket containing 960 LED brackets, the material claw pulling and welding head PR scanning only need to be performed three times respectively, which improves the wire bonding efficiency of the machine.

[0013] 2. In the present invention, the setting of the wire bonding area, the spacing between through hole groups and the spacing within the groups enables the LED chip to be accurately aligned during the welding process, reducing welding defects caused by position deviation and improving the wire bonding efficiency of the machine.

[0014] 3. The positioning holes in the present invention enhance the positioning accuracy of the pressure plate during use, and the C-shaped groove effectively disperses the forces at both ends of the pressure plate, thereby preventing the welding line area in the middle of the pressure plate from being subjected to excessive stress and causing deformation.

[0015] 4. The provision of the grooves in the present invention changes the material distribution of the pressure plate body, enhances the local structural rigidity, further reduces the stress in the middle of the pressure plate, and avoids deformation in the welding line area.

[0016] 5. In the present invention, the inner side wall of the welding through hole is provided with a slope and the opening of the through hole gradually decreases from the upper end to the lower end, so that the welding head will not touch the hole wall when moving above the welding through hole, thereby avoiding damage to the pressure plate due to collision and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 This is a structural diagram of the LED full-automatic wire bonding machine pressing plate of the present application;

[0019] Figure 2 yes Figure 1 Cross-sectional view along AA direction;

[0020] Figure 3 yes Figure 1 Cross-sectional view along BB direction. DETAILED DESCRIPTION

[0021] In order to make the technical problems, technical solutions and beneficial effects solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0022] See also Figures 1 to 3 A fully automatic LED wire bonding machine pressure plate, used to clamp and secure LED brackets, comprises a pressure plate body 1, with a wire bonding area defined in the middle thereof. This area is provided with fourteen columns and twenty-four rows of solder through-holes 2 arranged vertically and horizontally. Since the machine's material jaws have a maximum range of motion of 57mm and the pressure plate window length for 14 columns of solder through-holes is 56.04mm, using 14 columns of solder through-holes maximizes the range of motion of the machine's material jaws. For a single-piece LED bracket containing 960 LED brackets, using a pressure plate with a 14×24 layout, the material jaws only need to pull the material three times, and the soldering head only needs to perform three PR scans. In this embodiment, the solder through-holes are arranged in 14 columns vertically and 24 rows horizontally, allowing for processing of up to 336 LED brackets at a time. For a single-piece LED bracket containing 960 LED brackets, the material jaws only need to pull the material three times, and the soldering head only needs to perform three PR scans, respectively, improving the machine's wire bonding efficiency.

[0023] Furthermore, as a preferred embodiment of this solution but not a limitation, the welding through holes 2 are arranged in groups of two, and the wire bonding area is provided with seven groups of through holes. The spacing between each two groups of through holes is greater than the spacing between the two rows of through holes within each group. The spacing between each two groups of through holes is 1.45 mm to 1.55 mm, preferably 1.5 mm, and the spacing between the two rows of through holes within each group is 0.95 mm to 1.05 mm, preferably 1 mm. The horizontal length of the wire bonding area is 58.5 mm to 59.5 mm, preferably 59 mm, and the vertical length of the wire bonding area is 74.5 mm to 75.5 mm, preferably 75 mm. The thickness of the wire bonding area is 4.75 mm to 4.85 mm, preferably 4.8 mm. In this embodiment, the arrangement of the wire bonding area, the spacing between through hole groups, and the spacing within each group enables precise alignment of the LED chips during the welding process, reduces welding defects caused by position deviation, and improves the wire bonding efficiency of the machine.

[0024] Furthermore, as a preferred embodiment of this solution but not a limitation, positioning holes 3 for positioning the pressure plate are provided at both ends of the working surface of the pressure plate body 1. A slot structure that can reduce the stress on the welding line area is provided between the positioning holes 3 and the welding through-hole 2. The slot structure is a C-shaped slot 4 that runs through the upper and lower sides of the pressure plate body 1. The C-shaped slots 4 at both ends are symmetrically arranged with the welding line area as the center. The notches of the C-shaped slots 4 face the welding through-hole 2. After the C-shaped slots are provided, the stress on the two ends of the pressure plate is reduced to reduce the stress in the middle of the pressure plate, thereby avoiding deformation of the welding line area of ​​the pressure plate. In this embodiment, the positioning holes enhance the positioning accuracy of the pressure plate during use, and the C-shaped slots effectively disperse the stress on the two ends of the pressure plate, thereby avoiding deformation of the welding line area in the middle of the pressure plate due to excessive stress.

[0025] Furthermore, as a preferred embodiment of this solution but not a limitation, grooves 7 are provided on both sides of the welding line area, and the C-shaped grooves 4 are provided on the grooves 7. In this embodiment, the provision of the grooves changes the material distribution of the pressure plate body, enhances the local structural rigidity, further reduces the stress in the middle of the pressure plate, and avoids deformation in the welding line area.

[0026] Furthermore, as a preferred embodiment of this solution but not limiting, the welding through-hole 2 is in the shape of an inverted trapezoid, and the inner sidewall of the welding through-hole 2 is provided with a bevel 20, and the opening of the welding through-hole 2 gradually decreases from the upper end to the lower end of the through-hole. In this embodiment, the inner sidewall of the welding through-hole is provided with a bevel, and the opening of the through-hole gradually decreases from the upper end to the lower end. This ensures that the welding head does not contact the hole wall when moving above the welding through-hole, thereby avoiding damage to the pressure plate due to collision and reducing costs.

[0027] The working principle of this embodiment is as follows:

[0028] When in use, the LED fully automatic wire bonding machine's pressure plate presses the LED bracket. The PR scanning imaging system on the welding head first searches for the LED bracket to be welded, then searches for all the LED brackets to be welded in the first row, and finally returns to the position of the first LED bracket and performs wire welding on the single LED bracket in the wire through-hole 2. All the scanned LED brackets are welded in sequence. After the wire welding is completed, the machine's positioning device separates the pressure plate from the single-piece LED bracket by connecting with the positioning hole 3. The material claw pulls the single-piece LED bracket to one side and makes the window of the pressure plate face the LED bracket to be welded. There are 960 separate brackets in a single piece of LED bracket. The specification of the pressure plate is 14×24. Up to 336 LED brackets can be welded in a single time. The material claw only needs to pull the material three times and the welding head PR scan three times. The robotic arm can complete the wire welding action of the entire LED bracket. Compared with other wire bonding machine pressure plates with fewer columns, the 14-column pressure plate has higher wire welding efficiency.

[0029] The above are implementation methods provided in conjunction with specific content, and the specific implementation of this application is not limited to these descriptions. Any method structure that is similar to the method structure of this application, or any technical deduction or replacement based on the concept of this application, should be considered as the scope of protection of this application.

Claims

1. A pressing plate of an LED fully automatic wire bonding machine, used for pressing and fixing an LED bracket, comprising a pressing plate body (1), characterized in that: A welding line area is provided in the middle of the pressure plate body (1), and fourteen rows of welding through holes (2) are arranged vertically and horizontally in the welding line area; The welding through holes (2) are arranged in twenty-four rows transversely; The welding through holes (2) are grouped in pairs. The welding line area is provided with seven groups of through holes in total. The spacing between each two groups of through holes is greater than the spacing between the two columns of through holes in each group.

2. The LED fully automatic wire bonding machine pressing plate according to claim 1, characterized in that: The distance between each two groups of through holes is 1.45 mm to 1.55 mm, and the distance between two columns of through holes in each group is 0.95 mm to 1.05 mm.

3. The LED fully automatic wire bonding machine pressing plate according to claim 2, characterized in that: The distance between each two groups of through holes is 1.5 mm, and the distance between two columns of through holes in each group is 1 mm.

4. The LED fully automatic wire bonding machine pressing plate according to claim 1, characterized in that: The horizontal length of the welding line area is 58.5 mm to 59.5 mm, the vertical length of the welding line area is 74.5 mm to 75.5 mm, and the thickness of the welding line area is 4.75 mm to 4.85 mm.

5. The LED fully automatic wire bonding machine pressing plate according to claim 4, characterized in that: The horizontal length of the bonding line area is 59 mm, the vertical length of the bonding line area is 75 mm, and the thickness of the bonding line area is 4.8 mm.

6. The LED fully automatic wire bonding machine pressing plate according to claim 1, characterized in that: Positioning holes (3) for positioning the pressure plate are provided at both ends of the working surface of the pressure plate body (1); a slot structure capable of reducing stress on the welding line area is provided between the positioning hole (3) and the welding through hole (2); the slot structure is a C-shaped slot (4) that passes through the upper and lower sides of the pressure plate body (1); and the notch of the C-shaped slot (4) faces the welding through hole (2).

7. The LED fully automatic wire bonding machine pressing plate according to claim 6, characterized in that: Grooves (7) are provided on both sides of the welding line area, and the C-shaped groove (4) is provided on the grooves (7).

8. The LED fully automatic wire bonding machine pressing plate according to claim 1, characterized in that: The welding through hole (2) is in an inverted trapezoidal shape, an inner side wall of the welding through hole (2) is provided with an inclined surface (20), and the opening of the welding through hole (2) gradually decreases from the upper end to the lower end of the through hole.

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