Heat sink and circuit assembly

Abstract

The utility model relates to a radiator and a circuit assembly, and belongs to the technical field of electronics. A radiator comprises a first heat dissipation assembly, a second heat dissipation assembly, a first heat dissipation module, a second heat dissipation module and a second heat dissipation module, and the first heat dissipation assembly is provided with a first heat dissipation through groove; the second heat dissipation assembly is arranged on the first heat dissipation assembly, the second heat dissipation assembly is provided with a second heat dissipation through groove, and a pin hole is defined by the first heat dissipation assembly and the second heat dissipation assembly; and the contact pins are arranged on the first heat dissipation assembly and / or the second heat dissipation assembly and are located at the contact pin holes. Due to the fact that the heat dissipation area of a first heat dissipation through groove formed in a first heat dissipation assembly is limited, the first heat dissipation assembly is arranged on a second heat dissipation assembly, and in combination with a second heat dissipation through groove formed in the second heat dissipation assembly, the heat dissipation surface area of the radiator can be increased; therefore, heat can be transferred from a heat source to surrounding air more quickly, and the heat dissipation process is smoother and more efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of electronics, in particular to a radiator and a circuit component. Background Art

[0002] In the prior art, the heat sink of the circuit board in the electronic component has an unreasonable heat dissipation structure design, which causes heat accumulation in the electronic component and cannot be quickly dissipated, which seriously threatens the stability of the entire electronic system and accelerates the aging of the electronic component, shortening its service life. Utility Model Content

[0003] Based on this, it is necessary to provide a heat sink and a circuit assembly to address the problem of unreasonable heat dissipation structure design of the heat sink.

[0004] A radiator comprises: a first heat dissipation component, the first heat dissipation component being provided with a first heat dissipation groove; a second heat dissipation component, the second heat dissipation component being arranged on the first heat dissipation component, the second heat dissipation component being provided with a second heat dissipation groove, the first heat dissipation component and the second heat dissipation component being enclosed to form a pin hole; and a pin, the pin being arranged on the first heat dissipation component and / or the second heat dissipation component and being located at the pin hole.

[0005] The above discloses a radiator. Since the heat dissipation area of ​​the first heat dissipation groove provided in the first heat dissipation component is limited, the first heat dissipation component is arranged on the second heat dissipation component, and combined with the second heat dissipation groove provided in the second heat dissipation component, the heat dissipation surface area of ​​the radiator can be increased, so that heat can be transferred from the heat source to the surrounding air more quickly, making the heat dissipation process smoother and more efficient, and effectively avoiding local overheating. At the same time, the second heat dissipation component can further conduct the heat absorbed by the first heat dissipation component, reduce the operating temperature of the first heat dissipation component, enhance the heat dissipation function of the entire radiator, and extend the service life of the device, further ensuring the normal operation of the circuit component. The pins are arranged at the pin holes formed by the first heat dissipation component and the second heat dissipation component, which can first play a good fixing role, ensuring that the radiator does not loosen or shift in the circuit component, and at the same time can ensure good contact between the circuit component and the radiator, so that the heat generated in the circuit component is transferred to the radiator through the pins, improving the heat dissipation efficiency of the entire circuit component, and ensuring the normal operation of the circuit component.

[0006] In one embodiment, there are multiple pin holes and multiple pins, and the multiple pins are correspondingly arranged on the multiple pin holes. By correspondingly arranging multiple pins on multiple pin holes, on the one hand, the connection force between the first heat dissipation component and the second heat dissipation component can be more evenly distributed. When the radiator is subjected to external force, each pin can share a part of the force, preventing the force from being concentrated in a certain local area and causing the connection between the components to become loose or damaged. This uniform force distribution can ensure that the two heat dissipation components fit tightly and maintain the stability of the overall structure of the radiator. On the other hand, it can increase the heat dissipation area and heat dissipation path of the circuit components, so that heat can be dissipated from the radiator to the air more quickly and evenly, ensuring the normal operation of the circuit components.

[0007] In one embodiment, the number of the first heat dissipation grooves is multiple. By providing multiple first heat dissipation grooves, the heat dissipation surface area can be significantly increased. The larger the heat dissipation area, the higher the efficiency of heat dissipation. When heat is conducted from the heat source to the first heat dissipation component, the multiple grooves provide more heat dissipation paths for the heat. The heat can be exchanged with the surrounding air through the surface of each groove, so that more heat can be dissipated per unit time, thereby effectively improving the heat dissipation performance of the entire radiator. At the same time, the multiple grooves can guide the air to flow therein, forming multiple independent heat convection channels. When the air flows in the grooves, it continuously carries away the heat from the surface of the grooves, and due to the presence of the grooves, the resistance to air flow is relatively small, and it can circulate more smoothly around the heat dissipation component, enhancing the effect of heat convection and accelerating heat dissipation.

[0008] In one embodiment, the number of the second heat dissipation grooves is multiple. By providing multiple second heat dissipation grooves, the heat dissipation surface area can be significantly increased. The larger the heat dissipation area, the higher the efficiency of heat dissipation. When heat is conducted from the heat source to the second heat dissipation component, the multiple grooves provide more heat dissipation paths for the heat. The heat can be exchanged with the surrounding air through the surface of each groove, so that more heat can be dissipated per unit time, thereby effectively improving the heat dissipation performance of the entire radiator. At the same time, the multiple grooves can guide the air to flow therein, forming multiple independent heat convection channels. When the air flows in the grooves, it continuously removes heat from the surface of the grooves, and due to the presence of the grooves, the resistance to air flow is relatively small, and it can circulate more smoothly around the heat dissipation component, enhancing the effect of heat convection and accelerating heat dissipation. It can also make the heat more evenly distributed in the second heat dissipation component, avoiding local overheating caused by heat concentration, which is conducive to maintaining the overall performance of the radiator.

[0009] In one embodiment, the first heat dissipation assembly includes a first heat dissipation plate and a first heat dissipation block. There are multiple first heat dissipation blocks, each disposed on the first heat dissipation plate and distributed at both ends of the first heat dissipation plate. The first heat dissipation blocks are provided with multiple first heat dissipation slots. By providing multiple first heat dissipation blocks at both ends of the first heat dissipation plate, heat transferred from the heat source can be effectively dispersed. When heat originates from the center of the first heat dissipation plate, the heat dissipation blocks at both ends can guide the heat toward the ends, preventing excessive heat accumulation in the center of the heat dissipation plate. This ensures a more even distribution of heat throughout the entire heat dissipation plate and heat dissipation block system, preventing localized overheating. The multiple first heat dissipation slots provided by the multiple first heat dissipation blocks increase the surface area for heat dissipation, thereby increasing the heat dissipation path. Furthermore, the provision of the first heat dissipation blocks at both ends provides physical support for the first heat dissipation plate. The heat dissipation plate may deform due to long-term thermal expansion and contraction. The heat dissipation blocks at both ends provide a certain degree of fixation and support, reducing deformation of the heat dissipation plate. This physical support maintains good contact between the heat dissipation plate and the heat dissipation blocks, ensuring smooth heat transfer from the heat dissipation plate to the heat dissipation blocks, and also helps extend the service life of the entire heat dissipation system.

[0010] In one embodiment, the first heat sink includes a first heat sink and a first heat sink base. The number of the first heat sinks is multiple, and the multiple first heat sinks are spaced apart along the length direction of the first heat sink base, and the first heat sink grooves are formed between adjacent first heat sinks. By arranging the multiple first heat sinks on the first heat sink base, the surface area of ​​the entire heat sink structure is greatly increased, so that more areas can exchange heat with the surrounding air. When heat is conducted from the heat source to the first heat sink base, it will be quickly dispersed to the multiple first heat sinks. Since the multiple first heat sinks are spaced apart to form multiple first heat sink grooves, a more regular and efficient flow path is provided for the air, guiding the air to flow quickly between the heat sinks, effectively dissipating the heat to the surrounding environment, thereby improving the reliability of the radiator, avoiding the continuous increase in the temperature of the heat source, ensuring that the circuit components can work safely, and extending their service life.

[0011] In one embodiment, the second heat dissipation assembly includes a second heat dissipation plate, a second heat dissipation block, and a protrusion. The second heat dissipation plate is arranged on the first heat dissipation assembly. There are multiple second heat dissipation blocks, multiple second heat dissipation blocks are arranged on the second heat dissipation plate and / or the first heat dissipation assembly, multiple second heat dissipation blocks are distributed at both ends of the second heat dissipation plate, the protrusion is arranged on the second heat dissipation plate, and the second heat dissipation block is provided with multiple second heat dissipation grooves. By arranging the second heat dissipation plate on the first heat dissipation assembly, since the heat dissipation area of ​​the first heat dissipation assembly itself is limited, the second heat dissipation plate can quickly absorb the heat of the heating element arranged on the first heat dissipation assembly and quickly transfer the heat to the air according to its own structure. This structure provides more space for heat dissipation, expands the heat dissipation area, achieves more efficient heat transfer, and avoids heat accumulation. Multiple second heat sinks are arranged at both ends of the second heat sink, and the second heat sink is also provided with multiple second heat dissipation slots. First, heat can flow more directionally on the second heat sink. After the heat is transferred to the second heat sink, it will naturally gather towards the heat sinks at both ends. This centralized heat conduction method is conducive to the rapid dissipation of heat. Secondly, the heat sinks at both ends of the second heat sink can balance the heat distribution of the entire radiator. If only one side or the middle part is used for heat dissipation, uneven heat distribution is likely to occur. The heat sinks at both ends can evenly disperse the heat in two directions. Combined with multiple second heat dissipation slots, the heat can be guided to dissipate in different directions, preventing heat from accumulating inside the second heat sink, thus avoiding local overheating. The protrusions are arranged on the first heat sink to provide storage space for the fastening bolts, so that the fastening bolts have a clear positioning position during installation, ensuring a close fit between the radiator and the heating component, and ensuring the stable heat dissipation process.

[0012] In one embodiment, the second heat sink includes a second heat sink and a second heat sink base. The second heat sink base is disposed on the second heat sink and / or the first heat sink assembly. There are multiple second heat sinks, which are spaced apart along the length of the second heat sink base. Second heat sink slots are formed between adjacent second heat sinks. Placing the second heat sink base on the second heat sink provides a more direct and efficient heat conduction path. When heat is transferred from the first heat sink assembly to the second heat sink, the second heat sink base, due to its close contact with the second heat sink, can quickly receive the heat, ensuring efficient heat transfer from the second heat sink to the second heat sink base, reducing thermal resistance and thereby improving the heat dissipation efficiency of the entire radiator. The multiple second heat sinks are disposed on the second heat sink base, and the multiple second heat sinks are spaced apart to form multiple second heat sink slots, which greatly increases the heat dissipation surface area. The larger the heat dissipation area, the more efficient the heat dissipation. The multiple second heat sink slots formed by the spacing between the heat sinks create favorable conditions for heat convection. These slots serve as air channels, allowing air to flow smoothly between the heat sinks. When air flows through the heat sink, it will continuously take away the heat. Moreover, due to the presence of the through slots, the resistance to air flow is relatively small, which can more effectively carry out heat convection and accelerate the dissipation of heat.

[0013] In one embodiment, a plurality of reinforcement members are further included, and the plurality of reinforcement members are disposed on the first heat dissipation assembly and the second heat dissipation assembly and located at the first heat dissipation slot and the second heat dissipation slot. By disposing the plurality of reinforcement members in the first heat dissipation slot and the second heat dissipation slot provided in the first heat dissipation assembly and the second heat dissipation assembly, and locating the reinforcement members near the pin holes, the reinforcement members can significantly increase the structural strength of the pin holes. Since the radiator may be subjected to various external forces during operation, such as vibration of the device, the reinforcement members can securely position the pins in the pin holes, preventing deformation, twisting, or damage to the pins, thereby ensuring the normal operation of the radiator.

[0014] The second aspect of the present application discloses a circuit assembly, which includes: a heat sink as described in any one of the above items, wherein the number of the heat sinks is multiple; a MOS tube assembly, wherein the MOS tube assembly is arranged on the heat sink; a locking bolt, wherein the heat sink is provided with an assembly hole, wherein the locking bolt passes through the heat sink and the MOS tube assembly and is located at the assembly hole, wherein the locking bolt connects the MOS tube assembly and the heat sink; and an electronic assembly, wherein the heat sink is arranged on the electronic assembly, and wherein the multiple pins pass through the electronic assembly.

[0015] The above discloses a circuit assembly, which includes multiple heat sinks, multiple MOS tube assemblies, multiple locking bolts and electronic components. The MOS tube assembly is set on the heat sink through the assembly hole using the locking bolts, which can ensure that there is close physical contact between the MOS tube assembly and the heat sink. When the MOS tube assembly generates heat during operation, the heat can be more effectively transferred from the MOS tube assembly to the heat sink, so that the heat can be smoothly transferred from the MOS tube to the heat sink for dissipation. At the same time, since the equipment may be affected by factors such as vibration and impact during operation, the fixing effect of the locking bolts can ensure that the contact between the MOS tube assembly and the heat sink always remains stable, ensuring that the heat dissipation process can be carried out continuously and stably. In addition, the heat sink is installed on the electronic component through the pins, which can transfer the heat generated by the electronic component to the heat sink through the pins, and finally dissipate the heat into the air through the heat sink, ensuring the normal operation of the electronic component.

[0016] In one embodiment, the MOS transistor assembly includes a MOS module and a power strip. The MOS module is mounted on a heat sink, and the locking bolts are inserted through the heat sink and the MOS module. There are multiple power strips, each mounted on the MOS module and electrically connected to the electronic component. By mounting the MOS module on the heat sink, heat generated during operation can be transferred to the heat sink. Otherwise, the performance and reliability of the MOS module are very sensitive to temperature. When the temperature is too high, its electrical characteristics will change, such as increasing on-resistance, slowing switching speed, and even causing damage. The heat sink can maintain the MOS module within a suitable operating temperature range, ensuring stable performance. Multiple power strips are mounted on the MOS module and electrically connected to the electronic component, creating a reliable electrical connection bridge. This ensures smooth current flow between the MOS module and other components, enabling the MOS module to perform normal operations such as signal amplification and switch control. The power strips ensure accurate transmission of these signals, enabling the entire electronic system to operate in a coordinated manner.

[0017] In one embodiment, the electronic assembly includes a circuit board and electronic components. The heat sink is provided with a plurality of pins that pass through the circuit board. The number of electronic components is multiple, and the plurality of electronic components are arranged on the circuit board. The plurality of electronic components are arranged relative to the heat sink. By arranging the plurality of pins of the heat sink on the circuit board and then arranging the plurality of electronic components on the circuit board, an efficient heat conduction path is established. The electronic components on the circuit board will generate heat when working, and this heat needs to be dissipated in time to ensure the normal performance and life of the components. At the same time, when the pins serve as signal transmission channels, they can ensure the integrity of the signal. Compared with other complex connection methods, the pins provide a relatively direct signal path, reduce the attenuation and interference of the signal during transmission, and ensure that the signal is accurately transmitted between the MOS tube assembly and the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a first perspective view of a radiator;

[0019] Figure 2 is a second perspective view of the radiator;

[0020] Figure 3 is a third perspective view of the radiator;

[0021] Figure 4 is a fourth perspective view of a radiator;

[0022] Figure 5 A perspective view of a circuit component.

[0023] The corresponding relationship between the reference numerals and component names is as follows:

[0024] 1 first heat dissipation assembly, 11 first heat dissipation plate, 12 first heat dissipation block, 121 first heat dissipation fin, 122 first heat dissipation base, 101 first heat dissipation slot, 102 pin hole;

[0025] 2 second heat dissipation assembly, 21 second heat dissipation plate, 22 second heat dissipation block, 221 second heat dissipation fin, 222 second heat dissipation base, 23 bump, 201 second heat dissipation slot, 202 assembly hole;

[0026] 3 pins;

[0027] 4 reinforcements;

[0028] 5MOS tube assembly, 51MOS module, 52 power strip;

[0029] 6 locking bolts;

[0030] 7 Electronic components, 71 circuit boards, 72 electronic components. DETAILED DESCRIPTION

[0031] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0033] The heat sink and circuit assembly according to some embodiments of the present invention will be described below with reference to the accompanying drawings.

[0034] Example 1

[0035] like Figures 1 to 4 As shown, this embodiment discloses a heat sink, including: a first heat dissipation component 1, the first heat dissipation component 1 is provided with a first heat dissipation groove 101; a second heat dissipation component 2, the second heat dissipation component 2 is arranged on the first heat dissipation component 1, the second heat dissipation component 2 is provided with a second heat dissipation groove 201, the first heat dissipation component 1 and the second heat dissipation component 2 are enclosed to form a pin hole 102; a pin 3, the pin 3 is arranged on the first heat dissipation component 1 and / or the second heat dissipation component 2 and is located at the pin hole 102.

[0036] The present application discloses a heat sink. Since the heat dissipation area of ​​the first heat dissipation groove 101 provided in the first heat dissipation component 1 is limited, the first heat dissipation component 1 is arranged on the second heat dissipation component 2. In combination with the second heat dissipation groove 201 provided in the second heat dissipation component 2, the heat dissipation surface area of ​​the heat sink can be increased, so that heat can be transferred from the heat source to the surrounding air more quickly, making the heat dissipation process smoother and more efficient, and effectively avoiding local overheating. At the same time, the second heat dissipation component 2 can further conduct the heat absorbed by the first heat dissipation component 1, reduce the operating temperature of the first heat dissipation component 1, enhance the heat dissipation function of the entire heat sink, and extend the service life of the device, further ensuring the normal operation of the circuit component. The pin 3 is arranged at the pin hole 102 formed by the first heat dissipation component 1 and the second heat dissipation component 2. First, it can play a good fixing role, ensuring that the heat sink does not loosen or shift in the circuit component, and at the same time, it can ensure good contact between the circuit component and the heat sink, so that the heat generated in the circuit component is transferred to the heat sink through the pin 3, thereby improving the heat dissipation efficiency of the entire circuit component and ensuring the normal operation of the circuit component.

[0037] like Figure 1 and Figure 3As shown, in addition to the features of the above embodiment, this embodiment further defines that: the number of pin holes 102 is multiple, the number of pins 3 is also multiple, and the multiple pins 3 are respectively arranged on the multiple pin holes 102. By arranging the multiple pins 3 on the multiple pin holes 102, on the one hand, the connection force between the first heat dissipation component 1 and the second heat dissipation component 2 can be more evenly distributed. When the radiator is subjected to external force, each pin can share a part of the force, preventing the force from being concentrated in a certain local area and causing the connection between the components to become loose or damaged. This uniform force distribution can ensure that the two heat dissipation components fit tightly and maintain the stability of the overall structure of the radiator. On the other hand, it can increase the heat dissipation area and heat dissipation path of the circuit components, so that the heat can be dissipated from the radiator to the air more quickly and evenly, ensuring the normal operation of the circuit components.

[0038] like Figure 1 and Figure 2 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the number of first heat dissipation grooves 101 is multiple. By providing multiple first heat dissipation grooves 101, the heat dissipation surface area can be significantly increased. The larger the heat dissipation area, the higher the efficiency of heat dissipation. When heat is conducted from the heat source to the first heat dissipation component 1, the multiple grooves provide more heat dissipation paths. Heat can be exchanged with the surrounding air through the surface of each groove, so that more heat can be dissipated per unit time, thereby effectively improving the heat dissipation performance of the entire radiator. At the same time, the multiple grooves can guide air to flow therein, forming multiple independent heat convection channels. When air flows in the grooves, it continuously removes heat from the groove surfaces. Due to the presence of the grooves, the resistance to air flow is relatively small, and the air can circulate more smoothly around the heat dissipation component, enhancing the effect of heat convection and accelerating heat dissipation.

[0039] like Figure 1 and Figure 3As shown, in addition to the features of the above-mentioned embodiment, this embodiment further provides for the provision of multiple second heat dissipation slots 201. By providing multiple second heat dissipation slots 201, the heat dissipation surface area can be significantly increased. The larger the heat dissipation area, the more efficient the heat dissipation. When heat is transferred from the heat source to the second heat dissipation component 2, the multiple slots provide more paths for heat dissipation. Heat can be exchanged with the surrounding air through the surface of each slot, allowing more heat to be dissipated per unit time, thereby effectively improving the heat dissipation performance of the entire radiator. Furthermore, the multiple slots guide air flow through them, forming multiple independent heat convection channels. As air flows through the slots, it continuously removes heat from the slot surfaces. Due to the presence of the slots, the air flow resistance is relatively low, allowing it to circulate more smoothly around the heat dissipation component, enhancing heat convection and accelerating heat dissipation. This also ensures a more even distribution of heat within the second heat dissipation component 2, preventing localized overheating caused by concentrated heat, which is crucial for maintaining the overall performance of the radiator.

[0040] like Figure 1 and Figure 2 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that the first heat dissipation assembly 1 includes a first heat dissipation plate 11 and a first heat dissipation block 12. There are multiple first heat dissipation blocks 12 disposed on the first heat dissipation plate 11 and distributed at both ends of the first heat dissipation plate 11. The first heat dissipation blocks 12 are provided with multiple first heat dissipation slots 101. By arranging multiple first heat dissipation blocks 12 at both ends of the first heat dissipation plate 11, heat transferred from the heat source can be effectively dispersed. When heat originates from the center of the first heat dissipation plate 11, the heat dissipation blocks at both ends can guide the heat toward the ends, preventing excessive heat accumulation in the center of the heat dissipation plate. This ensures a more even distribution of heat throughout the entire heat dissipation plate and heat dissipation block system, preventing localized overheating. The multiple first heat dissipation slots 101 provided by the multiple first heat dissipation blocks 12 increase the surface area for heat dissipation, thereby increasing the heat dissipation paths. Furthermore, the placement of the first heat dissipation blocks 12 at both ends provides physical support for the first heat dissipation plate 11. The heat dissipation plate may deform due to long-term thermal expansion and contraction. The heat dissipation blocks at both ends provide a certain degree of fixation and support, reducing the degree of deformation of the heat dissipation plate. This physical support can maintain good contact between the heat sink and the heat sink, ensuring that heat can be smoothly transferred from the heat sink to the heat sink, while also helping to extend the service life of the entire cooling system.

[0041] like Figure 1 and Figure 2As shown, in addition to the features of the above embodiment, this embodiment further defines that: the first heat sink 12 includes a first heat sink 121 and a first heat sink base 122. The number of first heat sinks 121 is multiple, and the multiple first heat sinks 121 are spaced apart along the length of the first heat sink base 122. First heat dissipation slots 101 are formed between adjacent first heat sinks 121. By arranging multiple first heat sinks 121 on the first heat sink base 122, the surface area of ​​the entire heat dissipation structure is greatly increased, allowing more area to exchange heat with the surrounding air. When heat is transferred from the heat source to the first heat sink base 122, it is quickly dispersed to the multiple first heat sinks 121. The multiple first heat sink slots 101 formed by the spaced apart arrangement of the multiple first heat sinks 121 provide a more regular and efficient air flow path for the air, guiding the air to flow quickly between the heat sinks and effectively dissipating the heat to the surrounding environment. This improves the reliability of the heat sink, prevents the temperature of the heat source from continuously rising, ensures the safe operation of the circuit components, and extends their service life.

[0042] like Figure 1 and Figure 3As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the second heat dissipation assembly 2 includes a second heat dissipation plate 21, a second heat dissipation block 22, and a protrusion 23; the second heat dissipation plate 21 is arranged on the first heat dissipation assembly 1; the number of second heat dissipation blocks 22 is multiple, and multiple second heat dissipation blocks 22 are arranged on the second heat dissipation plate 21 and / or the first heat dissipation assembly 1; the multiple second heat dissipation blocks 22 are distributed at both ends of the second heat dissipation plate 21; the protrusion 23 is arranged on the second heat dissipation plate 21; and the second heat dissipation block 22 is provided with multiple second heat dissipation grooves 201. By arranging the second heat dissipation plate 21 on the first heat dissipation assembly 1, due to the limited heat dissipation area of ​​the first heat dissipation assembly 1 itself, the second heat dissipation plate 21 can quickly absorb the heat from the heating element arranged on the first heat dissipation assembly 1 and quickly transfer the heat to the air based on its own structure. This structure provides more space for heat dissipation, expands the heat dissipation area, achieves more efficient heat transfer, and avoids heat accumulation. Multiple second heat sinks 22 are disposed at both ends of the second heat sink 21, and the second heat sink 22 is also provided with multiple second heat dissipation slots 201. Firstly, this allows heat to flow more directionally on the second heat sink 21. When heat is conducted to the second heat sink 21, it will naturally gather towards the heat sinks at both ends. This centralized heat conduction method is conducive to the rapid dissipation of heat. Secondly, the heat sinks at both ends of the second heat sink 21 can balance the heat distribution of the entire radiator. If only one side or the middle part is used for heat dissipation, it is easy to have uneven heat distribution. The heat sinks at both ends can evenly disperse the heat in two directions. Combined with the multiple second heat dissipation slots 201, the heat can be dissipated in different directions, preventing heat from accumulating inside the second heat sink 22 and avoiding local overheating. The protrusions 23 are disposed on the first heat sink 11 to provide storage space for the fastening bolts, so that the fastening bolts have a clear positioning position during installation, ensuring a close fit between the radiator and the heating component, and ensuring the stable heat dissipation process.

[0043] like Figure 1 and Figure 3As shown, in addition to the features of the above-described embodiment, this embodiment further defines that the second heat sink 22 includes a second heat sink 221 and a second heat sink base 222. The second heat sink base 222 is disposed on the second heat sink 21 and / or the first heat sink assembly 1. There are multiple second heat sinks 221, each spaced apart along the length of the second heat sink base 222. Second heat sink slots 201 are formed between adjacent second heat sinks 221. By disposing the second heat sink base 222 on the second heat sink 21, a more direct and efficient heat conduction path is provided. When heat is transferred from the first heat sink assembly 1 to the second heat sink 21, the second heat sink base 222, due to its close contact with the second heat sink 21, can quickly receive the heat, ensuring efficient heat transfer from the second heat sink 21 to the second heat sink base 222, reducing thermal resistance and thereby improving the heat dissipation efficiency of the entire radiator. Multiple second heat sinks 221 are arranged on a second heat sink base 222, and the spacing between the multiple second heat sinks 221 forms multiple second heat dissipation slots, which greatly increases the heat dissipation surface area. The larger the heat dissipation area, the more efficient the heat dissipation. At the same time, the multiple second heat dissipation slots 201 formed by the spacing between the heat sinks create favorable conditions for heat convection. These slots serve as air channels, allowing air to flow smoothly between the heat sinks. When air flows through the heat sinks, it continuously removes heat. Due to the presence of the slots, the resistance to air flow is relatively small, enabling more efficient heat convection and accelerating heat dissipation.

[0044] like Figure 1 and Figure 2 As shown, in addition to the features of the above-mentioned embodiment, this embodiment is further defined as follows: it also includes a reinforcement member 4, and the number of reinforcement members 4 is multiple. The multiple reinforcement members 4 are arranged on the first heat dissipation component 1 and the second heat dissipation component 2 and are located at the first heat dissipation groove 101 and the second heat dissipation groove 201. By arranging the multiple reinforcement members 4 in the first heat dissipation groove 101 and the second heat dissipation groove 201 provided in the first heat dissipation component 1 and the second heat dissipation component 2, and at the same time, these reinforcement members 4 are located near the pin holes 102, these reinforcement members 4 can significantly increase the structural strength of the pin holes 102. Since the radiator may be subjected to various external forces during operation, such as vibration of the equipment, the reinforcement members 4 can firmly place the pins 3 in the pin holes 102, preventing the pins 3 from deformation, twisting or damage, thereby ensuring the normal operation of the radiator.

[0045] Example 2

[0046] like Figure 4 and Figure 5As shown, this embodiment discloses a circuit assembly, including: a heat sink of any one of the above items, the number of heat sinks is multiple; a MOS tube assembly 5, the MOS tube assembly 5 is arranged on the heat sink; a locking bolt 6, the heat sink is provided with an assembly hole 202, the locking bolt 6 is passed through the heat sink and the MOS tube assembly 5 and is located at the assembly hole 202, the locking bolt 6 connects the MOS tube assembly 5 and the heat sink; an electronic assembly 7, the heat sink is arranged on the electronic assembly 7, and multiple pins 3 are passed through the electronic assembly 7.

[0047] The second aspect of the present application discloses a circuit assembly, which includes multiple heat sinks, multiple MOS tube assemblies 5, multiple locking bolts 6 and electronic components 7. The MOS tube assembly 5 is set on the heat sink by using the locking bolts 6 through the assembly holes 202, which can ensure that there is close physical contact between the MOS tube assembly 5 and the heat sink. When the MOS tube assembly 5 generates heat during operation, the heat can be more effectively transferred from the MOS tube assembly 5 to the heat sink, so that the heat can be smoothly transferred from the MOS tube to the heat sink for dissipation. At the same time, since the equipment may be affected by factors such as vibration and impact during operation, the fixing effect of the locking bolts 6 can ensure that the contact between the MOS tube assembly and the heat sink always remains stable, ensuring that the heat dissipation process can be carried out continuously and stably. In addition, the heat sink is inserted into the electronic component 7 through the pin 3, which can transfer the heat generated by the electronic component 7 to the heat sink through the pin 3, and finally dissipate the heat into the air through the heat sink, ensuring the normal operation of the electronic component 7.

[0048] like Figure 4 and Figure 5 As shown, in addition to the features of the above-described embodiment, this embodiment further defines that: the MOS transistor assembly 5 includes a MOS module 51 and a power strip 52. The MOS module 51 is mounted on a heat sink. A locking bolt 6 is inserted through the heat sink and the MOS module 51. There are multiple power strips 52, each mounted on the MOS module 51, and electrically connected to the electronic component 7. By mounting the MOS module 51 on the heat sink, heat generated during operation can be transferred to the heat sink. Otherwise, the performance and reliability of the MOS module are very sensitive to temperature. When the temperature is too high, its electrical characteristics will change, such as increasing on-resistance, slowing switching speed, and even causing damage. The heat sink can maintain the MOS module within a suitable operating temperature range, ensuring its stable performance. A plurality of power bars 52 are arranged on the MOS module 51, and the power bars 52 are electrically connected to the electronic components 7, building a reliable electrical connection bridge, which can ensure that the current can flow smoothly between the MOS module 51 and other components, so that the MOS module 51 can normally perform signal amplification, switch control and other operations. The power bars 52 can ensure the accurate transmission of these signals, so that the entire electronic system can work in a coordinated manner.

[0049] like Figure 1 and Figure 5 As shown, in addition to the features of the above-mentioned embodiment, this embodiment further defines that: the electronic assembly 7 includes a circuit board 71 and an electronic component 72, the heat sink is provided with a plurality of pins 3 that pass through the circuit board 71, the number of electronic components 72 is multiple, the multiple electronic components 72 are arranged on the circuit board 71, and the multiple electronic components 72 are arranged opposite to the heat sink. By arranging the multiple pins 3 of the heat sink on the circuit board 71, and then arranging the multiple electronic components 72 on the circuit board 71, an efficient heat conduction path is established. The electronic components 72 on the circuit board 71 will generate heat when working, and this heat needs to be dissipated in time to ensure the normal performance and life of the components. At the same time, when the pins 3 serve as a signal transmission channel, they can ensure the integrity of the signal. Compared with other complex connection methods, the pins 3 provide a relatively direct signal path, reduce the attenuation and interference of the signal during the transmission process, and ensure that the signal is accurately transmitted between the MOS tube assembly 5 and the electronic component 72.

[0050] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A radiator, characterized in that: The radiator comprises: A first heat dissipation component (1), wherein the first heat dissipation component (1) is provided with a first heat dissipation slot (101); A second heat dissipation component (2), the second heat dissipation component (2) being arranged on the first heat dissipation component (1), the second heat dissipation component (2) being provided with a second heat dissipation slot (201), the first heat dissipation component (1) and the second heat dissipation component (2) being enclosed to form a pin hole (102); A pin (3), the pin (3) being arranged on the first heat dissipation component (1) and / or the second heat dissipation component (2) and located at the pin hole (102).

2. The radiator according to claim 1, characterized in that The number of the pin holes (102) is multiple, the number of the pins (3) is also multiple, and the multiple pins (3) are respectively arranged on the multiple pin holes (102); and / or the number of the first heat dissipation slots (101) is multiple; And / or the number of the second heat dissipation slots (201) is plural.

3. The radiator according to claim 1, wherein: The first heat dissipation assembly (1) comprises a first heat dissipation plate (11) and a first heat dissipation block (12); the number of the first heat dissipation blocks (12) is multiple, the multiple first heat dissipation blocks (12) are arranged on the first heat dissipation plate (11) and distributed at both ends of the first heat dissipation plate (11); the first heat dissipation block (12) is provided with multiple first heat dissipation slots (101).

4. The radiator according to claim 3, characterized in that The first heat dissipation block (12) comprises a first heat dissipation fin (121) and a first heat dissipation base (122); the number of the first heat dissipation fins (121) is multiple, the multiple first heat dissipation fins (121) are spaced apart along the length direction of the first heat dissipation base (122), and the first heat dissipation grooves (101) are formed between adjacent first heat dissipation fins (121).

5. The radiator according to claim 1, wherein The second heat dissipation assembly (2) comprises a second heat dissipation plate (21), a second heat dissipation block (22) and a protrusion (23); the second heat dissipation plate (21) is arranged on the first heat dissipation assembly (1); the number of the second heat dissipation blocks (22) is multiple; the multiple second heat dissipation blocks (22) are arranged on the second heat dissipation plate (21) and / or the first heat dissipation assembly (1); the multiple second heat dissipation blocks (22) are distributed at both ends of the second heat dissipation plate (21); the protrusion (23) is arranged on the second heat dissipation plate (21); and the second heat dissipation block (22) is provided with multiple second heat dissipation slots (201).

6. The radiator according to claim 5, characterized in that The second heat dissipation block (22) comprises a second heat dissipation fin (221) and a second heat dissipation base (222); the second heat dissipation base (222) is arranged on the second heat dissipation plate (21) and / or the first heat dissipation assembly (1); there are a plurality of second heat dissipation fins (221); the plurality of second heat dissipation fins (221) are arranged at intervals along the length direction of the second heat dissipation base (222); and second heat dissipation slots (201) are formed between adjacent second heat dissipation fins (221).

7. The radiator according to claim 1, characterized in that It also includes a reinforcement member (4), the number of the reinforcement members (4) is multiple, and the multiple reinforcement members (4) are arranged on the first heat dissipation component (1) and the second heat dissipation component (2) and are located at the first heat dissipation slot (101) and the second heat dissipation slot (201).

8. A circuit assembly, characterized in that: The circuit assembly includes: The radiator according to any one of claims 1 to 7, wherein the number of the radiators is multiple; A MOS tube assembly (5), wherein the MOS tube assembly (5) is arranged on the radiator; A locking bolt (6), the heat sink is provided with an assembly hole (202), the locking bolt (6) is passed through the heat sink and the MOS tube assembly (5) and is located at the assembly hole (202), and the locking bolt (6) connects the MOS tube assembly (5) and the heat sink; An electronic component (7), wherein the heat sink is arranged on the electronic component (7), and a plurality of the pins (3) are inserted through the electronic component (7).

9. The circuit assembly according to claim 8, wherein: The MOS tube assembly (5) comprises a MOS module (51) and a power strip (52); the MOS module (51) is arranged on the radiator; the locking bolt (6) is passed through the radiator and the MOS module (51); there are a plurality of power strips (52); a plurality of the power strips (52) are arranged on the MOS module (51); and the plurality of the power strips (52) are electrically connected to the electronic assembly (7).

10. The circuit assembly according to claim 8, wherein: The electronic assembly (7) comprises a circuit board (71) and an electronic component (72); the plurality of pins (3) provided on the heat sink are inserted into the circuit board (71); the number of the electronic components (72) is plural; the plurality of electronic components (72) are arranged on the circuit board (71); and the plurality of electronic components (72) are arranged opposite to the heat sink.

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