Integrated phase change radiator

Abstract

The utility model discloses an integrated phase change radiator, which comprises a substrate and a plurality of radiating fins, a plurality of main channels and a plurality of transition channels are arranged in the substrate, and a liquid injection port is arranged at the top of the substrate; the base plate and the cooling fins are integrally formed, and the multiple cooling fins are located on the rear side of the base plate and are sequentially and evenly distributed at intervals in the left-right direction; the length direction of the main channels extends in the vertical direction, the main channels are sequentially and evenly distributed at intervals in the left-right direction, the liquid injection opening is communicated with one main channel, and every two adjacent main channels are communicated through a transition channel. According to the scheme, the problems that in a traditional mode that a micro-groove flat plate heat pipe filled with phase change liquid is installed in a groove in a substrate to achieve substrate heat dissipation, the surface of the substrate and the surface of the micro-groove flat plate heat pipe may not be located on the same plane, when the height difference exists between the substrate and the micro-groove flat plate heat pipe, attachment of the substrate and the micro-groove flat plate heat pipe is affected, and the heat dissipation effect is affected are solved. Therefore, the heat dissipation of the substrate is influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of phase change radiators, in particular to an integrated phase change radiator. Background Art

[0002] The traditional production process for electronic control boxes typically involves first securing the heat sink to the electronic control mounting plate, then attaching plastic support columns to the heat sink, and finally securing the electronic control motherboard to the plastic support columns with screws. This production method involves too many steps and results in low production efficiency.

[0003] In order to solve the above problems, there is an existing technology that uses a phase change radiator. This phase change radiator cleverly integrates the electronic control mounting plate and the radiator into one component. It only needs to install the electronic control mainboard directly on this integrated phase change radiator, which can save the original multiple installation steps and significantly improve production efficiency. The phase change radiator includes a substrate and a micro-grooved flat plate heat pipe. The surface of the substrate is provided with grooves. The micro-grooved flat plate heat pipe is installed in the grooves. The micro-grooved flat plate heat pipe is filled with a liquid heat transfer medium. The heat dissipation of the substrate is achieved by phase change heat transfer of the liquid heat transfer medium. However, in this phase change radiator, the surface of the substrate and the micro-grooved flat plate heat pipe may not be in the same plane. When there is a height difference between the two, it will affect the fit between the substrate and the micro-grooved flat plate heat pipe, thereby affecting the heat dissipation of the substrate. Utility Model Content

[0004] In response to the above-mentioned defects, the present invention proposes an integrated phase change heat sink, which aims to solve the problem that in the traditional method of achieving substrate heat dissipation by installing micro-grooved flat-plate heat pipes filled with phase change liquid into grooves on the substrate, the surfaces of the substrate and the micro-grooved flat-plate heat pipes may not be in the same plane. When there is a height difference between the two, it will affect the fit between the substrate and the micro-grooved flat-plate heat pipes, thereby affecting the heat dissipation of the substrate.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] An integrated phase-change radiator comprises a base plate and a plurality of radiating fins, wherein a plurality of main channels and a plurality of transition channels are provided inside the base plate, and a liquid injection port is provided on the top of the base plate;

[0007] The base plate and the plurality of heat dissipating fins are integrally formed, the plurality of heat dissipating fins are all located on the rear side of the base plate, and the plurality of heat dissipating fins are evenly spaced in sequence along the left-right direction; the length directions of the plurality of main channels are all extended in the up-down direction, and the plurality of main channels are evenly spaced in sequence along the left-right direction, the liquid injection port is connected to one of the main channels, and two adjacent main channels are connected through the transition channel.

[0008] Preferably, it further comprises a plurality of self-clinching studs, and the plurality of self-clinching studs are all fixed to the front side of the base plate.

[0009] Preferably, two wire-passing rubber rings are further included, and two wire-passing openings are opened at the bottom of the base plate, and the two wire-passing rubber rings are respectively arranged at the respective wire-passing openings.

[0010] Preferably, two sealing sheets are further included, and the two sealing sheets are respectively installed on the top and bottom of the substrate, and the two sealing sheets are respectively used to seal the opening at the top or bottom of the main channel.

[0011] Preferably, it further comprises a wiring seat, which is installed on the front side of the substrate and is located between the two wire-passing rubber rings.

[0012] Preferably, a plurality of screw holes are provided on both the left and right sides of the base plate.

[0013] The technical solution provided by the utility model may have the following beneficial effects:

[0014] Compared to the traditional method of heat dissipating the substrate by installing microgrooved flat-plate heat pipes filled with phase-change fluid into grooves on the substrate, this solution eliminates the need for microgrooved flat-plate heat pipes, thus avoiding the situation where the surfaces of the substrate and the microgrooved flat-plate heat pipes may not be in the same plane, thus affecting the substrate's heat dissipation. In this solution, by providing several main channels and transition channels within the substrate, and connecting adjacent main channels through the transition channels, this ensures that the phase-change fluid is evenly distributed and fully contacts the substrate, thereby improving the substrate's heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of an integrated phase change radiator;

[0016] Figure 2 It is a partial enlarged view of one embodiment of the present utility model.

[0017] Among them, 1. Base plate; 2. Heat sink fins; 3. Riveted studs; 4. Electronic control main board; 5. Wire-passing rubber ring; 6. Sealing piece; 7. Terminal block; 11. Main channel; 12. Liquid filling port; 13. Wire-passing port; 14. Screw hole. DETAILED DESCRIPTION

[0018] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0019] In the description of the present invention, it should be understood that the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, unless otherwise specified, "plurality" means more than two.

[0021] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "installation," "splicing," and "connection" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integral connection; they may refer to direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0022] An integrated phase-change heat sink includes a substrate 1 and a plurality of heat dissipation fins 2. The substrate 1 is provided with a plurality of main channels 11 and a plurality of transition channels (not shown in the figure). The top of the substrate 1 is provided with a liquid injection port 12.

[0023] The substrate 1 and the plurality of heat dissipating fins 2 are integrally formed, and the plurality of heat dissipating fins 2 are all located on the rear side of the substrate 1, and the plurality of heat dissipating fins 2 are evenly spaced in sequence along the left-right direction; the length directions of the plurality of main channels 11 are all extended in the up-down direction, and the plurality of main channels 11 are evenly spaced in sequence along the left-right direction, and the liquid injection port 12 is connected to one of the main channels 11, and two adjacent main channels 11 are connected through the transition channel.

[0024] An integrated phase change heat sink of this solution, such as Figure 1As shown, the phase change liquid is injected into the main channel 11 connected thereto through the liquid injection port 12. Since the two adjacent main channels 11 are connected through the transition channel, this ensures that the phase change liquid flows between the main channels 11, so that the phase change liquid can evenly fill all the main channels 11, thereby ensuring uniform heat dissipation of the entire substrate 1. The provision of several heat dissipation fins 2 can effectively increase the heat dissipation area, which helps to evenly transfer the heat on the substrate 1 to the surrounding environment, thereby improving the heat dissipation efficiency of the entire integrated phase change radiator. It is further explained that since the substrate 1 and the several heat dissipation fins 2 are integrally formed, the heat conduction path between the substrate 1 and the heat dissipation fins 2 is more direct and efficient, and the integral forming reduces the thermal resistance, so that heat can be transferred from the substrate 1 to the heat dissipation fins 2 more quickly. It is further explained that the substrate 1 and the several heat dissipation fins 2 are integrally formed by an aluminum drawing process.

[0025] Compared to the traditional method of achieving substrate heat dissipation by installing microgrooved flat-plate heat pipes filled with phase-change liquid into grooves on the substrate, this solution does not require the installation of microgrooved flat-plate heat pipes, thus avoiding the situation where the surfaces of the substrate and the microgrooved flat-plate heat pipes may not be in the same plane, thereby affecting the substrate's heat dissipation. In this solution, by providing a plurality of main channels 11 and transition channels within the substrate 1, and connecting two adjacent main channels 11 through the transition channels, this ensures that the phase-change liquid is evenly distributed and fully contacts the substrate 1, thereby improving the heat dissipation efficiency of the substrate 1.

[0026] Preferably, it further comprises a plurality of pressure riveting studs 3, and the plurality of pressure riveting studs 3 are all fixed to the front side of the substrate 1. In this embodiment, Figure 1 As shown, since the plurality of riveting studs 3 are fixed to the front side of the substrate 1 , it is convenient to install the electronic control mainboard 4 onto the riveting studs 3 by screws, thereby achieving the fixation of the electronic control mainboard 4 and the substrate 1 .

[0027] Preferably, it further comprises two wire-passing rubber rings 5, and the bottom of the substrate 1 is provided with two wire-passing openings 13, and the two wire-passing rubber rings 5 ​​are respectively arranged at the respective wire-passing openings 13. Figure 2 As shown, the arrangement of the wire-passing opening 13 can provide a passage for the cable, and the arrangement of the wire-passing rubber ring 5 plays the role of sealing protection, buffering and vibration reduction, and fixing the cable.

[0028] Preferably, two sealing sheets 6 are further included, and the two sealing sheets 6 are respectively installed on the top and bottom of the substrate 1, and the two sealing sheets 6 are respectively used to seal the openings at the top and bottom of the main channels 11. Figure 2As shown, since the two sealing sheets 6 are respectively installed on the top and bottom of the substrate 1, the arrangement of the two sealing sheets 6 can seal the interior of the main channels 11, thereby preventing the phase change liquid inside the main channels 11 from leaking out.

[0029] Preferably, it further comprises a wiring seat 7, which is mounted on the front side of the substrate 1 and is located between the two wire-passing rubber rings 5. Figure 1 As shown, since the terminal block 7 is located between the two wire-passing rubber rings 5, the setting of the terminal block 7 facilitates providing a wiring interface for the cables from the two wire-passing rubber rings 5, which is beneficial for supplying power to the electronic control mainboard 4 installed on the substrate 1.

[0030] Preferably, a plurality of screw holes 14 are provided on both the left and right sides of the base plate 1. Figure 1 As shown, the provision of several screw holes 14 makes it convenient for workers to install the entire integrated phase change radiator on the air conditioner outdoor unit by screws.

[0031] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.

Claims

1. An integrated phase change heat sink, characterized by: It includes a base plate and a plurality of heat dissipation fins, wherein a plurality of main channels and a plurality of transition channels are opened inside the base plate, and a liquid injection port is opened on the top of the base plate; The base plate and the plurality of heat dissipating fins are integrally formed, the plurality of heat dissipating fins are all located on the rear side of the base plate, and the plurality of heat dissipating fins are evenly spaced in sequence along the left-right direction; the length directions of the plurality of main channels are all extended in the up-down direction, and the plurality of main channels are evenly spaced in sequence along the left-right direction, the liquid injection port is connected to one of the main channels, and two adjacent main channels are connected through the transition channel.

2. The integrated phase change heat sink according to claim 1, characterized in that: It also includes a plurality of pressure riveting studs, which are all fixed to the front side of the base plate.

3. The integrated phase change heat sink according to claim 1, characterized in that: It also includes two wire-passing rubber rings. The bottom of the base plate is provided with two wire-passing openings, and the two wire-passing rubber rings are respectively arranged at the respective wire-passing openings.

4. The integrated phase change heat sink according to claim 1, characterized in that: It also includes two sealing sheets, which are respectively installed on the top and bottom of the substrate and are used to seal the openings at the top and bottom of several main channels.

5. The integrated phase change heat sink according to claim 3, characterized in that: It also includes a wiring seat, which is installed on the front side of the substrate and is located between the two wire-passing rubber rings.

6. The integrated phase change heat sink according to claim 1, characterized in that: A plurality of screw holes are provided on the left and right sides of the base plate.

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