Semiconductor labeling device

Abstract

The utility model relates to the field of labeling machines, and discloses a semiconductor labeling device which comprises a mounting seat, a linear module fixedly connected to the upper side of the mounting seat, a first connecting plate fixedly connected to a movable sliding table of the linear module, a bearing plate fixedly connected to the lower end of the first connecting plate, and a plurality of first connecting rods slidably connected to the bearing plate. The linear module drives the bearing plate to ascend or descend to a proper height according to thickness data of a to-be-labeled object detected by the distance measuring instrument, so that the labeling table is indirectly driven to be adjusted to a proper height, and the thickness of the to-be-labeled object is accurately measured. Due to the fact that labeled objects possibly comprise high-value products such as semiconductors, in order to prevent possible friction or collision caused by the fact that the labeling table is attached to the semiconductors, the first spring is arranged between the first nut and the bearing plate, and the buffering protection effect can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of labeling machines, in particular to a semiconductor labeling device. Background Art

[0002] With the continuous development and cost reduction of RFID technology, more innovative models combined with semiconductor manufacturing and applications may emerge in the future. For example, in the COF semiconductor production process, RFID technology can achieve real-time tracking and management of raw materials, work-in-progress, and finished products. By installing RFID readers on each station and attaching RFID tags to each roll of product, it can accurately record its batch number, direction, and processing flow, reducing manual intervention and errors on the production line, thereby improving production efficiency.

[0003] In order to achieve real-time tracking of materials involved in semiconductor manufacturing, it is first necessary to label the surface of each material with RFID tags. However, most of the labeling machines on the market are designed for labeling batch products of uniform specifications, that is, labeling is performed when the height, width and other specification data of the same product have a small fluctuation range. Even if there is a certain fluctuation in the product height within a small range, the labeling roller or the pressure roller also has a certain height buffering capacity. However, if labeling is performed on materials of different specifications in a large range such as all materials in the entire workshop, for example, the labeled products include material containers with a thickness of tens of centimeters, transportation tools and semiconductor chips with a thickness of less than one centimeter, the existing labeling device may be insufficient for such a large span of height switching. Based on this, a semiconductor labeling device is proposed. Utility Model Content

[0004] In order to solve the technical problem of large-scale height adjustment of labeling equipment, the utility model provides a semiconductor labeling device.

[0005] The utility model is implemented by the following technical solutions: a semiconductor labeling device, including a mounting seat, a linear module fixedly connected to the upper side of the mounting seat, a No. 1 connecting plate fixedly connected to the movable slide of the linear module, a No. 1 connecting plate fixedly connected to the lower end of the No. 1 connecting plate with a load-bearing plate, a plurality of No. 1 connecting rods are slidingly connected to the upper end of the load-bearing plate, a No. 1 nut is threadedly sleeved on the upper end of the plurality of No. 1 connecting rods, a No. 1 spring is provided between the lower side of each No. 1 nut and the upper side of the load-bearing plate, the lower ends of the plurality of No. 1 connecting rods are commonly fixedly connected to two of the fixed plates, a labeling platform is fixedly connected between the two fixed plates, a label paper transmission mechanism is provided inside the labeling platform, and a height adjustment mechanism is provided on one side of the mounting seat.

[0006] As a further improvement of the above solution, the height adjustment mechanism includes a second connecting plate fixedly connected to one side of the mounting base, and one end of the second connecting plate is fixedly connected to a rangefinder.

[0007] As a further improvement of the above scheme, the label paper transmission mechanism includes a label feeding slot, a bottom paper recovery slot and a label paper separation slot which are sequentially opened inside the labeling platform, and a shaping mechanism for flattening the label paper is provided on one side of the label feeding slot.

[0008] As a further improvement of the above solution, the shaping mechanism includes a limiting groove opened on the labeling table, the limiting groove is connected to the label feeding groove, the inner side of the limiting groove is slidably connected with a shaping block, and a buffer mechanism is provided on the upper side of the shaping block.

[0009] As a further improvement of the above-mentioned solution, the buffer mechanism includes a cover plate fixedly connected to the upper side of the limiting groove, and a plurality of No. 2 connecting rods are slidably connected to the upper side of the cover plate. The upper ends of the plurality of No. 2 connecting rods are threadedly sleeved with No. 2 nuts, and No. 2 springs are respectively arranged between the lower sides of the plurality of No. 2 nuts and the upper side of the cover plate.

[0010] As a further improvement of the above scheme, the label feeding trough and the label-paper separation trough are arranged in a straight line inclined downward, the initial section of the bottom paper recovery trough is arranged in a horizontal straight line close to the bottom of the labeling platform, and one end thereof intersects with the inclined straight line where the label feeding trough and the label-paper separation trough are located.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. This utility model uses a linear module to drive the load-bearing plate to rise or fall to a suitable height based on the thickness data of the object to be labeled detected by the distance meter, thereby indirectly driving the labeling platform to adjust to a suitable height. Since the objects to be labeled may include high-value products such as semiconductors, in order to prevent the labeling platform from laminating with the semiconductors, resulting in possible friction or collision, a No. 1 spring is provided between the No. 1 nut and the load-bearing plate to play a buffering and protective role.

[0013] 2. The utility model sets a shaping mechanism and uses a shaping block to squeeze and flatten the upper side of the label paper before tearing off at the label feeding slot, so as to prevent defects such as bubbles and bulges from occurring on the RFID label after labeling. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a semiconductor labeling device provided by the present invention;

[0015] Figure 2 for Figure 1 Bottom view of

[0016] Figure 3 for Figure 2 Side view of;

[0017] Figure 4 for Figure 1 A cross-sectional view of the middle labeling station (11);

[0018] Figure 5 for Figure 4 Schematic diagram of the explosion structure.

[0019] Description of main symbols:

[0020] 1. Mounting base; 2. Linear module; 3. Connecting plate No. 1; 4. Connecting plate No. 2; 5. Distance meter; 6. Nut No. 1; 7. Spring No. 1; 8. Load-bearing plate; 9. Fixing plate; 10. Connecting rod No. 1; 11. Labeling table; 12. Label-paper separation slot; 13. Connecting rod No. 2; 14. Nut No. 2; 15. Spring No. 2; 16. Cover plate; 17. Limit slot; 18. Shaping block; 19. Label feeding slot; 20. Bottom paper recovery slot. DETAILED DESCRIPTION

[0021] Below, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0022] Example:

[0023] Please combine Figure 1-Figure 5 , a semiconductor labeling device of this embodiment includes a mounting base 1, a linear module 2 is fixedly connected to the upper side of the mounting base 1, a No. 1 connecting plate 3 is fixedly connected to the movable slide of the linear module 2, the lower end of the No. 1 connecting plate 3 is fixedly connected to the load-bearing plate 8, and the upper sliding connection of the load-bearing plate 8 is 4 No. 1 connecting rods 10, the upper ends of the 4 No. 1 connecting rods 10 are all threadedly sleeved with No. 1 nuts 6, and a No. 1 spring 7 is arranged between the lower side of each No. 1 nut 6 and the upper side of the load-bearing plate 8. The lower ends of the multiple No. 1 connecting rods 10 are fixedly connected to two fixed plates 9, and a labeling platform 11 is fixedly connected between the two fixed plates 9. The labeling platform 11 is detachable in design, and a label paper transmission mechanism is arranged inside the labeling platform 11. A height adjustment mechanism is arranged on one side of the mounting base 1.

[0024] Please combine Figure 1 As shown, the height adjustment mechanism includes a second connecting plate 4 fixedly connected to one side of the mounting base 1, and one end of the second connecting plate 4 is fixedly connected to a rangefinder 5, through which the height of the labeling surface of the object to be measured is obtained in real time.

[0025] Please combine Figure 4As shown, the label paper transmission mechanism includes a label feeding slot 19, a bottom paper recovery slot 20 and a label paper separation slot 12 which are sequentially opened inside the labeling platform 11. A shaping mechanism for flattening the label paper is provided on one side of the label feeding slot 19.

[0026] The shaping mechanism includes a limit groove 17 opened on the labeling platform 11, the limit groove 17 is connected to the label feeding groove 19, the inner side of the limit groove 17 is slidably connected to a shaping block 18, and a buffer mechanism is provided on the upper side of the shaping block 18.

[0027] Please combine Figure 4 As shown, the buffer mechanism includes a cover plate 16 fixedly connected to the upper side of the limiting groove 17, and three No. 2 connecting rods 13 are slidably connected to the upper side of the cover plate 16. The upper ends of the three No. 2 connecting rods 13 are threadedly sleeved with No. 2 nuts 14, and No. 2 springs 15 are respectively arranged between the lower side of the three No. 2 nuts 14 and the upper side of the cover plate 16.

[0028] Please combine Figure 4 As shown, the label feeding slot 19 and the label paper separation slot 12 are arranged in a straight line inclined downward, and the initial section of the bottom paper recovery slot 20 is arranged in a horizontal straight line close to the bottom of the labeling platform 11, and one end thereof intersects with the inclined straight line where the label feeding slot 19 and the label paper separation slot 12 are located.

[0029] It should be noted that the angle between the bottom paper recovery slot 20 and the label feeding slot 19 must meet the angle required for the successful tearing of the label and the bottom paper of modern roll-type labels.

[0030] The implementation principle of a semiconductor labeling device in an embodiment of the present application is as follows: the rangefinder 5 detects the height and thickness of the object to be labeled transmitted from the assembly line, and transmits the data to the linear module 2. The linear module 2 pushes the load-bearing plate 8 to adjust the height to adapt to the labeling needs of the object at this time. The RFID label paper is now located in the label feeding slot 19 and the bottom paper recovery slot 20. The two ends of the labeling platform 11 adopt a rounded corner design. The separated RFID tag encounters the upper surface of the flowing object and is captured. At this time, the label flows out from the slot on the lower side of the labeling platform 11, and the height meets the effect of slightly applying a certain pressure on the upper surface of the object. When the pressure is too large, the No. 1 connecting rod 10 can slide upward along the load-bearing plate 8, and the No. 1 spring 7 is deformed and stretched. Due to the difference in stiffness of the label and the toughness of the bottom paper at the bottom of the label, the RFID tag will be successfully separated from the bottom paper at the label-paper separation slot 12.

[0031] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A semiconductor labeling device, comprising a mounting base (1), characterized in that: The upper side of the mounting seat (1) is fixedly connected to a linear module (2), the movable slide of the linear module (2) is fixedly connected to a No. 1 connecting plate (3), the lower end of the No. 1 connecting plate (3) is fixedly connected to a load-bearing plate (8), the upper sliding connection of the load-bearing plate (8) is connected to a plurality of No. 1 connecting rods (10), the upper ends of the plurality of No. 1 connecting rods (10) are all threadedly sleeved with a No. 1 nut (6), a No. 1 spring (7) is provided between the lower side of each No. 1 nut (6) and the upper side of the load-bearing plate (8), the lower ends of the plurality of No. 1 connecting rods (10) are commonly fixedly connected to two fixed plates (9), a labeling platform (11) is fixedly connected between the two fixed plates (9), a label paper transmission mechanism is provided inside the labeling platform (11), and a height adjustment mechanism is provided on one side of the mounting seat (1).

2. A semiconductor labeling device according to claim 1, characterized in that: The height adjustment mechanism comprises a second connecting plate (4) fixedly connected to one side of the mounting seat (1), and one end of the second connecting plate (4) is fixedly connected to a rangefinder (5).

3. The semiconductor labeling device according to claim 1, wherein: The label paper transmission mechanism comprises a label feeding slot (19), a bottom paper recovery slot (20) and a label paper separation slot (12) which are sequentially opened inside the labeling platform (11); a shaping mechanism for flattening the label paper is provided on one side of the label feeding slot (19).

4. A semiconductor labeling device as claimed in claim 3, characterized in that: The shaping mechanism comprises a limiting groove (17) provided on the labeling platform (11), the limiting groove (17) being connected to the label feeding groove (19), a shaping block (18) being slidably connected to the inner side of the limiting groove (17), and a buffer mechanism being provided on the upper side of the shaping block (18).

5. A semiconductor labeling device as claimed in claim 4, characterized in that: The buffer mechanism comprises a cover plate (16) fixedly connected to the upper side of the limiting groove (17); a plurality of No. 2 connecting rods (13) are slidably connected to the upper side of the cover plate (16); the upper ends of the plurality of No. 2 connecting rods (13) are all threadedly sleeved with No. 2 nuts (14); and No. 2 springs (15) are respectively arranged between the lower sides of the plurality of No. 2 nuts (14) and the upper side of the cover plate (16).

6. A semiconductor labeling device as claimed in claim 3, characterized in that: The label feeding trough (19) and the label paper separation trough (12) are arranged in a straight line that is inclined downward, and the initial section of the bottom paper recovery trough (20) is arranged in a horizontal straight line close to the bottom of the labeling platform (11), and one end thereof intersects with the inclined straight line where the label feeding trough (19) and the label paper separation trough (12) are located.

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