Tray assembly

Abstract

The utility model provides a tray assembly. The utility model provides a tray assembly. The tray assembly comprises a frame and a thin tray body nested on the frame, wherein the thin tray body is provided with a pocket for accommodating an electronic element; the thickness of the thin tray body is smaller than the specified thickness, and the thickness of the thin tray body is smaller than the thickness of the frame. The tray assembly meets the standard formulated by the JEDEC solid state technology association. According to the tray assembly provided by the invention, the frame and the thin tray body nested on the frame are arranged, and the tray assembly meets the standard formulated by the JEDEC solid state technology association, so that the tray assembly can be ensured to be compatible with common equipment and production processes in the electronic industry, and the adaptability and the use efficiency are improved; besides, the thickness of the thin tray body is smaller than the specified thickness, and the thickness of the thin tray body is smaller than the thickness of the frame, so that the cost can be reduced by using the thin tray body.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a tray assembly. Background Art

[0002] In the semiconductor industry, JEDEC trays are widely used in the packaging, testing, storage and transportation of chips due to their standardized design. Their rigidity and durability enable them to protect sensitive semiconductor electronic components from mechanical shock and electrostatic interference, thereby improving product reliability. In addition, this type of tray has excellent dimensional consistency and can be seamlessly adapted to automated equipment (such as placement machines, sorting systems, etc.), effectively shortening the production cycle and reducing the need for manual intervention, thereby significantly improving manufacturing efficiency. However, the high cost of JEDEC trays has become its main limiting factor. Its production usually uses high-performance plastic materials such as polycarbonate or polypropylene, supplemented by precise manufacturing processes, which makes the cost of each tray significantly higher than non-standardized ordinary trays. Utility Model Content

[0003] In view of this, the present application provides a tray assembly, which is used to provide a tray assembly that is compatible with JEDEC equipment and has a low cost.

[0004] Specifically, this application is implemented through the following technical solutions:

[0005] A first aspect of the present application provides a tray assembly, comprising a frame and a thin tray body nested on the frame;

[0006] The thin tray body has pockets for accommodating electronic components; the thickness of the thin tray body is less than a specified thickness, and the thickness of the thin tray body is less than the thickness of the frame; and the tray assembly meets the standards set by the JEDEC Solid State Technology Association.

[0007] Optionally, the size and shape of the thin tray body comply with the standards set by the JEDEC Solid State Technology Association, the size of the frame is consistent with the inner size of the surrounding portion of the thin tray body, and the surrounding portion of the thin tray body is snapped onto the frame.

[0008] Optionally, the size and external appearance of the frame meet the standards set by the JEDEC Solid State Technology Association; the tray assembly includes at least one thin tray body, and the size of each thin tray body is smaller than the size specified in the standards set by the JEDEC Solid State Technology Association;

[0009] The frame has at least one accommodating cavity inside for accommodating the thin tray assembly; each thin tray body is engaged in one of the accommodating cavities.

[0010] Optionally, each thin tray body is engaged in one of the accommodating cavities in any of the following ways: an interlocking way and a plug-in way.

[0011] Optionally, the plugging method includes vertical plugging or horizontal plugging.

[0012] Optionally, the edge of each thin tray body has a first interlocking mechanism; each accommodating cavity has a second interlocking mechanism, and each thin tray body is interlocked with the second interlocking mechanism in one accommodating cavity through the first interlocking mechanism.

[0013] Optionally, the accommodating cavity is a groove; a protrusion is provided at the bottom of the groove, and a socket matching the protrusion is provided on the thin tray body; the socket of the thin tray body is inserted into the protrusion, so that the thin tray body is engaged in the accommodating cavity by plugging.

[0014] Optionally, the accommodating cavity is a groove; a protrusion is provided on the side of the groove, and the protrusion and the bottom of the groove form a plug-in hole, and a plug-in plate matching the plug-in hole is provided on the thin tray body; the plug-in plate of the thin tray body is inserted into the plug-in hole, so that the thin tray body is engaged in the accommodating cavity by plugging.

[0015] Optionally, the frame is a frame of any of the following structural forms: a closed rectangle, or a frame structure consisting of a closed rectangle and internal support beams.

[0016] Optionally, the thin tray body is made of any one of the following materials: polypropylene, polycarbonate, polystyrene or polyester; the frame is made of any one of the following materials: polypropylene, polycarbonate, polystyrene or aluminum alloy.

[0017] The tray assembly provided in the present application is provided with a frame and a thin tray body nested on the frame, and the tray assembly meets the standards set by the JEDEC Solid State Technology Association, so as to ensure its compatibility with common equipment and production processes in the electronics industry, thereby improving adaptability and utilization efficiency; in addition, by making the thickness of the thin tray body less than the specified thickness and the thickness of the thin tray body less than the thickness of the frame, the use of a thin tray body can reduce costs, and further, the frame can provide additional support and protection to enhance the mechanical strength of the entire tray assembly, and the frame can be reused for a long time, which can further reduce costs; further, the nested design makes the installation and disassembly of the frame and the thin tray body more convenient, and also facilitates modular transportation or assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A schematic diagram of a first embodiment of a tray assembly provided in this application;

[0019] Figure 2 A schematic diagram of a second embodiment of a tray assembly provided in this application;

[0020] Figure 3 A schematic diagram of a framework shown as an exemplary embodiment of the present application;

[0021] Figure 4 A schematic diagram of a third embodiment of a tray assembly provided in this application;

[0022] Figure 5 This is a diagram showing the matching relationship between the frame and the thin tray body according to an exemplary embodiment of the present application;

[0023] Figure 6 This is a diagram showing the matching relationship between the frame and the thin tray body according to another exemplary embodiment of the present application.

[0024] Description of reference numerals:

[0025] 1: frame;

[0026] 11: accommodating cavity;

[0027] 12: internal support beam;

[0028] 2: Thin tray body;

[0029] 21: pocket;

[0030] 22: surrounding part;

[0031] 3: First interlocking mechanism;

[0032] 4: Second interlocking mechanism;

[0033] 5: convex;

[0034] 6: jack;

[0035] 7: Socket. DETAILED DESCRIPTION

[0036] Exemplary embodiments are described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different drawings represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this application.

[0037] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0038] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0039] In the semiconductor industry, JEDEC trays are widely used to handle, move, and store electronic components. JEDEC trays are sturdy, reliable, and compatible with automated systems, so electronics companies use them repeatedly. However, JEDEC trays are also expensive and are often discarded after a single use, resulting in a large amount of plastic waste. To reduce costs, suppliers often ship components on thinner, cheaper trays that don't fit in JEDEC machines, meaning assembly companies must transfer each component individually to a JEDEC tray, a slow and labor-intensive process. When assembly companies ask their suppliers to ship components directly on JEDEC trays, this results in increased costs and a large amount of plastic waste when the JEDEC trays are discarded after just one use.

[0040] The tray assembly provided in this application accommodates a low-cost thin tray body in a frame, so that the tray assembly complies with the JEDEC standard. In this way, when the tray assembly is used to transport electronic products, it can not only be compatible with JEDEC equipment, but also reduce costs and avoid waste of resources.

[0041] Specific embodiments are given below to introduce the technical solutions of the present application in detail.

[0042] Figure 1 This is a schematic diagram of embodiment 1 of the tray assembly provided in this application. Figure 1 Figure (A) is a schematic diagram of the thin tray body and frame in a separated state. Figure 1 Figure (B) shows the thin tray body and frame when they are combined. Figure 1 The tray assembly provided in this embodiment may include a frame 1 and a thin tray body 2 nested on the frame 1;

[0043] The thin tray body 2 has a pocket 21 for accommodating electronic components; the thickness of the thin tray body 2 is less than a specified thickness, and the thickness of the thin tray body 2 is less than the thickness of the frame 1; the tray assembly meets the standards set by the JEDEC Solid State Technology Association.

[0044] Optionally, in a possible implementation, the thin tray body 2 may be made of any one of the following materials: polypropylene, polycarbonate, and polystyrene.

[0045] It should be noted that the material used to manufacture the thin tray body 2 can be selected based on actual needs and is not limited in this application. For example, in one embodiment, if the thin tray body 2 requires high heat resistance and strong mechanical strength, polypropylene can be used as the manufacturing material of the thin tray body 2. For another example, in another embodiment, if the thin tray body 2 requires both high strength and a certain degree of transparency, polycarbonate can be used as the manufacturing material of the thin tray body 2. For another example, in yet another embodiment, if the thin tray body 2 is suitable for lightweight transportation and storage and requires low manufacturing costs, polystyrene can be selected as the manufacturing material of the thin tray body 2.

[0046] Furthermore, the frame 1 can be made of any of the following materials: polypropylene, polycarbonate, and polystyrene. In specific implementation, the specific material of the frame 1 is selected according to actual needs and is not limited in this embodiment.

[0047] Furthermore, the tray assembly provided in the present application, which is formed by combining a thin tray body 2 and a frame 1, meets the standards set by the JEDEC Solid State Technology Association, can facilitate the transportation of electronic products, and the tray assembly can be directly embedded in JEDEC equipment for production, processing and manufacturing.

[0048] It should be noted that the thickness of the thin tray body 2 is less than the specified thickness, which not only meets the storage and transportation requirements of electronic products but also reduces the overall cost of the tray assembly.

[0049] It should be noted that the specific value of the specified thickness is set based on actual needs and is not limited in this embodiment. For example, the specified thickness can be the thickness specified in the standards established by the JEDEC Solid State Technology Association, or it can be the thickness that can prevent the tray assembly from deforming when clamped by JEDEC equipment. This not only saves materials and reduces costs, but also reduces the total weight of the tray assembly, which is conducive to improving transportation efficiency.

[0050] Furthermore, the thickness of the thin tray body 2 is smaller than that of the frame 1 . Under the premise of reducing costs, the two can be combined to ensure a certain strength.

[0051] It should be noted that the frame 1 can provide rigid support to keep the thin tray body 2 stable during use. By nesting the thin tray body 2 into the frame 1, the thin tray body 2 can be more firmly fixed within the frame 1, avoiding displacement caused by vibration or impact during transportation or use.

[0052] The tray assembly is designed in accordance with the JEDEC Solid State Technology Association standards. Its size and interface are compatible with existing automated equipment (such as placement machines, handling systems, etc.), ensuring that the tray assembly can be efficiently circulated and used in the production line.

[0053] The tray assembly provided in this embodiment is provided with a frame and a thin tray body nested on the frame, and the tray assembly meets the standards set by the JEDEC Solid State Technology Association. In this way, it can ensure its compatibility with common equipment and production processes in the electronics industry, and improve adaptability and utilization efficiency. In addition, by making the thickness of the thin tray body less than the specified thickness and the thickness of the thin tray body less than the thickness of the frame, the use of the thin tray body can reduce costs. Furthermore, the frame can provide additional support and protection, thereby improving the mechanical strength of the entire tray assembly, and allowing the frame to be reused for a long time, which can further reduce costs. Furthermore, the nested design makes the installation and disassembly of the frame and the thin tray body more convenient, and also facilitates modular transportation or assembly.

[0054] Two more specific embodiments are given below to introduce the technical solution provided by this application in detail:

[0055] Further, Figure 2 This is a schematic diagram of the second embodiment of the tray assembly provided in this application. Figure 2 Figure (A) is a schematic diagram of the tray assembly in a split state; Figure 2 Figure (B) shows the tray assembly in its assembled state. Figure 2 Based on the above embodiment, the tray assembly provided in this embodiment has the size and shape of the thin tray body 2 comply with the standards set by the JEDEC Solid State Technology Association, the size of the frame 1 is consistent with the inner size of the surrounding portion 22 of the thin tray body 2, and the surrounding portion 22 of the thin tray body 2 is snapped onto the frame 1.

[0056] Specifically, the size and shape of the thin tray body 2 comply with the standards set by the JEDEC Solid State Technology Association, but its thickness is still less than the thickness specified in the standards set by the JEDEC Solid State Technology Association. Furthermore, the periphery of the thin tray body 2 also has a surrounding portion 22 extending downward. When the thin tray body 2 is embedded in the frame 1, the surrounding portion 22 surrounds the outer periphery of the frame 1, so that the thin tray body 2 is firmly fixed on the frame 1. The combined tray assembly has higher mechanical strength and structural stability. During the transportation and use of the tray assembly provided in this embodiment, damage to the tray assembly can be effectively avoided, thereby damaging the electronic components housed therein.

[0057] It should be noted that the size and shape of the frame 1 are compatible with the thin pallet body 2, so that the thin pallet body 2 can be accurately embedded in the interior of the frame 1, and the surrounding portion 22 of the thin pallet can also tightly surround the outside of the frame 1 to form a highly stable snap-on structure, thereby preventing the entire pallet assembly from loosening during transportation and use.

[0058] Figure 3 This is a schematic diagram of a framework shown in an exemplary embodiment of the present application. Figure 3 Alternatively, in a possible implementation, the frame 1 may be any of the following structural forms: a closed rectangle, a frame structure consisting of a closed rectangle and internal support beams. For example, Figure 3 In the example shown in Figure (A), the frame 1 is a closed rectangle. For example, Figure 3 In the examples shown in Figures (B), (C) and (D), the frame 1 is a frame structure consisting of a closed rectangle and internal support beams 12.

[0059] It should be noted that, see Figure 3 The specific position of the internal support beam 12 is set according to actual needs and is not limited in this embodiment.

[0060] The tray assembly provided in this embodiment has the size and shape of the thin tray body comply with the standards set by the JEDEC Solid State Technology Association, and the size of the frame is consistent with the inner size of the surrounding portion of the thin tray body. The surrounding portion of the thin tray body is snapped onto the frame. In this way, a low-cost tray assembly compatible with JEDEC equipment can be formed, and the frame can be reused.

[0061] Further, Figure 4 For the schematic diagram of the tray assembly embodiment 3 provided in this application, please refer to Figure 4 , Figure 4 Figure (A) is a schematic diagram of the tray assembly in a separated state. Figure 4Figure (B) shows the tray assembly in its assembled state. Figure 4 Based on the above embodiment, the tray assembly provided in this embodiment has a frame 1 whose size and external appearance meet the standards set by the JEDEC Solid State Technology Association. The tray assembly includes at least one thin tray body 2, and the size of each thin tray body 2 is smaller than the size specified in the standards set by the JEDEC Solid State Technology Association.

[0062] The frame 1 has at least one accommodating cavity 11 inside for accommodating the thin tray assembly; each thin tray body 2 is engaged in one of the accommodating cavities 11 .

[0063] For details, please refer to Figure 4 , it can be seen that in Figure 4 In the illustrated embodiment, the dimensions and external appearance of the frame 1 meet the standards set by the JEDEC Solid State Technology Association. For example, the frame 1 includes a clamping portion. Furthermore, the tray assembly incorporates a low-cost, thin tray body 2, which does not meet the JEDEC standards, into the accommodating cavity 11 within the frame 1. This allows the overall tray assembly to meet the JEDEC standards, enhancing the tray assembly's stability during electronic product transportation and enabling it to be directly embedded in JEDEC equipment for production, processing, and manufacturing.

[0064] For further information, please refer to Figure 4 The frame 1 has a plurality of accommodating cavities 11 for accommodating thin tray assemblies. Each thin tray body 2 is engaged with a accommodating cavity 11. The size and shape of the accommodating cavity 11 are adapted to the thin tray body 2 that needs to be embedded in the accommodating cavity 11. The thickness of the thin tray body 2 is also smaller than the thickness inside the accommodating cavity 11, so that the thin tray body 2 can be smoothly embedded in the accommodating cavity 11.

[0065] The tray assembly provided by this embodiment can accommodate various types of economical and affordable thin tray bodies in a frame. By using this frame, an assembly company can avoid transferring components one by one, thus saving time.

[0066] Specifically, the frame 1 has the same size and shape as the JEDEC tray, and provides multiple ways to fix the thin tray body 2 inside.

[0067] In specific implementation, the thin tray body 2 can be fixed on the frame 1 in the following manner:

[0068] Lego-style interlocking system: Using a grid of posts and holes on the bottom of the frame, similar to Lego bricks, matching holes on the thin tray body snap onto the posts, firmly securing the thin tray body in place and making insertion and removal of the thin tray body very easy.

[0069] Interlocking tabs: Tabs on the frame fit into slots in the low-profile tray body. When pressed together, they lock tightly. This design provides a secure fit but is also easy to release and reuse.

[0070] Corner or Tab Insert: The low-profile tray body can include a corner or small tab that inserts into a slot in the frame shell, securing the low-profile tray body securely in place. This allows for easy insertion and removal of the low-profile tray body without tools, while providing a stable fit that prevents movement during handling.

[0071] Sliding joint system: The edge of the frame has grooves into which the low-profile tray body with matching guides slides, and a small lock at the end secures the tray in place.

[0072] Spring Clips: Small spring clips on the edge of the frame hold the low-profile tray body in place by applying slight pressure. This allows for slight variations in the low-profile tray body size and provides a secure hold without damaging the tray.

[0073] Foam or elastic inserts: Anti-static foam or elastic material on the inner edge of the frame sandwiches the thin pallet body to keep it stable. This allows for different pallet thicknesses and prevents the pallet from shifting.

[0074] Understandably, standard JEDEC trays are made of high-quality, anti-static plastic to withstand repeated use and high temperatures. Due to their thick and sturdy construction, each JEDEC tray typically weighs approximately 200 to 300 grams, resulting in a significant amount of plastic waste if discarded after just one use.

[0075] In contrast, the tray assembly provided in this embodiment, the thinner thin tray assembly is typically made of lighter and cheaper materials such as polystyrene or ABS, typically weighing about 50 to 100 grams, and can reduce the use of plastic by up to 75%. By using this JEDEC equipment-compatible frame to fix the lighter thin tray body 2, plastic waste can be significantly reduced, costs can be saved, and it can help reduce the environmental impact of semiconductor manufacturing. It can also reduce the demand for JEDEC trays and reduce packaging and handling costs by allowing cheaper thin tray bodies 2 to be used with the frame. In addition, the need to transfer components one by one from the supplier's tray to the JEDEC tray can be avoided, speeding up assembly. Further, different types of thin tray assemblies are allowed to be used directly in a JEDEC-compatible frame.

[0076] The tray assembly provided in this embodiment ensures that the size and external appearance of the frame meet the standards set by the JEDEC Solid State Technology Association, and that the tray assembly includes at least one thin tray body, the size of each thin tray body is smaller than the size specified in the standards set by the JEDEC Solid State Technology Association, and the frame has at least one accommodating cavity for accommodating the thin tray body, and each thin tray body is engaged in one of the accommodating cavities. In this way, through the cooperation of the frame and the thin tray body, a tray assembly compatible with JEDEC equipment can be formed, and the cost of the tray assembly is low.

[0077] Optionally, each thin tray body 2 is engaged in one of the accommodating cavities 11 by any of the following methods: an interlocking method and a plug-in method.

[0078] The following describes the methods for engaging the thin tray body 2 in the accommodating cavity 11 by using an interlocking method and an inserting method.

[0079] Figure 5 This is a diagram showing the relationship between the frame and the thin tray body according to an exemplary embodiment of the present application. Figure 5 In one possible implementation, the edge of each thin tray body 2 has a first interlocking mechanism 3; each accommodating cavity 11 has a second interlocking mechanism 4, and each thin tray body 2 is interlocked with the second interlocking mechanism 4 in a accommodating cavity 11 through the first interlocking mechanism 3.

[0080] Please continue to refer to Figure 5 , Figure 5 The single thin tray body 2 and the accommodating cavity 11 form an interlocking structure. Figure 5 As can be seen in the figure, a first interlocking mechanism 3 having a thickness less than that of the thin tray body 2 is provided at the edge of the thin tray body 2. Correspondingly, a second interlocking mechanism 4 is provided inside the accommodating cavity 11. The second interlocking mechanism 4 is protruding, and the closer it is to the interior of the accommodating cavity 11, the smaller its thickness. In this way, when the thin tray body 2 is placed into the accommodating cavity 11, the first interlocking mechanism 3 can be placed on the second interlocking mechanism 4, and the structure of the thin tray body 2 in the middle position can just form an interlocking structure with the top end of the second interlocking mechanism 4.

[0081] Furthermore, the thin tray body 2 can be engaged with the interior of the accommodating cavity 11 by plugging. The plugging method also includes vertical plugging or horizontal plugging.

[0082] Figure 6 This is another exemplary embodiment of the present application showing the relationship between the frame and the thin tray body, please refer to Figure 6 ,exist Figure 6In Figure (A), the thin tray body 2 is vertically inserted into the accommodating cavity 11. Specifically, the accommodating cavity 11 is a groove; a protrusion 5 is provided at the bottom of the groove, and the thin tray body 2 is provided with a socket 6 that matches the protrusion 5. The socket 6 of the thin tray body 2 is inserted into the protrusion 5, so that the thin tray body 2 is inserted into the accommodating cavity 11.

[0083] Further, in Figure 6 In Figure (B), the thin tray body 2 is horizontally inserted into the accommodating cavity 11. Specifically, a protrusion 5 is provided on the side of the groove, and the protrusion 5 and the bottom of the groove form an insertion hole 7. The thin tray body 2 is provided with an insertion plate that matches the insertion hole 7. The insertion plate of the thin tray body 2 is inserted into the insertion hole 7, so that the thin tray body 2 is inserted into the accommodating cavity 11.

[0084] Specifically, in Figure 6 In the figure (A), the thin tray body 2 is inserted vertically into the accommodating cavity 11, which can effectively utilize the vertical space inside the accommodating cavity 11. This method is simple and efficient, and can greatly improve the installation efficiency of the thin tray body 2. Furthermore, the thin tray body 2 is directly inserted into the protrusion 5 at the bottom of the accommodating cavity 11 through the insertion hole 6 to ensure that the thin tray body 2 can be firmly inserted into the accommodating cavity 11. Figure 6 In Figure (B), the thin tray body 2 is engaged in the interior of the accommodating cavity 11 in a horizontal plug-in manner, so that the protrusion 5 inside the accommodating cavity 11 can provide strong support for the thin tray body 2, ensuring that the tray assembly can ensure the stable transportation of the thin tray body 2 during transportation. Among them, the horizontal plug-in in a sliding manner also improves the convenience of installation.

[0085] It should be noted that different insertion methods for attaching the thin tray body to the interior of the accommodating cavity have different advantages and can be adapted to different application scenarios. The insertion method can be selected based on actual needs and is not limited in this application. For example, in one embodiment, if efficient installation and transportation efficiency is required, a vertical insertion method can be selected for ease of installation; in another embodiment, if stability is required for transportation, a horizontal insertion method with greater stability can be selected.

[0086] The tray assembly provided in this embodiment accommodates the thin tray body within the frame's accommodating cavity through either vertical or horizontal insertion. Vertical insertion effectively utilizes the cavity's vertical space, improving installation efficiency and making it suitable for applications requiring quick installation and efficient space utilization. Furthermore, horizontal insertion provides greater support and stability, making it suitable for scenarios where the stability of the thin tray body must be ensured during transportation. Furthermore, the two insertion methods can be selected based on actual needs. Different insertion methods can be used to accommodate the thin tray body within the frame's accommodating cavity in different application scenarios, ensuring that the tray assembly can perform optimally in the appropriate application scenario. This effectively expands the scope of application for transporting electronic products using the tray assembly and enhances its robustness.

[0087] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A tray assembly, characterized in that: The tray assembly includes a frame and a thin tray body nested on the frame; The thin tray body has pockets for accommodating electronic components; the thickness of the thin tray body is less than a specified thickness, and the thickness of the thin tray body is less than the thickness of the frame; and the tray assembly meets the standards set by the JEDEC Solid State Technology Association.

2. The tray assembly according to claim 1, wherein: The size and shape of the thin tray body comply with the standards set by the JEDEC Solid State Technology Association. The size of the frame is consistent with the inner size of the surrounding portion of the thin tray body, and the surrounding portion of the thin tray body is snapped onto the frame.

3. The tray assembly according to claim 1, wherein: The size and external appearance of the frame meet the standards set by the JEDEC Solid State Technology Association; the tray assembly includes at least one thin tray body, and the size of each thin tray body is smaller than the size specified in the standards set by the JEDEC Solid State Technology Association; The frame has at least one accommodating cavity inside for accommodating the thin tray assembly; each thin tray body is engaged in one of the accommodating cavities.

4. The tray assembly according to claim 3, wherein: Each thin tray body is engaged in one of the accommodating cavities in any of the following ways: an interlocking way and a plug-in way.

5. The tray assembly according to claim 4, wherein: The plugging method includes vertical plugging or horizontal plugging.

6. The tray assembly according to claim 4, wherein: The edge of each thin tray body is provided with a first interlocking mechanism; each accommodating cavity is provided with a second interlocking mechanism, and each thin tray body is interlocked with the second interlocking mechanism in one accommodating cavity through the first interlocking mechanism.

7. The tray assembly according to claim 4, wherein: The accommodating cavity is a groove; a protrusion is provided at the bottom of the groove, and a socket matching the protrusion is provided on the thin tray body; the socket of the thin tray body is inserted into the protrusion, so that the thin tray body is engaged in the accommodating cavity by plugging.

8. The tray assembly according to claim 4, wherein: The accommodating cavity is a groove; a protrusion is provided on the side of the groove, and the protrusion and the bottom of the groove form an insertion hole. The thin tray body is provided with an insertion plate that matches the insertion hole; the insertion plate of the thin tray body is inserted into the insertion hole, so that the thin tray body is engaged in the accommodating cavity by insertion.

9. The tray assembly according to claim 2, wherein: The frame is any one of the following structural forms: a closed rectangle, or a frame structure consisting of a closed rectangle and internal supporting beams.

10. The tray assembly according to claim 1, wherein: The thin tray body is made of any of the following materials: polypropylene, polycarbonate and polystyrene; The frame is made of any of the following materials: polypropylene, polycarbonate and polystyrene.

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