Reaction chamber opening and closing control structure for semiconductor wafer processing

Abstract

The utility model discloses a reaction chamber opening and closing control structure for semiconductor wafer processing. A reaction chamber comprises a reaction chamber body I and a reaction chamber body II located above the reaction chamber body I. Wherein the opening and closing control structure comprises a hollow cylinder vertically arranged above the reaction cavity II, an electric cylinder fixedly mounted on the hollow cylinder, and a connecting rod positioned in the hollow cylinder. The connecting rod is fixed at the output end of the electric cylinder, the connecting rod penetrates through the end part of the hollow cylinder and is connected with the reaction cavity II, and the reaction cavity is opened and closed through the electric cylinder and the connecting rod, so that a too large operation space is not needed, and the cost and the occupied space of equipment are favorably reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a reaction chamber opening and closing control structure for semiconductor wafer processing. Background Art

[0002] Semiconductor processing equipment, such as thin film deposition equipment, heat treatment equipment, and etching equipment, all include a reaction chamber, in which components such as semiconductor substrates or wafers are placed for processing. Furthermore, a support body is provided inside the reaction chamber to support the semiconductor substrates or wafers. When removing or placing the semiconductor substrates or wafers from or onto the support body, two common structures are used in the industry. One is to place a lid on top of the reaction chamber. When removing or placing the semiconductor substrates or wafers from or onto the support body, the lid is opened by a mechanical structure, and the semiconductor substrates or wafers are removed from or onto the support body by a robotic arm. The second structure is to design a vertical motion device that cooperates with the support body. This vertical motion device drives the support body out of or into the reaction chamber, thereby completing the operation of removing or placing the semiconductor substrates or wafers from or onto the support body. The problems with these two structures are that they are complex, which is not conducive to reducing costs, and they require a large operating space, which is not conducive to reducing the equipment's footprint. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a reaction chamber opening and closing control structure for semiconductor wafer processing, which realizes the opening and closing of the reaction chamber through an electric cylinder and a connecting rod, thereby not requiring too much operating space, which is conducive to reducing costs and equipment space occupied.

[0004] A reaction chamber opening and closing control structure for semiconductor wafer processing, wherein the reaction chamber comprises a reaction chamber body I and a reaction chamber body II located above the reaction chamber body I;

[0005] The opening and closing control structure includes:

[0006] A hollow cylinder placed above the reaction chamber II;

[0007] An electric cylinder, which is fixedly mounted on the hollow cylinder;

[0008] The connecting rod located in the hollow cylinder is fixed at the output end of the electric cylinder. The connecting rod passes through the end of the hollow cylinder and is connected to the reaction chamber II.

[0009] In one embodiment, the connecting rod is a hollow structure, and the end of the connecting rod passes through the hollow cylinder and is threadedly connected to the reaction chamber II through a connector.

[0010] In one embodiment, the opening and closing control structure also includes an air outlet pipe vertically installed in the connecting rod and a cooling component for cooling the air outlet pipe; wherein, the air outlet pipe is fixedly passed through the reaction chamber II, and the air inlet end of the air outlet pipe is connected to the receiving space formed by the reaction chamber I and the reaction chamber II.

[0011] In one embodiment, the opening and closing control structure further includes a bellows, which is sleeved on the outside of the connecting rod.

[0012] Furthermore, the upper end of the bellows is fixed to the connecting rod, and the lower end is sealed and fixed to the bottom of the hollow cylinder.

[0013] Furthermore, the outlet end of the air outlet pipe is fixedly installed through the corresponding side wall of the connecting rod, and the outlet end of the air outlet pipe is located above the corrugated pipe.

[0014] Furthermore, the cooling assembly includes a water cooling channel formed between the air outlet pipe and the connecting rod, and a water inlet pipe and a water outlet pipe connected to the water cooling channel.

[0015] In one embodiment, the water inlet pipe and the water outlet pipe are fixedly installed on the corresponding two side walls of the connecting rod, and the water inlet pipe and the water outlet pipe are both arranged above the corrugated pipe.

[0016] Furthermore, a groove is provided on a side wall corresponding to the hollow cylinder, and the water inlet end of the water inlet pipe and the water outlet end of the water outlet pipe extend to the outside of the hollow cylinder through the groove.

[0017] Compared with the prior art, the beneficial effect of the present invention is that the opening and closing of the reaction chamber is achieved through the electric cylinder and the connecting rod, so that a large operating space is not required, which is conducive to reducing costs and equipment space occupation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a structural schematic diagram of a reaction chamber opening and closing control structure for semiconductor wafer processing provided by the present invention.

[0019] Figure 2 Shown Figure 1 sectional view of .

[0020] Figure 3 Shown Figure 2 Perspective view of point A in the middle.

[0021] Figure 4 Shown Figure 2 Closed view of the reaction chamber in Figure 1, where the arrow indicates the direction of movement of the connecting rod.

[0022] Description of main component symbols

[0023] 1. Hollow cylinder; 2. Electric cylinder; 3. Connecting rod; 4. Bellows; 5. Exhaust pipe; 6. Water cooling channel; 7. Water inlet pipe; 8. Water outlet pipe.

[0024] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION

[0025] The present invention will be described in detail below with reference to the accompanying drawings.

[0026] See also Figure 1-4 This embodiment provides a reaction chamber opening and closing control structure for semiconductor wafer processing. The reaction chamber includes a reaction chamber body I and a reaction chamber body II located above reaction chamber I. The opening and closing control structure comprises a hollow cylinder 1 vertically positioned above reaction chamber body II, an electric cylinder 2 fixedly mounted on the hollow cylinder 1, a connecting rod 3 located within the hollow cylinder 1, a bellows 4 sleeved around the connecting rod 3, an air outlet pipe 5 vertically mounted within the connecting rod 3, and a cooling assembly for cooling the air outlet pipe 5.

[0027] The connecting rod 3 is fixed to the output end of the electric cylinder 2. The connecting rod 3 has a hollow structure and extends through the end of the hollow cylinder 1 and is threadedly connected to the reaction chamber II via a connector. In this embodiment, the specific connection mode between the connecting rod 3 and the reaction chamber II is as follows: a connector is fixedly installed through the reaction chamber II, and the connector has a threaded cavity for adapting the connecting rod 3. The lower end of the connecting rod 3 is screwed into the connector through the threaded cavity, thereby completing the installation of the connecting rod 3 on the reaction chamber II. In addition, the connector has a through groove, along which the air outlet pipe 5 passes through the reaction chamber II.

[0028] In this embodiment, the position of the reaction chamber II is changed by the cooperation between the electric cylinder 2 and the connecting rod 3, thereby achieving the purpose of controlling the opening or closing of the reaction chamber.

[0029] The bellows 4 is fixed at its upper end to the connecting rod 3 and hermetically secured at its lower end to the bottom of the hollow cylinder 1. Bellows 4 is elastically deformable. When reaction chamber II is driven to move up and down relative to reaction chamber I, the connecting rod 3, driven up and down by the electric cylinder 2, adapts to the deformation of bellows 4, thereby ensuring structural sealing and directional gas output along the channel provided by the gas outlet pipe 5, preventing spillage.

[0030] The outlet end of the outlet pipe 5 is fixedly mounted on the corresponding side wall of the connecting rod 3 and is located above the bellows 4. The outlet pipe 5 is fixedly mounted through the reaction chamber II, and the inlet end of the outlet pipe 5 is connected to the receiving space formed by the reaction chambers I and II. The integration of the outlet pipe 5 with the linear drive component used to change the position of the reaction chamber II results in a compact structure, occupies little space, and also provides a cooling function, cooling the gas during exhaust.

[0031] The cooling assembly includes a water-cooling channel 6 formed between the air outlet pipe 5 and the connecting rod 3, and a water inlet pipe 7 and a water outlet pipe 8 connected to the water-cooling channel 6. The water inlet pipe 7 and the water outlet pipe 8 are respectively fixedly mounted on the corresponding two side walls of the connecting rod 3, and the water inlet pipe 7 and the water outlet pipe 8 are both arranged above the corrugated pipe 4. A groove is provided on the corresponding side wall of the hollow cylinder 1, and the water inlet end of the water inlet pipe 7 and the water outlet end of the water outlet pipe 8 extend to the outside of the hollow cylinder 1 through the groove. The gas in the reaction chamber is discharged from the connecting rod 3 along the air outlet pipe 5, and then discharged to the outside of the hollow cylinder 1 through the groove. In this embodiment, cold water is introduced into the water inlet pipe 7, and the cold water fills the water-cooling channel 6, so that the purpose of cooling the air outlet pipe 5 is achieved based on thermal convection.

[0032] In specific implementation, the reaction chamber disclosed in this embodiment can be used for the surface treatment process of silicon carbide wafers. For example, the silicon carbide wafer is placed in the reaction chamber for ion implantation. After the ion implantation is completed, heating is used to control the temperature in the reaction chamber to be higher than 1500°C. The silicon carbide wafer after ion implantation is annealed at this temperature for a period of time to achieve the purpose of improving the activation rate of the implanted ions and eliminating defects caused by lattice damage. In order to facilitate the cleaning and maintenance of the reaction chamber, the above-mentioned opening and closing control structure can be used to control the movement of the upper reaction chamber to achieve the purpose of opening or closing the reaction chamber.

[0033] In summary, the semiconductor wafer processing reaction chamber opening and closing control structure of this embodiment realizes the opening and closing of the reaction chamber through the electric cylinder and the connecting rod, thereby not requiring too much operating space, which helps to reduce costs and equipment space occupation.

[0034] The naming of the various components involved is based on the functions described in the specification, and is not limited to the specific nouns used in the present invention. Those skilled in the art may also choose other nouns to describe the names of the various components of the present invention.

Claims

1. A semiconductor wafer processing reaction chamber opening and closing control structure, the reaction chamber comprising a reaction chamber I and a reaction chamber II located above the reaction chamber I; It is characterized in that The opening and closing control structure includes: A hollow cylinder (1) placed upright above the reaction chamber II; An electric cylinder (2) fixedly mounted on the hollow cylinder (1); A connecting rod (3) located in the hollow cylinder (1) is fixed at the output end of the electric cylinder (2); the connecting rod (3) passes through the end of the hollow cylinder (1) and is connected to the reaction chamber II.

2. A semiconductor wafer processing reaction chamber opening and closing control structure according to claim 1, characterized in that: The connecting rod (3) is a hollow structure, and the end of the connecting rod (3) passes through the hollow cylinder (1) and is threadedly connected to the reaction chamber II through a connecting piece.

3. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 1, characterized in that: The opening and closing control structure further comprises an air outlet pipe (5) vertically installed in the connecting rod (3) and a cooling assembly for cooling the air outlet pipe (5); wherein the air outlet pipe (5) is fixedly passed through the reaction chamber II, and the air inlet end of the air outlet pipe (5) is connected to the receiving space formed by the reaction chamber I and the reaction chamber II.

4. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 3, characterized in that: The opening and closing control structure further comprises a bellows (4) which is sleeved on the outside of the connecting rod (3).

5. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 4, characterized in that: The upper end of the bellows (4) is fixed to the connecting rod (3), and the lower end is sealed and fixed to the bottom of the hollow cylinder (1).

6. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 5, characterized in that: The outlet end of the air outlet pipe (5) is fixedly installed through the corresponding side wall of the connecting rod (3), and the outlet end of the air outlet pipe (5) is located above the bellows (4).

7. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 6, characterized in that: The cooling assembly comprises a water cooling channel (6) formed between the air outlet pipe (5) and the connecting rod (3), a water inlet pipe (7) and a water outlet pipe (8) connected to the water cooling channel (6).

8. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 7, characterized in that: The water inlet pipe (7) and the water outlet pipe (8) are respectively fixedly mounted on the corresponding two side walls of the connecting rod (3), and the water inlet pipe (7) and the water outlet pipe (8) are both arranged above the corrugated pipe (4).

9. The semiconductor wafer processing reaction chamber opening and closing control structure according to claim 8, characterized in that: A slot is provided on a corresponding side wall of the hollow cylinder (1), and the water inlet end of the water inlet pipe (7) and the water outlet end of the water outlet pipe (8) extend to the outside of the hollow cylinder (1) through the slot.

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