Carrier assembly and gene sequencing system

By adopting a combination design of fixed support structure, adjustable support structure and elastic support structure on the gene sequencing platform, the problem of insufficient support stability of the gene sequencing platform outside the triangular area is solved, and stable support and high-precision sequencing over a larger area are achieved.

CN223422659UActive Publication Date: 2025-10-10WUHAN MGI TECH CO LTD
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Patent Information

Application Number
CN202422754893.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-12
Publication Date
2025-10-10
Estimated Expiration
2034-11-12

AI Technical Summary

Technical Problem

The support stability of the gene sequencing platform outside the triangular area is poor, affecting the sequencing accuracy and stability.

Method used

A combination of fixed support structure, adjustable support structure and elastic support structure is adopted to form a five-point support structure, which increases the stable support area and realizes automatic adjustment through the clamping assembly and driving parts to ensure flatness.

Benefits of technology

The stable support area of ​​the gene sequencing platform has been increased to ensure that the sequencing chip is stably supported over a larger area, improving sequencing precision and accuracy. The flatness stability is within 10µm, adapting to long-term use and external force vibration.

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Abstract

The utility model relates to the field of gene sequencing equipment, aims to solve the problem of small stable supporting range of a gene sequencing platform deck in the prior art, and provides a platform deck assembly and a gene sequencing system. The platform deck assembly comprises a bottom plate, a bearing plate and a supporting assembly. The supporting assembly comprises a fixed supporting structure, two adjustable supporting structures and an elastic supporting structure, and the fixed supporting structure and the two adjustable supporting structures are distributed in a triangular shape; the fixed supporting structure is supported between the bottom plate and the bearing plate, and the adjustable supporting structures are supported between the bottom plate and the bearing plate and can adjust the height of the bearing plate relative to the bottom plate. The elastic supporting structure is located outside the range of a triangle defined by the fixed supporting structure and the two adjustable supporting structures and is elastically supported between the bottom plate and the bearing plate. The device has the beneficial effects that the stable supporting range is enlarged, and relatively high planeness can still be ensured when the device bears an external force applied by repeatedly taking and placing the sequencing chip.
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Description

Technical Field

[0001] The present application relates to the field of gene sequencing equipment, and more specifically, to a carrier assembly and a gene sequencing system. Background Art

[0002] During gene sequencing, the sequencing chip needs to be placed on a gene sequencing platform. To ensure sequencing accuracy, the gene sequencing platform must maintain sufficiently high precision and support stability.

[0003] In some related technologies, gene sequencing platforms are supported by three fulcrums. These gene sequencing platforms can provide relatively stable support within the triangle area surrounded by the three fulcrums. However, outside the triangle area, there is a problem of relatively low support stability. Utility Model Content

[0004] The present application provides a carrier assembly and a gene sequencing system to solve the problem in related technologies that the gene sequencing carrier has poor support stability in areas outside the triangular area.

[0005] In a first aspect, the present application provides a carrier assembly, which includes a base plate, a load-bearing plate and a support assembly. The load-bearing plate is used to carry the test piece. The support assembly includes a fixed support structure, two adjustable support structures and an elastic support structure, and the fixed support structure and the two adjustable support structures are distributed in a triangular shape; the fixed support structure is supported between the base plate and the load-bearing plate, and each adjustable support structure is supported between the base plate and the load-bearing plate, and can adjust the height of the load-bearing plate relative to the base plate respectively; the elastic support structure is located outside the triangular range enclosed by the fixed support structure and the two adjustable support structures, and is elastically supported between the base plate and the load-bearing plate.

[0006] The carrier assembly in the present application is further provided with an elastic support structure outside the triangular area enclosed by the fixed support structure and the two adjustable support structures, which increases the area where the carrier plate can provide stable support.

[0007] In one possible embodiment, the line connecting the two adjustable support structures is the first side, the line connecting the fixed support structure and one of the adjustable support structures is the second side, and the line connecting the fixed support structure and the other adjustable support structure is the third side. The first, second, and third sides form an isosceles triangle, with the second and third sides being of equal length. There are two elastic support structures, symmetrically distributed on either side of the perpendicular bisector of the first side.

[0008] In a possible embodiment, the bottom plate is rectangular, the two adjustable support structures and the two elastic support structures are distributed at the four corners of the bottom plate, and the fixed support structure is located between the two elastic support structures.

[0009] In one possible embodiment, the adjustable support structure includes a first support, a first support column, and a support sleeve. The first support is fixedly connected to the base plate, the support sleeve is fixed to the bearing plate, and the first support column is movably connected to the support sleeve and supported by the first support. The first support column is configured to be movable relative to the support sleeve under the action of an external force, thereby moving the support sleeve toward or away from the first support.

[0010] In a possible embodiment, the bearing plate is provided with a mounting hole, and the support sleeve is fixedly mounted in the mounting hole. The first pillar is threadedly connected to the support sleeve and can make the support sleeve approach or move away from the first support.

[0011] In a possible embodiment, the fixed support structure includes a second support and a second pillar, wherein the second support is fixedly connected to the base plate, and the second pillar is fixedly connected to the bearing plate and supported by the second support.

[0012] In one possible embodiment, the platform assembly further includes a clamping assembly. The clamping assembly comprises a locking screw, a clamping block, and an elastic member. The locking screw comprises a screw head and a rod segment connected thereto. The rod segment passes through the support plate and is threadedly connected to the base plate. The clamping block and elastic member are respectively sleeved around the outer circumference of the rod segment. One end of the elastic member is supported on the support plate, while the other end elastically supports the clamping block on the screw head.

[0013] In a possible implementation, there are three pressing assemblies, which are distributed in a triangle shape, with one pressing assembly being located near the fixed support structure, and the other two pressing assemblies being located near two adjustable support structures, respectively.

[0014] In a possible embodiment, the carrier assembly further includes two driving members, which are respectively matched with two adjustable support structures to adjust the distance between the base plate and the carrier plate through the adjustable support structures.

[0015] In one possible embodiment, the carrier assembly further includes a height detection system and a computer. The height detection system is used to detect the first height, second height and third height of the carrier plate; wherein the first height and the second height are respectively the heights of the carrier plate from the base plate at the two adjustable support structures, and the third height is the height of the carrier plate from the base plate at the fixed support structure. The height detection system is communicatively connected to the computer and is used to transmit information of the detected first height, second height and third height to the computer. The computer is communicatively connected to the driving member and is used to calculate the flatness of the carrier assembly based on the first height, second height and third height, and control the two driving members to adjust the first height and / or second height according to the flatness until the flatness of the carrier assembly meets the set value.

[0016] In a second aspect, the present application provides a gene sequencing system comprising a transport component and the aforementioned carrier component. The transport component is used to transport the test piece to the carrier component and / or to remove the test piece from the carrier component. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a three-dimensional diagram of the gene sequencing system according to an embodiment of the present application.

[0019] Figure 2 This is a three-dimensional diagram of the stage assembly according to an embodiment of the present application.

[0020] Figure 3 for Figure 2 Exploded view of the stage assembly.

[0021] Figure 4 for Figure 3 Top view of the base plate and positive components.

[0022] Figure 5 for Figure 2 A top view of the stage assembly.

[0023] Figure 6 for Figure 5 Cross-sectional view of the carrier assembly along line AA.

[0024] Figure 7 for Figure 5 Cross-sectional view of the carrier assembly along line BB.

[0025] Figure 8 for Figure 5 Cross-sectional view of the carrier assembly along line CC.

[0026] Figure 9 This is a working principle diagram of the electric adjustment system according to an embodiment of the present application.

[0027] Figure 10 This is a flow chart of leveling the stage assembly according to an embodiment of the present application.

[0028] Figure 11 This is a state change diagram of the leveling process of the stage assembly in an embodiment of the present application.

[0029] Explanation of the main component symbols: 200 - test object; 210 - sequencing chip; 100 - gene sequencing system; 120 - transport assembly; 130 - optical imaging assembly; 110 - stage assembly; 10 - base plate; 20 - carrying plate; 30 - support assembly; 30a - fixed support structure; 30b - adjustable support structure; 30c - elastic support structure; 31 - first support; 32 - first pillar; 33 - support sleeve; 34 - second support; 35 - second pillar; 40 - pressing assembly; 41-locking screw; 41a-screw head; 41b-rod section; 42-clamping block; 43-elastic part; 50-driving part; 61, 62-setting screws; 150-electric adjustment system; 151-height detection system; 152-driving board; 153-computer; 154-USB plug interface; L1-first side; L2-second side; L3-third side; L4-median perpendicular; K1-matching hole; K2-mounting hole; K3-hexagonal socket hole; K4-accommodating hole; Z-thickness direction. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be an element centered therein. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be an element centered therein. When an element is considered to be "set on" another element, it may be directly set on the other element or there may also be an element centered therein. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0033] Some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.

[0034] Example

[0035] See also Figure 1This embodiment provides a gene sequencing system 100, which includes a carrier assembly 110, a transport assembly 120, and an optical imaging assembly 130. The gene sequencing system 100 can be an excitation light sequencing system.

[0036] The carrier assembly 110 is used to carry a test object 200, such as a sequencing chip 210. The optical imaging assembly 130 is used to perform optical imaging on the sequencing chip 210 supported on the carrier assembly 110. Based on the optical imaging results, the corresponding base types can be identified, thereby achieving gene sequencing. The transport assembly 120 is used to transport the sequencing chip 210 to be tested to the carrier assembly 110, or to remove the sequencing chip 210 from the carrier assembly 110 after testing is completed.

[0037] In this embodiment, the gene sequencing system 100 may further include a slide component (not shown in the figure). The carrier assembly 110 may be mounted on the slide component to move driven by the slide component.

[0038] See also Figure 2 and Figure 3 The carrier assembly 110 of this embodiment includes a base plate 10 , a carrying plate 20 and a support assembly 30 .

[0039] When the gene sequencing system 100 is configured with a slide component, the base plate 10 can be used to connect the slide component.

[0040] The carrier plate 20 is supported on the base plate 10 via a support assembly 30 . A surface of the carrier plate 20 away from the base plate 10 is used to support and position the sequencing chip 210 .

[0041] The support assembly 30 can support the carrier plate 20, and the support assembly 30 in this embodiment is an adjustable structure, which can adjust the carrier plate 20 to ensure that the sequencing chip 210 carried on the carrier plate 20 is perpendicular to the optical imaging assembly 130 to improve the precision and accuracy of sequencing.

[0042] Continue to see Figure 2-Figure 4 In this embodiment, the support assembly 30 includes a fixed support structure 30a, two adjustable support structures 30b, and an elastic support structure 30c. The fixed support structure 30a and the two adjustable support structures 30b are arranged in a triangular shape. The fixed support structure 30a is supported between the base plate 10 and the load-bearing plate 20. Each adjustable support structure 30b is supported between the base plate 10 and the load-bearing plate 20 and can adjust the height of the load-bearing plate 20 relative to the base plate 10. At different adjustable support structures 30b, the height of the load-bearing plate 20 relative to the base plate 10 can be adjusted by the corresponding adjustable support structure 30b to facilitate leveling of the load-bearing plate 20.

[0043] The elastic supporting structure 30 c is located outside the triangle range formed by the fixed supporting structure 30 a and the two adjustable supporting structures 30 b and is elastically supported between the bottom plate 10 and the carrying plate 20 .

[0044] Main references Figure 4 In this embodiment, the line connecting the two adjustable support structures 30b is defined as the first side L1, the line connecting the fixed support structure 30a and one of the adjustable support structures 30b is defined as the second side L2, and the line connecting the fixed support structure 30a and the other adjustable support structure 30b is defined as the third side L3. The first side L1, the second side L2, and the third side L3 form an isosceles triangle, wherein the second side L2 and the third side L3 are equal. In some embodiments, the length of the first side L1 is also equal to that of the second side L2 and the third side L3. In this case, the first side L1, the second side L2, and the third side L3 form an equilateral triangle to further ensure the force stability of the three-point support formed by the fixed support structure 30a and the two adjustable support structures 30b. There are two elastic support structures 30c, and the two elastic support structures 30c are symmetrically distributed on both sides of the perpendicular midline L4 of the first side L1. Optionally, the base plate 10 is rectangular, and the rectangle mentioned here includes a square. Two adjustable support structures 30b and two elastic support structures 30c are distributed at the four corners of the base plate 10, and the fixed support structure 30a is located between the two elastic support structures 30c.

[0045] Optionally, the elastic support structure 30c is a spring, such as a wave spring. One end of the elastic support structure 30c abuts against the surface of the base plate 10 facing the carrier plate 20, and the other end abuts against the surface of the carrier plate 20 facing the base plate 10, so as to apply an elastic support force to the carrier plate 20 away from the base plate 10. In order to improve the position stability of the elastic support structure 30c, matching holes K1 (which can be seen in FIG. 1 ) can be provided on the opposing surfaces of the base plate 10 and the carrier plate 20. Figure 3 ), which are used to respectively cooperate with the two ends of the elastic supporting structure 30c.

[0046] The carrier assembly 110 in the embodiment further comprises elastic support structures 30c outside the triangular region S1 (i.e. the triangular region enclosed by the first side L1, the second side L2 and the third side L3) enclosed by the fixed support structure 30a and the two adjustable support structures 30b, which increases the region where the carrier plate 20 can provide stable support. Specifically, each elastic support structure 30c encloses a triangular region S2 outside the triangular region S1 with the fixed support structure 30a and one of the adjustable support structures 30b. Due to the presence of the elastic support structure 30c, the force balance of the carrier assembly 110 in the triangular region S2 is also good, which can improve the stable support. Therefore, the carrier assembly 110 in the embodiment can provide a larger stable support region. In this way, the carrier assembly 110 in the embodiment is particularly suitable for supporting a sequencing chip 210 with a larger area, which can ensure that the sequencing chip 210 with a larger area can be stably and reliably supported in all or most of the region during detection, thereby improving the sequencing accuracy.

[0047] In the embodiment, the carrier assembly 110 further comprises a pressing assembly 40. The pressing assembly 40 elastically presses the carrier plate 20 towards the base plate 10. The number and distribution position of the pressing assembly 40 can be set as needed.

[0048] Referring to Figure 4 In the embodiment, the pressing assembly 40 has three pressing assemblies 40, which are distributed in a triangular shape. One of the pressing assemblies 40 is located near the fixed support structure 30a, and the other two pressing assemblies 40 are located near the two adjustable support structures 30b. The pressing assembly 40 is arranged near the fixed support structure 30a or the adjustable support structure 30b, which facilitates the fixed support structure 30a or the adjustable support structure 30b to maintain a pressed state, thereby ensuring the reliability of the support position of the carrier plate 20.

[0049] In the embodiment, the five-point support structure formed by the fixed support structure 30a, the two adjustable support structures 30b and the two elastic support structures 30c, combined with the pressing of the pressing assembly 40, enables the carrier assembly 110 to withstand the external force applied by the transfer assembly 120 when repeatedly picking and placing the sequencing chip 210 during long-term (e.g. more than 1 year) use, and ensures that the flatness of the carrier assembly 110 is stably maintained below 10 µm, thereby ensuring the detection accuracy and accuracy.

[0050] Referring again to Figure 2-Figure 4 In the embodiment, the carrier assembly 110 further comprises two driving members 50. The two driving members 50 are respectively matched with the two adjustable support structures 30b, and are used to adjust the distance between the base plate 10 and the carrier plate 20 through the adjustable support structures 30b. Optionally, the driving member 50 is a micro driving motor.

[0051] The driver 50 can be controlled to achieve automatic adjustment to improve the adjustment efficiency. The driver 50 can also be combined with the distance measurement system of the optical imaging component 130 of the gene sequencing system 100 to achieve an automatic debugging function.

[0052] In other embodiments, the driving member 50 may not be provided, or the driving member 50 may be removed, and the adjustment may be achieved by manually adjusting the adjustable support structure 30b.

[0053] The stage assembly 110 of this embodiment can be configured to have a structure that is compatible with both automatic adjustment and manual adjustment modes.

[0054] The following combination Figure 5 and Figure 6 The adjustable supporting structure 30b of this embodiment is exemplarily introduced.

[0055] See also Figure 5 and Figure 6 In this embodiment, the adjustable support structure 30b includes a first support 31, a first support column 32 and a support sleeve 33.

[0056] The first support 31 is fixedly connected to the bottom plate 10. For example, the first support 31 is fixedly connected to the bottom plate 10 by interference fit.

[0057] The support sleeve 33 is fixed to the bearing plate 20, and the first pillar 32 is movably connected to the support sleeve 33 and supported on the first support 31. The first pillar 32 is configured to be movable relative to the support sleeve 33 under the action of an external force, so that the support sleeve 33 is close to or away from the first support 31. Optionally, the bearing plate 20 is provided with a mounting hole K2, and the support sleeve 33 is fixedly installed in the mounting hole K2. The first pillar 32 is threadedly connected to the support sleeve 33, and when the first pillar 32 is rotated by an external force, the first pillar 32 can make the support sleeve 33 close to or away from the first support 31, thereby making the bearing plate 20 close to or away from the base plate 10. The support sleeve 33 can be fixedly arranged in the mounting hole K2 by an interference fit, or it can be locked and fixed in the mounting hole K2 of the bearing plate 20 by a set screw 61.

[0058] Optionally, the mounting hole K2 passes through the carrier plate 20 along the thickness direction Z, so that the first support 32 can extend from the carrier plate 20 and be supported on the first support 31. Furthermore, when a driver 50 is provided, the driver 50 can be engaged with the end of the mounting hole K2 away from the base plate 10 via another set screw 62. The driver 50 can extend into the mounting hole K2 to be in transmission connection with the first support 32, thereby driving the first support 32 to rotate for adjustment.

[0059] The first support 32 can be provided with a hexagonal socket K3 for mating with the driver 50 to transmit torque. Of course, after the driver 50 is removed, the first support 32 can also be manually adjusted using an hexagonal socket wrench. In other embodiments, the hexagonal socket K3 can be replaced with a hole or protrusion of another shape, as long as it can be used with the driver 50 or a manual adjustment tool (such as a wrench) to adjust the first support 32.

[0060] The following combination Figure 7 The fixed support structure 30 a of this embodiment is exemplarily introduced.

[0061] See also Figure 7 In this embodiment, the fixed support structure 30a includes a second support 34 and a second pillar 35. The second support 34 is fixedly connected to the base plate 10, and the second pillar 35 is fixedly connected to the bearing plate 20 and supported by the second support 34.

[0062] The second support 34 can be fixed to the base plate 10 by interference fit, the second pillar 35 can be fixed to the support plate 20 by interference fit, and the portion of the second pillar 35 extending out of the support plate 20 is supported by the second support 34 .

[0063] In this embodiment, optionally, the adjustable support structure 30b adopts a line-surface contact form of support, and the fixed support structure 30a adopts a point-surface contact form of support. For example, in the adjustable support structure 30b, the first support 31 provides a conical groove surface, and the first pillar 32 is provided with a ball head, and the ball head and the conical groove surface are tangent to a circular tangent to form a line-surface contact support. In the fixed support structure 30a, the second support 34 provides a support surface, and the second pillar 35 is provided with a ball head, and the ball head and the support surface are tangent to one point to form a point-surface contact support. This combination of contact support forms is conducive to improving the flatness of the carrier assembly 110, and under external vibration interference, the support plate 20 is not prone to position drift, thereby ensuring the stability of the carrier assembly 110. Of course, in order to delay the wear of the contact position, the contact position material can adopt a material with a higher hardness.

[0064] In other embodiments, the first support 31 may also provide a V-grooved surface, and the first support 32 may be provided with a ball head, thereby forming a double-tangent point support between the ball head and the V-grooved surface. Furthermore, the contact support forms of the two adjustable support structures 30b may be the same or different, and are not limited here.

[0065] The following is combined with Figure 7 or Figure 8 The pressing assembly 40 of this embodiment is introduced as an example.

[0066] See also Figure 7 or Figure 8In this embodiment, the pressing assembly 40 includes a locking screw 41 , a pressing block 42 and an elastic member 43 .

[0067] The locking screw 41 includes a connected screw head 41a and a rod segment 41b. The rod segment 41b passes through the support plate 20 and is threadedly connected to the base plate 10. The clamping block 42 and elastic member 43 are respectively sleeved on the outer periphery of the rod segment 41b. The elastic member 43 is supported on the support plate 20 at one end and elastically supports the clamping block 42 on the screw head 41a at the other end. Optionally, a receiving hole K4 is recessed on the side of the support plate 20 facing away from the base plate 10. The clamping block 42, elastic member 43, screw head 41a, and part of the rod segment 41b are accommodated in the receiving hole K4 to prevent the clamping assembly 40 from protruding from the support plate 20.

[0068] In this embodiment, the elastic member 43 may be a spring, a spring sheet, an elastic pad or other components capable of providing elastic force, which is not limited here.

[0069] The clamping assembly 40 can provide a force to ensure the static support stability of the stage assembly 110. Moreover, after the locking screw 41 is tightened, the basic spacing between the base plate 10 and the supporting plate 20 is determined. At this time, the supporting plate 20 can be leveled by adjusting the two adjustable support structures 30b.

[0070] It should be noted that the above-mentioned contact support forms are only examples, and the contact support forms of the fixed support structure 30a and the adjustable support structure 30b can also adopt any other suitable point, line or surface contact support forms, which are not limited here.

[0071] See also Figure 9 , the stage assembly 110 of this embodiment can also form an electric adjustment system 150.

[0072] The electric adjustment system 150 includes a height detection system 151 , two driving components 50 , a driving board 152 , a computer 153 and a USB interface 154 .

[0073] The driver board 152 is electrically connected to the computer 153 via a USB port 154 and is used to control the operation of the two driver components 50. The driver board 152 and the USB port 154 can be integrated to enhance portability and assembly. For ease of description, one of the two driver components 50 is referred to as the first driver component 50a, and the other as the second driver component 50b.

[0074] Height detection system 151 is used to detect a first height Ha, a second height Hb, and a third height H0 of the carrier plate 20. The first height Ha and the second height Hb are the heights of the carrier plate 20 from the base plate 10 at the two adjustable support structures 30b, respectively. The third height H0 is the height of the carrier plate 20 from the base plate 10 at the fixed support structure 30a. The first driving member 50a can adjust the first height Ha, and the second driving member 50b can adjust the second height Hb. The third height H0 is defined by the fixed support structure 30a and can be set to a fixed value.

[0075] The height detection system 151 is communicatively connected to the computer 153 and is used to transmit information of the detected first height Ha, second height Hb and third height H0 to the computer 153. The computer 153 can calculate the flatness of the carrier assembly 110 based on the first height Ha, second height Hb and third height H0, and control the two driving members 50 to adjust the first height Ha and the second height Hb in an appropriate manner accordingly until the flatness of the carrier assembly 110 meets the requirements.

[0076] Figure 10 Shown Figure 9 The electric adjustment system 150 is based on the principle of automatic leveling.

[0077] See also Figure 10 , the automatic leveling process includes the following steps:

[0078] Step 1: Detect the initial values ​​of the first height Ha, the second height Hb and the third height H0. At this time, the state of the plane P1 to be leveled is shown in FIG. Figure 11 Part (a) of

[0079] Step 2: Adjust the first height Ha or the second height Hb separately so that the first height Ha is equal to the second height Hb. At this time, the state of the plane P1 to be leveled is shown in FIG. Figure 11 Part (b) of the figure shows that the angle D1 between plane P1 and the reference plane is calculated as D1 = |Hb-Ha| / 2 / Pb*360, where Pb is the pitch of the threads of the first and second struts 32 and 35. If Hb = Ha cannot be achieved in a single operation, it is necessary to continue the iteration process until |Hb-Ha| < 1µm, at which point Hb = Ha is considered achieved. Due to the backlash of the precision adjustment thread pair, the direction of thread rotation and the overall force direction of the thread pair must be considered in the precision adjustment design, and a callback is required after overshoot.

[0080] Step three, after the adjustment in step two is completed, adjust the first height Ha and the second height Hb synchronously, manually ensure or set the motor to the same angle, and rotate synchronously. At this time, considering that the system is in a micron-level balancing system, the first height H0 may also drift upward or downward, so the binary method can be used to find the optimal plane position during the adjustment process; the calculation formula for the adjustment angle D2 is: D2=|Ha-H0| / 2 / Pb*360. Similarly, if a single adjustment cannot meet |Ha-H0|<2µm, multiple iterations are required until the overall flatness is within the range of 5µm, and the adjustment of the plane P1 to be leveled is considered complete. The status of the plane P1 to be leveled after adjustment in step three can be seen Figure 11 Part (c) of . By comparison, we can see that Figure 11 The flatness of part (c) is higher than Figure 11 Flatness of part (b).

[0081] In summary, compared to the complex automatic leveling systems employed in related technologies, the five-point support structure of this embodiment utilizes purely mechanical adjustable support, achieving stable and reliable leveling without the need for software algorithms or control systems, resulting in lower costs. Especially under external pressure or vibration, the overall flatness stability of stage assembly 110 of this embodiment remains within 10µm, ensuring the long-term stability of the optical system.

[0082] Furthermore, the five-point support structure of the carrier assembly 110 of this embodiment can provide a larger area of ​​stable support, ensuring that the flatness of high-throughput large chips (such as the sequencing chip 210 with a size of 70*70mm) is less than 10µm during the sequencing process. At the same time, during long-term use, the system can withstand the external force exerted by the transport assembly 120 when repeatedly taking and placing the sequencing chip 210, ensuring that the system can stably maintain a flatness of less than 10µm.

[0083] The above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent replacements of the technical solutions of the present application should not depart from the spirit and scope of the technical solutions of the present application.

Claims

1. A stage assembly, characterized in that: include: base plate; A carrying plate, used for carrying the test piece; as well as, A support assembly comprising a fixed support structure, two adjustable support structures, and an elastic support structure, wherein the fixed support structure and the two adjustable support structures are arranged in a triangular shape; the fixed support structure is supported between the base plate and the load-bearing plate, and each of the adjustable support structures is supported between the base plate and the load-bearing plate and can adjust the height of the load-bearing plate relative to the base plate; The elastic supporting structure is located outside the triangular range formed by the fixed supporting structure and the two adjustable supporting structures, and is elastically supported between the bottom plate and the carrying plate.

2. The stage assembly according to claim 1, wherein: The connection line between the two adjustable support structures is the first side, the connection line between the fixed support structure and one of the adjustable support structures is the second side, and the connection line between the fixed support structure and the other adjustable support structure is the third side; The first side, the second side and the third side form an isosceles triangle, and the second side and the third side are equal in length; There are two elastic support structures, and the two elastic support structures are symmetrically distributed on both sides of the perpendicular midline of the first side.

3. The stage assembly according to claim 2, wherein: The bottom plate is rectangular; The two adjustable support structures and the two elastic support structures are distributed at the four corners of the bottom plate, and the fixed support structure is located between the two elastic support structures.

4. The stage assembly according to claim 1, wherein: The adjustable support structure includes a first support, a first support column and a support sleeve; The first support is fixedly connected to the base plate, the support sleeve is fixed to the bearing plate, and the first pillar is movably connected to the support sleeve and supported by the first support; The first pillar is configured to be movable relative to the support sleeve under the action of an external force, so that the support sleeve moves closer to or away from the first support.

5. The stage assembly according to claim 4, wherein: The bearing plate is provided with a mounting hole, and the support sleeve is fixedly mounted in the mounting hole; The first pillar is threadedly connected to the support sleeve and can move the support sleeve closer to or away from the first support.

6. The stage assembly according to claim 1, wherein: The fixed support structure includes a second support and a second support column; The second support is fixedly connected to the base plate, and the second pillar is fixedly connected to the bearing plate and supported by the second support.

7. The stage assembly according to claim 1, wherein: The carrier assembly further includes a pressing assembly; The clamping assembly includes a locking screw, a clamping block and an elastic member; the locking screw includes a screw head and a rod section connected to each other; The rod segment passes through the bearing plate and is threadedly connected to the bottom plate; The pressing block and the elastic member are respectively sleeved on the outer circumference of the rod segment, and one end of the elastic member is supported on the bearing plate, and the other end elastically supports the pressing block on the screw head.

8. The stage assembly according to any one of claims 1 to 7, wherein: The stage assembly further includes two driving members; The two driving members are respectively matched with the two adjustable supporting structures, and are used to adjust the distance between the bottom plate and the carrying plate through the adjustable supporting structures.

9. The stage assembly according to claim 8, wherein: The stage assembly also includes a height detection system and a computer; The height detection system is used to detect a first height, a second height, and a third height of the carrying plate; wherein the first height and the second height are respectively the heights of the carrying plate from the two adjustable support structures to the base plate, and the third height is the height of the carrying plate from the fixed support structure to the base plate; The height detection system is communicatively connected to the computer and is used to transmit information of the detected first height, second height and third height to the computer; The computer is communicatively connected to the driving member, and is used to calculate the flatness of the carrier assembly based on the first height, the second height and the third height, and control the two driving members to adjust the first height and / or the second height according to the flatness until the flatness of the carrier assembly meets the set value.

10. A gene sequencing system, characterized in that: include: The stage assembly according to any one of claims 1 to 9; A transfer assembly is used to transfer the piece to be tested to the carrier assembly and / or to remove the piece to be tested from the carrier assembly.