Sealing device, electronic component, sensor and vehicle

Abstract

The utility model relates to a sealing device, an electronic component, a sensor and a vehicle, the sealing device is at least partially arranged in a chip packaging shell, and the sealing device comprises a sealing piece and a mounting piece; the sealing element is used for sealing at least one part of the chip assembly; the mounting piece is connected with the sealing piece; the mounting member includes: a mounting portion; the mounting part is used for limiting the position of the mounting piece relative to the sealing piece so as to limit the relative position of the sealing piece and the chip assembly. By independently configuring the mounting part, the sealing part is mounted at the to-be-sealed position of the part such as a chip through the mounting part, sealing can be completed before the part is assembled to the formed whole equipment, and compared with a conventional mode of completing sealing in the process of assembling the refined part, the sealing efficiency is greatly improved. The possibility of sealing failure caused by large assembling errors can be reduced, namely the jacking precision between the sealing piece and the part can be improved, and therefore the sealing requirement of the refined part is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sealing structure, in particular to a sealing device, an electronic component, a sensor and a vehicle. BACKGROUND

[0002] At present, sealing rings are generally used to seal the sensing element part of a pressure sensor and other devices. With the refinement of devices, the local sealing requirements of refined devices are increasingly high, and the conventional installation method often cannot meet the sealing requirements. For example, for some pressure sensors used on vehicles, the sealing performance of the sealing position is poor, which may cause air leakage at the sealing position and limit the detection accuracy of the sensor. In response to the refinement of the size of the sealing position, new requirements are put forward for the precise positioning of the sealing. CONTENT OF THE INVENTION

[0003] The present application provides a sealing device, an electronic component, a sensor and a vehicle, which improves the positioning and installation accuracy of the sealing position, at least partially solving the technical problem that conventional sealing cannot meet the sealing performance requirements of refined parts.

[0004] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a sealing device is provided, which is at least partially arranged in a chip package shell, and the sealing device comprises:

[0005] a sealing member for sealing at least a part of a chip assembly;

[0006] a mounting member connected with the sealing member;

[0007] wherein the mounting member has:

[0008] a mounting portion for limiting the position of the mounting member relative to the sealing member, so as to limit the relative position of the sealing member and the chip assembly.

[0009] Optionally, in some embodiments of the present application, the mounting portion defines a positioning space for mounting the sealing member, and at least a part of the sealing member is located in the positioning space.

[0010] Optionally, in some embodiments of the present application, the mounting portion is provided with a mounting groove, and the inner wall of the mounting portion forming the mounting groove defines the positioning space, and the sealing member is at least partially embedded in the mounting groove and in surface contact with the inner wall forming the mounting groove.

[0011] Optionally, in some embodiments of the present application, the mounting member is formed with a through hole, and the through hole communicates with the mounting groove.

[0012] Optionally, in some embodiments of the present application, the sealing member is fixedly connected with the mounting member.

[0013] Optionally, in some embodiments of the present application, the mounting member further has:

[0014] a connecting portion for positioning and mounting the mounting member to the chip assembly.

[0015] Optionally, in some embodiments of the present application, the connecting portion is at least partially combined with the chip assembly when the mounting member is positioned and mounted to the chip assembly.

[0016] Optionally, in some embodiments of the present application, the connecting portion is at least partially interlocked with the chip assembly when the mounting member is positioned and mounted to the chip assembly.

[0017] Optionally, in some embodiments of the present application, the connecting portion comprises:

[0018] a connecting post protruding from the surface of the mounting portion.

[0019] According to a second aspect of the present application, an electronic component is provided, comprising:

[0020] a chip body;

[0021] a sealing member for sealing at least a portion of the chip body;

[0022] a mounting member connected with the sealing member;

[0023] wherein the mounting member has:

[0024] a mounting portion for limiting the position of the mounting member relative to the sealing member, so as to limit the relative position of the sealing member and the chip body.

[0025] Optionally, in some embodiments of the present application, the mounting portion defines a positioning space for mounting the sealing member, and at least a portion of the sealing member is located in the positioning space.

[0026] Optionally, in some embodiments of the present application, the mounting portion is provided with a mounting groove, and the inner wall of the mounting portion forming the mounting groove defines the positioning space, and at least a portion of the sealing member is embedded in the mounting groove and in surface contact with the inner wall forming the mounting groove.

[0027] Optionally, in some embodiments of the present application, the mounting member is provided with a through hole, and the through hole is in communication with the mounting groove.

[0028] Optionally, in some embodiments of the present application, the electronic component further comprises:

[0029] a circuit board, fixedly connected with the chip body;

[0030] The mounting member further has:

[0031] a connecting portion for positioning and mounting the mounting member to the circuit board;

[0032] When the mounting member is positioned and mounted to the circuit board, the connecting portion is at least partially combined with the circuit board.

[0033] Optionally, in some embodiments of the present application, the connecting portion is at least partially interfitting with the circuit board.

[0034] Optionally, in some embodiments of the present application, one of the connecting portion and the chip body is provided with:

[0035] a connecting post protruding from the mounting portion / the surface of the circuit board;

[0036] wherein the other of the connecting portion and the circuit board is provided with a through hole; the connecting post at least partially passes through the through hole to combine the connecting portion and the circuit board.

[0037] Optionally, in some embodiments of the present application, a plurality of connecting posts / through holes are provided on the connecting portion.

[0038] According to a third aspect of the present application, a sensor is provided, comprising the electronic component as described above.

[0039] Optionally, in some embodiments of the present application, the sensor further comprises:

[0040] a chip package shell formed with a receiving cavity for accommodating the electronic component;

[0041] wherein the electronic component is arranged in the receiving cavity.

[0042] Optionally, in some embodiments of the present application, the mounting member of the electronic component further comprises:

[0043] an outer sealing member in contact with the inner wall of the chip package shell forming the receiving cavity to form a seal for the receiving cavity.

[0044] Optionally, in some embodiments of the present application, the chip package shell is provided with an air hole communicating with the receiving cavity; the outer sealing member is provided with an abutting surface; the inner wall of the chip package shell forming the receiving cavity abuts against the abutting surface at a position abutting against the inner wall forming the air hole.

[0045] Optionally, in some embodiments of the present application, the outer sealing member surface is provided with a groove; and a portion of the outer sealing member forming the groove is embedded in the air hole.

[0046] According to a fourth aspect of the present application, a vehicle is provided, which comprises the sealing device as described above, or comprises the electronic component as described above, or comprises the sensor as described above.

[0047] In the sealing device of the embodiments of the present application, the mounting member is independently configured, and the sealing member is mounted to the to-be-sealed position of the component such as a chip by the mounting portion, so that the sealing can be completed before the component is assembled to the formed overall device. Compared with the conventional sealing method which is completed during the assembly of the fine component, the possibility of sealing failure caused by larger assembly error can be reduced, that is, the alignment between the sealing member and the component can be improved, so as to adapt to the sealing requirement of the fine component.

[0048] Other features and advantages of the present application will be described in detail in the following specific implementation part. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0050] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0051] Figure 1 is a schematic diagram of the overall structure of an electronic component provided in an exemplary embodiment of the present application;

[0052] Figure 2 is a schematic diagram of the overall structure of a sealing device provided in an exemplary embodiment of the present application;

[0053] Figure 3 is a sectional view of the sealing device provided in an exemplary embodiment of the present application;

[0054] Figure 4 is a schematic diagram of the structure of the sealing device connected to a chip assembly provided in an exemplary embodiment of the present application;

[0055] Figure 5 is Figure 1 a schematic diagram of the structure of the chip assembly in

[0056] Figure 6is a schematic view of the overall structure of a sensor provided in the exemplary embodiments of the present application;

[0057] Figure 7 is a sectional view of the sensor provided in the exemplary embodiments of the present application;

[0058] Figure 8 is Figure 7 is a partial enlarged view of the vicinity of the outer seal;

[0059] Figure 9 is a schematic view of the overall structure of a vehicle provided in the exemplary embodiments of the present application.

[0060] BRIEF DESCRIPTION OF DRAWINGS

[0061] 1, vehicle;

[0062] 10, sensor; 11, chip package housing; 11a, accommodating cavity; 11b, air hole;

[0063] 100, sealing device;

[0064] 110, seal;

[0065] 120, mounting member; 121, mounting portion; 121a, positioning space; 121b, mounting groove; 121c, through hole; 122, connecting portion; 123, connecting column; 124, outer seal; 124a, abutting surface; 124b, slotted groove;

[0066] 200, chip assembly; 210, chip body; 220, circuit board; 221, through hole;

[0067] 300, electronic element. DETAILED DESCRIPTION

[0068] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative labor fall within the protection scope of the present application.

[0069] In the related art, for an electronic gas pressure sensor, a chip for realizing pressure sensing inside is often integrated on a circuit board, or the circuit board and the chip are designed in an integrated manner. When gas is blown to a sensing portion on the chip, the chip sends an electric signal containing pressure information of the gas blown to the sensing portion to the circuit board, and the circuit board obtains the gas pressure of the gas by calculation and processing. The sensing portion outside is often sealed by a sealing ring to avoid inaccurate detection of the gas pressure by the sensing portion due to gas leakage.

[0070] However, the sealing ring for sealing the sensing part on the air pressure sensor is often fixed or integrally formed on the housing of the sensor, and during the assembly of the chip and the circuit board assembly into the housing, the positioning assembly of the sealing ring, the chip and the circuit board is realized. In this assembly mode, the positioning accuracy between the chip and the circuit board assembly and the sealing ring depends on the assembly accuracy of the housing and the sealing ring, but the housing is often an injection molding part, etc., which often does not have high dimensional accuracy, which limits the assembly accuracy between the chip and the circuit board assembly and the sealing ring, especially under the current situation of gradually miniaturizing the chip size, this sealing form often makes the sealing effect of the sealing ring not good. For the sealing parts of other precision parts, there is also a similar problem of poor sealing effect as the electronic air pressure sensor.

[0071] According to the first aspect of the present application, referring to Figures 1 to 5 The sealing device 100 is provided at least partially in the chip package housing 11, and the sealing device 100 comprises a sealing member 110 and a mounting member 120.

[0072] The sealing member 110 is used to seal at least part of the chip assembly 200. As an example of a specific scheme, the sealing member 110 is a sealing ring made of rubber or the like. It completes the sealing by surrounding the sealing part of the component. For example, when the component is an electronic air pressure sensor, the sealing member 110 can seal the chip by fitting the chip of the sensor 10 and surrounding the periphery of the sensing part of the chip.

[0073] The mounting member 120 is connected with the sealing member 110, so that the mounting member 120 can be used to mount the sealing member 110. The mounting member 120 has a mounting part 121. The mounting part 121 is used to limit the position of the mounting member 120 relative to the sealing member 110, so as to limit the relative position of the sealing member 110 and the chip assembly 200.

[0074] With the above scheme, by independently configuring the mounting member 120 and mounting the sealing member 110 to the sealing position of the component such as the chip by the mounting part 121, the sealing can be completed before the assembly of the overall device formed by assembling these components. Compared with the conventional sealing method which is completed during the assembly of these fine components, the possibility of sealing failure caused by larger assembly error can be reduced, that is, the assembly accuracy between the sealing member 110 and the component can be improved, so as to adapt to the sealing requirements of fine components.

[0075] It should be noted that although most of the contents in the present application are to describe the sealing device 100 providing sealing function to a chip assembly 200, those skilled in the art can still apply the sealing device 100 provided by the present application to other devices according to actual needs, i.e. the cooperation mode of the sealing device 100 and the chip assembly 200 should be regarded as an exemplary description of the actual application of the sealing device 100, and not the only limitation of the use scenario of the sealing device 100. The specific cooperation form of using the sealing device 100 to seal other devices can be flexibly configured according to the actual situation of the device, and the present application does not repeat it.

[0076] In some embodiments, referring to Figure 2 and Figure 3 , the installation part 121 defines a positioning space 121a for installing the sealing member 110, and at least part of the sealing member 110 is located in the positioning space 121a, which provides an installation position for the sealing member 110, so that the sealing member 110 can be installed on the installation part 121, and before the chip assembly 200 is assembled to form a device such as a sensor 10, the sealing member 110 can be positioned and installed on the chip assembly 200 by the installation member 120.

[0077] As a specific scheme, referring to Figure 3 , the installation part 121 is provided with an installation groove 121b; the inner wall of the installation part 121 forming the installation groove 121b defines the positioning space 121a, and the sealing member 110 is at least partially embedded in the installation groove 121b and in surface contact with the inner wall forming the installation groove 121b. In this way, the sealing member 110 is limited by the inner wall of the installation groove 121b to achieve the fixation of the sealing member 110 on the installation member 120. This installation method can fully utilize the inner wall of the installation groove 121b to position the sealing member 110, and for the specific scheme of using rubber or other materials with plastic deformation ability to make the sealing member 110, embedding the sealing member 110 in the installation groove is conducive to limiting the deformation of the sealing member 110 due to thermal expansion and contraction, thereby improving the structural stability of the sealing member 110.

[0078] As a specific scheme, referring to Figure 3As shown, the mounting member 120 is formed with a through hole 121c which communicates with the mounting groove 121b. This scheme is suitable for the specific scenario where the part of the chip assembly 200 sealed by the sealing member 110 needs to be in contact with the outside for mechanical, fluid flow, etc. to make the chip assembly 200 as part of the sensor to realize the specific function of the sensor. More specifically, for example, the chip assembly 200 can be part of a barometric pressure sensor, at this time the part of the chip assembly 200 sealed by the sealing member 110 can be in communication with the outside through the through hole 121c, so that the outside gas can flow to the chip assembly 200 to realize the detection of barometric pressure by the chip assembly 200. Of course, the sealing member 110 is also penetrated by a channel corresponding to the through hole 121c, so that the gas flow can pass through the sealing member 110 to the chip assembly 200.

[0079] In some embodiments, the sealing member 110 is fixedly connected with the mounting member 120. In a more specific scheme, the sealing member 110 is, for example, interference fitted with the inner wall forming the mounting groove 121b, or fixed at the positioning space 121a by gluing or the like.

[0080] In some embodiments, referring to Figure 2 and Figure 4 As shown, the mounting member 120 further has a connecting portion 122. The connecting portion 122 is used to positionally mount the mounting member 120 to the chip assembly 200. That is, by using the above scheme, the sealing member 110 can be directly positioned and mounted to the chip assembly 200 by the mounting member 120, compared with, for example, fixing the mounting member 120 to other parts of the device in which the chip assembly 200 is finally integrated, and then using these parts to positionally cooperate with the chip assembly 200, which reduces assembly errors and thus ensures the assembly precision of the sealing member 110 and the chip assembly 200.

[0081] When the mounting member 120 is positioned and mounted to the chip assembly 200, the connecting portion 122 is at least partially combined with the chip assembly 200, that is, the connecting portion 122 and the chip assembly 200 form a mechanical connection. In a more specific scheme, when the mounting member 120 is positioned and mounted to the chip assembly 200, the connecting portion 122 is at least partially embedded with the chip assembly 200. So that the mounting member 120 can be fixed on the chip assembly 200.

[0082] As a specific scheme, referring to Figure 1 , Figure 4 and Figure 5As shown, the chip assembly 200 comprises a chip body 210 and a circuit board 220. The chip body 210 has a portion to be sealed by the sealing member 110, i.e. the sealing member 110 is used to seal at least a portion of the chip body 210. The mounting portion 121 is used to limit the position of the mounting member 120 relative to the sealing member 110, so as to limit the relative position of the sealing member 110 and the chip body 210, and to achieve the mounting of the chip body 210 and the sealing member 110 by the mounting member 120.

[0083] The circuit board 220 is used to mount the chip body 210. In practical applications, the circuit board 220 and the chip body 210 are integrally formed. Alternatively, the circuit board 220 and the chip body 210 are fixedly connected, e.g. the chip body 210 is provided with pins which are fixed on the circuit board 220 by soldering.

[0084] In some embodiments, referring to Figure 4 As shown, the connecting portion 122 is used to positionally mount the mounting member 120 to the circuit board 220. When the mounting member 120 is positionally mounted to the circuit board 220, the connecting portion 122 is at least partially combined with the circuit board 220. Considering that the size of the circuit board 220 is usually larger than that of the chip body 210, the combination of the connecting portion 122 and the circuit board 220 facilitates the assembly of the chip assembly 200 and the sealing device 100, thereby reducing the difficulty of assembly.

[0085] In specific solutions, the connecting portion 122 is at least partially embedded in the circuit board 220, so as to achieve the fixed connection of the chip assembly 200 and the mounting member 120.

[0086] As an example of the specific implementation of the combination of the sealing device 100 and the chip assembly 200, referring to Figure 4 and Figure 5 As shown, one of the connecting portion 122 and the chip body 210 is provided with a connecting column 123. The connecting column 123 is protrudingly arranged on the mounting portion 121, or the connecting column 123 is protrudingly arranged on the surface of the circuit board 220. Correspondingly, the other of the connecting portion 122 and the circuit board 220 is provided with a through hole 221. The connecting column 123 is at least partially inserted through the through hole 221, so as to combine the connecting portion 122 and the circuit board 220. The drawings of the present application show the implementation in which the connecting column 123 is protrudingly arranged on the surface of the mounting portion 121, and the through hole 221 is formed on the circuit board 220. By the cooperation of the connecting column 123 and the through hole 221, the mounting member 120 and the chip assembly 200 are fixedly connected by being embedded in each other.

[0087] In some embodiments, during the embedding of the connecting posts 123 into the through holes 221, an interference fit is formed between the walls of the through holes 221 and the connecting posts 123, which prevents the connecting posts 123 from being detached from the through holes 221, thereby achieving the purpose of fixing the mounting member 120, and further enabling the sealing member 110 to be stably positioned and mounted onto the chip assembly 200.

[0088] In more specific embodiments, the connecting portion 122 is provided with a plurality of connecting posts 123 / through holes 221, and correspondingly, the circuit board 220 is provided with a plurality of through holes 221 corresponding to the plurality of connecting posts 123, or is provided with a plurality of connecting posts 123 corresponding to the plurality of through holes 221, so as to increase the number of connecting portions between the mounting member 120 and the circuit board 220, and to improve the connecting strength.

[0089] According to a second aspect of the present application, referring to Figure 1 and Figure 4 , an electronic element 300 is provided, which at least includes the above-mentioned chip assembly 200 and the sealing device 100. The electronic element 300 has all the beneficial effects of the above-mentioned sealing device 100, which will not be repeated here.

[0090] According to a third aspect of the present application, referring to Figures 6 to 8 , a sensor 10 is provided, which includes the above-mentioned electronic element 300. The sensor 10 has all the beneficial effects of the above-mentioned electronic element 300, which will not be repeated here.

[0091] In some embodiments, referring to Figure 6 , the sensor 10 further includes a chip package housing 11. The chip package housing 11 is formed with a receiving cavity 11a for accommodating the electronic element 300, and the electronic element 300 is arranged in the receiving cavity 11a to provide protection for the electronic element 300 by the chip package housing 11.

[0092] In some embodiments, the mounting member 120 of the electronic element 300 further includes an outer sealing member 124. The outer sealing member 124 is in contact with the inner wall of the receiving cavity 11a formed by the chip package housing 11 to form a seal for the receiving cavity 11a. In specific embodiments, in order to realize the connection between the chip body 210 of the electronic element 300 and the outside in terms of mechanics and fluid flow, a communication cavity is provided on the chip package housing 11, which communicates the receiving cavity 11a with the outside of the chip package housing 11. The outer sealing member 124 is at least partially embedded in the communication cavity to provide a sealing effect for the receiving cavity 11a by the outer sealing member 124. The outer sealing member 124 may, for example, be a sealing ring made of rubber or the like.

[0093] As an exemplary illustration of a specific embodiment, the sensor 10 may, for example, be a barometric pressure sensor, and correspondingly, referring toFigure 7 and Figure 8 As shown in FIG. 11, the chip package shell 11 is provided with an air hole 11b in communication with the accommodating cavity 11a, which corresponds to the communication cavity mentioned above. The outer seal 124 is provided with an abutting surface 124a, and the inner wall of the chip package shell 11 forming the accommodating cavity 11a abuts against the abutting surface 124a at the position where the inner wall abuts to form the air hole 11b, so that the abutting surface 124a is in contact with the wall surface of the chip package shell 11 to form a seal.

[0094] In some embodiments, the outer seal 124 is provided with a slot 124b, and the part of the outer seal 124 forming the slot 124b is embedded in the air hole 11b. The slot 124b is provided to facilitate plastic deformation of the outer seal 124, so as to embed the outer seal 124 into the air hole 11b.

[0095] According to a fourth aspect of the present application, referring to Figure 9 As shown in FIG. 11, the chip package shell 11 is provided with an air hole 11b in communication with the accommodating cavity 11a, which corresponds to the communication cavity mentioned above. The outer seal 124 is provided with an abutting surface 124a, and the inner wall of the chip package shell 11 forming the accommodating cavity 11a abuts against the abutting surface 124a at the position where the inner wall abuts to form the air hole 11b, so that the abutting surface 124a is in contact with the wall surface of the chip package shell 11 to form a seal.

[0096] The vehicle can be a fuel automobile, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., which is not limited in the present application.

[0097] In the description of the present application, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0098] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0099] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.

[0100] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification made to the above embodiment according to the technical essence of the present application, without departing from the technical solution of the present application, still falls within the scope of the technical solution of the present application.

Claims

1. A sealing device, at least partially disposed within a chip packaging housing, characterized in that: The sealing device comprises: a sealing member for sealing at least a portion of the chip assembly; a mounting member connected to the sealing member; Wherein, the mounting member has: The mounting portion is used to limit the position of the mounting component relative to the sealing component, so as to limit the relative position of the sealing component and the chip assembly.

2. The sealing device according to claim 1, characterized in that The installation portion defines a positioning space for installing the sealing member, and at least a portion of the sealing member is located in the positioning space.

3. The sealing device according to claim 2, characterized in that The mounting portion is provided with a mounting groove; the inner wall of the mounting portion forming the mounting groove defines the positioning space; the sealing member is at least partially embedded in the mounting groove and forms surface contact with the inner wall forming the mounting groove.

4. The sealing device according to claim 3, characterized in that The mounting piece is formed with a through hole, and the through hole is connected to the mounting groove.

5. The sealing device according to claim 1, characterized in that The sealing component is fixedly connected to the mounting component.

6. The sealing device according to any one of claims 1 to 5, characterized in that: The mounting member also has: The connecting portion is used to position and install the mounting member on the chip assembly.

7. The sealing device according to claim 6, characterized in that When the mounting member is positioned and mounted to the chip assembly, the connecting portion is at least partially combined with the chip assembly.

8. The sealing device according to claim 7, characterized in that When the mounting member is positioned and mounted to the chip assembly, at least a portion of the connecting portion is engaged with the chip assembly.

9. The sealing device according to claim 8, characterized in that The connecting portion includes: The connecting column is protrudingly arranged on the surface of the mounting portion.

10. An electronic component, characterized in that: include: Chip body; a sealing member, configured to seal at least a portion of the chip body; a mounting member connected to the sealing member; Wherein, the mounting member has: The mounting portion is used to limit the position of the mounting component relative to the sealing component, so as to limit the relative position of the sealing component and the chip body.

11. The electronic component according to claim 10, wherein: The installation portion defines a positioning space for installing the sealing member, and at least a portion of the sealing member is located in the positioning space.

12. The electronic component according to claim 11, wherein: The mounting portion is provided with a mounting groove; the inner wall of the mounting portion forming the mounting groove defines the positioning space; the sealing member is at least partially embedded in the mounting groove and forms surface contact with the inner wall forming the mounting groove.

13. The electronic component according to claim 12, wherein: The mounting piece is formed with a through hole, and the through hole is connected to the mounting groove.

14. The electronic component according to any one of claims 10 to 13, characterized in that: Also includes: A circuit board, fixedly connected to the chip body; The mounting member also has: A connecting portion, used to position and mount the mounting member on the circuit board; Wherein, when the mounting member is positioned and mounted on the circuit board, the connecting portion is at least partially combined with the circuit board.

15. The electronic component according to claim 14, wherein The connecting portion is at least partially engaged with the circuit board.

16. The electronic component according to claim 15, characterized in that One of the connecting portion and the chip body is provided with: A connecting post protruding from the mounting portion / the circuit board surface; Wherein, the other one of the connecting portion and the circuit board is provided with a through hole; the connecting column at least partially passes through the through hole to combine the connecting portion and the circuit board.

17. The electronic component according to claim 16, wherein: The connecting portion is provided with a plurality of connecting columns / through holes.

18. A sensor, characterized in that: The electronic component comprises the electronic component according to any one of claims 10 to 17.

19. The sensor according to claim 18, characterized in that Also includes: A chip packaging shell is formed with a receiving cavity for receiving the electronic component; Wherein, the electronic component is arranged in the accommodating cavity.

20. The sensor according to claim 19, characterized in that The mounting member of the electronic component further comprises: The outer sealing member contacts the inner wall of the accommodating cavity formed by the chip packaging shell to form a seal for the accommodating cavity.

21. The sensor according to claim 20, characterized in that The chip packaging shell is provided with an air hole communicating with the accommodating cavity; the outer seal is provided with an abutting surface; the inner wall of the chip packaging shell forming the accommodating cavity abuts against the abutting surface at a position where the inner wall forming the air hole is connected.

22. The sensor according to claim 21, characterized in that A groove is provided on the surface of the outer sealing member; and a portion of the outer sealing member forming the groove is embedded in the air hole.

23. A vehicle, characterized in that: The device comprises the sealing device according to any one of claims 1 to 9, or the electronic component according to any one of claims 10 to 17, or the sensor according to any one of claims 18 to 22.

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