Multifunctional packaging test platform

By designing a flip structure for a multi-functional packaging test platform, the problem of low testing efficiency caused by the need for two clamping and flipping of semiconductor substrates was solved, achieving efficient and accurate fixture flipping and positioning, and improving testing efficiency.

CN223461666UActive Publication Date: 2025-10-21SHANDONG COM MICROELECTRONICS CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202422654855.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2025-10-21
Estimated Expiration
2034-10-31

AI Technical Summary

Technical Problem

In the existing technology, packaging devices are mounted on both sides of the semiconductor substrate, which requires two clamping, releasing, and flipping operations, resulting in low testing efficiency.

Method used

A multifunctional packaging and testing platform was designed, which includes a worktable, a support, a fixture, and a flipping structure. By cooperating with the positioning block of the flipping structure and the contact surface, the fixture can be easily flipped and accurately positioned, simplifying the clamping process.

Benefits of technology

It improves the efficiency of semiconductor substrate testing, ensures that the fixture flipping structure is simple and the positioning is accurate, and avoids damage to the substrate during clamping.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223461666U_ABST
    Figure CN223461666U_ABST
Patent Text Reader

Abstract

The utility model relates to the field of semiconductor testing, in particular to a multifunctional packaging testing platform. The multifunctional packaging test platform comprises a workbench; a bracket; the clamp is provided with a first side surface and a second side surface which are opposite; the overturning structure comprises a rotating shaft fixedly connected with the clamp and a sleeve fixedly connected with the support. A major arc groove is formed in the sleeve, and a first abutting face and a second abutting face are formed, wherein the first abutting face and the second abutting face are symmetrically arranged. A positioning block matched with the major arc groove is arranged on the rotating shaft; the positioning block is configured in the mode that when the positioning block abuts against the first abutting face, the second side face faces the workbench, and when the positioning block abuts against the second abutting face, the first side face faces the workbench. According to the multifunctional packaging test platform of the utility model, the semiconductor substrate can be overturned through the overturning clamp, and the basic test efficiency of the semiconductor can be improved; and meanwhile, the overturning structure is simple and practical, and the overturning angle of the clamp can be accurately positioned.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Push-pull force test platform and fixing module thereof

    CN216208117U