Vacuum gate valve mechanism of sputter coating machine

Abstract

The utility model provides a vacuum gate valve mechanism of sputter coating machine, vacuum gate valve mechanism includes lift cylinder, flashboard, first junction valve, second junction valve, the flashboard is equipped with the first junction valve close to the heating cavity one side, and the flashboard is equipped with the second junction valve close to the vacuum pump water cooling mechanism one side, the bottom of flashboard is equipped with lift cylinder, and the lift cylinder is equipped with the gate. A partition plate is arranged in the hollow structure of the gate plate, the bottom of the partition plate is connected with a lifting air cylinder, the vacuum gate valve mechanism is in a closed state before vacuumizing, and the partition plate is located at the top of the gate plate to separate the heating cavity from the vacuum pump water cooling mechanism; the lifting air cylinder drives the partition plate to descend so that air between the first connecting valve and the second connecting valve can be communicated, the vacuum pump water cooling mechanism can be communicated with the heating cavity, and after high-temperature gas is cooled through the water cooling mechanism, the vacuum pump conducts vacuumizing operation on the cooled gas.

Description

TECHNICAL FIELD

[0001] The utility model relates to sputter coating technology field, more specifically, relate to a kind of vacuum gate valve mechanism of sputter coating machine. BACKGROUND

[0002] Sputter coating technology is to use ion bombardment target surface, the atom of target material is hit out phenomenon is called sputtering, sputtering atom deposition is generated on substrate surface film and is called sputtering coating, for obtaining high quality thin film, in the magnetron sputtering device, fill in a certain amount of working gas, by being applied to two corresponding electrode plate voltage, under the electric field generated by electrode plate, enough energy can be obtained, so as to carry out impact with the gas molecules between electrode plate, ionization occurs, produce ion, ion is impacted target material under the action of electric field and magnetic field, sputtering target material atom deposition is formed on substrate film.Accurately control reaction gas pressure, target and substrate spacing, sputtering power and other parameters to accurately control deposition rate to obtain high quality thin film material.

[0003] In prior art, vacuum heating cavity needs to be configured with vacuum pump to carry out vacuumizing, but high temperature of heating cavity can cause damage to pump body, and there lacks blocking between heating cavity and vacuum pump when vacuumizing is not needed, so that vacuum environment is not easy to maintain. UTILITY MODEL CONTENT

[0004] Therefore, in order to solve the above problems, the utility model provides a vacuum gate valve mechanism of sputtering coating machine, vacuum gate valve mechanism 5 is located between vacuum pump water cooling mechanism 4 and process cavity 1, the vacuum pump water cooling mechanism 4 includes water cooling mechanism 43 and is located the vacuum pump 42 of water cooling mechanism 43 below, the vacuum gate valve mechanism 5 includes lift cylinder 51, gate 52, first connecting valve 54, second connecting valve 55, one side of gate 52 is equipped with first connecting valve 54, is connected with process cavity 1 through first connecting valve 54, the other side of gate 52 is equipped with second connecting valve 55, is connected with vacuum pump water cooling mechanism 4 through second connecting valve 55, the bottom of gate 52 is equipped with lift cylinder 51, the gate 52 is hollow structure, the hollow structure of gate 52 is equipped with baffle 53, the bottom of baffle 53 is connected with lift cylinder 51, when baffle 53 rises to the hollow structure of gate 52, the vacuum gate valve mechanism 5 is in closed state, separates process cavity 1 and vacuum pump water cooling mechanism 4, when needing to be evacuated, lift cylinder 51 drives baffle 53 to descend, so that the hollow structure of gate 52, first connecting valve 54, second connecting valve 55 is communicated with vacuum pump water cooling mechanism 4 and process cavity 1, the vacuum gate valve mechanism 5 is in open state at this time, after the high-temperature gas is cooled through water cooling mechanism 43, vacuum pump 42 carries out vacuumizing operation to the cooled gas, so that high-temperature gas will not cause damage to vacuum pump 42, in turn makes process cavity 1 can be independently broken vacuum and open, so the vacuum leakage in process cavity 1 can be avoided, therefore, shorten the time of changing material, improve the efficiency of later coating.

[0005] The invention discloses a vacuum gate valve mechanism of a sputtering coating machine, the vacuum gate valve mechanism 5 is arranged between the vacuum pump water cooling mechanism 4 and the process cavity 1, the vacuum pump water cooling mechanism 4 comprises a water cooling mechanism 43 and a vacuum pump 42 arranged below the water cooling mechanism 43, characterized in that: the vacuum gate valve mechanism 5 comprises a lifting cylinder 51, a gate plate 52, a first connecting valve 54 and a second connecting valve 55, one side of the gate plate 52 is provided with the first connecting valve 54, and the first connecting valve 54 is connected with the process cavity 1, the other side of the gate plate 52 is provided with the second connecting valve 55, and the second connecting valve 55 is connected with the vacuum pump water cooling mechanism 4, the bottom of the gate plate 52 is provided with the lifting cylinder 51, the gate plate 52 is a hollow structure, the hollow structure of the gate plate 52 is provided with a partition plate 53, the bottom of the partition plate 53 is connected with the lifting cylinder 51, when the partition plate 53 rises to the hollow structure of the gate plate 52, the vacuum gate valve mechanism 5 is in a closed state, and the process cavity 1 and the vacuum pump water cooling mechanism 4 are separated, when vacuumizing is needed, the lifting cylinder 51 drives the partition plate 53 to descend, so that the hollow structure of the gate plate 52, the first connecting valve 54 and the second connecting valve 55 are communicated with the vacuum pump water cooling mechanism 4 and the process cavity 1, at this time, the vacuum gate valve mechanism 5 is in an open state, after the high-temperature gas is cooled by the water cooling mechanism 43, the vacuum pump 42 performs vacuumizing operation on the cooled gas, so that the high-temperature gas will not damage the vacuum pump 42.

[0006] Further, the area of the partition plate 53 is not less than the area of the first connecting valve 54 or the second connecting valve 55, so that the first connecting valve 54 or the second connecting valve 55 can be sealed when the partition plate 53 is located at the top of the gate plate 52, thereby ensuring the vacuum environment in the process cavity 1.

[0007] Further, the first connecting valve 54 and the second connecting valve 55 are connected with the process cavity 1 and the vacuum pump water cooling mechanism 4 respectively through double-headed screws 56, the double-headed screws 56 are provided in plurality and are uniformly and interval arranged on the first connecting valve 54 and the second connecting valve 55.

[0008] Further, one side of the first connecting valve 54 connected with the process cavity 1 and one side of the second connecting valve 55 connected with the vacuum pump water cooling mechanism 4 are provided with copper pads 57, which are used for sealing the connection of the first connecting valve 54 and the second connecting valve 55, can withstand high-temperature baking, and have high sealing performance and low leakage rate.

[0009] Further, a plurality of reinforcing plates 521 are arranged on both sides of the gate plate 52, the reinforcing plates 521 are integrally formed with the gate plate 52, and are used for strengthening the structural strength of the gate plate 52.

[0010] Further, one side of the lifting cylinder 51 is provided with an adapter 511, which is used for connecting an external control mechanism, and the lifting cylinder 51 is electrically connected with the external control mechanism.

[0011] Further, one side of the process cavity 1 is provided with a wafer conveying port 13, and the other side is provided with a third connecting valve 15 which is matched and connected with the first connecting valve 54.

[0012] Further, one end of the vacuum pump water cooling mechanism 4 is provided with a fourth connecting valve 41 which is matched and connected with the second connecting valve 55.

[0013] The utility model discloses a kind of vacuum gate valve mechanisms of sputter coating machine, vacuum gate valve mechanism 5 is located between vacuum pump water cooling mechanism 4 and process cavity 1, the vacuum pump water cooling mechanism 4 includes water cooling mechanism 43 and vacuum pump 42 located below water cooling mechanism 43, the vacuum gate valve mechanism 5 includes lift cylinder 51, gate 52, first connecting valve 54, second connecting valve 55, one side of the gate 52 is provided with first connecting valve 54, connect with process cavity 1 by the first connecting valve 54, the other side of gate 52 is provided with second connecting valve 55, connect with vacuum pump water cooling mechanism 4 by the second connecting valve 55, the bottom of gate 52 is equipped with lift cylinder 51, the gate 52 is hollow structure, the hollow structure of the gate 52 is equipped with baffle 53, the bottom of the baffle 53 is connected with lift cylinder 51, when the baffle 53 rises to the hollow structure of the gate 52, the vacuum gate valve mechanism 5 is in closed state, process cavity 1 and vacuum pump water cooling mechanism 4 are separated, when needing to be evacuated, lift cylinder 51 drives baffle 53 to descend, so that the hollow structure of gate 52, first connecting valve 54, second connecting valve 55 is communicated with vacuum pump water cooling mechanism 4 and process cavity 1, at this moment, vacuum gate valve mechanism 5 is in open state, after high-temperature gas is cooled by the water cooling mechanism 43, vacuum pump 42 carries out vacuumizing operation to the cooled gas, so that high-temperature gas does not cause damage to vacuum pump 42, in turn, process cavity 1 can be independently broken vacuum and opened, so that the vacuum leakage in process cavity 1 can be avoided, therefore, change time is shortened, and the efficiency of later coating is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the connection overall structural drawing of the utility model's vacuum gate valve mechanism of sputter coating machine.

[0015] Figure 2 It is the overall structural drawing of the utility model's vacuum gate valve mechanism of sputter coating machine.

[0016] Figure 3 It is the side view of the utility model's vacuum gate valve mechanism of sputter coating machine.

[0017] MAIN ELEMENT SYMBOL EXPLANATION

[0018] The process cavity 1, wafer conveying port 13, third connecting valve 15, vacuum pump water cooling mechanism 4, fourth connecting valve 41, vacuum pump 42, water cooling mechanism 43, vacuum gate valve mechanism 5, lifting cylinder 51, adapter 511, gate plate 52, reinforcing plate 521, partition plate 53, first connecting valve 54, second connecting valve 55, double-end screw rod 56, copper pad 57.

[0019] The following specific embodiments will further illustrate the utility model in conjunction with the above-mentioned drawings. Specific embodiments

[0020] As Figure 1 shown, it is the connecting overall structure diagram of the vacuum gate valve mechanism of the sputtering coating machine of the utility model; as Figure 2 shown, it is the overall structure diagram of the vacuum gate valve mechanism of the sputtering coating machine of the utility model; as Figure 3 shown, it is the side view of the vacuum gate valve mechanism of the sputtering coating machine of the utility model. Example 1:

[0021] A kind of vacuum gate valve mechanism of sputtering coating machine, vacuum gate valve mechanism 5 is located between vacuum pump water cooling mechanism 4 and process cavity 1, the vacuum pump water cooling mechanism 4 includes water cooling mechanism 43 and vacuum pump 42 arranged below water cooling mechanism 43, it is characterized by: the vacuum gate valve mechanism 5 includes lifting cylinder 51, gate plate 52, first connecting valve 54, second connecting valve 55, one side of the gate plate 52 is equipped with first connecting valve 54, is connected with process cavity 1 by the first connecting valve 54, the other side of gate plate 52 is equipped with second connecting valve 55, is connected with vacuum pump water cooling mechanism 4 by the second connecting valve 55, the bottom of gate plate 52 is equipped with lifting cylinder 51, the gate plate 52 is hollow structure, the hollow structure of the gate plate 52 is equipped with partition plate 53, the bottom of the partition plate 53 is connected with lifting cylinder 51, when the partition plate 53 rises to the hollow structure of the gate plate 52, the vacuum gate valve mechanism 5 is in closed state, separates process cavity 1 and vacuum pump water cooling mechanism 4, when needing to be pumped, lifting cylinder 51 drives partition plate 53 to descend, so that the hollow structure of gate plate 52, first connecting valve 54, second connecting valve 55 is communicated with vacuum pump water cooling mechanism 4 and process cavity 1, at this time, vacuum gate valve mechanism 5 is in open state, after the high-temperature gas is cooled by the water cooling mechanism 43, vacuum pump 42 carries out vacuumizing operation to the cooled gas, so that high-temperature gas will not cause damage to vacuum pump 42.

[0022] The area of the partition plate 53 is not less than the area of the first connecting valve 54 or the second connecting valve 55, so that the partition plate 53 can seal the first connecting valve 54 or the second connecting valve 55 when located at the top of the gate plate 52, thereby ensuring the vacuum environment in the process cavity 1.

[0023] The first connecting valve 54 and the second connecting valve 55 are connected with the process cavity 1 and the vacuum pump water cooling mechanism 4 through double-end screws 56, the double-end screws 56 are provided with multiple and are uniformly and interval arranged on the first connecting valve 54 and the second connecting valve 55.

[0024] The side of the first connecting valve 54 connected with the process cavity 1 and the side of the second connecting valve 55 connected with the vacuum pump water cooling mechanism 4 are provided with copper pads 57 for sealing the connecting position of the first connecting valve 54 and the second connecting valve 55, can bear high temperature baking, and have high sealing property and low leakage rate.

[0025] The shutter 52 is provided with multiple reinforcing plates 521 on both sides, the reinforcing plates 521 are integrally formed with the shutter 52 for strengthening the structural strength of the shutter 52.

[0026] One side of the lifting cylinder 51 is provided with an adapter 511 for connecting with an external control mechanism, the lifting cylinder 51 is electrically connected with the external control mechanism.

[0027] One side of the process cavity 1 is provided with a wafer conveying port 13, and the other side is provided with a third connecting valve 15, the third connecting valve 15 is matched and connected with the first connecting valve 54.

[0028] One end of the vacuum pump water cooling mechanism 4 is provided with a fourth connecting valve 41, the fourth connecting valve 41 is matched and connected with the second connecting valve 55.

[0029] The utility model discloses a sputtering coating machine's vacuum gate valve mechanism, vacuum gate valve mechanism 5 is located between vacuum pump water cooling mechanism 4 and process cavity 1, vacuum pump water cooling mechanism 4 includes water cooling mechanism 43 and is located the vacuum pump 42 of water cooling mechanism 43 below, vacuum gate valve mechanism 5 includes lift cylinder 51, gate 52, first connecting valve 54, second connecting valve 55, one side of gate 52 is equipped with first connecting valve 54, is connected with process cavity 1 through first connecting valve 54, the other side of gate 52 is equipped with second connecting valve 55, and is connected with vacuum pump water cooling mechanism 4 through second connecting valve 55, the bottom of gate 52 is equipped with lift cylinder 51, the gate 52 is hollow structure, the hollow structure of gate 52 is equipped with baffle 53, the bottom of baffle 53 is connected with lift cylinder 51, when baffle 53 rises to the hollow structure place of gate 52, vacuum gate valve mechanism 5 is in closed state, and separates process cavity 1 and vacuum pump water cooling mechanism 4, when needing to extract vacuum, lift cylinder 51 drives baffle 53 to descend, so that the hollow structure of gate 52, first connecting valve 54, second connecting valve 55 is communicated with vacuum pump water cooling mechanism 4 and process cavity 1, at this moment, vacuum gate valve mechanism 5 is in open state, after the cooling of high-temperature gas through water cooling mechanism 43, vacuum pump 42 carries out the vacuum extraction operation to the gas after cooling, so that high-temperature gas will not cause damage to vacuum pump 42, and then process cavity 1 can be opened alone to break the vacuum, so that the vacuum leakage in process cavity 1 can be avoided, therefore, shorten the time of replacing material, improve the efficiency of later coating.

[0030] The above-described embodiments only express several implementation manners of the utility model, and the description is more specific and detailed, but it can not be understood as the limitation of the utility model patent scope. It should be pointed out that for ordinary skilled person in the art, without departing from the concept of the utility model, a number of variations and improvements can be made, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be according to the attached claims.

Claims

1. A vacuum gate valve mechanism of a sputter coater, the vacuum gate valve mechanism (5) is arranged between a vacuum pump water cooling mechanism (4) and a process chamber (1), the vacuum pump water cooling mechanism (4) comprises a water cooling mechanism (43) and a vacuum pump (42) arranged below the water cooling mechanism (43), characterized in that: The vacuum gate valve mechanism (5) comprises a lifting cylinder (51), a gate plate (52), a first connecting valve (54) and a second connecting valve (55). One side of the gate plate (52) is provided with the first connecting valve (54) connected with the process cavity (1) through the first connecting valve (54). The other side of the gate plate (52) is provided with the second connecting valve (55) connected with the vacuum pump water cooling mechanism (4) through the second connecting valve (55). The bottom of the gate plate (52) is provided with the lifting cylinder (51). The gate plate (52) is a hollow structure. The hollow structure of the gate plate (52) is provided with a partition plate (53). The bottom of the partition plate (53) is connected with the lifting cylinder (51). When the partition plate (53) rises to the hollow structure of the gate plate (52), the vacuum gate valve mechanism (5) is in a closed state, and the process cavity (1) and the vacuum pump water cooling mechanism (4) are separated. When vacuumizing is needed, the lifting cylinder (51) drives the partition plate (53) to descend, so that the hollow structure of the gate plate (52), the first connecting valve (54) and the second connecting valve (55) are communicated with the vacuum pump water cooling mechanism (4) and the process cavity (1). At this time, the vacuum gate valve mechanism (5) is in an open state. After the high-temperature gas is cooled by the water cooling mechanism (43), the vacuum pump (42) performs vacuumizing operation on the cooled gas, so that the high-temperature gas will not damage the vacuum pump (42).

2. The vacuum gate valve mechanism of a sputter coating machine according to claim 1, wherein: The area of the partition plate (53) is not less than the area of the first connecting valve (54) or the second connecting valve (55), so that the partition plate (53) can seal the first connecting valve (54) or the second connecting valve (55) when the partition plate (53) is located at the top of the gate plate (52), thereby ensuring the vacuum environment in the process cavity (1).

3. The vacuum gate valve mechanism of a sputter coating machine according to claim 1, wherein: The first connecting valve (54) and the second connecting valve (55) are connected with the process cavity (1) and the vacuum pump water cooling mechanism (4) through double-headed screws (56), respectively. The double-headed screws (56) are provided in plurality and uniformly spaced and arranged on the first connecting valve (54) and the second connecting valve (55).

4. The vacuum gate valve mechanism of sputter coating machine as claimed in claim 1, wherein: The side of the first connecting valve (54) connected with the process cavity (1) and the side of the second connecting valve (55) connected with the vacuum pump water cooling mechanism (4) are both provided with copper pads (57).

5. The vacuum gate valve mechanism of sputter coating machine as claimed in claim 1, wherein: The gate plate (52) is provided with a plurality of reinforcing plates (521) on both sides. The reinforcing plates (521) are integrally formed with the gate plate (52) and are used for strengthening the structural strength of the gate plate (52).

6. The vacuum gate valve mechanism of a sputter coating machine according to claim 1, wherein: The lifting cylinder (51) is provided with an adapter (511) on one side for connecting an external control mechanism. The lifting cylinder (51) is electrically connected with the external control mechanism.

7. The vacuum gate valve mechanism of sputter coating machine as claimed in claim 1, wherein: One side of the process cavity (1) is provided with a wafer conveying port (13), and the other side is provided with a third connecting valve (15). The third connecting valve (15) is matched and connected with the first connecting valve (54).

8. The vacuum gate valve mechanism of sputter coating machine as claimed in claim 1, wherein: One end of the vacuum pump water cooling mechanism (4) is provided with a fourth connecting valve (41). The fourth connecting valve (41) is matched and connected with the second connecting valve (55).

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