Heat dissipation earphone

Abstract

The utility model provides a heat dissipation earphone. The heat dissipation earphone comprises a shell, a permanent magnet, a first vibration unit and a second vibration unit, the first vibration unit is suitable for interacting with the permanent magnet to vibrate and produce sound when current is introduced; and the second vibration unit is suitable for interacting with the permanent magnet to vibrate to generate airflow when current is introduced so as to dissipate heat of the heat dissipation earphone. According to the heat dissipation earphone, the design of the double vibration units which are mutually independent and share one permanent magnet is adopted, one group of vibration units interact with the permanent magnet to vibrate and produce sound when current is input, and the other group of vibration units interact with the permanent magnet to vibrate to generate airflow to dissipate heat of the heat dissipation earphone when current is input. According to the design, the existing structure of the earphone is fully utilized to construct a heat dissipation system for heat dissipation, so that the heat dissipation effect of the earphone is effectively improved, the original design of the earphone is not influenced, and the sound quality of the earphone is not influenced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to earphone technical field, concretely relates to a heat dissipation earphone. BACKGROUND

[0002] Earphone, especially ear muff type earphone, is easy to heat in the inside of earphone and the ear of user for long time wearing, which not only will influence the tone of earphone, reduce the service life of earphone, but also will bring the discomfort to the ear of user. UTILITY MODEL CONTENTS

[0003] The utility model provides an improved heat dissipation earphone, adopt the design of two vibration units that are independent and share one permanent magnet, one group of vibration units is vibrated and makes sound by interacting with the permanent magnet when current is passed, the other group of vibration units is vibrated to generate airflow to the heat dissipation earphone for heat dissipation when current is passed, the design makes full use of the existing structure of earphone to build the heat dissipation system for heat dissipation, which not only effectively improves the heat dissipation effect of earphone, but also does not affect the original design of earphone and the tone of earphone.

[0004] To realize the above-mentioned purpose, the utility model provides the following technical scheme:

[0005] An improved heat dissipation earphone, which comprises a shell, a permanent magnet, a first vibration unit and a second vibration unit installed on the shell.

[0006] Optionally, the second vibration unit and the first vibration unit are independently arranged and current is not passed at the same time.

[0007] Optionally, the first vibration unit is adapted to vibrate and make sound outside the shell, and the second vibration unit is adapted to vibrate and generate airflow inside the shell.

[0008] Optionally, the first vibration unit comprises a first coil arranged around the permanent magnet and a first diaphragm connected with the first coil, the first diaphragm is installed on the shell, and the first coil is adapted to interact with the permanent magnet to drive the first diaphragm to vibrate and make sound outside the shell when current is passed.

[0009] Optionally, the second vibration unit comprises a second coil arranged around the permanent magnet and a second diaphragm connected with the second coil, the second diaphragm is installed inside the shell, and the second coil is adapted to interact with the permanent magnet to drive the second diaphragm to reciprocate and generate the airflow inside the shell when current is passed.

[0010] Optionally, the heat-dissipation earphone further comprises a heat-dissipation cavity located inside the shell; a part of the boundary of the heat-dissipation cavity is defined by the second diaphragm; when the second diaphragm reciprocally vibrates, the heat-dissipation cavity is adapted to alternately generate negative pressure and positive pressure to form the air flow.

[0011] Optionally, the heat-dissipation earphone further comprises an ear cover located outside the shell and arranged adjacent to the first vibration unit; the heat-dissipation cavity is adapted to communicate with the inside of the ear cover through the shell to dissipate heat from the ear cover by the air flow.

[0012] Optionally, when the negative pressure is generated, the outside cold air is adapted to be introduced into the inside of the ear cover and exchange heat with the heat inside the ear cover to form hot air into the heat-dissipation cavity; when the positive pressure is generated, the hot air inside the heat-dissipation cavity is adapted to be introduced out of the heat-dissipation cavity.

[0013] Optionally, the heat-dissipation earphone further comprises a first one-way valve and a second one-way valve respectively installed in the ear cover and the heat-dissipation cavity; when the negative pressure is generated, the first one-way valve is adapted to be opened to introduce the outside cold air into the inside of the ear cover; when the positive pressure is generated, the second one-way valve is adapted to be opened to introduce the hot air inside the heat-dissipation cavity out.

[0014] Optionally, the hot air introduced out of the heat-dissipation cavity is adapted to enter the inside of the shell; the shell is made of heat-dissipation material to adapt to introduce the hot air inside the shell out of the shell, or the shell is provided with a second heat-dissipation hole in communication with the outside to adapt to introduce the hot air inside the shell out of the shell.

[0015] Optionally, the heat-dissipation earphone further comprises an inner shell arranged in the shell; the second diaphragm is located between the permanent magnet and the inner shell and cooperates with the inner shell to define the heat-dissipation cavity.

[0016] Optionally, the second diaphragm and the inner shell are further adapted to define a device cavity in the inside of the shell independently of the heat-dissipation cavity; the heat-dissipation earphone further comprises an electronic element accommodated in the device cavity; when the second diaphragm reciprocally vibrates, the device cavity is also adapted to alternately generate negative pressure and positive pressure to form the air flow to dissipate heat from the electronic element.

[0017] Optionally, the shell is made of heat-dissipation material to adapt to introduce the hot air inside the device cavity out of the shell to dissipate heat from the electronic element, or the shell is provided with a second heat-dissipation hole in communication with the device cavity and the outside respectively to allow the air flow to enter and exit to dissipate heat from the electronic element.

[0018] Optionally, the second vibrating diaphragm is made of mute material.

[0019] Optionally, the vibration frequency and vibration amplitude of the second vibrating diaphragm can be adjusted according to the heat dissipation efficiency requirement within the vibration noise receiving range.

[0020] Compared with the prior art, the technical scheme of the embodiment of the utility model has beneficial effects.

[0021] For example, a double-vibration-unit design is adopted, in which the two vibration units are independent of each other and share one permanent magnet. When current is passed through one group of vibration units, the vibration units interact with the permanent magnet to vibrate and produce sound, and when current is passed through the other group of vibration units, the vibration units interact with the permanent magnet to vibrate and generate air flow to dissipate heat from the earphone. This design makes full use of the existing structure of the earphone to build a heat dissipation system to dissipate heat, which not only effectively improves the heat dissipation effect of the earphone, but also does not affect the original design of the earphone and the sound quality of the earphone.

[0022] For another example, the first vibration unit and the second vibration unit are arranged outside and inside the inner cavity of the shell respectively, so that the two vibration units are completely independent in space and do not affect each other.

[0023] For another example, the second vibrating diaphragm is made of mute material, and the vibration frequency and vibration amplitude of the second vibrating diaphragm can be adjusted as required within the vibration noise receiving range, so as to meet the requirement of different heat dissipation efficiency.

[0024] For another example, the second vibrating diaphragm is used to define the boundary of the heat dissipation cavity in the inner part of the shell, which is not only ingenious in design, but also effectively utilizes the space without changing the original structure of the earphone.

[0025] For another example, the second vibrating diaphragm is used to define a device cavity independent of the heat dissipation cavity in the inner part of the shell, and then the air flow generated by the vibration of the second vibrating diaphragm is used to dissipate heat from the electronic elements in the device cavity, thereby realizing multifunctional heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a schematic view of the front of the heat dissipation earphone in the embodiment of the utility model;

[0027] Figure 2 is an exploded schematic view of the heat dissipation earphone in the embodiment of the utility model;

[0028] Figure 3 is a sectional view of the heat dissipation earphone in the embodiment of the utility model, in which the second vibrating diaphragm moves forward, and negative pressure is generated in the heat dissipation cavity;

[0029] Figure 4 is another sectional view of the heat dissipation earphone in the embodiment of the utility model, in which the second vibrating diaphragm moves backward, and positive pressure is generated in the heat dissipation cavity;

[0030] Figure 5is a schematic view of the back of the heat dissipation earphone in the embodiment of the utility model;

[0031] Figure 6 is a kind of arrangement schematic view of ear cover filler in the embodiment of the utility model.

[0032] Mark explanation:

[0033] 1 heat dissipation earphone;

[0034] 11 shell, 110 shell inner cavity, 11a front cover, 11b rear cover, 11c through-hole, 111 support, 112 inner shell, 112a second valve mounting hole, 113 sound cavity, 114 heat dissipation cavity, 115 device cavity, 116 second heat dissipation hole;

[0035] 12 permanent magnet;

[0036] 13 first vibration unit, 131 first coil, 132 first diaphragm;

[0037] 14 second vibration unit, 141 second coil, 142 second diaphragm;

[0038] 15 ear cover, 150 ear cover inner cavity, 150a first valve mounting hole, 151 contact part, 152 first heat dissipation hole, 153 filler;

[0039] 161 first one-way valve, 162 second one-way valve;

[0040] 17 connecting pipeline;

[0041] A the position of second diaphragm after moving forward;B the position of second diaphragm after moving backward. Specific embodiments

[0042] In order to make the purpose, features and beneficial effects of the utility model more obvious and easy to understand, the specific embodiments of the utility model are described in detail below in conjunction with the drawings.It can be understood that the following described specific embodiments are only used to explain the utility model, and not limit the utility model.And, the description of the same, similar components in different embodiments and the description of components, features, effects, etc.belonging to prior art can be omitted.

[0043] In addition, in order to facilitate description, only part related to the utility model is shown in the drawings instead of all structures.And, the same, similar reference signs can be used to refer to the same, similar components in different embodiments in the drawings.

[0044] Reference Figures 1 to 6 , the utility model embodiment provides an improved heat dissipation earphone 1.

[0045] Specifically, the heat-dissipation earphone 1 comprises a housing 11, and a permanent magnet 12 and a first vibration unit 13 mounted on the housing 11.

[0046] In specific implementation, the heat-dissipation earphone 1 further comprises a bracket 111 mounted on the housing 11. The bracket 111 is used for mounting and supporting the permanent magnet 12.

[0047] In some embodiments, the housing 11 can comprise a front cover 11a and a rear cover 11b connected in front and back. The rear cover 11b has an opening facing forward, and the front cover 11a has a ring structure with an outer periphery connected to the opening of the rear cover 11b and an inner periphery used for mounting and fixing the bracket 111.

[0048] In some embodiments, the bracket 111 also has a ring structure with an outer periphery fixedly connected to the inner periphery of the front cover 11a of the housing 11 and an inner periphery used for mounting and fixing the permanent magnet 12.

[0049] In specific implementation, the first vibration unit 13 comprises a first coil 131 arranged around the permanent magnet 12, and a first diaphragm 132 connected to the first coil 131. The first diaphragm 132 is mounted on the housing 11, and the first coil 131 is adapted to interact with the permanent magnet 12 to drive the first diaphragm 132 to vibrate and emit sound outside the housing 11 when current is passed through.

[0050] In some embodiments, the first diaphragm 132 is also mounted on the inner periphery of the front cover 11a of the housing 11 and located in front of the bracket 111.

[0051] In some embodiments, the front cover 11a and the rear cover 11b of the housing 11 are adapted to jointly define an internal space of the housing 11, i.e., a housing inner cavity 110. The first diaphragm 132 is located outside the housing inner cavity 110.

[0052] In some embodiments, the front cover 11a of the housing 11 and the first diaphragm 132 are also adapted to define a sound-emitting cavity 113 outside the housing 11. The sound-emitting cavity 113 is adapted to open towards the user's ear to facilitate the user to receive the sound emitted by the heat-dissipation earphone 1.

[0053] In specific implementation, the heat-dissipation earphone 1 further comprises an ear cover 15 located outside the housing 11 and arranged adjacent to the first vibration unit 13. In this case, the front cover 11a of the housing 11, the first diaphragm 132, and the ear cover 15 are adapted to jointly define the sound-emitting cavity 113.

[0054] In some embodiments, the ear cover 15 has a ring structure and is fixedly mounted on the front end surface of the front cover 11a.

[0055] In specific implementation, the shell 11, the support 111, the permanent magnet 12, the first coil 131, the first diaphragm 132, the ear cover 15 of the heat dissipation earphone 1, and the positional and connecting relationship among these components can be implemented by any known technique in the art, which is not limited here.

[0056] In specific implementation, the heat dissipation earphone 1 further comprises a second vibration unit 14. The second vibration unit 14 is adapted to interact with the permanent magnet 12 to vibrate and generate airflow for heat dissipation of the heat dissipation earphone 1 when current is applied.

[0057] In specific implementation, the current applied to the second vibration unit 14 is variable frequency current.

[0058] In specific implementation, the second vibration unit 14 comprises a second coil 141 arranged around the permanent magnet 12, and a second diaphragm 142 connected to the second coil 141. The second diaphragm 142 is mounted in the interior of the shell 11, i.e. the shell inner cavity 110; the second coil 141 is adapted to interact with the permanent magnet 12 to drive the second diaphragm 142 to reciprocatingly vibrate in the interior of the shell 11, i.e. the shell inner cavity 110, to generate airflow when current is applied.

[0059] As mentioned above, the first coil 131 is also arranged around the permanent magnet 12. In specific implementation, the first coil 131 and the second coil 141 can be respectively sleeved on the front and rear ends of the permanent magnet 12. The first coil 131 is arranged in front and close to the first diaphragm 132, and the second coil 141 is arranged in rear and close to the second diaphragm 142.

[0060] As mentioned above, the first diaphragm 132 is mounted outside the shell inner cavity 110, and the second diaphragm 142 is mounted in the shell inner cavity 110. Thus, the first vibration unit 13 is adapted to vibrate and sound outside the shell 11; and the second vibration unit 14 is adapted to reciprocatingly vibrate in the interior of the shell 11, i.e. the shell inner cavity 110, to generate airflow.

[0061] In specific implementation, the second vibration unit 14 and the first vibration unit 13 are independently arranged and not applied with current at the same time.

[0062] Specifically, when the heat dissipation earphone 1 needs to play sound, current is applied to the first coil 131 of the first vibration unit 13, so that the first coil 131 interacts with the permanent magnet 12 to drive the first diaphragm 132 to vibrate and sound outside the shell 11. When the heat dissipation earphone 1 does not need to play sound, current is applied to the second coil 141 of the second vibration unit 14, so that the second coil 141 interacts with the permanent magnet 12 to drive the second diaphragm 142 to reciprocatingly vibrate in the interior of the shell 11, i.e. the shell inner cavity 110, to generate airflow.

[0063] In some embodiments, the heat dissipation earphone 1 further comprises a heat dissipation cavity 114 located inside the housing 11, i.e. in the housing inner cavity 110. Part of the boundary of the heat dissipation cavity 114 is defined by the second diaphragm 142. When the second diaphragm 142 reciprocates, it is adapted to generate negative pressure and positive pressure in the heat dissipation cavity 114 to form an air flow to dissipate heat from the heat dissipation earphone 1.

[0064] In some embodiments, the heat dissipation earphone 1 further comprises an inner shell 112 mounted in the housing inner cavity 110. The second diaphragm 142 is located between the permanent magnet 12 and the inner shell 112, and cooperates with the inner shell 112 to define the heat dissipation cavity 114.

[0065] In specific implementations, the inner shell 112 is made of hard material, such as hard plastic, so as to generate negative pressure and positive pressure in the heat dissipation cavity 114 when the second diaphragm 142 vibrates.

[0066] In some embodiments, the second diaphragm 142 and the inner shell 112 can be integrally formed by overmolding or assembled together.

[0067] In specific implementations, the heat dissipation cavity 114 is adapted to communicate with the inner cavity 150 of the ear cover 15 through the housing 11, so as to dissipate heat from the ear cover 15 through the air flow.

[0068] In some embodiments, the heat dissipation cavity 114 communicates with the inner cavity 150 of the ear cover 15 through the connecting pipe 17, and the air flow in the inner cavity 150 of the ear cover 15 can be conducted to the heat dissipation cavity 114 through the connecting pipe 17.

[0069] Corresponding to the position of the connecting pipe 17, the front cover 11a of the housing 11 is also provided with a through hole 11c to allow the connecting pipe 17 to pass through the front cover 11a of the housing 11 so that the two ends of the connecting pipe 17 are connected to the inner cavity 150 of the ear cover 15 and the heat dissipation cavity 114, respectively.

[0070] As mentioned above, when the second diaphragm 142 reciprocates, it is adapted to generate negative pressure and positive pressure in the heat dissipation cavity 114 alternately to form an air flow. Since the inner cavity 150 of the ear cover 15 communicates with the heat dissipation cavity 114, when the second diaphragm 142 reciprocates, it is also adapted to generate an air flow in the inner cavity 150 of the ear cover 15.

[0071] Referring to Figure 3 and Figure 4 , respectively, show the position A of the second diaphragm 142 after moving forward, and the position B of the second diaphragm 142 after moving backward. In some embodiments, the second diaphragm 142 is adapted to reciprocate between the two positions.

[0072] In specific embodiments, the heat dissipation earphone 1 further comprises a first one-way valve 161 and a second one-way valve 162 installed in the ear cover inner cavity 150 and the heat dissipation cavity 114 respectively. The first one-way valve 161 is installed in the ear cover inner cavity 150 and is adapted to allow external air to enter the ear cover inner cavity 150. The second one-way valve 162 is installed in the heat dissipation cavity 114 and is adapted to allow air in the heat dissipation cavity 114 to flow out.

[0073] In specific embodiments, the ear cover 15 and the inner shell 112 are respectively provided with a first valve mounting hole 150a and a second valve mounting hole 112a for mounting the first one-way valve 161 and the second one-way valve 162 respectively.

[0074] In specific embodiments, when the second diaphragm 142 moves forward, a negative pressure is generated in the heat dissipation cavity 114. Since the ear cover inner cavity 150 is in communication with the heat dissipation cavity 114, the first one-way valve 161 installed in the ear cover inner cavity 150 is opened under the action of the negative pressure to guide cold air from the outside into the ear cover inner cavity 150. After the cold air enters the ear cover inner cavity 150, heat exchange occurs between the cold air and the heat in the ear cover inner cavity 150 to form hot air, which then enters the heat dissipation cavity 114. When the second diaphragm 142 moves backward, a positive pressure is generated in the heat dissipation cavity 114. The second one-way valve 162 is opened under the action of the positive pressure to guide the hot air in the heat dissipation cavity 114 out of the heat dissipation cavity 114.

[0075] In some embodiments, the hot air guided out of the heat dissipation cavity 114 is adapted to enter the inside of the outer shell 11, i.e., the outer shell inner cavity 150. In this case, the outer shell 11, for example, the rear cover 11b of the outer shell 11, is further provided with a second heat dissipation hole 116 in communication with the outside to guide the hot air in the inside of the outer shell 11, i.e., the outer shell inner cavity 150, out of the outside of the outer shell 11. Alternatively, the outer shell 11 is not provided with the second heat dissipation hole 116, and the outer shell 11 is made of a heat dissipation material to adapt to guide the hot air in the inside of the outer shell 11 out of the outside of the outer shell 11. Alternatively, the second heat dissipation hole 116 can be provided while the outer shell 11 is made of a heat dissipation material to jointly guide the hot air in the inside of the outer shell 11 out of the outside of the outer shell 11.

[0076] In the embodiments of the present application, the above technical solutions can be used to dissipate heat from the ear cover 15, especially the ear cover inner cavity 150.

[0077] In specific embodiments, the heat in the ear cover inner cavity 150 mainly comes from the ear cover 15 itself and its surroundings. When a user wears the heat dissipation earphone 1, especially when the ear cover 15 is in close contact with the user's ear and its surroundings, the sound generating cavity 113 of the heat dissipation earphone 1 forms a relatively closed space. The relatively closed space is prone to accumulate heat, and the accumulated heat will be conducted to the ear cover 15 itself and then enter the ear cover inner cavity 150.

[0078] In some embodiments, the earmuff 15 further includes a contact portion 151 adapted to fit the skin around the ear of the user. The contact portion 151 is also prone to generate heat when the heat dissipating earphone 1 is worn.

[0079] In a specific implementation, the contact portion 151 is further provided with a first heat dissipation hole 152 communicating with the interior of the earmuff 15 , namely the earmuff inner cavity 150 . The first heat dissipation hole 152 is adapted to conduct heat from the contact portion 151 into the interior of the earmuff 15 , namely the earmuff inner cavity 150 .

[0080] In some embodiments, the earmuffs 15 are in close contact with the user's ears. When negative pressure is generated within the heat dissipation cavity 114, the first one-way valve 161 opens, allowing cool air to enter the earmuff cavity 150 through the first one-way valve 161 and remove heat from the cavity. Because the earmuffs 15 are in close contact with the user's ears, only a small portion of the heat removed enters the earmuff cavity 150 through the first heat dissipation holes 152.

[0081] In other embodiments, the earmuff 15 is not in close contact with the periphery of the user's ear. In this case, the earmuff inner cavity 150 can also be cooled by the first heat dissipation holes 152.

[0082] In some embodiments, a filler 153 is further provided in the inner cavity 150 of the earmuff to support the earmuff 15 .

[0083] In some embodiments, the filler 153 may be an elastic filler.

[0084] like Figure 6 As shown, in some embodiments, the filler 153 may adopt a columnar structure, and a plurality of columnar fillers 153 are evenly filled in the earmuff inner cavity 110 to evenly support the earmuff 15 .

[0085] In other embodiments, the filler 153 may also adopt any other known structure in the prior art, such as a grid, which is not limited herein.

[0086] In a specific implementation, the heat dissipation of the earmuff 15 by adopting the technical solution of the embodiment of the present utility model will not be affected by the filler 153 .

[0087] In some embodiments, the second diaphragm 142 is made of silent materials such as soft rubber materials such as silicone, and will not make any sound even within the vibration frequency range audible to humans, and its vibration frequency and vibration amplitude can be adjusted as needed within the vibration noise reception range.

[0088] In a specific implementation, the vibration frequency and vibration amplitude of the second diaphragm 42 can be adjusted according to the efficiency requirements of the cold and hot air exchange.

[0089] As mentioned above, in some embodiments, the heat dissipation earphone 1 further comprises an inner shell 112 installed in the inner cavity 110 of the outer shell. In this case, the second diaphragm 142 is further adapted to define a device cavity 115 in the inner cavity 110 of the outer shell 110 together with the inner shell 112, which is independent of the heat dissipation cavity 114, to accommodate electronic components of the heat dissipation earphone 1, such as a battery, a circuit board, etc.

[0090] In specific implementations, when the second diaphragm 142 reciprocates, the device cavity 115 is also adapted to generate negative pressure and positive pressure to form air flow to dissipate heat from the electronic components.

[0091] In some embodiments, the outer shell 11, for example, the rear cover 11b of the outer shell 11, is further provided with a second heat dissipation hole 116 in communication with the device cavity 115 and the outside, respectively, to allow air to enter and exit to dissipate heat from the electronic components in the device cavity 115.

[0092] In other embodiments, the outer shell 11 is not provided with the second heat dissipation hole 116, but is made of a heat dissipation material to guide hot air inside the device cavity 115 to the outside of the outer shell 11 to dissipate heat from the electronic components.

[0093] In yet other embodiments, the second heat dissipation hole 116 can be provided while the outer shell 11 is made of a heat dissipation material to jointly guide hot air inside the device cavity 115 to the outside of the outer shell 11 to dissipate heat from the electronic components.

[0094] Although the specific embodiments of the present application have been described above, these embodiments are not intended to limit the scope of the present application, even if a single embodiment is described with respect to a particular feature. The feature examples provided in the present application are intended to be illustrative, not limiting, unless otherwise stated. In specific implementations, one or more technical features of the dependent claims can be combined with the technical features of the independent claims, and the technical features of the corresponding claims can be combined in any appropriate manner rather than only through the specific combinations listed in the claims, as long as it is technically feasible.

[0095] Although the present application is disclosed as above, the present application is not limited thereto. Any person skilled in the art can make various modifications and modifications without departing from the spirit and scope of the present application, and therefore the protection scope of the present application should be subject to the scope defined by the claims.

Claims

1. A heat dissipating earphone (1), characterized in that, The earphone comprises a shell (11) and is installed with: a permanent magnet (12); a first vibration unit (13) adapted to interact with the permanent magnet (12) to vibrate and make sound outside the shell (11) when current is passed; an ear cover (15) located outside the shell (11) and arranged adjacent to the first vibration unit (13); a second vibration unit (14) adapted to interact with the permanent magnet (12) to vibrate and generate airflow inside the shell (11) to dissipate heat for the ear cover (15) when current is passed.

2. The heat dissipating earphone (1) according to claim 1, characterized in that, The second vibration unit (14) and the first vibration unit (13) are independently arranged and not passed with current at the same time.

3. The heat dissipating earphone (1) according to claim 1, characterized in that, The first vibration unit (13) comprises a first coil (131) arranged around the permanent magnet (12) and a first diaphragm (132) connected with the first coil (131); the first diaphragm (132) is installed outside the shell (11); the first coil (131) is adapted to interact with the permanent magnet (12) to drive the first diaphragm (132) to vibrate and make sound outside the shell (11) when current is passed.

4. The heat dissipation earphone (1) according to claim 1, characterized in that: The second vibration unit (14) comprises a second coil (141) arranged around the permanent magnet (12) and a second diaphragm (142) connected with the second coil (141); the second diaphragm (142) is installed inside the shell (11); the second coil (141) is adapted to interact with the permanent magnet (12) to drive the second diaphragm (142) to reciprocate and generate the airflow inside the shell (11) when current is passed.

5. The heat dissipating earphone (1) according to claim 4, characterized in that Further comprising a heat dissipation cavity (114) located inside the shell (11); part of the boundary of the heat dissipation cavity (114) is defined by the second diaphragm (142); when the second diaphragm (142) reciprocates, the heat dissipation cavity (114) is adapted to alternately generate negative pressure and positive pressure to form the airflow.

6. The heat dissipating earphone (1) according to claim 5, characterized in that The heat dissipation cavity (114) is adapted to communicate with the inside of the ear cover (15) through the shell (11) to dissipate heat for the ear cover (15) through the airflow.

7. The heat dissipating earphone (1) according to claim 6, characterized in that When the negative pressure is generated, the cold air outside is adapted to be introduced into the inside of the ear cover (15) and exchange heat with the heat inside the ear cover (15) to form hot air into the heat dissipation cavity (114); when the positive pressure is generated, the hot air in the heat dissipation cavity (114) is adapted to be introduced out of the heat dissipation cavity (114).

8. The heat dissipating earphone (1) according to claim 7, characterized in that, Further comprising a first one-way valve (161) and a second one-way valve (162) respectively installed in the ear cover (15) and the heat dissipation cavity (114); when the negative pressure is generated, the first one-way valve (161) is adapted to be opened to introduce the cold air outside into the inside of the ear cover (15); when the positive pressure is generated, the second one-way valve (162) is adapted to be opened to introduce the hot air in the heat dissipation cavity (114) out.

9. The heat dissipating earphone (1) according to claim 7, characterized in that, The hot air discharged from the heat dissipation cavity (114) is adapted to enter the interior of the shell (11); the shell (11) is made of heat dissipation material to adapt to the discharge of the hot air in the interior of the shell (11) to the exterior of the shell (11), or the shell (11) is provided with a second heat dissipation hole (116) in communication with the exterior to adapt to the discharge of the hot air in the interior of the shell (11) to the exterior of the shell (11).

10. The heat dissipating earphone (1) according to claim 5, characterized in that, Further comprising an inner shell (112) disposed in the shell (11); the second diaphragm (142) is located between the permanent magnet (12) and the inner shell (112) and cooperates with the inner shell (112) to define the heat dissipation cavity (114).

11. The heat dissipating earphone (1) according to claim 10, characterized in that, The second diaphragm (142) and the inner shell (112) are further adapted to define a device cavity (115) in the interior of the shell (11) independently of the heat dissipation cavity (114); the heat dissipation earphone (1) further comprises electronic elements accommodated in the device cavity (115); when the second diaphragm (142) reciprocates, the device cavity (115) is also adapted to alternately generate negative pressure and positive pressure to form air flow to dissipate heat from the electronic elements.

12. The heat dissipating earphone (1) according to claim 11, characterized in that, The shell (11) is made of heat dissipation material to adapt to the discharge of the hot air in the interior of the device cavity (115) to the exterior of the shell (11) to dissipate heat from the electronic elements, or The shell (11) is provided with a second heat dissipation hole (116) in communication with the device cavity (115) and the exterior, respectively, to allow air flow in and out to dissipate heat from the electronic elements.

13. The heat dissipating earphone (1) according to claim 4, characterized in that, The second diaphragm (142) is made of mute material.

14. The heat dissipating earphone (1) according to claim 4, characterized in that, The vibration frequency and amplitude of the second diaphragm (142) can be adjusted according to the heat dissipation efficiency requirement within the vibration noise receiving range.

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