Silicon wafer cleaning device
The design of the throwing bracket and the liquid replenishing tube solves the problems of poor washing effect and uneven distribution of cleaning liquid in the silicon wafer cleaning device, achieving more efficient cleaning effect and stable operation of the device.
Patent Information
- Application Number
- CN202422337039.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-09-25
AI Technical Summary
Existing silicon wafer cleaning devices have problems such as poor cleaning effect, uneven distribution of cleaning liquid, and easy clogging of the cleaning tank, which affect the cleaning effect and efficiency.
The throwing bracket is used to drive the material frame to move up and down, combined with multiple liquid holes, liquid replenishment pipes and ventilation components to enhance the cleaning effect, and the heater and liquid level sensor are used to ensure the uniform distribution of cleaning liquid and the normal operation of the cleaning tank.
It improves the cleaning effect, ensures the thorough cleaning of dead corners, reduces the problems of uneven distribution of cleaning liquid and clogging of the tank, and ensures the smooth progress of the cleaning process.
Smart Images
Figure CN223475783U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of silicon wafer cleaning technology, and in particular relates to a silicon wafer cleaning device. Background Art
[0002] During silicon wafer production, the cut silicon wafers need to be cleaned. The cleaning process includes pre-cleaning and secondary cleaning. Pre-cleaning mainly removes the slurry and slag adhering to the silicon wafer after cutting, while secondary cleaning removes various contaminants, such as metal ions, adhering to the surface of the silicon wafer through methods such as acid washing.
[0003] In the existing re-cleaning steps, ultrasonic devices are typically installed in the cleaning tank to vibrate the cleaning solution and clean the silicon wafers. However, this approach has several drawbacks:
[0004] 1. Because the position of the silicon material loading frame is fixed, it cannot produce a cleaning effect, and there are cleaning dead zones that ultrasonic waves cannot reach, so the cleaning effect cannot be guaranteed.
[0005] 2. During the cleaning process, the cleanliness of the cleaning solution decreases and fails to meet usage requirements. Therefore, a cleaner cleaning solution is needed, which is replenished into the cleaning tank via a circulation pump and inlet pipe. The cleaning solution overflows into an overflow trough located on one side of the cleaning tank and is then discharged through the filter. Because a single inlet pipe is used to replenish the cleaning solution, the distribution of the replenished solution within the tank is uneven, affecting the cleaning effect.
[0006] 3. The drain outlet of the cleaning tank is prone to blockage, making normal cleaning impossible. Utility Model Content
[0007] To solve the above-mentioned technical problems, this utility model provides a silicon wafer cleaning device, which effectively solves the above problems and overcomes the shortcomings of the prior art.
[0008] The technical solution adopted in this utility model is: a silicon wafer cleaning device, including a cleaning tank, comprising:
[0009] An ultrasonic vibrating plate is disposed inside the side wall of the cleaning tank.
[0010] A sling bracket is installed inside the cleaning tank and is movably connected to the side wall of the cleaning tank where the ultrasonic vibrating plate is not installed. It is used to place the material frame loaded with silicon wafers and can drive the material frame to move up and down.
[0011] A replenishment pipe is laid at the bottom of the cleaning tank, below the agitation support, and the replenishment pipe is provided with multiple liquid outlet holes.
[0012] Furthermore, the two ends of the throwing bracket are provided with throwing modules, which are disposed opposite to each other at the two ends of the cleaning tank and are movably connected to the side wall of the cleaning tank where the ultrasonic vibrating plate is not provided, thereby driving the throwing bracket to move up and down.
[0013] Furthermore, the throwing module includes,
[0014] A fixing sleeve is provided on the outside of the side wall of the cleaning tank where the ultrasonic transducer is not located;
[0015] A guide shaft is fitted inside the fixed sleeve, and the top of the guide shaft is connected to the projectile bracket, allowing it to move up and down along the fixed sleeve.
[0016] A positioning sensor is disposed on one side of the guide shaft to detect the position of the guide shaft.
[0017] Furthermore, an eccentric wheel is provided at the bottom of the guide shaft, and the eccentric wheel abuts against the bottom of the guide shaft. The rotation of the eccentric wheel can drive the guide shaft to move up and down.
[0018] Furthermore, the liquid outlet is located at the bottom of the liquid replenishment tube and is symmetrically arranged along the length of the liquid replenishment tube.
[0019] Furthermore, a heater is provided at the bottom of the replenishment pipe, and the heater is detachably connected to the cleaning tank.
[0020] Furthermore, a venting assembly is provided between the agitation bracket and the replenishment pipe, and the venting assembly has multiple vent holes for venting air into the cleaning tank.
[0021] Furthermore, the ventilation assembly includes,
[0022] A fixing frame is disposed between the agitator and the replenishment tube;
[0023] A clamping block is mounted on the fixed frame;
[0024] A ventilation pipe is clamped on the clamping block, and the ventilation pipe is provided with a plurality of ventilation holes.
[0025] Furthermore, the bottom of the cleaning tank is provided with a slag removal drawer for filtering slag, and the slag removal drawer is detachably connected to the cleaning tank.
[0026] Furthermore, a liquid level sensor is installed inside the cleaning tank.
[0027] The advantages and positive effects of this utility model are as follows: by adopting the above technical solution, the washing effect of the cleaning fluid is enhanced by moving the loading frame of silicon wafers up and down. The replenishment fluid is more evenly distributed in the cleaning tank by setting up the flat replenishment pipe, which improves the cleaning effect, ensures the normal operation of cleaning, and has a simple structure and is easy to operate. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer cleaning device according to an embodiment of the present invention.
[0029] Figure 2 This is a schematic diagram of a silicon wafer cleaning device with the protective cover removed from one side, according to an embodiment of this utility model.
[0030] Figure 3 This is a schematic diagram of the connection of a silicon wafer cleaning device's throwing bracket according to an embodiment of this utility model.
[0031] Figure 4 This is a top view of a silicon wafer cleaning device according to an embodiment of the present invention, with the cleaning tank without the throwing support.
[0032] Figure 5 This is a top view of a silicon wafer cleaning device according to an embodiment of the present invention, with the agitation support and ventilation assembly removed from the cleaning tank.
[0033] Figure 6 This is a schematic diagram of the liquid replenishment pipe structure of a silicon wafer cleaning device according to an embodiment of this utility model.
[0034] In the picture:
[0035] 10. Cleaning tank; 11. Overflow tank; 111. Overflow outlet.
[0036] 12. Sludge removal drawer; 13. Filter hole; 14. Drain outlet
[0037] 15. Slag removal port cover; 20. Ultrasonic vibrating plate; 30. Throwing support.
[0038] 31. Positioning plate; 40. Liquid replenishment tube; 41. Support frame
[0039] 42. Liquid outlet 50. Agitation module 51. Fixing sleeve
[0040] 52. Guide shaft 521. Connecting rod 522. Support plate
[0041] 53. Positioning sensor; 54. Protective cover; 55. Mounting bracket
[0042] 551, elongated hole; 56, connecting bracket; 561, detection end
[0043] 57. Eccentric wheel; 58. Drive shaft; 59. Drive motor
[0044] 60. Heater; 61. Temperature probe; 70. Ventilation assembly
[0045] 71. Filter 72. Mounting bracket 73. Clamping block
[0046] 80. Liquid level sensor DETAILED DESCRIPTION
[0047] This utility model provides a silicon wafer cleaning device, and the embodiments of this utility model will be described below with reference to the accompanying drawings.
[0048] In the description of the embodiments of this utility model, it should be understood that the terms "top," "bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, it should be noted that unless otherwise expressly specified and limited, the terms "set" and "connected" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements. Those skilled in the art can understand the specific meaning of the above terms in this utility model through specific circumstances.
[0049] like Figure 1 and Figure 2 As shown in the figure, an embodiment of the present invention provides a silicon wafer cleaning device, including a cleaning tank 10, an ultrasonic vibrating plate 20, a projectile support 30, and a replenishment pipe 40. The ultrasonic vibrating plate 20 is disposed opposite to the side wall of the cleaning tank 10 and is fixedly connected to the cleaning tank 10. The projectile support 30 is disposed inside the cleaning tank 10 and is movably connected to the side wall of the cleaning tank 10 without the ultrasonic vibrating plate 20. It is used to hold a frame containing silicon wafers and can move the frame up and down during the cleaning process, increasing the agitation effect of the cleaning fluid on the surface of the silicon wafers, making it easier for contaminants on the surface of the silicon wafers to fall off, and effectively cleaning even cleaning dead zones that ultrasonic waves cannot reach. The replenishment pipe 40 is horizontally laid at the bottom of the cleaning tank 10, below the projectile support 30, and has multiple outlet holes 42. Cleaning fluid is replenished into the cleaning tank 10 through the multiple outlet holes 42 at the bottom, making the cleaning fluid more uniform within the cleaning tank 10. An overflow tank 11 is provided on the side of the cleaning tank 10 where the ultrasonic transducer 20 is installed. An overflow outlet 111 is provided at the bottom of the overflow tank 11. The cleaning liquid in the cleaning tank 10 overflows into the overflow tank 11 and is discharged and then filtered and recycled.
[0050] Specifically, the agitation bracket 30 has agitation modules 50 at both ends. The agitation modules 50 are positioned opposite each other at the ends of the cleaning tank 10 and are movably connected to the sidewalls of the cleaning tank 10 where the ultrasonic vibrating plate 20 is not located, allowing the agitation bracket 30 to move up and down. In this embodiment, as... Figure 3 As shown, the throwing bracket 30 is specifically a U-shaped bracket. The horizontal part of the U-shaped bracket is located at the bottom of the cleaning tank 10 for placing the material frame. The vertical parts on both sides of the U-shaped bracket are used to connect the throwing module 50, which is installed on the outside of the cleaning tank 10. A positioning plate 31 is fixed on the horizontal part of the U-shaped bracket to engage with the material frame around its perimeter, preventing the material frame from falling off the throwing bracket 30 during the throwing process.
[0051] Specifically, the agitation module 50 includes a fixed sleeve 51, a guide shaft 52, and a positioning sensor 53. The fixed sleeve 51 is located on the outside of the side wall of the cleaning tank 10 where the ultrasonic vibrating plate 20 is not located. The guide shaft 52 is sleeved inside the fixed sleeve 51, and its top is connected to the agitation bracket 30, allowing it to move up and down along the fixed sleeve 51. A robotic arm is installed on the upper part of the cleaning tank 10 to remove the material frame from the cleaning tank 10. To avoid interference between the robotic arm and the agitation bracket 30, the robotic arm removes the material frame when the agitation bracket 30 is at its lowest position. Therefore, a positioning sensor 53 is installed on one side of the guide shaft 52 to detect the position of the guide shaft 52.
[0052] In this embodiment, the agitation module 50 includes two vertically arranged guide shafts 52. Two fixing sleeves 51 are fixed to the outside of the side wall of the cleaning tank 10 (where the ultrasonic vibrating plate 20 is not located) relative to the guide shafts 52. The guide shafts 52 pass through the interior of the fixing sleeves 51, with a clearance fit. The top of the guide shafts 52 is fixedly connected to the top of the vertical portion of the agitation bracket 30. The guide shafts 52 can move up and down along the fixing sleeves 51, thereby driving the agitation bracket 30 to move up and down. A protective cover 54 is fixedly installed on the outside of the guide shafts 52, and the protective cover 54 is fixedly connected to the top of the guide shafts 52.
[0053] In this embodiment, as Figure 1 and Figure 3As shown, a positioning sensor 53 is provided on one side of the guide shaft 52, and the positioning sensor 53 is fixed to the outer wall of the cleaning tank 10 by a fixing bracket 55. To facilitate the adjustment of the position of the positioning sensor 53, a vertical elongated hole 551 is provided on the fixing bracket 55, and the positioning sensor 53 is detachably connected to the elongated hole 551. A detection end 561 is provided on the side of the guide shaft 52 near the positioning sensor 53 via a vertically arranged connecting bracket 56. The top and bottom of the connecting bracket 56 are fixedly connected to the top and bottom of the guide shaft 52, respectively. A bent protrusion is integrally provided on the side of the connecting bracket 56 near the sensor, and the bent protrusion is the detection end 561. The guide shaft 52 can drive the detection end 561 to move up and down. The positioning sensor 53 is installed at the lower limit position of the detection end 561. When the positioning sensor 53 detects the detection end 561, the guide shaft 52 drives the throwing bracket 30 to the lowest position. After cleaning, the upper robotic arm can be used to remove the material frame from the cleaning tank 10.
[0054] Specifically, such as Figure 1 and Figure 2 As shown, an eccentric wheel 57 is provided at the bottom of the guide shaft 52. The eccentric wheel 57 abuts against the bottom of the guide shaft 52, and the rotation of the eccentric wheel 57 can drive the guide shaft 52 to move up and down. In this embodiment, a vertical connecting rod 521 is fixedly connected to the bottom of the guide shaft 52 on the same side, and a horizontal supporting plate 522 is fixed to the bottom of the connecting rod 521. The eccentric wheel 57 is located below the supporting plate 522. The eccentric wheels 57 located on both sides of the cleaning tank 10 are connected by a drive shaft 58. A drive motor 59 is installed at one end of the drive shaft 58. The drive motor 59 can drive both eccentric wheels 57 to rotate simultaneously through the drive shaft 58, thereby driving the guide shafts 52 on both sides of the cleaning tank 10 to move up and down.
[0055] Specifically, the liquid outlet 42 is located at the bottom of the replenishment pipe 40 and is symmetrically arranged along the length of the replenishment pipe 40. In this embodiment, as... Figure 4 and 5 As shown, the rectangular replenishment pipe 40 is laid flat at the bottom of the cleaning tank 10 via a support frame 41. Discharge holes 42 are provided at the bottom of the two longer sections of the rectangular replenishment pipe 40. Figure 6 As shown, at the bottom of each replenishment pipe 40, two rows of equally spaced outlet holes 42 are symmetrically arranged along the length of the replenishment pipe 40. A circulation pump is connected to the outside of the cleaning tank 10 to inject new cleaning fluid into the replenishment pipe 40. The cleaning fluid is ejected from multiple outlet holes 42 and slowly diffuses from bottom to top, making the new cleaning fluid more uniform in the cleaning tank 10.
[0056] Preferred, such as Figure 1 and Figure 5As shown, to improve the cleaning effect of the cleaning solution, a heater 60 is provided at the bottom of the replenishment pipe 40, and the heater 60 is detachably connected to the cleaning tank 10. In this embodiment, two heaters 60 are provided, and they are detachably connected to the cleaning tank 10 using clamps. A temperature probe 61 is installed on the side wall of the cleaning tank 10 to detect the temperature of the cleaning solution.
[0057] Preferred, such as Figure 4 As shown, a venting assembly 70 is provided between the agitation bracket 30 and the replenishment pipe 40. The venting assembly 70 has multiple vent holes for venting air into the cleaning tank 10. During the venting process, multiple bubbles are generated. These bubbles rise, contact the silicon wafer, and burst. The vibration generated by the bursting further ensures the cleaning effect. Figure 1 As shown, in order to ensure the cleanliness of the gas, a filter 71 can be installed on the cleaning tank 10 to filter the incoming gas.
[0058] Specifically, the ventilation assembly 70 includes a fixed bracket 72, clamping blocks 73, and a ventilation pipe. The ventilation pipe is not shown in the figure. The fixed bracket 72 is positioned between the agitator bracket 30 and the replenishment pipe 40, and is fixed to the bottom plate of the cleaning tank 10. Multiple clamping blocks 73 are fixed to the upper part of the fixed bracket 72. The ventilation pipe is clamped in the clamping blocks 73 and laid flat on the fixed bracket 72. A support frame 41 is fixed to the bottom of the fixed bracket 72 to support the replenishment pipe 40.
[0059] Preferred, such as Figure 1 , Figure 4 and Figure 5 As shown, during the cleaning process, slag accumulates at the bottom of the cleaning tank 10, clogging the drain port 14. Therefore, a slag removal drawer 12 is provided at the bottom of the cleaning tank 10 to filter the slag. The slag removal drawer 12 is detachably connected to the cleaning tank 10, making it easy to remove and clean. In this embodiment, the slag removal drawer 12 is located on the side of the cleaning tank 10 away from the overflow tank 11. The bottom of the cleaning tank 10 is an inclined surface, and a groove is provided at the lower end of the inclined surface to house the slag removal drawer 12. The slag removal drawer 12 has filter holes 13, and a drain port 14 is provided at the bottom of the groove. The cleaning liquid flows to the slag removal drawer 12 through the inclined surface, is filtered by the slag removal drawer 12, and is discharged through the drain port 14. At one end of the slag removal drawer 12, a slag removal port is provided on the side wall of the cleaning tank 10, through which the slag removal drawer 12 can be removed from the cleaning tank 10 for cleaning. A slag cleaning port cover 15 is installed on the slag cleaning port by means of a clamp, making the slag cleaning port cover 15 easy to remove and convenient to take out and put in the slag cleaning drawer 12.
[0060] Preferred, such as Figure 2As shown, a liquid level sensor 80 is installed inside the cleaning tank 10 to detect the liquid level of the cleaning fluid. When the cleaning fluid level is higher than the maximum limit, an alarm is triggered; when the cleaning fluid level is lower than the working level, the ultrasonic vibrating plate 20 and the heater 60 are not turned on; when the cleaning fluid level is lower than the minimum limit, operation stops.
[0061] The advantages and positive effects of this utility model are:
[0062] 1. By setting up a scouring bracket and a scouring module to move the silicon wafer loading frame up and down, the cleaning effect is enhanced, and the cleaning effect can be guaranteed even in cleaning dead corners that ultrasonic waves cannot reach;
[0063] 2. The cleaning effect was further ensured by installing a heater and ventilation components;
[0064] 3. By laying a replenishment pipe flat at the bottom of the cleaning tank, the replenished cleaning solution is more evenly distributed in the cleaning tank;
[0065] 4. By setting up a removable slag removal drawer, the blockage of the drain outlet is reduced, ensuring the normal cleaning of silicon wafers.
[0066] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.
Claims
1. A silicon wafer cleaning apparatus, comprising a cleaning tank, characterized in that, include: An ultrasonic vibrating plate is disposed inside the side wall of the cleaning tank. A sling bracket is installed inside the cleaning tank and is movably connected to the side wall of the cleaning tank where the ultrasonic vibrating plate is not installed. It is used to place the material frame loaded with silicon wafers and can drive the material frame to move up and down. A replenishment pipe is laid at the bottom of the cleaning tank, below the agitation support, and the replenishment pipe is provided with multiple liquid outlet holes.
2. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The throwing bracket has throwing modules at both ends. The throwing modules are arranged opposite to each other at both ends of the cleaning tank and are movably connected to the side wall of the cleaning tank where the ultrasonic vibrating plate is not provided, which can drive the throwing bracket to move up and down.
3. The silicon wafer cleaning apparatus according to claim 2, characterized in that: The projectile module includes, A fixing sleeve is provided on the outside of the side wall of the cleaning tank where the ultrasonic transducer is not located; A guide shaft is fitted inside the fixed sleeve, and the top of the guide shaft is connected to the projectile bracket, allowing it to move up and down along the fixed sleeve. A positioning sensor is disposed on one side of the guide shaft to detect the position of the guide shaft.
4. The silicon wafer cleaning apparatus according to claim 3, characterized in that: An eccentric wheel is provided at the bottom of the guide shaft. The eccentric wheel abuts against the bottom of the guide shaft. The rotation of the eccentric wheel can drive the guide shaft to move up and down.
5. A silicon wafer cleaning apparatus according to any one of claims 1-4, characterized in that: The liquid outlet is located at the bottom of the liquid replenishment tube and is symmetrically arranged along the length of the liquid replenishment tube.
6. A silicon wafer cleaning apparatus according to claim 5, characterized in that: The bottom of the replenishment pipe is equipped with a heater, which is detachably connected to the cleaning tank.
7. A silicon wafer cleaning apparatus according to any one of claims 1-4 and 6, characterized in that: A ventilation assembly is provided between the agitation bracket and the replenishment pipe. The ventilation assembly has multiple ventilation holes for venting air into the cleaning tank.
8. A silicon wafer cleaning apparatus according to claim 7, characterized in that: The ventilation assembly includes, A fixing frame is disposed between the agitator and the replenishment tube; A clamping block is mounted on the fixed frame; A ventilation pipe is clamped on the clamping block, and the ventilation pipe is provided with a plurality of ventilation holes.
9. A silicon wafer cleaning apparatus according to any one of claims 1-4, 6 and 8, characterized in that: The bottom of the cleaning tank is equipped with a slag removal drawer for filtering slag, and the slag removal drawer is detachably connected to the cleaning tank.
10. A silicon wafer cleaning apparatus according to claim 9, characterized in that: The cleaning tank is equipped with a liquid level sensor.