Cooling device for semiconductor chip cutting

Abstract

The utility model belongs to the technical field of electronic devices, in particular to a cooling device for semiconductor chip cutting, which comprises a mounting plate, and a cooling mechanism and a dust collection mechanism are respectively arranged above the mounting plate. The cooling mechanism comprises a cooling pipe, and the cooling mechanism realizes the action of cooling the semiconductor chip by cooling liquid flowing in the cooling pipe; the dust suction mechanism comprises a dust suction machine, and the dust suction mechanism achieves the action that the dust suction machine sucks smoke particles on the surface of the semiconductor chip. According to the cooling device for semiconductor chip cutting, the cooling mechanism and the dust collection mechanism are arranged, and the cooling mechanism cools a semiconductor chip from the lower portion of the mounting plate through cooling liquid circularly flowing in the cooling pipe; the dust suction mechanism sucks hot air and smoke particles generated on the surface of the semiconductor chip during cutting through a dust suction machine above the semiconductor chip, and the technical problems that an existing cooling device is inconvenient for cyclic utilization of cooling liquid and poor in dust suction efficiency are solved.

Description

Technical Field

[0001] This utility model relates to the field of electronic device technology, and in particular to a cooling device for semiconductor chip cutting. Background Technology

[0002] A cooling device for semiconductor chip dicing disclosed on a Chinese patent website (publication number: CN215433087U) solves the problem of traditional equipment spraying coolant to rinse and cool the dicing point during dicing. However, this method of adding coolant results in the operator's hands, workbench, and chip being covered with coolant, making cleaning difficult. The following issues still exist:

[0003] In actual use, the dust particles generated during cutting will spread to the surrounding working environment. The cooling pipes are filled with coolant, which carries away the accumulated heat through heat transfer. This makes it difficult to recycle the coolant. The fan blows the hot air and dust towards the vacuum cleaner, but the distance between the two sides and the cutting parts block the flow, resulting in poor dust collection efficiency and making it inconvenient to use. Utility Model Content

[0004] Based on the technical problems of existing cooling devices, such as inconvenience in recycling coolant and poor dust collection efficiency, this utility model proposes a cooling device for semiconductor chip cutting.

[0005] The present invention discloses a cooling device for semiconductor chip cutting, comprising a mounting plate, wherein a cooling mechanism and a dust extraction mechanism are respectively arranged on the top of the mounting plate.

[0006] The cooling mechanism is located below the vacuuming mechanism.

[0007] The cooling mechanism includes a cooling pipe, which enables the coolant flowing inside the cooling pipe to cool the semiconductor chip.

[0008] The dust collection mechanism includes a vacuum cleaner, which enables the vacuum cleaner to suck up dust particles from the surface of the semiconductor chip.

[0009] Preferably, the cooling mechanism further includes a circulating water tank, the surface of which is provided with a circulating air duct and a sliding groove, a circulating fan is fixedly connected to the surface of the circulating air duct, and two circulating fans are symmetrically distributed about the axis of the circulating water tank. A filter plate is fixedly connected to the surface of the sliding groove, the filter plate is located inside the circulating water tank, and the circulating fan is located above the filter plate.

[0010] Preferably, the two ends of the cooling pipe are respectively fixedly connected to an inlet water pipe and a return water pipe. One end of the inlet water pipe is fixedly connected to the outlet of the circulating water tank, and one end of the return water pipe is fixedly connected to the inlet of the circulating water tank. A circulating water pump and a one-way valve are respectively fixedly connected to the surface of the inlet water pipe.

[0011] Preferably, a heat-conducting plate is fixedly connected to the surface of the cooling pipe, the surface of the heat-conducting plate is fixedly connected to the lower surface of the mounting plate, and a support column is fixedly connected to the lower surface of the mounting plate, with a plurality of support columns symmetrically distributed about the axis of the mounting plate.

[0012] Preferably, the vacuuming mechanism further includes a top plate, on the surface of which guide columns and a lifting motor are fixedly connected respectively. Multiple guide columns are symmetrically distributed around the axis of the top plate. A flip plate is rotatably connected to the surface of the mounting plate. Two flip plates are symmetrically distributed around the axis of the mounting plate. The lower ends of multiple guide columns are fixedly connected to the surface of the flip plates. A lifting plate is slidably connected to the surface of each guide column. The lower surface of the lifting plate is fixedly connected to the surface of the vacuum cleaner. A flip cylinder is rotatably connected to the surface of the mounting plate. Two flip cylinders are symmetrically distributed around the axis of the mounting plate. The output shafts of both flip cylinders are rotatably connected to the surfaces of the two flip plates.

[0013] Preferably, a lifting screw is threadedly connected to the surface of the lifting plate, and a transmission pulley is fixedly connected to the surface of the lifting screw. The two ends of the lifting screw are rotatably connected to the surface of the top plate and the surface of the tilting plate, respectively. The two lifting screws are symmetrically distributed about the axis of the lifting plate. The surfaces of the two transmission pulleys are connected by belt drive. The output shaft of the lifting motor is fixedly connected to one end of the lifting screw through a coupling.

[0014] The beneficial effects of this utility model are as follows:

[0015] By setting up a cooling mechanism and a dust collection mechanism, the cooling mechanism cools the semiconductor chip from below the mounting plate through the coolant circulating inside the cooling pipe, while the dust collection mechanism uses a vacuum cleaner to remove the hot air and dust particles generated on the surface of the semiconductor chip during the cutting process. This solves the technical problems of existing cooling devices, such as the inconvenience of coolant recycling and poor dust collection efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a cooling device for semiconductor chip cutting proposed in this utility model;

[0017] Figure 2This is a front view of the structure of a vacuum cleaner for a cooling device used in semiconductor chip cutting, as proposed in this utility model.

[0018] Figure 3 This is a perspective view of the transmission pulley structure of a cooling device for semiconductor chip cutting proposed in this utility model;

[0019] Figure 4 This is a three-dimensional view of the filter plate structure of a cooling device for semiconductor chip cutting proposed in this utility model.

[0020] In the diagram: 1. Mounting plate; 2. Cooling pipe; 3. Vacuum cleaner; 201. Circulating water tank; 202. Circulating fan; 203. Filter plate; 204. Water inlet pipe; 205. Water return pipe; 206. Circulating water pump; 207. Check valve; 208. Heat conduction plate; 209. Support column; 301. Top plate; 302. Guide column; 303. Lifting motor; 304. Lifting plate; 305. Lifting screw; 306. Transmission pulley; 307. Tilting cylinder; 308. Tilting plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1-4 A cooling device for semiconductor chip cutting includes a mounting plate 1, with a cooling mechanism and a dust extraction mechanism respectively disposed on the top of the mounting plate 1.

[0023] The cooling mechanism is located below the vacuuming mechanism.

[0024] To reduce the heat generated during semiconductor chip dicing, which can negatively impact chip performance, a cooling mechanism is implemented. (Refer to...) Figure 1 , Figure 2 and Figure 4 The cooling mechanism includes a cooling pipe 2, which enables the coolant flowing inside the cooling pipe 2 to cool the semiconductor chip.

[0025] The cooling mechanism also includes a circulating water tank 201. The surface of the circulating water tank 201 is provided with a circulating air duct and a slide groove. A circulating fan 202 is fixedly connected to the surface of the circulating air duct. The two circulating fans 202 are symmetrically distributed with the axis of the circulating water tank 201 as the center. A filter plate 203 is fixedly connected to the surface of the slide groove. The filter plate 203 is located inside the circulating water tank 201, and the circulating fan 202 is located above the filter plate 203.

[0026] Furthermore, the circulating fan 202 accelerates the heat dissipation of the coolant inside the circulating water tank 201, facilitating the circulation of the coolant. A filter plate 203 is installed below the circulating fan 202 to prevent dust and debris from mixing into the coolant below.

[0027] The cooling pipe 2 is fixedly connected to the water inlet pipe 204 and the water return pipe 205 at both ends. One end of the water inlet pipe 204 is fixedly connected to the outlet of the circulating water tank 201, and one end of the water return pipe 205 is fixedly connected to the inlet of the circulating water tank 201. The surface of the water inlet pipe 204 is fixedly connected to the circulating water pump 206 and the one-way valve 207.

[0028] Furthermore, the return water pipe 205 draws coolant from the cooling pipe 2 into the cooling pipe 2 through the inlet above the circulating water tank 201, and the circulating water pump 206 on one side of the circulating water tank 201 pumps coolant into the cooling pipe 2 through the outlet below the circulating water tank 201 via the upper water pipe 204.

[0029] A heat-conducting plate 208 is fixedly connected to the surface of the cooling pipe 2. The surface of the heat-conducting plate 208 is fixedly connected to the lower surface of the mounting plate 1. A support column 209 is fixedly connected to the lower surface of the mounting plate 1. Multiple support columns 209 are symmetrically distributed around the axis of the mounting plate 1.

[0030] Furthermore, the cooling pipe 2 is fixedly connected to the surface of the mounting plate 1 via the heat-conducting plate 208 to improve heat dissipation efficiency.

[0031] A dust extraction mechanism is installed to remove the heat and dust particles generated during the dicing of semiconductor chips, as described above. Figures 1-3 The dust collection mechanism includes a vacuum cleaner 3, which enables the vacuum cleaner 3 to suck up dust particles from the surface of the semiconductor chip.

[0032] The vacuuming mechanism also includes a top plate 301. Guide columns 302 and a lifting motor 303 are fixedly connected to the surface of the top plate 301. Multiple guide columns 302 are symmetrically distributed around the axis of the top plate 301. A flip plate 308 is rotatably connected to the surface of the mounting plate 1. Two flip plates 308 are symmetrically distributed around the axis of the mounting plate 1. The lower ends of multiple guide columns 302 are fixedly connected to the surface of the flip plate 308. A lifting plate 304 is slidably connected to the surface of multiple guide columns 302. The lower surface of the lifting plate 304 is fixedly connected to the surface of the vacuum cleaner 3. A flip cylinder 307 is rotatably connected to the surface of the mounting plate 1. Two flip cylinders 307 are symmetrically distributed around the axis of the mounting plate 1. The output shafts of the two flip cylinders 307 are rotatably connected to the surfaces of the two flip plates 308.

[0033] Furthermore, the flip cylinder 307 adjusts the suction angle of the lifting plate 304, and the vacuum cleaner 3 absorbs the heat and dust particles generated during the chip cutting process above the semiconductor chip, thereby improving heat dissipation efficiency.

[0034] The surface of the lifting plate 304 is threaded with a lifting screw 305, and the surface of the lifting screw 305 is fixedly connected with a transmission pulley 306. The two ends of the lifting screw 305 are rotatably connected to the surface of the top plate 301 and the surface of the tilting plate 308, respectively. The two lifting screws 305 are symmetrically distributed with the axis of the lifting plate 304 as the center. The surfaces of the two transmission pulleys 306 are connected by belt drive. The output shaft of the lifting motor 303 is fixedly connected to one end of the lifting screw 305 through a coupling.

[0035] Furthermore, the lifting motor 303 installed on the surface of the top plate 301 drives the lifting plate 304 to move up and down through the lifting screw 305, and the transmission pulleys 306 on the surfaces of the two lifting screws 305 are connected by belt drive to realize the synchronous rotation of the two lifting screws 305.

[0036] By setting up a cooling mechanism and a dust collection mechanism, the cooling mechanism cools the semiconductor chip from below the mounting plate 1 through the coolant circulating inside the cooling pipe 2, while the dust collection mechanism uses a vacuum cleaner 3 to collect the hot air and dust particles generated on the surface of the semiconductor chip during cutting. This solves the technical problems of existing cooling devices, such as the inconvenience of coolant recycling and poor dust collection efficiency.

[0037] Working principle:

[0038] Before use, the lower surface of the mounting plate 1 is fixedly connected to the surface of the cooling pipe 2 via the heat-conducting plate 208. The cooling liquid circulating inside the cooling pipe 2 cools the semiconductor chip on the surface of the mounting plate 1. The two ends of the cooling pipe 2 are fixedly connected to the water inlet pipe 204 and the water outlet pipe 205, respectively. The circulating water pump 206 pumps the cooling liquid inside the circulating water tank 201 from the outlet at the bottom of the circulating water tank 201 through the water inlet pipe 204. The liquid flows into the cooling pipe 2 through the one-way valve 207 on the surface of the water inlet pipe 204, and after exchanging heat with the heat-conducting plate 208, it cools the semiconductor chip on the surface of the mounting plate 1. The other end flows into the upper part of the circulating water tank 201 through the return water pipe 205. The circulating water tank 201 is equipped with a filter plate 203 located above the coolant inside the circulating water tank 201 to filter the coolant flowing in from the upper return pipe. A circulating air duct is provided above the filter plate 203. A circulating fan 202 is provided on the surface of the circulating water tank 201 to accelerate the heat dissipation of the coolant inside the circulating water tank 201 through the circulating air duct, which facilitates the circulation of the coolant. A lifting motor 303 is provided on the surface of the top plate 301, which drives the lifting screw 305 to rotate. The two lifting screws 305 are connected by belt drives via pulleys, enabling them to rotate synchronously. Both lifting screws 305 are threadedly connected to the lifting plate 304. The surface of the lifting plate 304 is slidably connected to the surfaces of multiple guide posts 302. The lifting screws 305 drive the lifting plate 304 to move along the axis of the guide posts 302, adjusting the distance between the vacuum cleaner 3 and the semiconductor chip located below the lifting plate 304. The tilting cylinder 307, rotatably connected to the surface of the mounting plate 1, drives the guide posts 302 and the lifting screws 305 to tilt via the tilting plate 308, adjusting the suction angle of the vacuum cleaner 3 to improve suction efficiency.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A cooling device for semiconductor chip dicing, comprising a mounting plate (1), characterized in that: A cooling mechanism and a dust extraction mechanism are respectively provided on the top of the mounting plate (1); The cooling mechanism is located below the vacuuming mechanism; The cooling mechanism includes a cooling pipe (2), which enables the cooling liquid flowing inside the cooling pipe (2) to cool the semiconductor chip. The dust collection mechanism includes a vacuum cleaner (3), which enables the vacuum cleaner (3) to suck up dust particles from the surface of the semiconductor chip.

2. The cooling device for semiconductor chip cutting according to claim 1, characterized in that: The cooling mechanism also includes a circulating water tank (201). The surface of the circulating water tank (201) is provided with a circulating air duct and a slide groove. A circulating fan (202) is fixedly connected to the surface of the circulating air duct. The two circulating fans (202) are symmetrically distributed with the axis of the circulating water tank (201) as the center. A filter plate (203) is fixedly connected to the surface of the slide groove. The filter plate (203) is located inside the circulating water tank (201), and the circulating fan (202) is located above the filter plate (203).

3. The cooling device for semiconductor chip cutting according to claim 2, characterized in that: The cooling pipe (2) is fixedly connected to an inlet water pipe (204) and a return water pipe (205) at both ends. One end of the inlet water pipe (204) is fixedly connected to the outlet of the circulating water tank (201), and one end of the return water pipe (205) is fixedly connected to the inlet of the circulating water tank (201). A circulating water pump (206) and a one-way valve (207) are fixedly connected to the surface of the inlet water pipe (204).

4. The cooling device for semiconductor chip cutting according to claim 1, characterized in that: A heat-conducting plate (208) is fixedly connected to the surface of the cooling pipe (2). The surface of the heat-conducting plate (208) is fixedly connected to the lower surface of the mounting plate (1). A support column (209) is fixedly connected to the lower surface of the mounting plate (1). A plurality of support columns (209) are symmetrically distributed with the axis of the mounting plate (1) as the center.

5. The cooling device for semiconductor chip cutting according to claim 1, characterized in that: The dust collection mechanism also includes a top plate (301), on which guide columns (302) and a lifting motor (303) are fixedly connected respectively. Multiple guide columns (302) are symmetrically distributed about the axis of the top plate (301). A rotating plate (308) is rotatably connected to the surface of the mounting plate (1). Two rotating plates (308) are symmetrically distributed about the axis of the mounting plate (1). The lower ends of multiple guide columns (302) are respectively connected to the rotating plates (303). The surfaces of the guide columns (302) are fixedly connected to the surface of the vacuum cleaner (3), and the surfaces of the guide columns (302) are slidably connected to the lifting plates (304). The lower surface of the lifting plates (304) is fixedly connected to the surface of the vacuum cleaner (3). The surface of the mounting plate (1) is rotatably connected to the tilting cylinders (307). The two tilting cylinders (307) are symmetrically distributed with the axis of the mounting plate (1) as the center. The output shafts of the two tilting cylinders (307) are rotatably connected to the surfaces of the two tilting plates (308).

6. The cooling device for semiconductor chip dicing according to claim 5, characterized in that: The lifting plate (304) is threadedly connected to a lifting screw (305), and a transmission pulley (306) is fixedly connected to the surface of the lifting screw (305). The two ends of the lifting screw (305) are rotatably connected to the surface of the top plate (301) and the surface of the tilting plate (308), respectively. The two lifting screws (305) are symmetrically distributed with the axis of the lifting plate (304) as the center. The surfaces of the two transmission pulleys (306) are connected by belt drive. The output shaft of the lifting motor (303) is fixedly connected to one end of the lifting screw (305) through a coupling.

Images