Mold pressing heating structure integrating temperature monitoring

Abstract

The utility model relates to the technical field of molding press devices, in particular to an integrated temperature monitoring molding press heating structure which comprises a lower mold assembly and an upper mold assembly which can be close to or far away from each other, and further comprises a temperature measuring component which comprises an outer temperature measuring assembly and an inner temperature measuring assembly. The outer temperature measuring assembly comprises a lower mold outer temperature measuring optical fiber arranged on the outer side of the lower mold assembly in a wrapping mode and an upper mold outer temperature measuring optical fiber arranged on the outer side of the upper mold assembly in a wrapping mode. The inner temperature measuring assembly comprises a lower die inner temperature measuring optical fiber arranged in the lower die assembly and an upper die inner temperature measuring optical fiber arranged in the upper die assembly. The temperature outside the lower mold and the temperature outside the upper mold can be quickly and accurately measured by using the temperature measuring optical fiber outside the lower mold and the temperature measuring optical fiber outside the upper mold; the temperature measurement optical fiber in the lower mold and the temperature measurement optical fiber in the upper mold can be used for quickly and accurately measuring the temperature in the lower mold assembly and the upper mold assembly, so that the problem of low temperature monitoring precision of the mold assembly in the related technology is solved.

Description

Technical Field

[0001] This application relates to the field of molding machine equipment technology, and in particular to a molding heating structure with integrated temperature monitoring. Background Technology

[0002] Optical glass is a type of glass material used in the manufacture of lenses, prisms, mirrors, windows, etc., for optical instruments or mechanical systems. It has wide applications in consumer electronics, medical devices, and military weaponry. Precision molding technology, with its advantages of high precision, high efficiency, and low cost, has become the primary method for mass production of optical glass components. Precision molding technology uses a molding machine to heat and shape optical glass components. Heating methods include gas flame heating, infrared heating, and resistance wire heating.

[0003] The mold assembly of a molding machine is the core production area, characterized by high temperatures and complex processes. It involves intricate heat exchange with the external environment, necessitating temperature monitoring and control during processing. Conventional temperature monitoring methods include thermocouple measurement and infrared monitoring. Thermocouples require specific design and installation based on the equipment's structure and thermal environment. Their limited, single-point measurement capabilities make them ill-suited to accurately reflect the temperature characteristics of the core area, resulting in low accuracy and slow response. Infrared monitoring, on the other hand, is susceptible to interference from various radiating surfaces, leading to significant data errors. Neither method meets the high precision requirements of optical glass production. Utility Model Content

[0004] To address the issue of low temperature monitoring accuracy in mold components in related technologies, this invention provides a molding heating structure with integrated temperature monitoring.

[0005] A molding heating structure with integrated temperature monitoring includes a lower mold assembly and an upper mold assembly that can be brought close together or moved away from each other, and also includes a temperature measuring component. The temperature measuring component includes an outer temperature measuring component and an inner temperature measuring component. The outer temperature measuring component includes a lower mold outer temperature measuring optical fiber covering the outside of the lower mold assembly and an upper mold outer temperature measuring optical fiber covering the outside of the upper mold assembly. The inner temperature measuring component includes a lower mold inner temperature measuring optical fiber disposed inside the lower mold assembly and an upper mold inner temperature measuring optical fiber disposed in the upper mold assembly.

[0006] Furthermore, the lower mold assembly includes a lower mold base plate, the lower mold base plate is provided with a lower mold component and a lower heating element, the lower mold component has a lower mold cavity; the upper mold assembly includes an upper mold base plate, the upper mold base plate is provided with an upper mold component and an upper heating element, the upper mold component has an upper mold cavity, the upper mold cavity faces the lower mold cavity.

[0007] Furthermore, the upper mold external temperature measuring optical fiber includes an upper mold segment and an upper substrate segment. The upper mold segment is spirally arranged along the circumferential direction of the upper mold, and the upper substrate segment is spirally arranged along the circumferential direction of the upper mold substrate.

[0008] Furthermore, the upper mold segment has a starting point, which is located on the side of the upper mold cavity near the upper mold base plate.

[0009] Furthermore, the upper mold substrate has an upper mold base groove, and the upper mold component has an upper mold groove; the upper mold segment is fitted into the upper mold groove, and the upper substrate segment is fitted into the upper mold base groove.

[0010] Furthermore, the upper heating element is spirally diffused along the circumferential direction of the upper mold substrate, and the temperature-measuring optical fiber inside the upper mold is disposed on the upper mold substrate along the arrangement direction of the upper heating element, with the temperature-measuring optical fiber inside the upper mold disposed on one side of the upper heating element.

[0011] Furthermore, the structure of the lower mold external temperature measuring fiber is the same as that of the upper mold external temperature measuring fiber; the structure of the lower mold internal temperature measuring fiber is the same as that of the upper mold internal temperature measuring fiber.

[0012] This utility model has the following advantages:

[0013] 1. This utility model discloses a molding heating structure with integrated temperature monitoring. By setting up a temperature measuring component, which includes an outer temperature measuring component and an inner temperature measuring component, the outer temperature measuring fiber of the lower mold and the outer temperature measuring fiber of the upper mold can be used to quickly and accurately measure the temperature of the outer side of the lower mold and the upper mold components. The inner temperature measuring fiber of the lower mold and the inner temperature measuring fiber of the upper mold can be used to quickly and accurately measure the temperature of the inner side of the lower mold and the upper mold components. By adopting a distributed temperature measurement method, the measurement efficiency can be improved while ensuring the accuracy of temperature measurement, thereby improving the problem of low temperature monitoring accuracy of mold components in related technologies.

[0014] 2. This utility model discloses a molding heating structure with integrated temperature monitoring. By setting upper substrate grooves and upper mold grooves to adapt the upper substrate segment and upper mold segment of the external temperature-sensing optical fiber, the contact area between the external temperature-sensing optical fiber and the upper mold assembly is effectively increased, thereby further increasing the accuracy of temperature measurement. Simultaneously, by setting an internal temperature-sensing optical fiber that fits the heating element, the molding heating structure can accurately measure the temperature at the heating element, thus facilitating the determination and control of the heating structure's temperature. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a molding heating structure with integrated temperature monitoring according to an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of the lower mold assembly and the upper mold assembly in the embodiments of this application;

[0018] Figure 3 This is a schematic diagram of the cross-section of the temperature-measuring optical fiber in the upper heating body in an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1. Lower mold assembly; 11. Lower mold base plate; 12. Lower mold component; 121. Lower mold cavity; 13. Lower heating element; 2. Upper mold assembly; 21. Upper mold base plate; 22. Upper mold component; 221. Upper mold cavity; 23. Upper heating element; 3. Temperature measuring component; 31. External temperature measuring component; 311. Lower mold external temperature measuring fiber; 312. Upper mold external temperature measuring fiber; 3121. Upper mold segment; 3122. Upper base plate segment; 32. Internal temperature measuring component; 321. Upper mold internal temperature measuring fiber. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Reference Figure 1 as well as Figure 2 A molding heating structure with integrated temperature monitoring includes a lower mold assembly 1 and an upper mold assembly 2 that can be brought close together or moved away from each other, and a temperature measuring component 3. During operation, the lower mold assembly 1 and the upper mold assembly 2 process the material. During this process, the temperature measuring component 3 monitors the temperature of the lower mold assembly 1 and the upper mold assembly 2. Based on the temperature monitoring results, the temperature of the molding heating structure can be easily and instantly adjusted to ensure the quality of the finished product.

[0026] Specifically, the lower mold assembly 1 includes a lower mold base plate 11, on which a lower mold component 12 and a lower heating element 13 are disposed. The lower mold component 12 is fixedly connected to the lower mold base plate 11 and has a lower mold cavity 121 facing the upper mold assembly 2. The lower heating element 13 may specifically be a heating wire, and the lower heating element 13 is spirally diffused along the circumferential direction of the lower mold base plate 11.

[0027] Similarly, the upper mold assembly 2 includes an upper mold base plate 21, on which an upper mold component 22 and an upper heating element 23 are disposed. The upper mold component 22 is fixedly connected to the upper mold base plate 21 and has an upper mold cavity 221 facing the lower mold cavity 121. The upper heating element 23 may specifically be a heating wire. The upper heating element 23 is spirally diffused along the circumferential direction of the upper mold base plate 21, and is connected to a heating lead for providing energy.

[0028] Reference Figure 1 , Figure 2 as well as Figure 3The temperature measuring component 3 includes an external temperature measuring component 31 and an internal temperature measuring component 32. The external temperature measuring component 31 is used to measure the temperature of the outer side of the heating structure, and the internal temperature measuring component 32 is used to measure the temperature of the inner side of the heating structure. The external temperature measuring component 31 includes a lower mold external temperature measuring fiber 311 covering the outer side of the lower mold component 1 and an upper mold external temperature measuring fiber 312 covering the outer side of the upper mold component 2. The structure of the lower mold external temperature measuring fiber 311 is the same as that of the upper mold external temperature measuring fiber 312.

[0029] Taking the external temperature sensing fiber 312 as an example, the external temperature sensing fiber 312 includes an upper mold segment 3121 and an upper substrate segment 3122. The upper mold segment 3121 is spirally arranged along the circumferential direction of the upper mold 22, and the upper substrate segment 3122 is spirally arranged along the circumferential direction of the upper mold substrate 21. In this embodiment, the upper mold segment 3121 has a starting point located on the side of the upper mold cavity 221 near the upper mold substrate 21. The upper mold segment 3121 is wound through the upper mold 22 and then connected to the upper substrate segment 3122. The upper substrate segment 3122 is wound through the upper mold substrate 21 and then connected to the internal temperature sensing component 32. It can be understood that the upper mold segment 3121 and the upper substrate segment 3122 can also be independently arranged temperature sensing fiber segments. To accommodate the installation of the upper mold segment 3121 and the upper substrate segment 3122, the upper mold substrate 21 and the upper mold component 22 are provided with upper mold slots. The upper mold segment 3121 and the upper substrate segment 3122 are fitted into the upper mold slots. Through the upper mold slots and upper substrate slots, the external temperature-sensing fiber optic cable 312 can be quickly fitted and installed. This also increases the contact area between the external temperature-sensing fiber optic cable 312 and the upper mold component 2, thereby enabling stable monitoring of the temperature process and distribution during heating and cooling. This makes temperature monitoring and control fast and controllable, facilitating efficient and accurate temperature acquisition.

[0030] The internal temperature measurement component 32 includes a lower mold internal temperature measurement fiber disposed inside the lower mold component 1 and an upper mold internal temperature measurement fiber 321 disposed in the upper mold component 2. The structure of the lower mold internal temperature measurement fiber is the same as that of the upper mold internal temperature measurement fiber 321. Taking the upper mold internal temperature measurement fiber 321 as an example, the upper mold internal temperature measurement fiber 321 is disposed on the upper mold substrate 21 along the arrangement direction of the upper heating body 23. That is, the routing shape of the upper mold internal temperature measurement fiber 321 is similar to the routing shape of the upper heating body 23, and the upper mold internal temperature measurement fiber 321 is disposed on one side of the upper heating body 23. In this embodiment, the starting point of the upper mold internal temperature measurement fiber 321 is connected to the upper substrate segment 3122, and the upper mold internal temperature measurement fiber 321 spirals through the upper heating body 23 and then connects to the outer end cable on one side of the upper heating body 23.

[0031] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A molding heating structure with integrated temperature monitoring, comprising a lower mold assembly (1) and an upper mold assembly (2) that can move closer to or further away from each other, characterized in that, It also includes a temperature measuring component (3), which includes an external temperature measuring component (31) and an internal temperature measuring component (32); the external temperature measuring component (31) includes a lower mold external temperature measuring fiber (311) covering the outside of the lower mold component (1) and an upper mold external temperature measuring fiber (312) covering the outside of the upper mold component (2); the internal temperature measuring component (32) includes a lower mold internal temperature measuring fiber disposed inside the lower mold component (1) and an upper mold internal temperature measuring fiber (321) disposed in the upper mold component (2).

2. The molding heating structure with integrated temperature monitoring according to claim 1, characterized in that, The lower mold assembly (1) includes a lower mold base plate (11), which is provided with a lower mold component (12) and a lower heating element (13). The lower mold component (12) has a lower mold cavity (121). The upper mold assembly (2) includes an upper mold base plate (21), which is provided with an upper mold component (22) and an upper heating element (23). The upper mold component (22) has an upper mold cavity (221) facing the lower mold cavity (121).

3. The molding heating structure with integrated temperature monitoring according to claim 2, characterized in that, The upper mold external temperature measuring fiber (312) includes an upper mold segment (3121) and an upper substrate segment (3122). The upper mold segment (3121) is spirally arranged along the circumferential direction of the upper mold (22), and the upper substrate segment (3122) is spirally arranged along the circumferential direction of the upper mold substrate (21).

4. The molding heating structure with integrated temperature monitoring according to claim 3, characterized in that, The upper mold segment (3121) has a starting point located on the side of the upper mold cavity (221) near the upper mold base plate (21).

5. The molding heating structure with integrated temperature monitoring according to claim 3, characterized in that, The upper mold substrate (21) has an upper mold base groove, and the upper mold component (22) has an upper mold base groove; the upper mold segment (3121) is fitted into the upper mold base groove, and the upper mold base segment (3122) is fitted into the upper mold base groove.

6. A molding heating structure with integrated temperature monitoring according to any one of claims 2-5, characterized in that, The upper heating element (23) is spirally diffused along the circumferential direction of the upper mold substrate (21), and the temperature measuring fiber (321) inside the upper mold is disposed on the upper mold substrate (21) along the arrangement direction of the upper heating element (23). The temperature measuring fiber (321) inside the upper mold is disposed on one side of the upper heating element (23).

7. The molding heating structure with integrated temperature monitoring according to claim 6, characterized in that, The structure of the lower mold external temperature measuring fiber (311) is the same as that of the upper mold external temperature measuring fiber (312); the structure of the lower mold internal temperature measuring fiber is the same as that of the upper mold internal temperature measuring fiber (321).

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