Heating device of semiconductor detection equipment

Abstract

The utility model provides a heating device of semiconductor detection equipment, the semiconductor detection equipment defines a cavity to be heated for vacuumizing, the peripheral wall of the semiconductor detection equipment is provided with at least one characteristic part protruding outwards, and the heating device is characterized by comprising a heating cylinder, a heating device and a heating device, the heating cylinder is arranged around the outer side of the peripheral wall of the semiconductor detection equipment, avoiding openings are reserved in the positions, corresponding to the feature parts, of the heating cylinder, and an interlayer space is formed in the heating cylinder; and the heating assembly is arranged in the interlayer space of the heating cylinder and is used for generating heat in a controlled manner and transmitting the heat to the semiconductor detection equipment through the heating cylinder. The utility model has the advantages that the heating efficiency of the semiconductor detection equipment can be improved, and the working time cost of field operation is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a heating device for semiconductor testing equipment. Background Technology

[0002] In the current field of semiconductor equipment manufacturing and maintenance, ensuring stable operation of equipment in a high vacuum environment is crucial. Achieving a high vacuum environment often relies on effective heating of the equipment cavity to remove water and gas molecules adhering to the cavity surface. These molecules are then extracted using devices such as ion pumps to maintain the required vacuum level.

[0003] Traditional heating methods typically rely on silicone heating strips, which are tightly wrapped around the outer wall of a circular vacuum cavity. When energized, they heat up rapidly, transferring heat to the cavity to bake away internal moisture.

[0004] However, with existing heating methods, the internal temperature of the cavity often fails to reach the ideal temperature, affecting the subsequent vacuuming process. Utility Model Content

[0005] One objective of this invention is to overcome at least one technical defect in the prior art and to provide a heating device for a semiconductor testing equipment.

[0006] A further objective of this invention is to improve the heating efficiency of semiconductor testing equipment and reduce the time and cost of on-site operation.

[0007] Another further objective of this invention is to adjust the clamping tightness of the heating cylinder to the semiconductor detection equipment, so as to avoid poor contact that could affect the heating efficiency.

[0008] Another further objective of this invention is to further improve the heating efficiency of the heating cylinder for semiconductor testing equipment.

[0009] Specifically, this utility model provides a heating device for a semiconductor testing apparatus, wherein the semiconductor testing apparatus defines a cavity to be heated for vacuuming, and the outer peripheral wall of the semiconductor testing apparatus is provided with at least one outwardly protruding feature, characterized in that the heating device comprises:

[0010] A heating cylinder is disposed around the outer side of the outer peripheral wall of the semiconductor detection device. The heating cylinder has clearance openings corresponding to the positions of each of the aforementioned features. An internal space is formed within the heating cylinder.

[0011] A heating component is disposed within the interlayer space of the heating cylinder to generate heat in a controlled manner and transfer it to the semiconductor detection device through the heating cylinder.

[0012] Optionally, the heating cylinder is formed by bending a plate-like body, and a vertical strip-shaped adjustment port is formed at the mating side, and the heating device further includes:

[0013] At least one fastening component is provided at the adjustment port for changing the size of the adjustment port, thereby adjusting the clamping force of the heating cylinder on the semiconductor detection device.

[0014] Optionally, a gap is left between the periphery of the clearance opening and the feature portion to provide clamping allowance during the clamping process of the heating cylinder.

[0015] Optionally, each of the fastening components includes:

[0016] Two fixing members are respectively fixed to the heating cylinder on both sides of the adjustment port, and the two fixing members have coaxially arranged screw holes; and

[0017] Bolts are passed through the two said screw holes in sequence, thereby fastening them to the two said fasteners.

[0018] Optionally, each of the fastening components further includes:

[0019] A preload spring is pressed between the end of the bolt and the first fastener through which it passes.

[0020] Optionally, the edges at both ends of the heating cylinder are provided with reinforcing ribs.

[0021] Optionally, the outer peripheral wall of the semiconductor testing device is provided with an annular groove, and the number of the feature portions is multiple and spaced apart from each other, with each feature portion extending from the bottom of the annular groove. The heating device further includes:

[0022] One or more filler blocks are disposed in the annular groove between adjacent features to increase the contact area between the heating cylinder and the semiconductor detection device.

[0023] Optionally, the heating component is a heating wire arranged within the interlayer space.

[0024] Optionally, the heating device further includes:

[0025] A temperature measuring component is installed in the heating cylinder to monitor the real-time temperature of the heating cylinder.

[0026] Optionally, the heating device further includes:

[0027] A power cord, one end of which is connected to the heating component and the other end of which is connected to a power plug.

[0028] The heating device of this invention for a semiconductor testing equipment features a heating cylinder that surrounds the outer wall of the semiconductor testing equipment, with clearance openings provided for each feature. This allows the heating cylinder to fit snugly against the semiconductor testing equipment, increasing the contact area. The heating components are housed within the interlayer space of the heating cylinder, enabling efficient heat transfer to the semiconductor testing equipment and improving heating efficiency. Furthermore, the heating cylinder's design adapts to the features of the semiconductor testing equipment, reducing installation difficulty and significantly lowering on-site operating costs.

[0029] Furthermore, in the heating device of the semiconductor testing equipment of this invention, the heating cylinder is formed by bending a plate-like body, and a vertical strip-shaped adjustment port is formed on the mating side. The fastening component of the heating device is located at the adjustment port. The size of the adjustment port can be easily changed by the fastening component, thereby adjusting the clamping degree of the heating cylinder on the semiconductor testing equipment. In this way, it can be ensured that the heating cylinder and the semiconductor testing equipment are in close contact, effectively avoiding the problem of reduced heating efficiency due to poor contact.

[0030] Furthermore, in the heating device of the semiconductor testing equipment of this invention, the outer peripheral wall of the semiconductor testing equipment is provided with an annular groove, and the number of feature parts is multiple and spaced apart from each other, with each feature part extending from the bottom of the annular groove. To this end, one or more filler blocks are added to the heating device, and these filler blocks are disposed in the annular groove between adjacent feature parts. This increases the contact area between the heating cylinder and the semiconductor testing equipment, allowing heat to be transferred to the semiconductor testing equipment more quickly and evenly, thereby significantly improving heating efficiency.

[0031] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0032] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0033] Figure 1 This is a schematic structural diagram of a semiconductor testing device according to an embodiment of the present invention;

[0034] Figure 2 This is a schematic structural diagram of a heating device according to an embodiment of the present invention;

[0035] Figure 3 This is a schematic structural diagram of a heating cylinder according to an embodiment of the present invention;

[0036] Figure 4 This is a schematic structural diagram of a filling block according to an embodiment of the present utility model;

[0037] Figure 5 A schematic assembly diagram of a filling block and a semiconductor testing device according to an embodiment of the present invention.

[0038] Figure label:

[0039] 10. Semiconductor testing equipment; 110. Cavity; 120. Feature part; 130. Annular groove; 20. Heating cylinder; 210. Clearance opening; 220. Adjustment opening; 230. Reinforcing rib; 30. Fastening assembly; 310. Fixture; 320. Bolt; 330. Preload spring; 40. Filler block; 50. Temperature measuring assembly; 60. Power cord; 61. Power plug. Detailed Implementation

[0040] Reference will now be made in detail to embodiments of the present invention, one or more of which are illustrated in the accompanying drawings. The various embodiments provided are intended to explain the present invention and not to limit it. In fact, various modifications and variations to the present invention will be apparent to those skilled in the art without departing from the scope or spirit of the invention. For example, a feature illustrated or described as part of one embodiment may be used with another embodiment to produce yet another embodiment. Therefore, the present invention is intended to cover such modifications and variations within the scope of the appended claims and their equivalents.

[0041] The following reference Figures 1 to 5 This invention describes the heating device of a semiconductor testing apparatus according to an embodiment of the present invention. The terms "inner," "outer," "upper," "lower," "top," "bottom," "lateral," and "longitudinal," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. To facilitate illustrating the structure of the device, some of the accompanying drawings of the present invention are shown in perspective.

[0042] In the description of this embodiment, it should be understood that the term "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0043] In the description of this embodiment, the terms "one embodiment," "some embodiments," "some examples," "one example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0044] This utility model embodiment provides a heating device for a semiconductor testing device 10. Given that the outer peripheral wall of the semiconductor testing device 10 exhibits relatively complex geometric features and structural forms, in order to make this utility model easier to understand, this embodiment first introduces the semiconductor testing device 10.

[0045] In some embodiments, the semiconductor detection device 10 can be a charged particle beam imaging device, which controls the focusing state of charged particles to allow the charged particles to interact with the sample and performs imaging by capturing particle signals such as secondary particles and transmitted particles, thereby characterizing information such as the morphology, structure, and composition of the sample. The most common charged particle beam imaging devices include scanning electron microscopes, transmission electron microscopes, and focused ion beam microscopes.

[0046] Figure 1 This is a schematic structural diagram of a semiconductor testing device 10 according to an embodiment of the present invention.

[0047] like Figure 1 As shown, the semiconductor testing device 10 defines a cavity 110 to be heated for vacuuming. The outer peripheral wall of the semiconductor testing device 10 is provided with at least one outwardly protruding feature 120. The outer peripheral wall of the semiconductor testing device 10 is provided with an annular groove 130. The number of feature 120 can be multiple and they are spaced apart from each other. Each feature 120 extends from the bottom of the annular groove 130.

[0048] Understandably, due to the complex geometric features and structures of the outer peripheral wall of the cavity 110, such as feature 120 and annular groove 130, the silicone heating tape needs to carefully avoid these features during the winding process in traditional heating methods to ensure close contact between the heating tape and the surface of the cavity 110. This process is not only time-consuming and labor-intensive, increasing on-site operation costs, but may also lead to poor contact between the heating tape and the cavity 110, affecting heating efficiency.

[0049] Furthermore, due to the limitations of the heating band's size and shape, the surface area of ​​the cavity 110 it can cover is limited. This results in a limited overall temperature rise in the cavity 110 during heating, with the highest temperature reaching only around 170°C, far below the ideal heating requirement of 240°C. This not only prolongs the baking time and increases energy consumption, but may also prevent moisture and gas molecules inside the cavity 110 from being fully baked out, affecting the improvement of the vacuum level.

[0050] Furthermore, the existing heating system lacks temperature regulation and display functions, forcing operators to rely solely on external temperature detectors to monitor the temperature of chamber 110. This not only reduces the accuracy and real-time performance of temperature control but may also affect the baking effect and the stability of the vacuum level due to temperature fluctuations.

[0051] The heating device in this embodiment can efficiently heat the semiconductor detection device 10, thereby effectively removing water and gas molecules adhering to the surface of the cavity 110. Subsequently, by using a device such as an ion pump, these molecules can be extracted, achieving the medium-to-high vacuum required by the cavity 110.

[0052] Figure 2 This is a schematic structural diagram of a heating device according to an embodiment of the present invention. Figure 3 This is a schematic structural diagram of the heating cylinder 20 according to an embodiment of the present invention.

[0053] like Figures 2 to 3 As shown, the heating device generally includes a heating cylinder 20 and a heating assembly. The heating cylinder 20 surrounds the outer side of the outer peripheral wall of the semiconductor testing device 10. The heating cylinder 20 has a clearance opening 210 corresponding to the position of each feature portion 120, and a sandwich space is formed inside the heating cylinder 20. The heating assembly is disposed within the sandwich space of the heating cylinder 20 to controllably generate heat and transfer it to the semiconductor testing device 10 through the heating cylinder 20.

[0054] In this embodiment, the heating device has a heating cylinder 20 surrounding the outer periphery of the semiconductor testing device 10, and a clearance opening 210 is provided at the position of each feature portion 120. Therefore, the heating cylinder 20 can fit tightly against the semiconductor testing device 10, increasing the contact area. The heating components are disposed within the interlayer space of the heating cylinder 20, and the heat generated can be efficiently transferred to the semiconductor testing device 10 through the heating cylinder 20, improving heating efficiency. Furthermore, the design of the heating cylinder 20 can adapt to the feature portions 120 of the semiconductor testing device 10, reducing the installation difficulty of the heating device and significantly reducing on-site operation time costs.

[0055] It should be noted that although the interlayer space and heating assembly are not shown in the accompanying drawings of this embodiment, those skilled in the art, having understood the above embodiments, will be fully aware of the specific structure of the interlayer space and heating assembly.

[0056] For example, the heating component specifically uses a heating wire, and the interlayer space specifically refers to the hollow portion inside the heating cylinder 20 used to install the heating wire. In this embodiment, the interior of the heating cylinder 20 is entirely hollow, and the heating wire is arranged inside the heating cylinder 20.

[0057] In one example, the heating component can be a mica heating wire. A mica heating wire refers to a unique electrothermal element formed by embedding a heating wire (metal wire) within a mica sheet substrate. The mica sheet possesses excellent properties such as insulation, high-temperature resistance, and corrosion resistance, making it an ideal carrier for the heating wire. The working principle of the mica heating wire is based on resistance heating; when current passes through the heating wire, a resistance heating effect is generated, causing the heating wire to heat up. The heat is then conducted through the mica sheet to the heating cylinder 20, ultimately heating the semiconductor testing equipment 10.

[0058] In an alternative embodiment, the heating cylinder 20 is formed by bending a plate-like body and has a vertical strip-shaped adjustment port 220 formed on the mating side. The heating device also includes at least one fastening component 30, which is disposed at the adjustment port 220 for changing the size of the adjustment port 220, thereby adjusting the clamping degree of the heating cylinder 20 on the semiconductor testing device 10.

[0059] The size of the adjustment port 220 can be easily changed by using the fastening component 30, thereby adjusting the clamping tightness of the heating cylinder 20 on the semiconductor testing device 10. This ensures a tight fit between the heating cylinder 20 and the semiconductor testing device 10, effectively avoiding the problem of reduced heating efficiency due to poor contact.

[0060] Furthermore, since the clamping force can be flexibly adjusted by the fastening component 30, the heating device can also be applied to other semiconductor testing equipment 10 with similar size and shape to a certain extent, thus improving its versatility and practicality.

[0061] In an alternative embodiment, a gap is left between the periphery of the clearance 210 and the feature 120 to provide clamping allowance during the clamping process of the heated cylinder 20.

[0062] This gap ensures that the edge of the clearance opening 210 will not accidentally get stuck on the feature part 120 during the adjustment of the clamping degree, thereby effectively preventing the heating cylinder 20 from being damaged due to improper force.

[0063] In an optional embodiment, each fastening assembly 30 may include two fasteners 310 and a bolt 320, wherein the two fasteners 310 are respectively fixed to the heating cylinder 20 on both sides of the adjustment port 220, and the two fasteners 310 have coaxially arranged screw holes, and the bolt 320 passes through the two screw holes in sequence to be fastened to the two fasteners 310.

[0064] Initially, the bolt 320 is slightly loosened to increase the distance between the two fasteners 310, thereby widening the adjustment port 220. Then, the semiconductor testing device 10 is placed inside the heating chamber 110, ensuring that its feature portion 120 is precisely aligned and inserted into the corresponding clearance port 210. Finally, by tightening the bolt 320, the two fasteners 310 are gradually brought closer together, reducing the width of the adjustment port 220. The degree of tightening of the bolt 320 is then adjusted appropriately so that the heating cylinder 20 can tightly wrap around the outer periphery of the semiconductor testing device 10 with appropriate force.

[0065] In an alternative embodiment, each fastening assembly 30 may further include a preload spring 330, which is pressed between the end of the bolt 320 and the first fastener 310 through which it passes.

[0066] Thus, during the tightening of bolt 320, the preload spring 330 is compressed, thereby storing a certain amount of preload. This preload helps ensure a tight connection between bolt 320 and nut, preventing loosening due to vibration or temperature changes. More importantly, the presence of preload limits the extent to which bolt 320 can be tightened, preventing over-clamping of the heating cylinder 20 and potential damage to the internal heating components.

[0067] In one example, the number of fastening components 30 can be two, with the two fastening components 30 arranged vertically at an interval at the adjustment port 220.

[0068] The two fastening components 30 can apply uniform clamping force to the upper and lower parts of the semiconductor testing device 10 respectively. This uniform clamping force helps ensure the stability of the semiconductor testing device 10 during heating, avoiding deformation or damage caused by uneven force. At the same time, the uniform clamping force can also improve heating efficiency. When the semiconductor testing device 10 is uniformly clamped, the contact area between it and the heating cylinder 20 is larger, and the heat transfer is more uniform, thereby improving the heating speed and heating effect.

[0069] The heating cylinder 20 can be made of a high-temperature resistant and high-thermal-conductivity material. Reinforcing ribs 230 are formed at both axial ends of the heating cylinder 20. For example, when the cavity 110 of the heating cylinder 20 is in an upward-facing state, reinforcing ribs 230 are formed at the top and bottom edges of the heating cylinder 20. The reinforcing ribs 230 can increase the structural strength of the heating cylinder 20 during clamping, enabling the heating cylinder 20 to withstand greater clamping forces and more complex stress distributions, thereby improving the clamping effect.

[0070] Figure 4 This is a schematic structural diagram of the filling block 40 according to an embodiment of the present invention. Figure 5 A schematic assembly diagram of a filling block 40 and a semiconductor testing device 10 according to an embodiment of the present invention.

[0071] like Figure 4 and Figure 5 As shown, the heating device may also include one or more filler blocks 40 disposed in an annular groove 130 between adjacent feature portions 120, for increasing the contact area between the heating cylinder 20 and the semiconductor detection device 10.

[0072] In this way, by increasing the contact area between the heating cylinder 20 and the semiconductor testing device 10, heat can be transferred to the semiconductor testing device 10 more quickly and evenly, thereby significantly improving the heating efficiency.

[0073] In this embodiment, a filling block 40 is provided in the annular groove 130 between any two adjacent feature portions 120.

[0074] It is understandable that the design of the annular groove 130 results in a narrow diameter in the middle of the semiconductor testing device 10. However, this embodiment solves the problem of diameter variation in the semiconductor testing device 10 by placing a filler block 40 in the annular groove 130 between any two adjacent feature portions 120, thus ensuring a uniform diameter at the top and bottom. This not only optimizes the heat conduction path and ensures heating efficiency, but also avoids the impact of partial suspension of the heating cylinder 20 on its lifespan, ensuring the overall performance and stability of the heating cylinder 20.

[0075] The inner surface of the filler block 40 is contoured to the bottom surface of the annular groove 130, and the outer surface of the filler block 40 is contoured to the inner surface of the heating cylinder 20. The thickness of the filler block 40 is the same as the depth of the annular groove 130. In this way, after the heating cylinder 20 clamps the part to be baked, the inner and outer surfaces of the filler block 40 can fit tightly with the heating cylinder 20 and the semiconductor detection device 10 respectively, leaving almost no gaps, ensuring effective heat transfer.

[0076] In a preferred embodiment, the filler block 40 is an aluminum filler block 40.

[0077] Aluminum is a metal with high thermal conductivity. This high thermal conductivity allows the aluminum filler block 40 to quickly transfer heat from the heating cylinder 20 to the semiconductor detection device 10, thereby improving heating efficiency and reducing temperature gradient.

[0078] Furthermore, aluminum is a widely used metal with a relatively low price, which helps reduce overall manufacturing costs. In addition, aluminum has good plasticity and ductility, making it easy to form into various shapes and sizes through casting, forging, and machining methods, which helps reduce processing time and costs.

[0079] In an optional embodiment, the heating device may further include a temperature measuring component 50, which is disposed in the heating cylinder 20 and used to monitor the real-time temperature of the heating cylinder 20.

[0080] The addition of the temperature sensing component 50 enables the heating device to achieve more precise temperature control. Through real-time monitoring and feedback, the temperature control system can adjust the heating power in a timely manner to ensure that the temperature inside the heating cylinder 20 remains within the set range.

[0081] In one example, the temperature sensing component 50 can be a temperature sensor, which is attached and fixed to the outer surface of the heating cylinder 20, and located as far away as possible from the adjustment port 220. The fixing method includes, but is not limited to, soft fixing and hard fixing.

[0082] In an alternative embodiment, the heating device further includes a power cord 60, one end of which is connected to the heating assembly and the other end of which is connected to a power plug 61.

[0083] In one example, the power plug 61 may have a self-locking device that, when connected to the power cord 60, can be rotated to lock it in place, ensuring that the power cord 60 will not come off.

[0084] The power cord 60 acts as a bridge between the heating device and the power source. One end is securely connected to the heating element, responsible for transmitting electrical energy to the heating element to generate the required heat. The other end is connected to the power plug 61, which has a self-locking device. This design not only makes operation simple but also ensures that the power cord 60 remains securely connected during prolonged use, effectively preventing safety hazards caused by the power cord 60 coming loose.

[0085] In summary, the heating device of this embodiment can rapidly and efficiently raise the temperature of the semiconductor detection device 10 while meeting the medium-to-high vacuum requirements of the cavity 110 (pressure between 10). 2 Pa~10 -5(within the Pa range). Furthermore, compared to ordinary silicone tape heating methods, the heating device of this embodiment can easily raise the temperature of the semiconductor detection device 10 to over 240°C, far exceeding the conventional level of 170°C.

[0086] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A heating device for a semiconductor testing apparatus, wherein the semiconductor testing apparatus defines a cavity to be heated for vacuuming, and the outer peripheral wall of the semiconductor testing apparatus is provided with at least one outwardly protruding feature, characterized in that, The heating device includes: A heating cylinder is disposed around the outer side of the outer peripheral wall of the semiconductor detection device. The heating cylinder has clearance openings corresponding to the positions of each of the aforementioned features. An internal space is formed within the heating cylinder. A heating component is disposed within the interlayer space of the heating cylinder to generate heat in a controlled manner and transfer it to the semiconductor detection device through the heating cylinder.

2. The heating device of the semiconductor testing equipment according to claim 1, characterized in that, The heating cylinder is formed by bending a plate-like body, and a vertical strip-shaped adjustment port is formed on the mating side. The heating device also includes: At least one fastening component is provided at the adjustment port for changing the size of the adjustment port, thereby adjusting the clamping force of the heating cylinder on the semiconductor detection device.

3. The heating device of the semiconductor testing equipment according to claim 2, characterized in that, A gap is left between the periphery of the clearance opening and the feature portion to provide clamping allowance during the clamping process of the heating cylinder.

4. The heating device of the semiconductor testing equipment according to claim 3, characterized in that, Each of the fastening components includes: Two fixing members are respectively fixed to the heating cylinder on both sides of the adjustment port, and the two fixing members have coaxially arranged screw holes; and Bolts are passed through the two said screw holes in sequence, thereby fastening them to the two said fasteners.

5. The heating device of the semiconductor testing equipment according to claim 4, characterized in that, Each of the fastening components also includes: A preload spring is pressed between the end of the bolt and the first fastener through which it passes.

6. The heating device of the semiconductor testing equipment according to claim 1, characterized in that, The edges at both ends of the heating cylinder are reinforced with ribs.

7. The heating device of the semiconductor testing equipment according to claim 1, characterized in that, The outer peripheral wall of the semiconductor testing device is provided with an annular groove, and the number of the feature parts is multiple and spaced apart from each other. Each feature part extends from the bottom of the annular groove. The heating device further includes: One or more filler blocks are disposed in the annular groove between adjacent features to increase the contact area between the heating cylinder and the semiconductor detection device.

8. The heating device of the semiconductor testing equipment according to claim 1, characterized in that, The heating component is a heating wire arranged in the interlayer space.

9. The heating device of the semiconductor testing equipment according to claim 1, characterized in that, Also includes: A temperature measuring component is installed in the heating cylinder to monitor the real-time temperature of the heating cylinder.

10. The heating device of the semiconductor testing equipment according to claim 1, characterized in that, Also includes: A power cord, one end of which is connected to the heating component and the other end of which is connected to a power plug.

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