Auxiliary sheet inserting device

Abstract

The utility model relates to an auxiliary wafer inserting device which comprises an auxiliary adjusting piece and a tidying wheel, when a silicon wafer is clamped in a silicon wafer clamping groove of the auxiliary adjusting piece, it can be guaranteed that the median plane of the silicon wafer and the median plane of a flower basket are coplanar, namely, the silicon wafer is located in the middle of the left and right; meanwhile, as the distance between the bottom wall of the silicon wafer clamping groove and the bottom of the tooth groove of the flower basket is half of the difference value between the depth of the tooth groove and the thickness of the silicon wafer, the silicon wafer can be ensured to be located in the middle in the vertical direction when the silicon wafer is clamped in the silicon wafer clamping groove, namely, the silicon wafer is clamped in the middle in the flower basket, and therefore the silicon wafer can be placed in the middle by moving the tidying wheel. When the silicon wafer is inserted subsequently, the position of the silicon wafer is restrained by clamping the silicon wafer with the regularizing wheel, so that the silicon wafer can be ensured to be in the middle position when the silicon wafer is put into a basket, the accuracy and the efficiency of putting the silicon wafer into the basket are improved, and the risks of damage, fragmentation and blockage of the silicon wafer are reduced.

Description

Technical Field

[0001] This application relates to the field of silicon wafer technology, and in particular to auxiliary wafer insertion devices. Background Technology

[0002] With the increasing demand for efficient energy in modernization, photovoltaic power generation, as one of the important means of utilizing solar energy, has received increasing attention and vigorous development from countries around the world.

[0003] Currently, silicon wafer production is a crucial link in the photovoltaic industry chain. Typically, silicon wafers are cut from silicon rods, and the cut wafers need to be cleaned. Before cleaning, the silicon wafers are separately inserted into baskets and then cleaned by a cleaning machine. If the wafers are not positioned accurately when entering the basket, quality defects such as edge breakage, fragmentation, and chipping can easily occur, thus affecting the yield of finished silicon wafers. Utility Model Content

[0004] Therefore, it is necessary to provide an auxiliary wafer insertion device to address the problem of inaccurate wafer insertion position in existing wafer insertion methods.

[0005] An auxiliary insertion device for assisting in inserting silicon wafers into the toothed grooves of a basket, the auxiliary insertion device comprising:

[0006] An auxiliary adjustment component is provided with a silicon wafer slot, the center surface of which coincides with the center surface of the auxiliary adjustment component; the auxiliary adjustment component is movable along a first direction to engage with the toothed groove of the basket; wherein, the center surface of the auxiliary adjustment component is coplanar with the center surface of the basket, the bottom wall of the silicon wafer slot and the bottom wall of the corresponding toothed groove of the basket have a first distance in the vertical direction, twice the first distance being the difference between the groove depth dimension of the toothed groove in the vertical direction and the thickness dimension of the silicon wafer;

[0007] At least two sets of alignment wheels are slidably disposed on both sides of the auxiliary adjustment member along the second direction to engage with the silicon wafer that is engaged within the auxiliary adjustment member; the alignment wheels are used to define the insertion path of the silicon wafer.

[0008] In one embodiment, the auxiliary adjustment member is provided with a snap-fit ​​portion for engaging with the toothed groove of the flower basket, the snap-fit ​​portion being recessed downward out of the silicon wafer slot.

[0009] In one embodiment, the edge of the snap-fit ​​portion is provided with a first limiting baffle that protrudes relative to the silicon wafer slot, and the first limiting baffle is used to abut against the silicon wafer.

[0010] In one embodiment, the thickness of the snap-fit ​​portion gradually increases from the edge of the auxiliary adjustment member toward the center surface of the auxiliary adjustment member.

[0011] In one embodiment, the auxiliary insert device further includes a pushing unit capable of engaging with the auxiliary adjustment member, the pushing unit being used to drive the auxiliary adjustment member to move along a first direction so that the auxiliary adjustment member engages with the toothed groove of the flower basket.

[0012] In one embodiment, the auxiliary adjustment member is provided with a push slot for engaging with the push unit.

[0013] In one embodiment, the auxiliary adjustment member is further provided with a second limiting baffle extending along the second direction, the second limiting baffle cooperating with the snap-fit ​​portion to form the push slot.

[0014] In one embodiment, the auxiliary adjustment component is further provided with an observation port, which is connected to the silicon wafer slot and the push slot.

[0015] In one embodiment, the pushing unit includes a telescopic drive member and a push plate connected to the telescopic drive member, the push plate being used to engage with the pushing slot.

[0016] In one embodiment, the auxiliary insert device further includes a base with a sliding portion; a support member is disposed between the leveling wheel and the sliding portion, the support member being slidably connected to the sliding portion, and the leveling wheel being rotatably connected to the support member; and / or,

[0017] Each group of the straightening wheels includes multiple wheels, and each wheel is provided with an annular limiting groove, the wall of which is used to abut against the silicon wafer; and / or,

[0018] The sidewall of the auxiliary adjustment component abuts against the sidewall of the toothed groove of the flower basket.

[0019] The aforementioned auxiliary insert device moves along the first direction and engages with the toothed groove of the basket, such that the center surface of the auxiliary adjustment component is coplanar with the center surface of the basket, and the center surface of the silicon wafer slot coincides with the center surface of the auxiliary adjustment component. Thus, when the silicon wafer is inserted into the wafer slot, the center plane of the wafer is ensured to be coplanar with the center plane of the basket, meaning the wafer is centered horizontally. Simultaneously, since the distance between the bottom wall of the wafer slot and the bottom of the basket's toothed groove is half the difference between the groove depth and the wafer thickness, the wafer is also centered vertically within the basket. Therefore, by moving the alignment wheel to engage with the wafer, the insertion path is limited. After removing the auxiliary adjustment component from the basket, subsequent wafer insertions are constrained by engaging the wafer with the alignment wheel, ensuring the wafer is centered upon entering the basket. This improves the accuracy and efficiency of wafer insertion, reducing the risk of wafer breakage, fragmentation, and blockage. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of an auxiliary insert device and a flower basket provided in an embodiment of this application.

[0021] Figure 2 for Figure 1 A partial schematic diagram of the auxiliary insert device shown.

[0022] Figure 3 for Figure 1 A schematic diagram of the auxiliary adjustment component in the auxiliary insert device shown.

[0023] Figure 4 for Figure 3 A magnified view of point A in the auxiliary insert device shown.

[0024] Figure 5 for Figure 3 A schematic diagram of the auxiliary insert device shown from another perspective.

[0025] Figure 6 for Figure 5 A magnified view of point B in the auxiliary insert device shown.

[0026] Figure 7 for Figure 1 A schematic diagram of the pushing unit and the aligning wheel in the auxiliary insert device shown.

[0027] Reference numerals: 110, Auxiliary adjustment component; 111, Silicon wafer slot; 112, Snap-fit ​​part; 113, First limit baffle; 114, Push slot; 115, Second limit baffle; 116, Observation port; 120, Push unit; 121, Telescopic drive component; 122, Push plate; 131, Base; 132, Sliding part; 133, Support component; 134, Guiding wheel; 210, Basket; 211, Gear; 220, Lifting drive component; 230, Conveyor wheel; 240, Conveyor belt; 1000, Silicon wafer. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0030] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0034] In semiconductor manufacturing and photovoltaic cell production, centering the silicon wafers within the basket is a crucial step to ensure their safety and quality during transport, handling, and processing. Centering the wafers ensures even weight distribution within the basket, reducing tilting or imbalance caused by a shift in the center of gravity. It also reduces stress on the wafer edges, preventing cracks or damage due to uneven edge stress. During handling and transport, centered wafers are less prone to displacement, minimizing the risk of collisions with the basket walls or other wafers. Even in chemical processing, cleaning, and coating processes, centered wafers ensure uniform contact with the processing liquid, improving processing efficiency, reducing edge effects, and enhancing consistency and uniformity.

[0035] In existing technology, after manually inserting the silicon wafer into the basket, since the depth of the basket's grooves is 2mm and the wafer thickness is generally 0.15mm, if it is placed vertically and centered, the distance between the wafer and the upper and lower walls of the grooves is (2-0.15) / 2=0.925mm. Since 0.925mm < 1mm, and to ensure horizontal centering, the edge of the wafer will not contact the sidewalls of the grooves, but will have gaps to prevent wear. Due to the design limitations of the basket teeth and columns, precise instruments cannot be used for measurement; instead, multiple basket columns must be visually inspected to adjust the wafer to approximately the center of the basket. This not only requires a significant amount of time to adjust the wafer's position but also lacks precision. Furthermore, frequent adjustments increase the risk of wafer breakage, impacting production capacity.

[0036] Based on this, this application provides an auxiliary wafer insertion device that can improve the accuracy and efficiency of silicon wafer insertion into the basket.

[0037] See Figure 1 , Figure 4 and Figure 6 As shown, an embodiment of this application provides an auxiliary wafer insertion device for assisting in inserting a silicon wafer 1000 into the toothed groove 211 of a basket 210. The auxiliary wafer insertion device includes an auxiliary adjustment member 110 and at least two sets of leveling wheels 134. The auxiliary adjustment member 110 is provided with a silicon wafer slot 111, the center surface of which coincides with the center surface of the auxiliary adjustment member 110. The auxiliary adjustment member 110 is movable along a first direction to engage with the toothed groove 211 of the basket 210. The center surface of the auxiliary adjustment member 110 is coplanar with the center surface of the basket 210. (See reference...) Figure 6 As shown, when the auxiliary adjustment member 110 is inserted into the toothed groove 211 of the basket 210 and the silicon wafer 1000 is inserted into the silicon wafer slot 111, the bottom wall of the silicon wafer slot 111 and the bottom wall of the corresponding toothed groove 211 of the basket 210 have a first distance D in the vertical direction. Twice the first distance D is the difference between the groove depth (H) of the toothed groove 211 in the vertical direction and the thickness T of the silicon wafer 1000. This ensures that the silicon wafer 1000 is in a centered position. At least two sets of leveling wheels 134 are slidably disposed on both sides of the auxiliary adjustment member 110 along the second direction to engage with the silicon wafer 1000 inserted into the auxiliary adjustment member 110. The leveling wheels 134 are used to define the insertion path of the silicon wafer 1000. The first direction is... Figure 3 The X direction shown is the length direction of silicon wafer 1000. The second direction is the Y direction, which is the width direction of silicon wafer 1000. The vertical direction is the Z direction, which is the thickness direction of silicon wafer 1000. In essence, the median plane refers to the central symmetry plane of an object, which divides the object into two symmetrical parts. Figure 3 The mid-plane of the auxiliary adjustment component 110 is indicated by a dashed rectangle.

[0038] Specifically, the width of the auxiliary adjustment member 110 can be adapted to the width of the receiving groove formed by the left and right toothed grooves 211, so that when the auxiliary adjustment member 110 moves along the first direction and is engaged with the toothed groove 211 of the basket 210, the side wall of the auxiliary adjustment member 110 abuts against the side wall of the toothed groove 211 of the basket 210, so that the center surface of the auxiliary adjustment member 110 is coplanar with the center surface of the basket 210, and the center surface of the silicon wafer slot 111 coincides with the center surface of the auxiliary adjustment member 110. Thus, when the silicon wafer 1000 is snapped into the silicon wafer slot 111, the center plane of the silicon wafer 1000 is ensured to be coplanar with the center plane of the basket 210, meaning the silicon wafer 1000 is centered horizontally. Simultaneously, since the distance D between the bottom wall of the silicon wafer slot 111 and the bottom of the toothed groove 211 of the basket 210 is half the difference between the groove depth H and the thickness T of the silicon wafer 1000, it is ensured that when the silicon wafer 1000 is snapped into the silicon wafer slot 111, the silicon wafer 1000 is centered vertically, meaning the silicon wafer 1000 is centered vertically when snapped into the basket 210. The position inside basket 210 is centered. Therefore, by moving the alignment wheel 134 to engage with the silicon wafer 1000, the insertion path of the silicon wafer 1000 can be limited. After removing the auxiliary adjustment component 110 from basket 210, when inserting the silicon wafer 1000, the position of the silicon wafer 1000 is constrained by the engagement between the silicon wafer 1000 and the alignment wheel 134. This ensures that the silicon wafer 1000 is centered when entering the basket, thereby improving the accuracy and efficiency of the silicon wafer 1000 entering the basket and reducing the risk of silicon wafer 1000 breakage, fragmentation, and blockage.

[0039] In the above embodiments, besides ensuring that the width of the auxiliary adjustment member 110 matches the width of the receiving groove formed by the left and right toothed grooves 211, thus achieving coplanarity between the center plane of the auxiliary adjustment member 110 and the center plane of the flower basket 210, in other embodiments, the width of the auxiliary adjustment member 110 may not match the width of the receiving groove. Instead, detection elements (not shown) can be placed on the front and rear sides of the center plane of the auxiliary adjustment member 110, and sensing elements (not shown) can be placed on the front and rear sides of the center plane of the flower basket 210. The cooperation of the sensing elements and detection elements allows for the detection of whether the center plane of the flower basket 210 is aligned with the center plane of the auxiliary adjustment member 110.

[0040] See Figure 1 and Figure 4As shown, in one embodiment, the auxiliary adjustment member 110 is provided with a locking portion 112 for engaging with the toothed groove 211 of the basket 210, the locking portion 112 being recessed downward to form the silicon wafer slot 111. Thus, when the silicon wafer 1000 is engaged with the auxiliary adjustment member 110 located within the toothed groove 211 of the basket 210, a portion of the silicon wafer 1000 is also located within the basket 210, reducing the overall space occupied by the device. Furthermore, the edge of the locking portion 112 is provided with a first limiting baffle 113 protruding relative to the silicon wafer slot 111, the first limiting baffle 113 being used to abut against the silicon wafer 1000. The silicon wafer 1000 is positioned by the first limiting baffle 113, so that the silicon wafer 1000 is stably placed in the silicon wafer slot 111. When the alignment wheel 134 approaches and abuts against the silicon wafer 1000, the silicon wafer 1000 will not shift, thus ensuring the alignment reliability of the alignment wheel 134 and ensuring the accuracy of the subsequent wafer insertion position.

[0041] See Figure 3 and Figure 4 As shown, in one embodiment, the thickness of the latching portion 112 gradually increases from the edge of the auxiliary adjustment member 110 towards its center surface, meaning that the top and bottom surfaces of the latching portion 112 are beveled. Thus, when the auxiliary adjustment member 110 is inserted into the basket 210, the beveled surface provides a guiding function and reduces insertion resistance.

[0042] See Figure 1 and Figure 2 As shown, in one embodiment, the auxiliary insert device further includes a pushing unit 120 capable of engaging with the auxiliary adjustment member 110. The pushing unit 120 drives the auxiliary adjustment member 110 to move along a first direction, so that the auxiliary adjustment member 110 engages with the toothed groove 211 of the basket 210, reducing manual labor. Further, see... Figure 4 As shown, the auxiliary adjustment member 110 is provided with a push slot 114 for engaging with the push unit 120. The connection between the auxiliary adjustment member 110 and the push unit 120 is achieved through the push slot 114.

[0043] See Figure 4 As shown, in one embodiment, the auxiliary adjustment member 110 is further provided with a second limiting baffle 115 extending along the second direction. The second limiting baffle 115 cooperates with the snap-fit ​​portion 112 to form a push slot 114. Simultaneously, the second limiting baffle 115 can also limit the push unit 120, preventing the push unit 120 from accidentally disengaging from the auxiliary adjustment member 110 during operation. (See reference...) Figure 2 and Figure 4As shown, specifically, the pushing unit 120 includes a telescopic drive member 121 and a push plate 122 connected to the telescopic drive member 121. The push plate 122 is used to engage with the push slot 114. Through the extension operation of the telescopic drive member 121, the auxiliary adjustment member 110 is engaged on the flower basket 210. The telescopic drive member 121 can be a cylinder or an electric push rod, etc.

[0044] See Figure 1 and Figure 4 As shown, in one embodiment, the auxiliary adjustment member 110 is further provided with an observation port 116, which communicates with the silicon wafer slot 111 and the push slot 114. Thus, the observation port 116 can be used to determine whether the auxiliary adjustment member 110 is fully engaged with the basket 210, allowing the push unit 120 to stop operating. Simultaneously, the observation port 116 can also be used to determine whether the silicon wafer 1000 is fully engaged within the silicon wafer slot 111, ensuring the reliability of subsequent operations.

[0045] See Figure 1 and Figure 7 As shown, in one embodiment, the auxiliary insertion device further includes a base 131, on which a sliding portion 132 is provided; a support member 133 is provided between the alignment wheel 134 and the sliding portion 132, the support member 133 being slidably connected to the sliding portion 132, and the alignment wheel 134 being rotatably connected to the support member 133. Through the sliding engagement between the support member 133 and the sliding portion 132, the approach operation of the alignment wheel 134 relative to the silicon wafer 1000 is guided, ensuring precise contact between the silicon wafer 1000 and the alignment wheel 134. The sliding portion 132 can be a slide rail protruding relative to the base 131, and the support member 133 is provided with a groove that engages with the slide rail. The engagement of the slide rail and the groove guides the movement of the alignment wheel 134. Specifically, the support member 133 is provided with a fixed shaft, and the aligning wheel 134 is rotatably mounted on the fixed shaft, which supports and fixes the aligning wheel 134. At the same time, when the silicon wafer 1000 moves relative to the aligning wheel 134 in the first direction, the aligning wheel 134 will also rotate under the action of friction, reducing the friction between the aligning wheel 134 and the silicon wafer 1000, and reducing the possibility of wear on the silicon wafer 1000.

[0046] like Figure 7 As shown, in one embodiment, each set of alignment wheels 134 includes multiple wheels, and each alignment wheel 134 is provided with an annular limiting groove (not shown). The groove wall of the annular limiting groove is used to abut against the silicon wafer 1000. By using the annular limiting groove to engage and limit the silicon wafer 1000, the silicon wafer 1000 abutting against the alignment wheel 134 is more stable during the basket entry process, improving basket entry efficiency and accuracy.

[0047] like Figure 1As shown, in some embodiments, the bottom of the flower basket 210 is provided with a conveyor wheel 230 and a conveyor belt 240. The flower basket 210 is conveyed to a preset position through friction transmission between the conveyor belt 240 and the conveyor wheel 230. Furthermore, the top of the flower basket 210 is provided with a lifting drive 220. The lifting drive 220 drives the flower basket 210 to rise and fall, so that multiple silicon wafers 1000 are sequentially inserted into the toothed grooves 211 at different heights.

[0048] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An auxiliary insert device, characterized in that, The auxiliary insertion device includes: (1000) for inserting silicon wafers into the slots (211) of a basket (210). An auxiliary adjustment component (110) is provided with a silicon wafer slot (111), the mid-plane of which coincides with the mid-plane of the auxiliary adjustment component (110); the auxiliary adjustment component (110) is movable along a first direction to engage with the toothed groove (211) of the basket (210); wherein, the mid-plane of the auxiliary adjustment component (110) is coplanar with the mid-plane of the basket (210), the bottom wall of the silicon wafer slot (111) and the bottom wall of the corresponding toothed groove (211) of the basket (210) have a first distance in the vertical direction, twice the first distance being the difference between the groove depth of the toothed groove (211) in the vertical direction and the thickness of the silicon wafer (1000); At least two sets of alignment wheels (134) are slidably disposed on both sides of the auxiliary adjustment member (110) along the second direction to engage with the silicon wafer (1000) snapped into the auxiliary adjustment member (110); the alignment wheels (134) are used to define the insertion path of the silicon wafer (1000).

2. The auxiliary insert device according to claim 1, characterized in that, The auxiliary adjustment component (110) is provided with a snap-fit ​​part (112) for engaging with the toothed groove (211) of the flower basket (210), and the snap-fit ​​part (112) is recessed downward out of the silicon wafer slot (111).

3. The auxiliary insert device according to claim 2, characterized in that, The edge of the snap-fit ​​portion (112) is provided with a first limiting baffle (113) that protrudes relative to the silicon wafer slot (111), and the first limiting baffle (113) is used to abut against the silicon wafer (1000).

4. The auxiliary insert device according to claim 2, characterized in that, The thickness of the snap-fit ​​portion (112) gradually increases from the edge of the auxiliary adjustment member (110) toward the center surface of the auxiliary adjustment member (110).

5. The auxiliary insert device according to claim 2, characterized in that, The auxiliary insert device further includes a push unit (120) that can engage with the auxiliary adjustment member (110). The push unit (120) is used to drive the auxiliary adjustment member (110) to move along a first direction so that the auxiliary adjustment member (110) engages with the toothed groove (211) of the flower basket (210).

6. The auxiliary insert device according to claim 5, characterized in that, The auxiliary adjustment component (110) is provided with a push slot (114) for engaging with the push unit (120).

7. The auxiliary insert device according to claim 6, characterized in that, The auxiliary adjustment component (110) is also provided with a second limiting baffle (115) extending along the second direction, and the second limiting baffle (115) cooperates with the snap-fit ​​part (112) to form the push slot (114).

8. The auxiliary insert device according to claim 7, characterized in that, The auxiliary adjustment component (110) is also provided with an observation port (116), which is connected to the silicon wafer slot (111) and the push slot (114).

9. The auxiliary insert device according to claim 6, characterized in that, The pushing unit (120) includes a telescopic drive member (121) and a push plate (122) connected to the telescopic drive member (121), the push plate (122) being used to engage with the pushing slot (114).

10. The auxiliary insert device according to claim 1, characterized in that, The auxiliary insert device further includes a base (131), on which a sliding part (132) is provided; a support member (133) is provided between the leveling wheel (134) and the sliding part (132), the support member (133) being slidably connected to the sliding part (132), and the leveling wheel (134) being rotatably connected to the support member (133); and / or, Each set of the alignment wheels (134) includes multiple wheels, and each alignment wheel (134) is provided with an annular limiting groove, the groove wall of which is used to abut against the silicon wafer (1000); and / or, The sidewall of the auxiliary adjustment member (110) abuts against the sidewall of the toothed groove (211) of the flower basket (210).

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