Heat-conducting aluminum substrate

Abstract

The utility model provides a heat-conducting aluminum substrate, which solves the problems of weak anti-electromagnetic interference capability and the like of the aluminum substrate, and comprises an aluminum sheet main body, etching points are distributed on the aluminum sheet main body, the surface of the aluminum sheet main body is sequentially covered with a copper-plated layer and a copper-clad RCC insulating layer, and the copper-clad RCC insulating layer and the etching points are directly covered with electroplated layers. The cable has the advantages of strong anti-electromagnetic interference capability, good heat conduction performance and the like.

Description

Technical Field

[0001] This utility model belongs to the field of aluminum substrate technology, and specifically relates to a thermally conductive aluminum substrate. Background Technology

[0002] With the continuous development of technology, the design of automotive lights places increasingly higher demands on the heat dissipation performance of aluminum substrates and the electromagnetic interference. Components need to be grounded to the aluminum layer. Conventional aluminum substrates can no longer meet these requirements. Therefore, it is necessary to develop a high thermal conductivity aluminum substrate with the aluminum base layer connected to the ground plane. However, in the actual production process, existing aluminum substrates use high-temperature lamination to laminate the substrate, PP, and copper foil. During lamination, the amount of resin overflow is difficult to control, and resin from the PP may overflow onto the thermal channel pads. Residual resin on the thermal channel pads affects heat conduction, compromising the heat dissipation performance of the thermoelectric separation circuit board.

[0003] To address the shortcomings of existing technologies, people have conducted long-term explorations and proposed various solutions. For example, Chinese patent literature discloses a manufacturing process for a thermoelectric separation circuit board [201910424714.8], which includes the following steps: cutting a copper substrate, then covering the copper substrate with a dry film, forming bosses corresponding to LED thermal pads on the copper substrate through exposure, development, and etching, and removing the dry film on the bosses; coating the copper substrate with resin, curing the resin, and grinding the resin layer on the bosses to expose the bosses; then covering with a dry film, and removing the dry film from areas other than the bosses through exposure and development; plating a layer of copper foil on the copper substrate, and grinding the surface of the copper foil to make the surface height of the copper foil uniform; then attaching a dry film to the copper foil, exposing and developing it, and then removing the copper foil on the dry film of the bosses through etching to create the outer layer circuitry, and then removing the dry film on the bosses to expose the bosses.

[0004] The above solution has solved the problem of heat dissipation of the substrate to a certain extent, but it still has many shortcomings, such as weak resistance to electromagnetic interference. Summary of the Invention

[0005] The purpose of this invention is to address the above-mentioned problems by providing a thermally conductive aluminum substrate with a reasonable design and strong resistance to electromagnetic interference.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a thermally conductive aluminum substrate, comprising an aluminum sheet body, etched dots distributed on the aluminum sheet body, a copper plating layer and a copper-clad RCC insulating layer sequentially covering the surface of the aluminum sheet body, and an electroplating layer directly covering the copper-clad RCC insulating layer and the etched dots.

[0007] In the aforementioned thermally conductive aluminum substrate, the etching points on the aluminum sheet body are obtained by brushing and etching after double-sided exposure.

[0008] In the aforementioned thermally conductive aluminum substrate, the etched ends are exposed relative to the copper plating layer and the copper-clad RCC insulating layer by grinding.

[0009] In the aforementioned thermally conductive aluminum substrate, the thickness of the copper plating layer is 10-50 μm.

[0010] In the aforementioned thermally conductive aluminum substrate, the copper plating layer and the copper-clad RCC insulating layer are integrally formed by lamination.

[0011] In the aforementioned thermally conductive aluminum substrate, the copper-clad RCC insulating layer includes a resin layer bonded to the copper plating layer, a copper foil layer bonded to the side of the resin layer opposite to the copper plating layer, and an electroplated layer covering the copper foil layer.

[0012] In the aforementioned thermally conductive aluminum substrate, the thickness of the copper-clad RCC insulating layer is 50-100 μm.

[0013] In the aforementioned thermally conductive aluminum substrate, the thickness of the electroplated layer is 10-25 μm.

[0014] In the aforementioned thermally conductive aluminum substrate, the total thickness of the thermally conductive aluminum substrate is 1.0-2.0 mm.

[0015] In the aforementioned thermally conductive aluminum substrate, the etched point and the electroplated layer are attached to form the first contact portion, the copper-clad RCC insulating layer and the electroplated layer are attached to form the second contact portion, and the copper plating layer and the electroplated layer are attached to form the third contact portion. The third contact portion is located between the first contact portion and the second contact portion.

[0016] Compared with existing technologies, the advantages of this utility model are as follows: the electroplated layer is connected to the aluminum sheet body through the etching points, thereby forming an effective anti-electromagnetic interference structure and improving the overall performance; the electroplated layer is connected to the aluminum sheet body through a secondary electroplating method, isolating the resin layer of the copper-clad RCC insulating layer, which greatly improves the heat conduction efficiency; the etching points are exposed by grinding and contact the electroplated layer, reducing the overall processing difficulty. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the aluminum sheet body of this utility model;

[0019] In the figure, the aluminum sheet body 1, the etched point 2, the copper plating layer 3, the copper RCC insulating layer 4, the resin layer 41, the copper foil layer 42, the electroplating layer 5, the first contact part 6, the second contact part 7, and the third contact part 8. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0021] like Figure 1-2 As shown, a thermally conductive aluminum substrate includes an aluminum sheet body 1 with etched dots 2 distributed on it. A copper plating layer 3 and a copper-clad RCC insulating layer 4 are sequentially covered on the surface of the aluminum sheet body 1. An electroplated layer 5 is directly covered on the copper-clad RCC insulating layer 4 and the etched dots 2. The electroplated layer 5 in this thermally conductive aluminum substrate is in contact with the aluminum sheet body 1, so as to ground the aluminum sheet body 1 and thus have a good anti-electromagnetic interference effect.

[0022] Specifically, a suitable aluminum sheet body 1 is selected according to actual needs. The etching points 2 on the aluminum sheet body 1 are obtained by brushing and double-sided exposure etching, and the etching points 2 have a columnar structure.

[0023] In detail, the end of etch point 2 is exposed relative to the copper plating layer 3 and the copper-clad RCC insulating layer 4 by grinding. During the grinding process, part of the copper plating layer 3 and the copper-clad RCC insulating layer 4 are also ground off until etch point 2 is subjected to secondary electroplating.

[0024] Furthermore, the thickness of the copper plating layer 3 is 10-50um, preferably 30um. After the copper plating is completed, a drying process is required to ensure the quality of subsequent substrate processing.

[0025] Furthermore, the copper plating layer 3 and the copper-clad RCC insulating layer 4 are integrally formed by pressing, and the formed copper plating layer 3 and copper-clad RCC insulating layer 4 completely cover the aluminum sheet body 1.

[0026] In addition, the copper-clad RCC insulating layer 4 includes a resin layer 41 bonded to the copper plating layer 3, and a copper foil layer 42 bonded to the side of the resin layer 41 opposite to the copper plating layer 3. The electroplated layer 5 covers the copper foil layer 42. The resin layer 41 can be made of epoxy resin, BT resin, modified PPE resin, or other materials, and is formed by vacuum pressing.

[0027] Meanwhile, the thickness of the copper-clad RCC insulating layer 4 is 50-100um, preferably 70um.

[0028] As can be seen, the thickness of the electroplated layer 5 is 10-25um. After electroplating, the electroplated layer 5 is exposed and further etched to form the required circuit pattern.

[0029] It is evident that the total thickness of this thermally conductive aluminum substrate is 1.0-2.0 mm, with a preferred thickness of 1.5 mm.

[0030] Preferably, the area where the etched point 2 adheres to the electroplated layer 5 is the first contact portion 6, the area where the copper-clad RCC insulating layer 4 adheres to the electroplated layer 5 is the second contact portion 7, and the area where the copper-plated layer 3 adheres to the electroplated layer 5 is the third contact portion 8. The third contact portion 8 is located between the first contact portion 6 and the second contact portion 7, wherein the resin layer 41 separates the copper-plated layer 3 from the copper foil layer 42.

[0031] In summary, the principle of this embodiment is as follows: a copper plating layer 3 is electroplated on the aluminum sheet body 1, and then a copper-clad RCC insulating layer 4 is pressed on. The top of the etched point 2 is exposed by grinding and then covered by a secondary electroplating layer 5, so that the electroplating layer 5 contacts and grounds the aluminum sheet body 1 through the etched point 2. The electromagnetic interference resistance of the aluminum substrate can be improved without drilling.

[0032] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

[0033] Although this document frequently uses terms such as aluminum sheet body 1, etched point 2, copper plating layer 3, copper-clad RCC insulating layer 4, resin layer 41, copper foil layer 42, electroplating layer 5, first contact portion 6, second contact portion 7, and third contact portion 8, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

Claims

1. A thermally conductive aluminum substrate, characterized in that, It includes an aluminum sheet body (1), on which etched dots (2) are distributed. The surface of the aluminum sheet body (1) is sequentially covered with a copper plating layer (3) and a copper-clad RCC insulating layer (4). The copper-clad RCC insulating layer (4) and the etched dots (2) are directly covered with an electroplated layer (5).

2. The thermally conductive aluminum substrate according to claim 1, characterized in that, The etching points (2) on the aluminum sheet body (1) are obtained by brushing and double-sided exposure followed by etching.

3. The thermally conductive aluminum substrate according to claim 1, characterized in that, The etched point (2) ends are exposed relative to the copper plating layer (3) and the copper-clad RCC insulating layer (4) by grinding.

4. The thermally conductive aluminum substrate according to claim 1, characterized in that, The thickness of the copper plating layer (3) is 10-50 μm.

5. The thermally conductive aluminum substrate according to claim 1, characterized in that, The copper plating layer (3) and the copper-clad RCC insulating layer (4) are integrally formed by pressing.

6. The thermally conductive aluminum substrate according to claim 1, characterized in that, The copper-clad RCC insulating layer (4) includes a resin layer (41) bonded to the copper plating layer (3), and a copper foil layer (42) is bonded to the side of the resin layer (41) opposite to the copper plating layer (3), and the electroplated layer (5) covers the copper foil layer (42).

7. The thermally conductive aluminum substrate according to claim 1, characterized in that, The thickness of the copper-clad RCC insulating layer (4) is 50-100 μm.

8. The thermally conductive aluminum substrate according to claim 1, characterized in that, The thickness of the electroplated layer (5) is 10-25 μm.

9. A thermally conductive aluminum substrate according to claim 1, characterized in that, The total thickness of this thermally conductive aluminum substrate is 1.0-2.0 mm.

10. A thermally conductive aluminum substrate according to claim 1, characterized in that, The etching point (2) and the electroplated layer (5) are attached to the first contact part (6), the copper-clad RCC insulating layer (4) and the electroplated layer (5) are attached to the second contact part (7), the copper plating layer (3) and the electroplated layer (5) are attached to the third contact part (8), and the third contact part (8) is located between the first contact part (6) and the second contact part (7).

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