Double-station processing PCB laser windowing device

Abstract

The utility model discloses a PCB (Printed Circuit Board) laser windowing device with double-station processing, which comprises a machine base, a first feeding and discharging station, a second feeding and discharging station and a processing station are arranged on the machine base; the laser windowing mechanism is arranged on the processing station; the first feeding and discharging mechanism comprises a first feeding and discharging platform arranged on the machine base in a sliding mode. The second feeding and discharging mechanism comprises a second feeding and discharging platform arranged on the machine base in a sliding mode. A linear motor is arranged on the machine base and comprises a stator part fixed to the machine base, a first rotor and a second rotor, the first rotor and the second rotor are connected to the stator part in a sliding mode, the first feeding and discharging platform is arranged on the first rotor, and the second feeding and discharging platform is arranged on the second rotor. The first rotor drives the first feeding and discharging platform to reciprocate between the first feeding and discharging station and the machining station along the linear path, and the second rotor drives the second feeding and discharging platform to reciprocate between the second feeding and discharging station and the machining station along the linear path.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing equipment technology, and in particular to a laser windowing device for dual-station PCB processing. Background Technology

[0002] A circuit board, or PCB (Printed Circuit Board), is an indispensable component in modern electronic devices, carrying the electrical connections and signal transmissions between electronic components. A crucial step in PCB manufacturing is applying a solder mask layer to the board surface to protect the circuitry and prevent short circuits in component leads. This solder mask typically consists of a layer of solder resist ink (often referred to as green solder mask) applied to the etched circuit board using a specific process. However, to meet specific application requirements, such as heat dissipation and contact, the solder mask layer needs to be removed at certain soldering locations; this step is called "windowing."

[0003] For example, the utility model patent with patent authorization announcement number CN214256767U discloses a solder resist opening device for processing solder resist opening on circuit boards. The solder resist opening device includes: a frame, a laser main body mechanism, and a feeding mechanism. The frame is provided with a processing station. The laser main body mechanism is movable to the frame and is located above the processing station. The laser main body mechanism includes multiple laser processing heads, and the light outlet of the laser processing heads is set facing the processing station. The feeding mechanism is located on the frame and is used to transport the circuit board, thereby improving the solder resist opening efficiency of the circuit board and enhancing the circuit board's effectiveness.

[0004] Based on the search of the aforementioned patent grant announcement numbers, and considering their shortcomings, the following was found:

[0005] Existing PCB board windowing equipment has a single loading mechanism. After completing the initial loading step, the equipment must go through a complete processing cycle, including using laser technology to precisely open the PCB board until the entire process is completed and the opened PCB board is successfully unloaded before the next round of loading can begin. This continuous and non-parallel operation mode significantly restricts the overall processing speed and production efficiency of the equipment, making it difficult to fully realize its capacity potential in a fast-paced, high-volume production environment. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a dual-station PCB board laser windowing device. This addresses the problem that existing PCB board windowing equipment has a single loading mechanism. After completing the initial loading step, the equipment must go through a complete processing cycle, including using laser technology to precisely open the PCB board until the entire process is completed and the opened PCB board is successfully unloaded before the next loading operation can begin. This continuous and non-parallel operation mode significantly restricts the overall processing speed and production efficiency of the equipment, making it difficult to fully realize its production capacity potential in a fast-paced, high-volume production environment.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] This utility model provides a dual-station PCB board laser windowing device, comprising: a base, on which a first loading / unloading station, a second loading / unloading station, and a processing station are disposed, the first loading / unloading station and the second loading / unloading station being located on opposite sides of the base, and the processing station being located between the first loading / unloading station and the second loading / unloading station, the first loading / unloading station, the processing station, and the second loading / unloading station being arranged in a straight line on the base; a laser windowing mechanism, disposed on the processing station, for performing a preset laser windowing operation on the PCB board located at the processing station; a first loading / unloading mechanism, comprising a first loading / unloading platform slidably disposed on the base, the first loading / unloading platform being used to support and position the PCB board; and a second loading / unloading mechanism, comprising a second loading / unloading platform slidably disposed on the base, the second loading / unloading platform being used to support and position the PCB board.

[0009] The machine base is equipped with a linear motor, which includes a stator fixed to the machine base and a first mover and a second mover slidably connected to the stator. The first loading / unloading platform is mounted on the first mover, and the second loading / unloading platform is mounted on the second mover. The first mover drives the first loading / unloading platform to reciprocate along a straight path between the first loading / unloading station and the processing station, and the second mover drives the second loading / unloading platform to reciprocate along a straight path between the second loading / unloading station and the processing station.

[0010] Furthermore, the first loading and unloading platform includes a first horizontal moving plate, a first height adjustment component, and a first bearing positioning plate. The first horizontal moving plate is connected to the first moving element, and the first bearing positioning plate is connected to the upper side of the first horizontal moving plate through the first height adjustment component. The first height adjustment component is used to adjust the height difference between the first bearing positioning plate and the first horizontal moving plate, and the first bearing positioning plate is used to support and position the PCB board.

[0011] Furthermore, the first height adjustment component includes: a first vertical guide rail and a first vertical slider, wherein the first vertical slider is slidably connected to the first vertical guide rail in the vertical direction; wherein, the first vertical guide rail is disposed on the upper side of the first horizontal moving plate and the first vertical slider is disposed on the lower side of the first bearing positioning plate, or, the first vertical guide rail is disposed on the lower side of the first bearing positioning plate and the first vertical slider is disposed on the upper side of the first horizontal moving plate.

[0012] Furthermore, the first height adjustment component also includes: a first drive cylinder, a first tilting slider, and a second tilting slider. The first tilting slider is slidably connected to the upper side of the first horizontal moving plate, and the second tilting slider is fixedly connected to the lower side of the first bearing positioning plate. The fixed end of the first drive cylinder is connected to the first horizontal moving plate, and the telescopic end of the first drive cylinder is connected to the first tilting slider.

[0013] The first inclined slider has a first inclined surface with a gradually changing height on its upper side, and the second inclined slider has a second inclined surface that corresponds to and fits against the first inclined surface on its lower side. The first inclined surface and the second inclined surface are slidably connected. The first driving cylinder is used to drive the first inclined slider to move in the direction of the height change of the first inclined surface, so that the second inclined slider drives the first bearing positioning plate to rise or fall.

[0014] Furthermore, the first tilting slider is located at the middle position of the first horizontal moving plate, the second tilting slider is located at the middle position of the first bearing positioning plate, and the first vertical guide rail and the first vertical slider are respectively located at the four corners of the first horizontal moving plate and the first bearing positioning plate.

[0015] Furthermore, the upper side of the first bearing positioning plate is provided with a plurality of adsorption holes, and the first bearing positioning plate is provided with a negative pressure chamber connected to the adsorption holes, and the negative pressure chamber is connected to a vacuum pumping device through an air pipe.

[0016] Furthermore, the laser windowing mechanism includes a laser component, a first CCD camera positioning component, and a second CCD camera positioning component. The laser component is positioned directly above the processing station, the first CCD camera positioning component is positioned on the side of the laser component facing the first loading / unloading station, and the second CCD camera positioning component is positioned on the side of the laser component facing the second loading / unloading station. The laser component is used to perform a preset laser windowing operation on the PCB board located at the processing station, the first CCD camera positioning component is used to photograph and position the PCB board fed towards the first loading / unloading station, and the second CCD camera positioning component is used to photograph and position the PCB board fed towards the second loading / unloading station.

[0017] Furthermore, the laser assembly includes two rows of parallel laser modules, the length direction of which is perpendicular to the movement direction of the first loading / unloading platform and the second loading / unloading platform. Each laser module includes a plurality of lasers uniformly arranged along the length direction of the laser module, with the light outlets of the lasers facing downwards.

[0018] Furthermore, the laser window opening mechanism also includes a dust extraction component, which is used to extract dust from the processing station.

[0019] Furthermore, the dust collection assembly includes a first suction hood, a second suction hood, and a third suction hood located above the processing station. The first suction hood is located on the side of the laser assembly closer to the first loading / unloading station, the third suction hood is located on the side of the laser assembly closer to the second loading / unloading station, and the second suction hood is located in the middle of the two rows of laser modules. The length direction of the first suction hood, the second suction hood, and the third suction hood is the same as the length direction of the laser module.

[0020] The second suction hood has its air inlet facing directly downwards, while the first and third suction hoods have their air inlets facing downwards and tilted towards the second suction hood. The first, second, and third suction hoods are connected to the vacuum cleaner fan via the first, second, and third pipes, respectively.

[0021] This utility model discloses a dual-station PCB laser windowing device. The PCB positioning mechanism uses a horizontal moving plate to move and position the PCB between the loading / unloading station and the processing station. The height of the supporting positioning plate can be flexibly adjusted through a height adjustment component, thereby changing the laser irradiation focal length to adapt to the processing needs of PCBs of different thicknesses and sizes. The laser windowing mechanism uses a laser beam to precisely cut the solder mask layer on the PCB, greatly shortening the windowing time and making the entire PCB processing flow more efficient.

[0022] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0023] Figure 1 This is a perspective view of a laser windowing device for dual-station PCB processing according to an embodiment of the present invention.

[0024] Figure 2 This is a side view of a laser windowing device for dual-station PCB processing according to an embodiment of the present invention.

[0025] Figure 3 This is a top view of the laser windowing device for dual-station processing of PCB boards according to an embodiment of the present invention;

[0026] Figure 4 This is a front view of the laser windowing device for dual-station processing of PCB boards according to an embodiment of the present invention;

[0027] Figure 5 This is a perspective view of the first loading and unloading platform in the dual-station PCB board laser windowing device according to an embodiment of the present invention.

[0028] Figure 6 This is a first-state side view of the first loading and unloading platform in the dual-station PCB board laser windowing device of this utility model embodiment;

[0029] Figure 7 This is a second-state side view of the first loading and unloading platform in the dual-station PCB board laser windowing device according to an embodiment of the present invention.

[0030] Figure 8 This is a three-dimensional view of the cooperative structure of the laser component and the dust collection component in the dual-station PCB board laser window opening device according to an embodiment of the present invention.

[0031] Figure 9 This is a bottom view of the cooperative structure of the laser component and the dust collection component in the dual-station PCB board laser window opening device according to an embodiment of this utility model.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Base; 11. Linear motor; 2. Laser window opening mechanism; 21. Laser component; 211. Laser module; 2111. Laser; 22. First CCD camera positioning component; 23. Second CCD camera positioning component; 24. Dust collection component; 241. First suction hood; 242. Second suction hood; 243. Third suction hood; 3. First loading / unloading mechanism; 31. First loading / unloading platform; 311. First horizontal moving plate; 312. First height adjustment component; 3121. First vertical guide rail; 3122. First vertical slider; 3123. First drive cylinder; 3124. First tilt slider; 3125. Second tilt slider; 313. First bearing positioning plate; 4. Second loading / unloading mechanism; 41. Second loading / unloading platform. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0036] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "resin", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] Please see the appendix Figure 1 and Figure 2This utility model provides a dual-station PCB board laser windowing device, comprising: a base 1, on which a first loading / unloading station, a second loading / unloading station, and a processing station are provided. The first loading / unloading station and the second loading / unloading station are located on opposite sides of the base 1, and the processing station is located between the first loading / unloading station and the second loading / unloading station. The first loading / unloading station, the processing station, and the second loading / unloading station are arranged in a straight line on the base 1; a laser windowing mechanism 2, which is disposed on the processing station and is used to perform a preset laser windowing operation on the PCB board located at the processing station; and a first loading / unloading mechanism 3, which includes a first loading / unloading platform 31 slidably disposed on the base 1, the first loading / unloading platform 31 being used for... The system includes a second loading / unloading mechanism 4, which is slidably mounted on a base 1 and is used to support and position PCB boards. The base 1 is equipped with a linear motor 11, which includes a stator fixed to the base 1 and a first and second mover slidably connected to the stator. The first loading / unloading platform 31 is mounted on the first mover, and the second loading / unloading platform 41 is mounted on the second mover. The first mover drives the first loading / unloading platform 31 to reciprocate along a straight path between the first loading / unloading station and the processing station, and the second mover drives the second loading / unloading platform 41 to reciprocate along a straight path between the second loading / unloading station and the processing station.

[0042] Understandably, existing PCB laser windowing equipment typically employs a single-station design. This means that the next PCB can only be loaded after completing one PCB processing cycle (including loading, processing, and unloading). This serial operation mode limits the continuous production capacity of the equipment, especially in the electronics manufacturing industry where high efficiency and large-volume production are required. Therefore, this embodiment utilizes a linear motor 11 to drive the sliding first loading / unloading platform 31 and the second loading / unloading platform 41, which reciprocate linearly between the first loading / unloading station, the second loading / unloading station, and the processing station, respectively. The high precision and fast response characteristics of the linear motor 11 enable the PCB to move and be positioned quickly and accurately between different stations. During operation, the first loading / unloading platform 31, driven by the first actuator, moves from the first loading / unloading station to the processing station. When the PCB board on the first loading / unloading platform 31 arrives at the processing station, the laser windowing mechanism 2 begins to execute the preset laser windowing operation. While the PCB board on the first loading / unloading platform 31 is being processed, the second loading / unloading platform 41 can move to the second loading / unloading station to load the next PCB board. After the PCB board on the first loading / unloading platform 31 is processed, it is moved to the first loading / unloading station for unloading, while the PCB board on the second loading / unloading platform 41 moves to the processing station for processing. This cycle repeats, achieving alternating operation between the two stations and improving overall production efficiency. Specifically, since the first and second loading / unloading stations in this solution are located on opposite sides of the machine base 1, workers or robots used for loading / unloading have more ample operating space to perform loading / unloading operations at both stations.

[0043] Furthermore, the first loading / unloading platform 31 includes a first horizontal moving plate 311, a first height adjustment component 312, and a first bearing positioning plate 313. The first horizontal moving plate 311 is connected to the first moving element, and the first bearing positioning plate 313 is connected to the upper side of the first horizontal moving plate 311 through the first height adjustment component 312. The first height adjustment component 312 is used to adjust the height difference between the first bearing positioning plate 313 and the first horizontal moving plate 311. The first bearing positioning plate 313 is used to support and position the PCB board. It should be explained that during the PCB board production process, different models of PCB boards may have different thicknesses. In order to ensure that the laser windowing device can adapt to PCB boards of different thicknesses and maintain processing accuracy, this embodiment sets the first height adjustment component 312 on the first loading / unloading platform 31. This allows the height of the first bearing positioning plate 313 to be adjusted to adapt to PCB boards of different thicknesses, ensuring the stability of the PCB board during processing and thus improving the accuracy of laser windowing.

[0044] Furthermore, the first height adjustment component 312 includes: a first vertical guide rail 3121 and a first vertical slider 3122, wherein the first vertical slider 3122 is slidably connected to the first vertical guide rail 3121 in the vertical direction; wherein, the first vertical guide rail 3121 is disposed on the upper side of the first horizontal moving plate 311, and the first vertical slider 3122 is disposed on the lower side of the first bearing positioning plate 313, or, the first vertical guide rail 3121 is disposed on the lower side of the first bearing positioning plate 313, and the first vertical slider 3122 is disposed on the upper side of the first horizontal moving plate 311.

[0045] Specifically, the first height adjustment assembly 312 further includes: a first drive cylinder 3123, a first tilting slider 3124, and a second tilting slider 3125. The first tilting slider 3124 is slidably connected to the upper side of the first horizontal moving plate 311, and the second tilting slider 3125 is fixedly connected to the lower side of the first bearing positioning plate 313. The fixed end of the first drive cylinder 3123 is connected to the first horizontal moving plate 311, and the telescopic end of the first drive cylinder 3123 is connected to the first tilting slider 3124. The upper side of the first tilting slider 3124 is provided with a first tilting surface with gradually changing height, and the lower side of the second tilting slider 3125 is provided with a second tilting surface that corresponds to and fits against the first tilting surface. The first tilting surface and the second tilting surface are slidably connected. The first drive cylinder 3123 is used to drive the first tilting slider 3124 to move in the direction of the height change of the first tilting surface, so that the second tilting slider 3125 drives the first bearing positioning plate 313 to rise or fall.

[0046] It is understood that, in this embodiment, the sliding connection between the first vertical guide rail 3121 and the first vertical slider 3122 provides the first bearing positioning plate 313 with freedom of movement in the vertical direction, while the cooperation of the first drive cylinder 3123, the first tilting slider 3124, and the second tilting slider 3125 enables precise adjustment of the height of the first bearing positioning plate 313. In the initial state, the telescopic end of the first drive cylinder 3123 is in the retracted state, and the first tilting slider 3124 and the second tilting slider 3125 remain relatively stationary through the contact of their tilted surfaces, with the first bearing positioning plate 313 located at the initial height position. When the height of the first bearing positioning plate 313 needs to be adjusted, the control system activates the first drive cylinder 3123. The telescopic end of the first drive cylinder 3123 begins to extend and retract, driving the first inclined slider 3124 to move in the direction of the height change of the first inclined surface. Since the first inclined surface and the second inclined surface are correspondingly fitted and slidably connected, the movement of the first inclined slider 3124 is converted into the lifting or lowering movement of the second inclined slider 3125 and the first bearing positioning plate 313. When the first bearing positioning plate 313 reaches the target height, the control system stops the operation of the first drive cylinder 3123 and locks its position to maintain the stability of the first bearing positioning plate 313. Preferably, the structure of the second loading and unloading platform 41 is the same as that of the first loading and unloading platform 31, and will not be described again here and below.

[0047] Furthermore, the first tilting slider 3124 is positioned at the center of the first horizontal moving plate 311, and the second tilting slider 3125 is positioned at the center of the first bearing positioning plate 313. The first vertical guide rail 3121 and the first vertical slider 3122 are respectively positioned at the four corners of the first horizontal moving plate 311 and the first bearing positioning plate 313. In this embodiment, by positioning the first tilting slider 3124 and the second tilting slider 3125 at the center of the first horizontal moving plate 311 and the first bearing positioning plate 313, the smooth lifting or lowering of the first bearing positioning plate 313 can be achieved more effectively. Simultaneously, the first vertical guide rail 3121 and the first vertical slider 3122 at the four corners provide stable support, preventing the first bearing positioning plate 313 from tilting or swaying during height adjustment.

[0048] Furthermore, the upper side of the first bearing positioning plate 313 is provided with several adsorption holes, and a negative pressure chamber connected to the adsorption holes is provided inside the first bearing positioning plate 313. The negative pressure chamber is connected to a vacuum pumping device through an air pipe. When the vacuum pumping device is started, the air in the negative pressure chamber is extracted through the air pipe to form a negative pressure environment. Due to the effect of atmospheric pressure, the adsorption holes on the first bearing positioning plate 313 will generate an adsorption force on the PCB board, tightly adhering the PCB board to the first bearing positioning plate 313.

[0049] Furthermore, the laser windowing mechanism 2 includes a laser component 21, a first CCD camera positioning component 22, and a second CCD camera positioning component 23. The laser component 21 is positioned directly above the processing station, the first CCD camera positioning component 22 is positioned on the side of the laser component 21 facing the first loading / unloading station, and the second CCD camera positioning component 23 is positioned on the side of the laser component 21 facing the second loading / unloading station. The laser component 21 is used to perform a preset laser windowing operation on the PCB board located at the processing station, the first CCD camera positioning component 22 is used to take pictures and position the PCB board fed in the direction of the first loading / unloading station, and the second CCD camera positioning component 23 is used to take pictures and position the PCB board fed in the direction of the second loading / unloading station.

[0050] In this embodiment, the laser windowing mechanism 2 uses the first CCD camera positioning component 22 and the second CCD camera positioning component 23 to visually position the incoming PCB boards at the first and second loading / unloading stations, respectively. By capturing specific marks or features on the PCB board and comparing them with a preset image, the accurate position of the PCB board on the processing platform is determined. The laser component 21 then performs a precise laser windowing operation based on the data provided by the CCD camera positioning components. Both the first CCD camera positioning component 22 and the second CCD camera positioning component 23 include multiple CCD positioning cameras.

[0051] Specifically, the laser assembly 21 includes two rows of parallel laser modules 211. The length direction of the laser modules 211 is perpendicular to the movement direction of the first loading / unloading platform 31 and the second loading / unloading platform 41. Each laser module 211 includes a plurality of lasers 2111 evenly arranged along its length, with the light-emitting ports of the lasers 2111 facing downwards. It can be understood that the laser assembly 21 consists of two rows of parallel laser modules 211, with multiple lasers 2111 evenly arranged on each laser module 211. This allows the laser modules 211 to simultaneously perform windowing operations at different positions on the PCB board during operation, improving processing efficiency. The downward-facing light-emitting ports of the lasers 2111 directly target the PCB board for processing.

[0052] Furthermore, the laser window opening mechanism 2 also includes a dust collection component 24, which is used to extract dust from the processing station. Specifically, the dust collection assembly 24 includes a first suction hood 241, a second suction hood 242, and a third suction hood 243 located above the processing station. The first suction hood 241 is located on the side of the laser assembly 21 near the first loading / unloading station, and the third suction hood 243 is located on the side of the laser assembly 21 near the second loading / unloading station. The second suction hood 242 is located in the middle of the two rows of laser modules 211. The length direction of the first suction hood 241, the second suction hood 242, and the third suction hood 243 is the same as the length direction of the laser module 211. The air intake of the second suction hood 242 faces directly downwards, and the air intakes of the first suction hood 241 and the third suction hood 243 face downwards and are inclined towards the second suction hood 242. The first suction hood 241, the second suction hood 242, and the third suction hood 243 are respectively connected to the dust collection fan through the first pipe, the second pipe, and the third pipe.

[0053] It is understandable that a large amount of smoke and debris is generated during the laser windowing process on PCB boards. If this smoke and debris are not cleaned up in time, it will not only pollute the working environment but may also damage the laser 2111 and the PCB board, reducing processing quality and equipment lifespan. Therefore, in this embodiment, the suction port of the dust extraction component 24 is directly aimed at the smoke and debris generated during the laser windowing process. When the laser component 21 performs the laser windowing operation, the dust extraction fan starts, and the dust and debris are sucked in by the dust extraction component 24, achieving real-time cleaning of the smoke and debris during the laser windowing process, effectively protecting the working environment and processing quality of the PCB board windowing process. Specifically, the vacuum cleaner starts working after receiving the start command. The airflow enters the first suction hood 241, the second suction hood 242, and the third suction hood 243 through the first pipe, the second pipe, and the third pipe, respectively. The air inlets of the first suction hood 241 and the third suction hood 243 are downward and tilted towards the second suction hood 242, which can capture the smoke and debris that spread from both sides of the area of ​​the first or second processing station. The air inlet of the second suction hood 242 is set directly downward, directly aimed at the center of the processing station area, to capture the main smoke and debris.

[0054] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A laser windowing device for PCB boards with dual-station processing, characterized in that, include: A machine base is provided with a first loading / unloading station, a second loading / unloading station, and a processing station. The first loading / unloading station and the second loading / unloading station are located on opposite sides of the machine base, and the processing station is located between the first loading / unloading station and the second loading / unloading station. The first loading / unloading station, the processing station, and the second loading / unloading station are arranged in a straight line on the machine base. A laser windowing mechanism is provided on the processing station and is used to perform a preset laser windowing operation on the PCB board located at the processing station. The first loading and unloading mechanism includes a first loading and unloading platform slidably disposed on the base, the first loading and unloading platform being used to support and position the PCB board; The second loading and unloading mechanism includes a second loading and unloading platform slidably disposed on the base, the second loading and unloading platform being used to support and position the PCB board; The machine base is equipped with a linear motor, which includes a stator fixed to the machine base and a first mover and a second mover slidably connected to the stator. The first loading / unloading platform is mounted on the first mover, and the second loading / unloading platform is mounted on the second mover. The first mover drives the first loading / unloading platform to reciprocate along a straight path between the first loading / unloading station and the processing station, and the second mover drives the second loading / unloading platform to reciprocate along a straight path between the second loading / unloading station and the processing station.

2. The laser windowing device for dual-station PCB board processing according to claim 1, characterized in that, The first loading and unloading platform includes a first horizontal moving plate, a first height adjustment component, and a first bearing positioning plate. The first horizontal moving plate is connected to the first moving element, and the first bearing positioning plate is connected to the upper side of the first horizontal moving plate through the first height adjustment component. The first height adjustment component is used to adjust the height difference between the first bearing positioning plate and the first horizontal moving plate, and the first bearing positioning plate is used to support and position the PCB board.

3. The laser windowing device for dual-station PCB board processing according to claim 2, characterized in that, The first height adjustment component includes: a first vertical guide rail and a first vertical slider, wherein the first vertical slider is slidably connected to the first vertical guide rail in the vertical direction; wherein the first vertical guide rail is disposed on the upper side of the first horizontal moving plate and the first vertical slider is disposed on the lower side of the first bearing positioning plate, or the first vertical guide rail is disposed on the lower side of the first bearing positioning plate and the first vertical slider is disposed on the upper side of the first horizontal moving plate.

4. The laser windowing device for dual-station PCB board processing according to claim 3, characterized in that, The first height adjustment component further includes: a first drive cylinder, a first tilting slider, and a second tilting slider. The first tilting slider is slidably connected to the upper side of the first horizontal moving plate, and the second tilting slider is fixedly connected to the lower side of the first bearing positioning plate. The fixed end of the first drive cylinder is connected to the first horizontal moving plate, and the telescopic end of the first drive cylinder is connected to the first tilting slider. The first inclined slider has a first inclined surface with a gradually changing height on its upper side, and the second inclined slider has a second inclined surface that corresponds to and fits against the first inclined surface on its lower side. The first inclined surface and the second inclined surface are slidably connected. The first driving cylinder is used to drive the first inclined slider to move in the direction of the height change of the first inclined surface, so that the second inclined slider drives the first bearing positioning plate to rise or fall.

5. A laser windowing device for dual-station PCB board processing according to claim 4, characterized in that, The first tilting slider is located at the middle of the first horizontal moving plate, the second tilting slider is located at the middle of the first bearing positioning plate, and the first vertical guide rail and the first vertical slider are respectively located at the four corners of the first horizontal moving plate and the first bearing positioning plate.

6. The laser windowing device for dual-station PCB processing according to claim 2, characterized in that, The upper side of the first bearing positioning plate is provided with a plurality of adsorption holes, and the first bearing positioning plate is provided with a negative pressure chamber connected to the adsorption holes. The negative pressure chamber is connected to a vacuum pumping device through an air pipe.

7. The laser windowing device for dual-station PCB processing according to claim 1, characterized in that, The laser windowing mechanism includes a laser component, a first CCD camera positioning component, and a second CCD camera positioning component. The laser component is positioned directly above the processing station. The first CCD camera positioning component is positioned on the side of the laser component facing the first loading / unloading station. The second CCD camera positioning component is positioned on the side of the laser component facing the second loading / unloading station. The laser component is used to perform a preset laser windowing operation on the PCB board located at the processing station. The first CCD camera positioning component is used to photograph and position the PCB board fed towards the first loading / unloading station. The second CCD camera positioning component is used to photograph and position the PCB board fed towards the second loading / unloading station.

8. A laser windowing device for dual-station PCB board processing according to claim 7, characterized in that, The laser assembly includes two rows of parallel laser modules. The length direction of the laser modules is perpendicular to the movement direction of the first loading / unloading platform and the second loading / unloading platform. Each laser module includes a plurality of lasers evenly arranged along the length direction of the laser module, and the light outlets of the lasers face downwards.

9. A laser windowing device for dual-station PCB processing according to claim 8, characterized in that, The laser window opening mechanism also includes a dust extraction component, which is used to extract dust from the processing station.

10. A laser windowing device for dual-station PCB processing according to claim 9, characterized in that, The dust collection assembly includes a first suction hood, a second suction hood, and a third suction hood located above the processing station. The first suction hood is located on the side of the laser assembly closer to the first loading / unloading station, the third suction hood is located on the side of the laser assembly closer to the second loading / unloading station, and the second suction hood is located in the middle of the two rows of laser modules. The length direction of the first suction hood, the second suction hood, and the third suction hood is the same as the length direction of the laser module. The second suction hood has its air inlet facing directly downwards, while the first and third suction hoods have their air inlets facing downwards and tilted towards the second suction hood. The first, second, and third suction hoods are connected to the vacuum cleaner fan via the first, second, and third pipes, respectively.

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