Integrated circuit support plate grabbing device and integrated circuit support plate detection equipment

Abstract

The utility model discloses an integrated circuit carrier plate grabbing device and integrated circuit carrier plate detection equipment. The integrated circuit carrier plate grabbing device comprises a substrate, a clamping mechanism and a clamping mechanism, the air distribution block is arranged on the base plate, an air extraction opening and a plurality of air distribution openings are formed in the air distribution block, and the air extraction opening is communicated with a vacuumizing device; and each suction nozzle is suitable for being attracted to the air distribution block through magnetic force and can move in the length direction of the air distribution block, and the multiple suction nozzles communicate with the multiple air distribution ports correspondingly. The integrated circuit carrier plate grabbing device has the advantages of being not prone to damage the carrier plate, high in applicability and the like.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and more specifically, to an integrated circuit carrier board gripping device and an integrated circuit carrier board testing device having the integrated circuit carrier board gripping device. Background Technology

[0002] In the manufacturing process of IC (integrated circuit) substrates, it is necessary to accurately and quickly detect and identify scratches, dents, and other defects on the substrate surface and other areas, and promptly screen out defective products. As an indispensable and important component of electronic products, IC substrates are gradually developing towards miniaturization, densification, and integration. Manual inspection can no longer meet the needs of IC substrate production.

[0003] The integrated circuit substrate inspection equipment in related technologies has a gripping device that is only applicable to substrates of one size, making it difficult to manufacture substrates of various sizes. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an integrated circuit carrier board gripping device, which has advantages such as being less likely to damage the carrier board and having strong applicability.

[0005] This utility model also proposes an integrated circuit carrier board inspection device with the aforementioned integrated circuit carrier board gripping device.

[0006] To achieve the above objectives, an integrated circuit carrier board gripping device is provided according to an embodiment of the first aspect of the present invention. The integrated circuit carrier board detection device includes: a substrate; a gas distribution block disposed on the substrate, the gas distribution block having an air extraction port and a plurality of air distribution ports, the air extraction port being connected to a vacuum pumping device; and a plurality of suction nozzles, each of the suction nozzles being adapted to be magnetically adsorbed onto the gas distribution block and movable in the length direction of the gas distribution block, the plurality of suction nozzles being respectively connected to the plurality of air distribution ports.

[0007] The integrated circuit carrier board gripping device according to the embodiments of this utility model has the advantages of not easily damaging the carrier board and strong applicability.

[0008] In addition, the integrated circuit carrier board gripping device according to the above embodiments of the present invention may also have the following additional technical features:

[0009] According to one embodiment of the present invention, each of the suction nozzles is provided with a magnet at its upper end, and the lower surface of the air distribution block is provided with a ferromagnetic plate, wherein the magnet is adapted to be magnetically attracted to the ferromagnetic plate.

[0010] According to one embodiment of the present invention, there are two gas distribution blocks, the length direction of the gas distribution blocks is oriented along the front-back direction, and each gas distribution block is movably disposed on the substrate.

[0011] According to one embodiment of the present invention, the substrate is provided with a slide rail, each of the gas distribution blocks is provided with a slider, the slider is slidably disposed on the slide rail, and each of the gas distribution blocks and the substrate is connected by a threaded locking member that can be tightened or loosened. The threaded locking member restricts the relative movement between the gas distribution block and the substrate in the tightened state, and allows the relative movement between the gas distribution block and the substrate in the loosened state.

[0012] According to one embodiment of the present invention, the plurality of suction nozzles and the plurality of air distribution ports are respectively connected by flexible hoses.

[0013] According to one embodiment of the present invention, at least a portion of the plurality of gas distribution ports are connected to an on / off valve.

[0014] According to one embodiment of the present invention, each of the nozzles includes: a nozzle body, the nozzle body being connected to the air distribution port; and an elastic buffer rod, the elastic buffer rod being connected to the nozzle body and adapted to be magnetically adsorbed onto the air distribution block, the elastic buffer rod being adapted to axially elastically extend and retract.

[0015] According to one embodiment of the present invention, the integrated circuit substrate gripping device further includes a mounting base, on which the substrate is movably disposed vertically.

[0016] According to one embodiment of the present invention, a vacuum control module is provided on the substrate, the air extraction port is connected to the vacuum pumping device through the vacuum control module, and a pressure gauge is provided on the vacuum control module.

[0017] According to a second aspect of the present invention, an integrated circuit carrier board inspection device is provided, the integrated circuit carrier board inspection device including the integrated circuit carrier board gripping device according to a first aspect of the present invention.

[0018] The integrated circuit substrate testing equipment according to the embodiments of the present invention, by utilizing the integrated circuit substrate gripping device according to the first aspect of the present invention, has the advantages of being less likely to damage the substrate and having strong applicability.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the integrated circuit carrier board gripping device according to an embodiment of the present utility model.

[0022] Figure 2 This is a schematic diagram of the integrated circuit carrier board gripping device according to an embodiment of the present utility model.

[0023] Figure 3 This is a partial structural schematic diagram of the integrated circuit carrier board gripping device according to an embodiment of the present utility model.

[0024] Reference numerals: Integrated circuit carrier board gripping device 1, substrate 10, slide rail 11, air distribution block 20, air extraction port 21, air distribution port 22, ferromagnetic plate 23, slider 24, threaded locking part 25, on / off valve 26, suction nozzle 30, magnet 31, suction nozzle body 32, elastic buffer rod 33, pipeline interface 34, mounting base 40, lifting drive device 41, vacuum control module 50, pressure gauge 51, carrier board 2. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] The integrated circuit carrier board gripping device 1 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0029] like Figures 1-3 As shown, the integrated circuit carrier board gripping device 1 according to an embodiment of the present invention includes a substrate 10, an air distribution block 20 and a plurality of suction nozzles 30.

[0030] The gas distribution block 20 is disposed on the substrate 10. The gas distribution block 20 is provided with an air extraction port 21 and multiple air distribution ports 22. The air extraction port 21 is connected to a vacuum pumping device. Each suction nozzle 30 is adapted to be magnetically attached to the gas distribution block 20 and is movable in the length direction of the gas distribution block 20. The multiple suction nozzles 30 are respectively connected to the multiple air distribution ports 22.

[0031] Specifically, the suction nozzle 30 is adapted to vacuum adsorb the carrier plate 2. The gas distribution block 20 has an airflow channel, and both the suction port 21 and the gas distribution port 22 are connected to the airflow channel. The vacuum device can be a vacuum generator.

[0032] When the integrated circuit substrate gripping device 1 grips the substrate 2, the vacuuming device draws air through the air extraction port 21, generating negative pressure within the air distribution block 20. Multiple air distribution ports 22 draw air in, creating vacuum at multiple suction nozzles 30, which then adsorbs the substrate 2. When the integrated circuit substrate gripping device 1 places the substrate 2, the vacuuming device stops, and the vacuum at the suction nozzles 30 ceases, allowing the substrate 2 to detach from the suction nozzles 30.

[0033] The suction nozzle 30 can be magnetically attached to any position along the length of the air distribution block 20, thereby adjusting the position of the suction nozzle 30 along the length of the air distribution block 20. The movement of the suction nozzle 30 along the length of the air distribution block 20 can be achieved by overcoming the magnetic force to detach the suction nozzle 30 from the air distribution block 20, and then magnetically attaching it to other positions on the air distribution block 20.

[0034] According to the embodiment of the present invention, the integrated circuit carrier board gripping device 1 is provided with a suction nozzle 30 and an air distribution block 20. The air extraction port 21 of the air distribution block 20 is connected to a vacuum pumping device. The vacuum pumping device can generate negative pressure, and the air distribution block 20 distributes the airflow. Negative pressure is generated at multiple suction nozzles 30 to achieve vacuum adsorption of the carrier board 2. This facilitates the gripping and handling of the carrier board 2 by the integrated circuit carrier board gripping device 1. Compared with mechanical gripping methods, this method can avoid damage to the carrier board 2 and improve the reliability of gripping.

[0035] Furthermore, each suction nozzle 30 is adapted to be magnetically attached to the air distribution block 20 and movable in the length direction of the air distribution block 20. Compared with the integrated circuit carrier board gripping device in the related technology, the suction nozzle 30 can be adapted to carrier boards 2 of different sizes by adjusting the position of the suction nozzle 30, thereby improving the compatibility and applicability of the integrated circuit carrier board gripping device 1.

[0036] Furthermore, since magnetic adsorption is used, compared to the method where the nozzle 30 is slidably set on the air distribution block 20, the position of the nozzle 30 can be adjusted by overcoming the magnetic force to detach the nozzle 30 from the air distribution block 20. This reduces the friction between the nozzle 30 and the air distribution block 20 when adjusting the position, reduces the generation of debris and dust during friction, and avoids interfering with the accuracy and reliability of the detection.

[0037] Therefore, the integrated circuit carrier board gripping device 1 according to the present utility model has the advantages of not easily damaging the carrier board and strong applicability.

[0038] The integrated circuit carrier board gripping device 1 according to a specific embodiment of the present invention is described below with reference to the accompanying drawings.

[0039] In some specific embodiments of this utility model, such as Figures 1-3 As shown, the integrated circuit carrier board gripping device 1 according to an embodiment of the present invention includes a substrate 10, an air distribution block 20 and a plurality of suction nozzles 30.

[0040] Specifically, such as Figure 3 As shown, each suction nozzle 30 has a magnet 31 at its upper end (indicated by arrows in the up-down, front-back, and left-right directions), and a ferromagnetic plate 23 is provided on the lower surface of the air distribution block 20. The magnet 31 is adapted to be magnetically attracted to the ferromagnetic plate 23. This allows the suction nozzle 30 to be easily attracted to different positions along the length of the air distribution block 20.

[0041] Specifically, an air distribution port 22 is formed on the upper surface of the air distribution block 20, and an air extraction port 21 is formed on the rear end face of the air distribution block 20. Multiple air distribution ports 22 are spaced apart in the front-rear direction of their respective air distribution blocks 20.

[0042] Advantageously, such as Figure 1 and Figure 2As shown, there are two air distribution blocks 20, with their length direction oriented along the front-to-back direction. Each air distribution block 20 is movably mounted on the substrate 10. This allows the two rows of suction nozzles 30 on the two air distribution blocks 20 to adsorb the two sides of the carrier plate 2 respectively, resulting in a more uniform force on the suction nozzles 30 and improved stability when adsorbing the carrier plate 2. Furthermore, the position of the suction nozzles 30 on the air distribution blocks 20 can be adjusted in the left-to-right direction by moving the air distribution blocks 20, thereby further facilitating the adaptation to carrier plates 2 of different sizes.

[0043] In other words, the position and spacing of the suction nozzle 30 in the left and right directions can be adjusted by moving the air distribution block 20 left and right, and the position and spacing of the suction nozzle 30 in the front and back directions can be adjusted by moving the air distribution block 20 front and back, thus facilitating compatibility with carrier plates 2 of different lengths and widths.

[0044] More specifically, such as Figure 2 As shown, a slide rail 11 is provided on the substrate 10, and a slider 24 is provided on each air distribution block 20. The slider 24 is slidably disposed on the slide rail 11. A threaded locking member 25 that can be tightened or loosened is connected between each air distribution block 20 and the substrate 10. When tightened, the threaded locking member 25 restricts the relative movement between the air distribution block 20 and the substrate 10. When loosened, the threaded locking member 25 allows the relative movement between the air distribution block 20 and the substrate 10. Specifically, the slide rail 11 is disposed on the rear surface of the substrate 10, and a transition plate is connected to the rear end of the air distribution block 20. The slider 24 is disposed on the transition plate. The threaded locking member 25 passes through the substrate 10 and is threadedly engaged with the transition plate. When the threaded locking member 25 is tightened, it abuts against the substrate 10 to restrict the relative movement between the air distribution block 20 and the substrate 10. The arrangement of the slide rail 11 and the slider 24 can make the movement of the air distribution block 20 more stable and reliable. The threaded locking part 25 can be loosened when the suction nozzle 30 needs to be adjusted in the left and right direction, so as to move the air distribution block 20 to the required position, and then the threaded locking part 25 can be tightened, thereby preventing the air distribution block 20 from moving arbitrarily.

[0045] Advantageously, multiple suction nozzles 30 and multiple air distribution ports 22 are connected by flexible hoses (not shown in the figure). Specifically, the suction nozzle 30 is provided with a tubing interface 34, to which the flexible hose can be connected. This avoids restricting the movement of the suction nozzle 30 by the tubing, thereby facilitating the adjustment of the position of the suction nozzle 30.

[0046] More advantageously, such as Figure 1 and Figure 2 As shown, at least a portion of the plurality of air distribution ports 22 are connected to on / off valves 26. Specifically, an on / off valve 26 is connected to the air distribution port 22 at the front of each air distribution block 20. For example, as Figure 1 and Figure 2As shown, each gas distribution block 20 has four gas distribution ports 22, and the two gas distribution ports 22 located at the front of the gas distribution block 20 are connected to on / off valves 26. This allows the on / off valves 26 to close the corresponding gas distribution ports 22 when the size of the carrier plate 2 is small and the corresponding suction nozzle 30 is not required. This allows for the targeted selection of the gas distribution ports 22 according to the size of the carrier plate, ensuring that the suction nozzle 30 used has sufficient adsorption force, and further improving the stability and reliability of adsorption.

[0047] Figure 3 An integrated circuit carrier board gripping device 1 according to some examples of the present invention is shown. For example... Figure 3 As shown, each nozzle 30 includes a nozzle body 32 and an elastic buffer rod 33. The nozzle body 32 is connected to the air distribution port 22. The elastic buffer rod 33 is connected to the nozzle body 32 and is adapted to be magnetically attached to the air distribution block 20. The elastic buffer rod 33 is adapted to axial elastic expansion and contraction. In this way, the elastic buffer rod 33 can be used to buffer the impact of the nozzle 30 on the carrier plate 2 when the nozzle 30 is attached to it, thereby reducing the impact of the nozzle 30 on the carrier plate 2 and preventing damage to the carrier plate 2.

[0048] Specifically, such as Figure 1 and Figure 2 As shown, the integrated circuit substrate gripping device 1 also includes a mounting base 40, on which the substrate 10 is movably mounted vertically. Specifically, the mounting base 40 is provided with a guide rail, on which the substrate 10 is vertically mounted. The mounting base 40 is provided with a lifting drive device 41, which is connected to the substrate 10 in a transmission manner. The lifting drive device 41 can be a dust-free screw. In this way, the lifting of the suction nozzle 30 can be achieved by lifting the substrate 10, facilitating the adsorption and handling of the substrate 2.

[0049] More specifically, such as Figure 1 and Figure 2 As shown, a vacuum control module 50 is provided on the substrate 10, and the suction port 21 is connected to the vacuum pumping device through the vacuum control module 50. A pressure gauge is provided on the vacuum control module 50. This facilitates the control and monitoring of the adsorption state of the suction nozzle 30, and facilitates the adsorption of the carrier plate 2.

[0050] The integrated circuit carrier board inspection device according to an embodiment of the present invention is described below. The integrated circuit carrier board inspection device according to an embodiment of the present invention includes an integrated circuit carrier board gripping device 1 according to the above embodiment of the present invention.

[0051] The integrated circuit substrate testing equipment according to the embodiments of the present invention has the advantages of being less likely to damage the substrate and having strong applicability by utilizing the integrated circuit substrate gripping device 1 according to the above embodiments of the present invention.

[0052] Other components and operations of the integrated circuit carrier board testing equipment according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An integrated circuit carrier board gripping device, characterized in that, include: substrate; Gas distribution block, the gas distribution block is disposed on the substrate, the gas distribution block is provided with an air extraction port and multiple air distribution ports, the air extraction port is connected to a vacuum pumping device; Multiple suction nozzles, each of which is adapted to be magnetically attached to the gas distribution block and movable along the length of the gas distribution block, and the multiple suction nozzles are respectively connected to the multiple gas distribution ports.

2. The integrated circuit carrier board gripping device according to claim 1, characterized in that, Each of the suction nozzles is provided with a magnet at its upper end, and the lower surface of the air distribution block is provided with a ferromagnetic plate, the magnet being adapted to be magnetically attracted to the ferromagnetic plate.

3. The integrated circuit carrier board gripping device according to claim 1, characterized in that, There are two gas distribution blocks, and the length direction of the gas distribution blocks is oriented along the front-to-back direction. Each gas distribution block is movably disposed on the base plate.

4. The integrated circuit carrier board gripping device according to claim 3, characterized in that, The substrate is provided with a slide rail, and each of the gas distribution blocks is provided with a slider. The slider is slidably disposed on the slide rail. Each of the gas distribution blocks and the substrate is connected by a threaded locking member that can be tightened or loosened. When the threaded locking member is tightened, it restricts the relative movement between the gas distribution block and the substrate. When the threaded locking member is loosened, it allows the relative movement between the gas distribution block and the substrate.

5. The integrated circuit carrier board gripping device according to claim 1, characterized in that, The multiple suction nozzles and the multiple air distribution ports are connected by hoses.

6. The integrated circuit carrier board gripping device according to claim 1, characterized in that, At least a portion of the plurality of gas distribution ports are connected to an on / off valve.

7. The integrated circuit carrier board gripping device according to claim 1, characterized in that, Each of the nozzles includes: A suction nozzle body, wherein the suction nozzle body is connected to the air distribution port; An elastic buffer rod is connected to the nozzle body and is adapted to be magnetically attached to the air distribution block. The elastic buffer rod is adapted to axial elastic extension and contraction.

8. The integrated circuit carrier board gripping device according to claim 1, characterized in that, It also includes a mounting base, on which the substrate is movably mounted vertically.

9. The integrated circuit carrier board gripping device according to claim 1, characterized in that, The substrate is provided with a vacuum control module, and the air extraction port is connected to the vacuum pumping device through the vacuum control module. The vacuum control module is provided with a pressure gauge.

10. An integrated circuit substrate testing device, characterized in that, Includes the integrated circuit carrier board gripping device according to any one of claims 1-9.

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