Sucking disc slicing device for half diffusion silicon wafers

Abstract

The utility model discloses a half diffusion silicon wafer suction cup wafer separating device, and belongs to the technical field of silicon wafer transmission equipment. The device is used on automatic equipment of half silicon wafers and comprises four suckers which are linked at the same time, each sucker is fixed on a supporting connecting piece on one side face of a corresponding support, the support is of an eccentric support design structure, the support is connected with a base of a lifting module in a sliding mode, every two suckers form a group, and each group of suckers adsorb one half silicon wafer. The two groups of suckers respectively place two half silicon wafers in the two flower baskets, and then the two half silicon wafers are combined into a whole and put into the small boat to take and place the silicon wafers. The utility model provides a semi-wafer diffusion silicon wafer sucker wafer separating device, which improves the productivity of whole semi-wafer automation, occupies a smaller area and saves space.

Description

Technical Field

[0001] This utility model belongs to the technical field of silicon wafer transfer equipment, and in particular relates to a half-wafer diffusion silicon wafer chuck separating device. Background Technology

[0002] In the field of silicon wafer processing, silicon wafers are a key material for the manufacture of semiconductor devices and solar cells, and their processing efficiency and quality have a decisive impact on the performance and cost of the final products. With the rapid development of the electronics and energy industries, the market demand for silicon wafers is increasing, placing higher demands on the efficiency and capacity of silicon wafer processing technologies. Especially in the high-temperature diffusion process, this stage plays a crucial role in the electrical properties of silicon wafers; therefore, improving the automation level and capacity of this process has become an urgent need for industry development.

[0003] Traditional silicon wafer processing technologies are primarily designed for whole silicon wafers, and these technologies are increasingly unable to meet the demands of modern production in terms of processing capacity and efficiency. Existing automated equipment has relatively low capacity in the high-temperature diffusion process, making it difficult to match the capacity requirements of the main processing unit. This significantly limits the efficiency and output of the entire production line. Furthermore, with the increase in silicon wafer size and processing precision, traditional processing methods are proving inadequate when handling half-wafers, failing to achieve efficient and stable production. Utility Model Content

[0004] To address the problems in related technologies, this application provides a half-wafer diffusion silicon wafer chuck slitting device, which is used in conjunction with automated equipment for the high-temperature process section of half-wafer silicon wafers, thereby increasing the overall automated half-wafer production capacity and saving space with a smaller footprint.

[0005] The technical solution is as follows:

[0006] A half-wafer diffusion silicon wafer chuck slitting device is used on automated half-wafer silicon wafer equipment. It includes four chucks that move simultaneously. Each chuck is fixed on a support connector on one side of a corresponding bracket. The bracket has an eccentric bracket design and is connected to a ball screw on a Z-axis module. Two chucks form a group, and each group of chucks picks up one half-wafer silicon wafer. After the two groups of chucks place the two half-wafer silicon wafers into two baskets respectively, they are combined into a whole and put into a small boat to pick up and put in the silicon wafer.

[0007] In a further technical solution, the suction cup controls the adsorption of silicon wafers through an air passage structure.

[0008] A further technical solution is that the suction cup assembly connected to the bracket is provided with two air pipes that are linked front and rear, and the two separate air pipes are merged into the same air pipe. At the same time, a speed regulating valve is connected to the suction cup.

[0009] A further technical solution involves an air passageway inside the air passage structure.

[0010] A further technical solution involves a sliding rail on the base of the lifting module, with the support moving along the Y-axis on the sliding rail.

[0011] A further technical solution is to use a ball screw as the sliding track.

[0012] The technical solution includes at least the following technical effects:

[0013] 1. By increasing the number of suction cups and linking four sets of suction cups together, the overall wafer loading and unloading capacity has been significantly improved, meeting the demand for an increase of about 70% in silicon wafer capacity.

[0014] 2. The combined design of the suction cups and the use of the eccentric support optimize the space utilization of the equipment, allowing more silicon wafers to be processed simultaneously.

[0015] 3. The front and rear linkage air circuit design improves the stability of suction cup operation and reduces malfunctions caused by air circuit problems.

[0016] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0018] Figure 1 This is a front view of a half-wafer diffusion silicon wafer chuck slitting device provided in a preferred embodiment of the present invention;

[0019] Figure 2 A side view of a half-wafer diffusion silicon wafer chuck slitting device provided in a preferred embodiment of this utility model;

[0020] Figure 3 A schematic diagram of the air passage structure of the suction cup from a structural perspective; Attached image description:

[0022] 1. First suction cup; 2. Second suction cup; 3. Third suction cup; 4. Fourth suction cup; 5. First bracket; 6. Second bracket; 7. Third bracket; 8. Fourth bracket; 9. Lifting module; 10. First station; 11. Second station; 12. Third station; 13. Support connector. Detailed Implementation

[0023] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this invention as detailed in the appended claims.

[0024] As attached Figures 1-3 As shown, this embodiment of a half-wafer diffusion wafer chuck separating device increases the wafer loading and unloading capacity in the high-temperature diffusion process by increasing the number of chucks and optimizing their layout. This structure is suitable for automated half-wafer diffusion equipment, increasing the automated half-wafer diffusion capacity by approximately 70%, while also saving space by occupying less floor space.

[0025] Two sets of suction cups are used, with two suction cups per set, and all four suction cups operate simultaneously. The suction cup assembly features an eccentric bracket design, with the bracket fixed to the lifting module. A support connector is fixedly connected to the suction cup set, and the bracket is connected to the base of the lifting module 9. The base of the lifting module 9 is equipped with a ball screw connected to the bracket, allowing for forward and backward movement along the Y-axis. In this embodiment, the lifting module is a Z-axis lifting module.

[0026] like Figure 2 As shown, when the first suction cup 1 and the second suction cup 2 are combined, the picking and placing operations are performed on the left half of the quartz boat; when separated, they are performed in two different baskets. Similarly, when the other two suction cups, the third suction cup 3 and the fourth suction cup 4, are combined, the picking and placing operations are performed on the right half of the quartz boat; when separated, they are performed in two different baskets. By increasing the number of suction cups, the overall loading and unloading capacity is improved.

[0027] The suction cup uses gas control to adsorb silicon wafers. The suction cup's support features a simple and relatively fixed air path design, with interconnected air pipes to avoid interference. The suction cup assembly, connecting the suction cup to the support, has two separate air pipes, one at the front and one at the back. These two separate air pipes are merged into a single pipe and then connected via a cable chain to a vacuum generator and pneumatic components such as solenoid valves. The suction cup is also connected to a speed control valve to regulate its suction force. The air path utilizes internal air channels for ventilation, avoiding the complex layout of external air pipes, reducing the possibility of air path interference, and improving the stability and durability of the air path.

[0028] In this embodiment, four sets of suction cups perform wafer loading and unloading operations at the quartz boat and basket workstation. The suction cups are controlled by a pneumatic structure to achieve the adsorption and release of silicon wafers. When wafer loading or unloading is required, all four sets of suction cups operate simultaneously, performing both combined and separated operations via an eccentric support, enabling efficient operation of the suction cups at the quartz boat and basket workstation. The simple design of the pneumatic structure ensures the synchronization and stability of the suction cup movements.

[0029] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art that are not covered by the invention. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the appended claims.

[0030] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.

Claims

1. A half-wafer diffusion silicon wafer chuck separating device, characterized in that: It is used in automated equipment for half silicon wafers. It includes four suction cups that work together simultaneously. Each suction cup is fixed on a support connector on one side of a corresponding bracket. The bracket has an eccentric bracket design and is slidably connected to the base of the lifting module. Two suction cups form a group. Each group of suction cups picks up one half silicon wafer. After the two groups of suction cups place the two half silicon wafers into two baskets respectively, they are combined into a whole and put into a small boat to pick up and put in the silicon wafer.

2. The half-wafer diffusion silicon wafer chuck separating device according to claim 1, characterized in that, The suction cup adsorbs the silicon wafer through an air passage structure.

3. The half-wafer diffusion silicon wafer chuck separating device according to claim 2, characterized in that, The suction cup assembly connected to the bracket is equipped with two air pipes that are linked front and rear. The two separate air pipes are merged into one air pipe, and a speed control valve is connected to the suction cup.

4. The half-wafer diffusion silicon wafer chuck separating device according to claim 2, characterized in that, The gas passage structure has an internal air opening groove.

5. The half-wafer diffusion silicon wafer chuck separating device according to claim 1, characterized in that, The base of the lifting module is equipped with a sliding rail, and the bracket moves along the Y-axis on the sliding rail.

6. The half-wafer diffusion silicon wafer chuck separating device according to claim 5, characterized in that, The sliding track is a ball screw.

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