Hairbrush module for semiconductor packaging sputtering deburring
By combining the adjustment component and the clamping component into a brush module, the problem of poor flexibility of traditional brush modules is solved, and a high-precision deburring effect for semiconductor packaging is achieved.
Patent Information
- Application Number
- CN202422709378.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-07
AI Technical Summary
Traditional deburring brush modules have poor flexibility and are difficult to remove burrs from specific areas or hard-to-reach locations. At the same time, semiconductor packages are prone to movement or vibration during the deburring process, which affects the processing accuracy.
The brush module, which combines adjustment and clamping components, uses a drive motor to drive unidirectional and bidirectional threaded screws to achieve multi-angle adjustment of the brush and opposing clamping and fixing of the semiconductor package, ensuring that no movement or vibration occurs during the deburring process.
It enables the removal of burrs in specific areas and hard-to-reach locations, improves processing accuracy, and prevents semiconductor packages from moving and vibrating during the deburring process.
Smart Images
Figure CN223519299U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor packaging technical field, concretely is a brush module for semiconductor packaging sputtering deburring. BACKGROUND
[0002] Semiconductor packaging is an important link in the semiconductor industry chain, with the rapid development of semiconductor industry, the packaging industry also presents the vigorous development situation, in the semiconductor packaging process, burr problem has been an important factor influencing the packaging quality and reliability, sputtering process is a kind of technology for plating a layer or several layers of metal film on the surface of semiconductor product, for shielding component signal, solve the difficult problem of signal mutual interference. However, after sputtering process is completed, metal burr is often produced in the process of stripping product. These metal burrs adhere to the product, not only affect the appearance quality of product, but also may cause potential threat to the electrical performance and reliability of product.
[0003] And the traditional deburring brush module, the flexibility of removing burr is poor, leading to difficult to remove the burr of specific area or difficult to reach position, and the semiconductor package is easy to produce movement or vibration in the process of removing burr, thereby leading to poor processing precision. UTILITY MODEL CONTENT
[0004] The utility model aims at solving the shortcoming in prior art, and provides a brush module for semiconductor packaging sputtering deburring.
[0005] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a brush module for semiconductor packaging sputtering deburring, including brush module body, the brush module body includes the adjusting assembly for scheduling adjustment and the clamping assembly for fixing semiconductor package;
[0006] The adjusting assembly includes a support bottom plate, the upper end extension plate of the support bottom plate is fixedly connected with a drive motor one, the output end of the drive motor one is fixedly connected with a one-way threaded lead screw, the one-way threaded lead screw is threadedly connected with a threaded sleeve block, the threaded sleeve block is fixedly connected with a connecting plate, a sliding groove is formed in the connecting plate, and a connecting column is slidably connected to the sliding groove, the lower end of the connecting column is fixedly connected with an electric telescopic rod, the lower end of the electric telescopic rod is fixedly connected with a drive motor two, and the output end of the drive motor two is fixedly connected with a brush;
[0007] The clamping assembly is arranged below the adjusting assembly, the clamping assembly includes a drive motor three, the output end of the drive motor three is fixedly connected with a two-way threaded lead screw, the two-way threaded lead screw is threadedly connected with a threaded sleeve plate, the side, away from the drive motor three, of the threaded sleeve plate is fixedly connected with a clamping plate, and the side, away from the threaded sleeve plate, of the clamping plate is fixedly connected with a buffer pad.
[0008] As a further description of the above technical solutions:
[0009] The upper end of the support bottom plate is fixedly connected with a support rod, the upper end of the support rod is rotationally connected with a guide rod, the guide rod is slidingly connected with a guide block, one end of the guide rod away from the support rod is provided with a stop block for limiting the guide block, and the guide block is rotationally connected to the uppermost end of the connecting column.
[0010] As a further description of the above technical solutions:
[0011] The connecting column is fixedly connected with a limiting block and is provided with a plurality of groups of limiting plates for limiting the connecting plate.
[0012] As a further description of the above technical solutions:
[0013] The two groups of unidirectional threaded rods are vertically crossed and arranged in an up-down manner for driving the connecting column to be adjusted in different directions, and the unidirectional threaded rods are rotationally connected to the extension plate provided at the upper end of the support bottom plate.
[0014] As a further description of the above technical solutions:
[0015] The driving motor three is fixedly connected to the upper end of the support bottom plate, the upper end of the support bottom plate is fixedly connected with a fixed plate, and the bidirectional threaded rod is rotationally connected to the fixed plate.
[0016] As a further description of the above technical solutions:
[0017] The fixed plate is provided with two groups of limiting sliding rods fixedly connected between the two groups, the threaded sleeve plates are provided with two groups and sliding on the limiting sliding rods in opposite directions or reverse directions, respectively, one side of the threaded sleeve plate away from the driving motor three is fixedly connected with a containing plate, and the containing plate slidingly penetrates the other threaded sleeve plate.
[0018] As a further description of the above technical solutions:
[0019] The lower end of the support bottom plate is fixedly connected with a support column, and the support column is provided with a plurality of groups of support plates for supporting the brush module body.
[0020] The utility model has the advantages of the following beneficial effects:
[0021] 1. By simultaneously or respectively starting the driving motor one, the connecting column can be driven to move in different directions, the electric telescopic rod is started to adjust the height of the brush, the driving motor two is started to drive the brush to rotate, so that the brush can be adjusted at multiple angles, and the burrs in specific areas or difficult-to-reach positions can be removed.
[0022] 2, by starting the drive motor three drive two sets of connecting plate and connecting column to the opposite direction, can be to the semiconductor package to the opposite direction clamping fixed, so as to prevent the semiconductor package in the process of removing burr or vibration, thereby improving the machining accuracy. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 A three-dimensional structure diagram of a brush module for sputtering burr removal of a semiconductor package is proposed in the utility model Figure One ;
[0024] Figure 2 A three-dimensional structure diagram of a brush module for sputtering burr removal of a semiconductor package is proposed in the utility model Figure Two ;
[0025] Figure 3 A partial structure diagram of a brush module for sputtering burr removal of a semiconductor package is proposed in the utility model Figure One ;
[0026] Figure 4 A partial structure diagram of a brush module for sputtering burr removal of a semiconductor package is proposed in the utility model Figure Two ;
[0027] Figure 5 A partial structure diagram of a brush module for sputtering burr removal of a semiconductor package is proposed in the utility model Figure Three .
[0028] LEGEND:
[0029] 1, brush module body; 2, adjusting assembly; 21, support bottom plate; 22, drive motor one; 23, one-way threaded rod; 24, threaded sleeve block; 25, connecting plate; 26, connecting column; 27, limit block; 28, electric telescopic rod; 29, drive motor two; 210, brush; 211, support rod; 212, guide rod; 213, guide block; 3, clamping assembly; 31, drive motor three; 32, two-way threaded rod; 33, fixed plate; 34, threaded sleeve plate; 35, clamping plate; 36, buffer pad; 37, containing plate; 38, limit slide rod; 4, support column. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0031] Reference Figures 1-5 The utility model provides a kind of brush module for semiconductor package sputtering deburring, comprising: brush module body 1.
[0032] Specifically, brush module body 1 includes the adjusting assembly 2 for scheduling adjustment and the clamping assembly 3 for fixing semiconductor package;
[0033] Adjusting assembly 2 includes support base plate 21, the upper end extension plate of support base plate 21 is fixedly connected with drive motor one 22, the output end of drive motor one 22 is fixedly connected with one-way screw rod 23, and one-way screw rod 23 is threadedly connected with threaded sleeve block 24, and threaded sleeve block 24 is fixedly connected with connecting plate 25, while the slide groove opened on connecting plate 25 is slidably connected with connecting column 26, the lower end of connecting column 26 is fixedly connected with electric telescopic rod 28, and the lower end of electric telescopic rod 28 is fixedly connected with drive motor two 29, and the output end of drive motor two 29 is fixedly connected with brush 210;
[0034] Clamping assembly 3 is below adjusting assembly 2, and clamping assembly 3 includes drive motor three 31, the output end of drive motor three 31 is fixedly connected with two-way screw rod 32, two-way screw rod 32 is threadedly connected with threaded sleeve plate 34, and threaded sleeve plate 34 is fixedly connected with clamping plate 35 on the side away from drive motor three 31, and clamping plate 35 is fixedly connected with buffer pad 36 on the side away from threaded sleeve plate 34.
[0035] In the embodiment, adjusting assembly 2 and clamping assembly 3 cost semiconductor package sputtering deburring brush module involved in the application, the operation of removing burr to semiconductor package is realized.
[0036] In the embodiment, brush 210 contains brush handle for conveniently connecting the output end of drive motor two 29, and also is provided with nylon bristle, and the upper end of bristle and the lower end of brush handle are provided with connecting member for stably connecting brush handle and bristle, to ensure that bristle can be firmly fixed on brush handle, and will not fall off or loosen during use.
[0037] In the embodiment, the height of brush 210 is adjusted up and down by electric telescopic rod 28, and brush 210 is driven to rotate by drive motor two 29 for removing burr to semiconductor package.
[0038] It should be noted that threaded sleeve plate 34 is provided with two groups, clamping plate 35 and buffer pad 36 are horizontally symmetrical and provided between two groups of threaded sleeve plate 34, and two groups of buffer pad 36 are attached with semiconductor package (not shown).
[0039] Specifically, the upper end of the support bottom plate 21 is fixedly connected with a support rod 211, the upper end of the support rod 211 is rotationally connected with a guide rod 212, the guide rod 212 is slidingly connected with a guide block 213, the end of the guide rod 212 away from the support rod 211 is provided with a stop block for limiting the guide block 213, and the guide block 213 is rotationally connected to the uppermost end of the connecting column 26, the connecting column 26 is fixedly connected with a limiting block 27 and is provided with a plurality of groups for limiting the connecting plate 25, the two groups of unidirectional threaded rods 23 are vertically crossed and are arranged in an upper and lower manner for driving the connecting column 26 to be adjusted in different directions, and the unidirectional threaded rods 23 are rotationally connected to the extension plate provided on the upper end of the support bottom plate 21.
[0040] As a preferred embodiment, the limiting block 27 is provided with a plurality of groups and is uniformly distributed on the upper and lower sides of the two groups of connecting plates 25, and the limiting block 27 is arranged between the electric telescopic rod 28 and the guide block 213.
[0041] As a preferred embodiment, the driving motor one 22 is provided with two groups for respectively driving the two groups of unidirectional threaded rods 23 to be reversely rotated, and the connecting column 26 and the brush 210 are driven to move at different angles through the forward and reverse rotation of the two groups of unidirectional threaded rods 23, and the two groups of driving motors one 22 can be simultaneously started or can be started respectively.
[0042] Specifically, the driving motor three 31 is fixedly connected to the upper end of the support bottom plate 21, the upper end of the support bottom plate 21 is fixedly connected with a fixed plate 33, the bidirectional threaded rod 32 is rotationally connected to the fixed plate 33, the fixed plate 33 is provided with two groups and is fixedly connected with a limiting sliding rod 38 between the two groups, the threaded sleeve plate 34 is provided with two groups and is slidingly arranged on the limiting sliding rod 38 in a facing or opposite direction, the side of the threaded sleeve plate 34 away from the driving motor three 31 is fixedly connected with a containing plate 37, the containing plate 37 is slidingly penetrated on the other threaded sleeve plate 34, the lower end of the support bottom plate 21 is fixedly connected with a support column 4, and the support column 4 is provided with a plurality of groups for supporting the brush module body 1.
[0043] As a preferred embodiment, the limiting sliding rod 38 is provided with two groups and is arranged on the two sides of the bidirectional threaded rod 32, and is arranged below the containing plate 37, and the bidirectional threaded rod 32 is arranged below the containing plate 37.
[0044] It should be noted that the shape of the containing plate 37 is U-shaped, which is used for containing burrs after the semiconductor package is cleaned by the brush 210.
[0045] In use, by simultaneously or separately starting the driving motor one, the two groups of unidirectional screw rods are driven to rotate in the same direction or in the opposite direction respectively, so that the two groups of threaded sleeve blocks and the two groups of connecting plates are moved in different directions, the connecting column is moved in different directions, the electric telescopic rod is started to adjust the height of the brush, the driving motor two is started to drive the brush to rotate, so that the brush is allowed to be adjusted at multiple angles, the semiconductor package is placed between the two groups of buffer pads, the driving motor three is started, the bidirectional screw rod is driven to rotate, the two groups of threaded sleeve plates are driven to slide on the two groups of limiting slide rods in the opposite directions, and the two groups of connecting plates and the connecting column are driven to move in the opposite directions, so that the semiconductor package is clamped and fixed in the opposite directions.
[0046] The brush module for sputtering deburring of the semiconductor package allows the brush to be adjusted at multiple angles, facilitates deburring of burrs in specific areas or difficult-to-reach positions, clamps and fixes the semiconductor package in the opposite directions, so that movement or vibration of the semiconductor package in the deburring process is prevented, and processing precision is improved.
[0047] Finally, it should be noted that: the above only for the preferred embodiments of the utility model, and does not limit the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. within the spirit and principles of the utility model, should be included in the protection scope of the utility model.
Claims
1. A brush module for sputter deburring of semiconductor packages, characterized by: Including brush module body (1), the brush module body (1) includes the adjusting assembly (2) for dispatching adjustment and the clamping assembly (3) for fixing semiconductor package; The adjusting assembly (2) includes a support bottom plate (21), the upper end extension plate of the support bottom plate (21) is fixedly connected with a drive motor one (22), the output end of the drive motor one (22) is fixedly connected with a one-way threaded lead screw (23), the one-way threaded lead screw (23) is threadedly connected with a threaded sleeve block (24), the threaded sleeve block (24) is fixedly connected with a connecting plate (25), the slide groove opened on the connecting plate (25) is slidably connected with a connecting column (26), the lower end of the connecting column (26) is fixedly connected with an electric telescopic rod (28), the lower end of the electric telescopic rod (28) is fixedly connected with a drive motor two (29), the output end of the drive motor two (29) is fixedly connected with a brush (210), and the brush (210) is slidably connected with the connecting column (26). The clamping assembly (3) is arranged below the adjusting assembly (2), the clamping assembly (3) includes a drive motor three (31), the output end of the drive motor three (31) is fixedly connected with a two-way threaded lead screw (32), the two-way threaded lead screw (32) is threadedly connected with a threaded sleeve plate (34), the side, away from the drive motor three (31), of the threaded sleeve plate (34) is fixedly connected with a clamping plate (35), and the side, away from the threaded sleeve plate (34), of the clamping plate (35) is fixedly connected with a buffer pad (36).
2. The brush module for sputter deburring of semiconductor packages of claim 1, wherein: The upper end of the support bottom plate (21) is fixedly connected with a support rod (211), the upper end of the support rod (211) is rotatably connected with a guide rod (212), the guide rod (212) is slidably connected with a guide block (213), the end, away from the support rod (211), of the guide rod (212) is provided with a stopper for limiting the guide block (213), and the guide block (213) is rotatably connected to the uppermost end of the connecting column (26).
3. The brush module for sputter deburring of semiconductor packages of claim 2, wherein: The connecting column (26) is fixedly connected with a limiting block (27) and is provided with a plurality of groups for limiting the connecting plate (25).
4. The brush module for sputter deburring of semiconductor packages of claim 3, wherein: The one-way threaded lead screw (23) is vertically crossed with two groups and is arranged up and down for driving the connecting column (26) to adjust in different directions, and the one-way threaded lead screw (23) is rotatably connected to the extension plate arranged on the upper end of the support bottom plate (21).
5. The brush module for sputter deburring of semiconductor packages of claim 4, wherein: The drive motor three (31) is fixedly connected to the upper end of the support bottom plate (21), the upper end of the support bottom plate (21) is fixedly connected with a fixed plate (33), and the two-way threaded lead screw (32) is rotatably connected to the fixed plate (33).
6. The brush module for sputter deburring of semiconductor packages of claim 5, wherein: The fixed plate (33) is provided with two groups and is fixedly connected with a limiting slide rod (38) between the two groups, the threaded sleeve plate (34) is provided with two groups and is slidably arranged on the limiting slide rod (38) in opposite directions or opposite directions, the side, away from the drive motor three (31), of the threaded sleeve plate (34) is fixedly connected with a containing plate (37), and the containing plate (37) is slidably penetrated through the other threaded sleeve plate (34).
7. The brush module for sputter deburring of semiconductor packages of claim 6, wherein: The lower end of the support bottom plate (21) is fixedly connected with a support column (4), and the support column (4) is provided with a plurality of groups for supporting the brush module body (1).