Graphite mold chip packaging and sintering device

Abstract

The utility model relates to the field of chip packaging and sintering, and discloses a graphite mold chip packaging and sintering device which comprises an upper mold, a lower positioning mold and a fixing frame, the bottom of the lower positioning mold is fixedly connected with the fixing frame, an ejection frame is movably installed in the lower positioning mold, an ejection rod is movably installed in a heating plate, and the ejection rod is fixedly connected with the upper mold. An upper die is movably installed on the top of the lower positioning die, a welding pressing needle is movably installed in the upper die, an inserting groove is formed in the welding pressing needle, and a connecting rod is movably installed on the periphery of the welding pressing needle. Through cooperative use of the material jacking frame, the jacking rod, the inserting groove and the connecting rod, a worker can be assisted to carry out material taking operation after machining is finished, the worker does not need to carry out chip body discharging operation in sequence through tools, the worker can conveniently install and detach a plurality of welding pressing needles at the same time, and the working efficiency is improved. When not in use, the plug-in and plug-out disassembly are performed in sequence, so that the labor cost is effectively saved and the working efficiency is further improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of chip packaging sintering, in particular to a graphite mold chip packaging sintering device. BACKGROUND

[0002] The graphite mold chip packaging sintering device is a device specially used for a semiconductor chip packaging process, mainly used for solidifying and forming a graphite mold chip through a high-temperature sintering process, and finally forming a solid structure with high strength and stability by using a high-temperature environment to make the binder and other components in the chip material chemically react, the graphite mold plays a good role in heat conduction and high-temperature resistance in the process, and can effectively ensure that the chip is not damaged in the sintering process, and is widely used in the fields of electronics, optoelectronics and high-precision manufacturing.

[0003] At present, the related graphite mold chip packaging sintering device lacks a material ejection structure for assisting in ejection, and the staff needs to use external tools to take out the material after the chip packaging sintering is completed, so that the material taking operation is relatively cumbersome, labor is consumed, and the material taking efficiency is not ideal. CONTENT OF THE INVENTION

[0004] In order to solve the problems in the background art, the application provides a graphite mold chip packaging sintering device.

[0005] The graphite mold chip packaging sintering device provided by the application adopts the following technical scheme:

[0006] A graphite mold chip packaging sintering device, comprising an upper mold, a lower positioning mold and a fixed frame, the bottom of the lower positioning mold is fixedly connected with the fixed frame, the inside of the lower positioning mold is movably installed with a material ejection frame, the bottom of the material ejection frame is embeddedly installed with a mounting plate, the inside of the lower positioning mold at the top of the material ejection frame is fixedly connected with a heating plate, the inside of the heating plate is movably installed with a top rod, the top of the lower positioning mold is movably installed with the upper mold, the inside of the upper mold is movably installed with a welding pressure needle, a chip body is arranged between the welding pressure needle and the lower positioning mold, the bottom of the chip body is provided with solder, the inside of the welding pressure needle is provided with a slot, and the periphery of the welding pressure needle is movably installed with a connecting rod.

[0007] Preferably, the inner sides of the lower positioning mold and the fixed frame are both provided with limiting grooves, the two sides of the material ejection frame are both fixedly connected with limiting blocks, and the limiting blocks are embedded with the limiting grooves.

[0008] Preferably, the inside of the slot is provided with an anti-skid ring, and the connecting rod is embedded with the anti-skid ring.

[0009] Preferably, the bottom end of the inside of the fixed frame is fixedly connected with a bolt hole, and the bolt hole is provided with two groups.

[0010] Preferably, the top rack is fixedly connected with a connecting block at both ends, and the inner side of the connecting block is fixedly connected with a handle.

[0011] To sum up, the present application has the following beneficial technical effects:

[0012] Through the setting of the top rack and the top rod, the worker can assist in taking out the material after processing, without the worker using tools to take out the chip body in sequence, saving manpower and time, and improving work efficiency. Through the setting of the slot and the connecting rod, when the number of welding pressure needles needed is determined, the connecting rod is used to connect multiple welding pressure needles together. When multiple welding pressure needles are used, only one welding pressure needle needs to be taken out to take out all the welding pressure needles, which is convenient for the worker to install and disassemble multiple welding pressure needles at the same time, without the need to insert and pull out in sequence when not in use, saving labor costs and further improving work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a whole perspective view of the application embodiment;

[0014] Figure 2 is a schematic view of the internal structure of the application embodiment;

[0015] Figure 3 is a schematic view of the local structure of the fixed frame and the mounting plate of the application embodiment;

[0016] Figure 4 is a schematic view of the local structure of the fixed frame and the bolt hole of the application embodiment;

[0017] Figure 5 is a schematic view of the local structure of the chip and the solder of the application embodiment;

[0018] Figure 6 is a schematic view of the local structure of the slot and the anti-skid ring of the application embodiment.

[0019] Reference signs: 1, welding pressure needle; 101, slot; 102, anti-skid ring; 2, upper die; 3, chip body; 4, top rod; 5, lower positioning die; 6, top rack; 7, heating plate; 8, limiting block; 9, limiting groove; 10, fixed frame; 1001, bolt hole; 11, solder; 12, mounting plate; 13, handle; 1301, connecting block; 14, connecting rod. DETAILED DESCRIPTION

[0020] The following will be described in detail in combination with the accompanying Figures 1-6 The application will be further described in detail.

[0021] The application embodiment discloses a graphite mold chip packaging sintering device. Referring to Figures 1-6The utility model provides a graphite mould core chip package sintering device, including upper die 2, lower positioning mould 5 and fixed frame 10, the bottom fixed connection of lower positioning mould 5 has fixed frame 10, the inside movable mounting of lower positioning mould 5 has top material frame 6, the bottom embedded mounting of top material frame 6 has mounting plate 12, the inside fixed connection of top material frame 6 top lower positioning mould 5 has heating plate 7, the inside movable mounting of heating plate 7 has top rod 4, the top movable mounting of lower positioning mould 5 has upper die 2, the inside movable mounting of upper die 2 has welding pressure needle 1, and the chip body 3 is arranged between welding pressure needle 1 and lower positioning mould 5, and the bottom of chip body 3 is equipped with solder 11, and the inside of welding pressure needle 1 is equipped with slot 101, and the periphery movable mounting of welding pressure needle 1 has connecting rod 14, and lower positioning mould 5 positions the position of chip body 3 through accurate structure, ensures the stability and accuracy of chip body 3 in the packaging process, and upper die 2 is used in cooperation with welding pressure needle 1, and the chip body 3 is positioned through welding pressure needle 1, ensures the accurate contact between chip body 3 and lower positioning mould 5 and the alignment of welding area, makes the external heating equipment close to heating plate 7, makes heating plate 7 conduct heat, and heating plate 7 provides heating, so that chip body 3 and solder 11 reach the required temperature in the heating process, thereby realizing the welding of chip body 3 and packaging material, welding pressure needle 1 applies proper pressure in the heating process, and the appropriate weight is pressed on chip body 3, so that chip body 3 can be fully sealed after solder 11 melts, and the staff can install the external hydraulic jacking equipment to the bottom of top material frame 6, after the chip package welding processing is finished, first, upper die 2 is pulled up, makes upper die 2 pull up welding pressure needle 1 and disassembles, then utilizes the external hydraulic jacking equipment to jacking top material frame 6 or pulls up top material frame 6, and top material frame 6 drives the top rod 4 in the inside of heating plate 7, makes top rod 4 all top up chip body 3 on the top of upper die 2, and the staff can take and discharge operation, the staff can insert connecting rod 14 into the inside of the slot 101 in the inside of multiple adjacent welding pressure needle 1 after determining the number of welding pressure needle 1 to be used, and multiple welding pressure needle 1 is connected together, and the staff can only take up one welding pressure needle 1 when using multiple welding pressure needle 1, so that all welding pressure needle 1 can be taken up, and it is easy for the staff to install and disassemble multiple welding pressure needle 1.

[0022] Refer to Figure 2 The inner side of lower positioning mould 5 and fixed frame 10 is equipped with limiting groove 9, and the both sides of top material frame 6 are fixedly connected with limiting block 8, the limiting block 8 is embedded with limiting groove 9, the limiting block 8 can move in the inside of limiting groove 9, the limiting block 8 can guide and limit the moving direction of top material frame 6, and the stability of top material frame 6 is improved.

[0023] Refer to Figure 6The inside of the slot 101 is provided with an anti-skid ring 102, and the connecting rod 14 is embedded with the anti-skid ring 102, the inner diameter of the anti-skid ring 102 is gradually reduced, the friction between the connecting rod 14 and the welding pressure needle 1 is increased, and the stability effect of the installation of the connecting rod 14 is increased.

[0024] With reference to Figure 3 The bottom end of the fixed frame 10 is fixedly connected with a bolt hole 1001, and the bolt hole 1001 is provided with two groups. The staff can install the external hydraulic jacking equipment in the inside of the fixed frame 10, and then screw the external fixing bolts into the hydraulic jacking equipment and the fixed frame 10 and penetrate the bolt hole 1001, so as to install the external hydraulic jacking equipment in the inside of the fixed frame 10.

[0025] With reference to Figure 3 Both ends of the material lifting frame 6 are fixedly connected with a connecting block 1301, and the inner side of the connecting block 1301 is fixedly connected with a handle 13. The staff holds the handle 13 to pull the material lifting frame 6, and the connecting block 1301 connects and fixes the handle 13 and the material lifting frame 6.

[0026] The implementation principle of the graphite mold chip packaging sintering device is as follows: first, the lower positioning mold 5 positions the chip body 3 by accurate structure, to ensure the stability and accuracy of the chip body 3 in the packaging process. The upper mold 2 is used in cooperation with the welding pressure needle 1. The welding pressure needle 1 positions the chip body 3, to ensure the accurate contact between the chip body 3 and the lower positioning mold 5 and the alignment of the welding area. The heating plate 7 provides heating, so that the chip body 3 and the solder 11 reach the required temperature in the heating process, thereby realizing the welding of the chip body 3 and the packaging material. The welding pressure needle 1 applies appropriate pressure in the heating process, to ensure that the chip body 3 can be fully sealed after the solder 11 is melted. The staff can install the external hydraulic jacking equipment at the bottom of the material lifting frame 6. After the chip packaging welding processing is completed, the upper mold 2 is pulled up first, so that the upper mold 2 drives the welding pressure needle 1 to be completely disassembled. Then the external hydraulic jacking equipment is used to jack up the material lifting frame 6 or pull up the material lifting frame 6, so that the material lifting frame 6 jacks up the jack rod 4 and links the chip body 3 to be jacked up, to realize auxiliary ejection. After determining the number of welding pressure needles 1 to be used, the connecting rod 14 is used to connect multiple welding pressure needles 1 together. When multiple welding pressure needles 1 are used, only one welding pressure needle 1 needs to be taken to lift all the welding pressure needles 1, which is more convenient to use the welding pressure needle 1.

[0027] Finally should be explained a few points are: first, in the description of the present application, it should be pointed out that, unless otherwise specified and limited, the term "installation", "connected", "connection" should be broad, can be mechanical or electrical connection, but also can be two elements inside the communication, can be directly connected, "up", "down", "left", "right" and so on, only for indicating the relative position relationship, when the absolute position of the described object changes, the relative position relationship may change;

[0028] Second: the utility model discloses the embodiment in the drawing, only relate to the structure involved in the embodiment of the present disclosure, other structures can refer to the usual design, under the condition of not conflicting, the same embodiment and different embodiments of the utility model can be combined with each other;

[0029] Finally: the above only for the preferred embodiment of the utility model has, and does not for limiting the utility model, any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the utility model, should be contained in the protection scope of the utility model.

[0030] The above are the preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application, should be covered within the scope of protection of the present application.

Claims

1. A graphite mold core chip package sintering apparatus comprising an upper mold (2), a lower positioning mold (5), and a fixing frame (10), characterized in that: The bottom of the lower positioning die (5) is fixedly connected with a fixed frame (10), the inside of the lower positioning die (5) is movably installed with a top material rack (6), the bottom of the top material rack (6) is embeddedly installed with a mounting plate (12), the inside of the top material rack (6) is fixedly connected with a heating plate (7) at the top of the lower positioning die (5), the inside of the heating plate (7) is movably installed with a top rod (4), the top of the lower positioning die (5) is movably installed with an upper die (2), the inside of the upper die (2) is movably installed with a welding pressing needle (1), the welding pressing needle (1) and the lower positioning die (5) are provided with a chip body (3), the bottom of the chip body (3) is provided with solder (11), the inside of the welding pressing needle (1) is provided with a slot (101), the outside of the welding pressing needle (1) is movably installed with a connecting rod (14).

2. The graphite mold chip package sintering device of claim 1, wherein: The inside of the lower positioning die (5) and the fixed frame (10) is provided with a limiting groove (9), the both sides of the top material rack (6) are fixedly connected with a limiting block (8), and the limiting block (8) is embedded with the limiting groove (9).

3. The graphite mold core chip package sintering device of claim 1, wherein: The inside of the slot (101) is provided with an antiskid ring (102), and the connecting rod (14) is embedded with the antiskid ring (102).

4. The graphite mold chip package sintering device of claim 1, wherein: The bottom end of the inside of the fixed frame (10) is fixedly connected with a bolt hole (1001), and the bolt hole (1001) is provided with two groups.

5. The graphite mold chip package sintering device of claim 1, wherein: The both ends of the top material rack (6) are fixedly connected with a connecting block (1301), and the inside of the connecting block (1301) is fixedly connected with a handle (13).

Images