Novel QFP lead frame with improved pin design

By improving the pin design, the new QFP lead frame, through the combination of adjustment and clamping components, solves the problems of solder overflow and cold solder joints during the soldering process, realizes the adjustment of pin length and the stable fixation of the circuit board, and improves production efficiency and product quality.

CN223527177UActive Publication Date: 2025-11-07RIRONG SEMICON (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202422728247.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-09
Publication Date
2025-11-07
Estimated Expiration
2034-11-09

AI Technical Summary

Technical Problem

The pin design of the existing leadframe is prone to solder overflow or poor soldering during the soldering process, which affects the firm connection between the chip and the leadframe and results in poor soldering effect, affecting production efficiency and yield.

Method used

The new QFP lead frame with improved pin design uses a combination of adjustment and clamping components, including a drive knob, drive screw, moving plate, limit post, connecting bracket, sliding block, spring, pull ring, etc., to adjust the pin length and fix the circuit board, thereby enhancing the soldering effect.

Benefits of technology

It improves the adjustability and protection of the pins, enhances the ease of circuit board installation, ensures a firm connection between the pins and the chip, and improves production efficiency and product qualification rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of lead frames, and discloses a novel QFP lead frame with improved pin design, which comprises a packaging box and a packaging cover, the periphery of the packaging box is provided with first connecting screw holes, the periphery of the packaging cover is provided with second connecting screw holes, and the first connecting screw holes are connected with the second connecting screw holes. The packaging cover is installed on the packaging box by screwing bolts into the second connecting screw holes and the first connecting screw holes, an adjusting assembly is fixedly installed in the packaging box, and a clamping assembly is fixedly installed on the adjusting assembly. A transmission knob is rotated, so that a transmission screw rod rotates, a moving plate moves upwards or downwards along a moving groove and the transmission screw rod through limitation of a packaging box, the moving plate drives a connecting frame, a circuit board and pins to move, and the other side of the connecting frame drives a sliding plate to move upwards or downwards along an auxiliary groove and a limiting column, so that the exposed length of the pins can be adjusted; therefore, the pin protectiveness is improved, and the pin adjustability of the QFP lead frame can be effectively improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a lead frame technical field especially relates to a new QFP lead frame of improving pin design. BACKGROUND

[0002] Lead frame as the chip carrier of integrated circuit is a kind of key structural members that realizes the electrical connection of chip internal circuit lead-out end and external lead by bonding material (gold wire, aluminum wire, copper wire), forms electrical circuit, it plays the bridge role of connection with external wire, and most of semiconductor integrated blocks need to use lead frame, it is important basic material in electronic information industry. Mainly including TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT etc., mainly using die stamping method and chemical etching method to produce, and the raw material used in lead frame includes KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90 etc.

[0003] Lead frame is the basic component of manufacturing semiconductor separate components, for example, is applied in the electronic components such as diode, transistor of various combinations. The substrate of lead frame 100 of prior art is copper alloy, aluminum alloy or iron alloy. Including carrier sheet part 101 and multiple pins 102, the lead frame is a flat surface, in the product manufacturing process, the chip needs to be welded on the carrier sheet part of lead frame, generally liquid tin-lead solution is added on the carrier sheet part, for the adhesion of carrier sheet part and chip. However, since the lead frame is a flat surface, if the solder is excessive in the above process, it will cause overflow, and if it is too little, it is easy to cause false welding, and the occurrence of the two cases will affect the firm combination between lead frame and chip, and ultimately affect the production efficiency and qualification rate of diode. Obviously, how to ensure the firm combination between lead frame and chip, and effectively prevent solder overflow is very important.

[0004] In order to solve the above problems, through the retrieval, the patent document with application No. 201520400029.9 discloses a lead frame structure; it is proposed that the first body has a carrier sheet part with a groove shape, the carrier sheet part is bonded with a chip, the periphery of the carrier sheet part has a flange part with a protrusion, a first groove part is arranged between the flange part and the carrier sheet part, the second body has a bonding part bonded with one end of a copper clamp, and a second groove part is arranged behind the bonding part. But it is inconvenient to adjust the length of the pin exposed outside before the pin is welded, so that the pin cannot be adjusted according to the required condition when the pin is welded, and it is inconvenient to clamp and fix the circuit board connected with the pin when the pin is welded, thereby affecting the effect of the pin welding. UTILITY MODEL CONTENTS

[0005] The utility model discloses a novel QFP lead frame of improved pin design which solves the defects in the prior art.

[0006] In order to achieve the above object, the utility model adopts the following technical scheme: a novel QFP lead frame of improved pin design, which comprises a packaging box and a packaging cover, a connecting hole one is arranged around the packaging box, a connecting hole two is arranged around the packaging cover, the packaging cover is connected with the connecting hole two and the connecting hole one through screwing and tightening, and then the packaging cover is installed on the packaging box, an adjusting assembly is fixedly installed in the packaging box, the adjusting assembly is fixedly installed with a clamping assembly, and the adjusting assembly comprises a transmission knob, a transmission screw rod, a moving plate, a sliding plate and a limiting column.

[0007] The clamping assembly comprises a connecting frame, a foot hole, a guide column, a spring, a sliding block, a connecting plate, a pull ring and an extension plate.

[0008] Further description of the above technical scheme:

[0009] One side of the packaging box is provided with a moving groove, the moving groove is slidably connected with the moving plate, one side of the moving plate is threadedly connected with the transmission screw rod, one side of the transmission screw rod is fixedly connected with the transmission knob, the transmission screw rod penetrates through and is rotatably connected to the middle part of one side of the packaging box, and the other side of the moving plate is fixedly connected to the connecting frame.

[0010] Further description of the above technical scheme:

[0011] The other side of the packaging box is provided with an auxiliary groove, the auxiliary groove is slidably connected with the sliding plate, one side of the sliding plate is slidably connected with the limiting column, and the limiting column is fixedly connected to the inside of one side of the packaging box.

[0012] Further description of the above technical scheme:

[0013] The limiting column is arranged in the auxiliary groove, and the other side of the sliding plate is fixedly connected to the connecting frame.

[0014] Further description of the above technical scheme:

[0015] One side of the connecting frame is provided with a sliding groove, the sliding groove is slidably connected with the sliding block, one side of the sliding block is fixedly connected with the spring, the sliding block is slidably connected with the guide column, one side of the spring is fixedly connected to the connecting frame, the spring is sleeved on the guide column, and the guide column is arranged in the sliding groove.

[0016] Further description of the above technical scheme:

[0017] One side of the sliding block is fixedly connected with the connecting plate, both sides of the connecting plate are fixedly connected with the extension plate, and the middle part of the connecting plate is fixedly connected with the pull ring.

[0018] As the further description of the above technical solutions:

[0019] The sliding groove, guide column, spring, sliding block, connecting plate and pull ring are provided with two groups and are symmetrically arranged.

[0020] As the further description of the above technical solutions:

[0021] The connecting frame is attached with a circuit board, one side of the circuit board is provided with a pin, the pin is placed in the pin hole, one side of the packaging box is fixedly connected with a protective sleeve, the pin is arranged in the protective sleeve, and the extension plate is attached to the upper surface of the circuit board.

[0022] The utility model has the advantages of the following beneficial effects:

[0023] 1. Rotate the transmission knob, make the transmission screw rotate, make the moving plate move up or down along the moving groove and the transmission screw through the packaging box limiting, the moving plate moves with the connecting frame, the circuit board and the pin, the other side of the connecting frame moves up or down along the auxiliary groove and the limiting column with the sliding plate, the length of the pin exposed outside can be adjusted, thereby increasing the protection of the pin, and the adjustment of the QFP lead frame to the pin can be effectively improved.

[0024] 2. Pull the two groups of pull rings, place the circuit board on the inner side of the connecting frame, make the pin pass through the pin hole and the protective sleeve, loosen the pull ring, make the sliding block move down with the connecting plate and the extension plate, and then press the circuit board, so that the circuit board with the pin is more convenient to install and fix, the convenience of the circuit board installation can be effectively improved, and the QFP lead frame is more convenient for clamping and fixing the circuit board with the pin. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 A three-dimensional structure schematic view of a novel QFP lead frame with improved pin design is provided for the utility model;

[0026] Figure 2 A sectional structure schematic view of a novel QFP lead frame with improved pin design is provided for the utility model;

[0027] Figure 3 For Figure 2 An enlarged view of A in the middle;

[0028] Figure 4 A partial component schematic view of a novel QFP lead frame with improved pin design is provided for the utility model Figure 1 ;

[0029] Figure 5 A partial component schematic view of a novel QFP lead frame with improved pin design is provided for the utility modelFigure 1 .

[0030] Legend:

[0031] 1, packaging box; 2, packaging cover; 3, connecting hole one; 4, connecting hole two; 5, adjusting assembly; 51, transmission knob; 52, transmission screw; 53, moving groove; 54, moving plate; 55, auxiliary groove; 56, sliding plate; 57, limiting column; 6, clamping assembly; 61, connecting frame; 62, foot hole; 63, sliding groove; 64, guide column; 65, spring; 66, sliding block; 67, connecting plate; 68, pull ring; 69, extension plate; 7, protective sleeve; 8, circuit board; 9, pin. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0033] Reference Figures 1-5 , the utility model provides an embodiment: a novel QFP lead frame that improves pin design, including packaging box 1, packaging cover 2, the four around on packaging box 1 is provided with connecting hole one 3, the four around of packaging cover 2 is provided with connecting hole two 4, and packaging cover 2 is connected with connecting hole one 3 in connecting hole two 4 through bolt tightening, and then packaging cover 2 is installed on packaging box 1, adjusting assembly 5 is fixedly installed in packaging box 1, and clamping assembly 6 is fixedly installed to adjusting assembly 5, and adjusting assembly 5 includes transmission knob 51, transmission screw 52, moving plate 54, sliding plate 56 and limiting column 57.

[0034] Clamping assembly 6 includes connecting frame 61, foot hole 62, guide column 64, spring 65, sliding block 66, connecting plate 67, pull ring 68 and extension plate 69.

[0035] As a preferred implementation, one side of packaging box 1 is provided with moving groove 53, moving groove 53 is slidably connected to moving plate 54, one side of moving plate 54 is threadedly connected to transmission screw 52, one side of transmission screw 52 is fixedly connected to transmission knob 51, transmission screw 52 penetrates and is rotatably connected to the middle part of one side of packaging box 1, and the other side of moving plate 54 is fixedly connected to connecting frame 61.

[0036] As Figures 1-5 shown: the connecting hole one 3 and the connecting hole two 4 are provided to better fix and connect the packaging cover 2 and the packaging box 1 by bolts.

[0037] In a preferred embodiment, an auxiliary groove 55 is provided on the other side of the packaging box 1, and a sliding plate 56 is slidably connected in the auxiliary groove 55. At the same time, a limiting post 57 is slidably connected to one side of the sliding plate 56, and the limiting post 57 is fixedly connected to one side of the packaging box 1.

[0038] In a preferred embodiment, the limiting post 57 is disposed in the auxiliary groove 55, and the other side of the sliding plate 56 is fixedly connected to the connecting frame 61.

[0039] like Figures 1-5 As shown: When it is necessary to adjust the height of circuit board 8 and pin 9, rotate the transmission knob 51. The transmission knob 51 drives the transmission screw 52 to rotate along the middle of one side of the package box 1. The rotation of the transmission screw 52 causes the moving plate 54 to move up or down along the moving groove 53 and the transmission screw 52 through the limit of the package box 1. The moving plate 54 moves the connecting frame 61, circuit board 8 and pin 9. The other side of the connecting frame 61, along the sliding plate 56, moves up or down along the auxiliary groove 55 and the limit post 57, so that the length of pin 9 exposed to the outside can be adjusted, thereby increasing the protection of pin 9.

[0040] In a preferred embodiment, a sliding groove 63 is provided on one side of the connecting frame 61, and a sliding block 66 is slidably connected in the sliding groove 63. At the same time, a spring 65 is fixedly connected to one side of the sliding block 66. The sliding block 66 is slidably connected to the guide post 64. One side of the spring 65 is fixedly connected to the connecting frame 61. The spring 65 is sleeved on the guide post 64, and the guide post 64 is located in the sliding groove 63.

[0041] In a preferred embodiment, a connecting plate 67 is fixedly connected to one side of the sliding block 66, and extension plates 69 are fixedly connected to both sides of the connecting plate 67. A pull ring 68 is fixedly connected to the middle of the connecting plate 67.

[0042] In a preferred embodiment, the slide 63, guide post 64, spring 65, sliding block 66, connecting plate 67, and pull ring 68 are all provided in two sets and are arranged symmetrically.

[0043] like Figures 1-5As shown: when the circuit board 8 needs to be fixed, pull the two groups of pull rings 68, and the pull ring 68 is pulled along with the connecting plate 67, the extension plate 69, and the sliding block 66 to move upward along the sliding groove 63 and the guide column 64, the sliding block 66 moves upward and extrudes the spring 65, and the circuit board 8 is placed on the inner side of the connecting frame 61 so that the pin 9 passes through the pin hole 62 and passes through the protective sleeve 7. Loosen the pull ring 68, and the sliding block 66 moves downward along the sliding groove 63 and the guide column 64 through the counter-thrust of the spring 65, and the sliding block 66 moves downward along with the connecting plate 67 and the extension plate 69, thereby pressing the circuit board 8, so that the circuit board 8 with the pin 9 is more convenient to install and fix, and the convenience of the circuit board 8 during installation can be effectively improved.

[0044] As a preferred embodiment, the connecting frame 61 is attached to the circuit board 8, one side of the circuit board 8 is provided with the pin 9, and the pin 9 is placed in the pin hole 62. One side of the packaging box 1 is fixedly connected to the protective sleeve 7, and the pin 9 is arranged in the protective sleeve 7. The extension plate 69 is attached to the upper surface of the circuit board 8.

[0045] As shown Figures 1-5 The protective sleeve 7 can effectively protect the pin 9 from being extruded and deformed, and can effectively protect the pin 9.

[0046] It should be noted that the pin hole 62, the protective sleeve 7, and the pin 9 are arranged in the same number, and the protective sleeve 7 and the pin hole 62 are arranged in parallel.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or equivalently replace some of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A new QFP lead frame for improving pin design, comprising a package box (1), a package cover (2), a plurality of connecting wire holes I (3) arranged around the package box (1), a plurality of connecting wire holes II (4) arranged around the package cover (2), and the package cover (2) is installed on the package box (1) by screwing the connecting wire holes II (4) with the connecting wire holes I (3) and then connecting the package cover (2) with the package box (1), characterized in that: The adjusting assembly (5) is fixedly installed in the packaging box (1), and the clamping assembly (6) is fixedly installed on the adjusting assembly (5); the adjusting assembly (5) comprises a transmission knob (51), a transmission screw rod (52), a moving plate (54), a sliding plate (56) and a limiting column (57); ​ The clamping assembly (6) comprises a connecting frame (61), a foot hole (62), a guide column (64), a spring (65), a sliding block (66), a connecting plate (67), a pull ring (68) and an extension plate (69).

2. The new QFP lead frame for improving the pin design according to claim 1, characterized in that: One side of the packaging box (1) is provided with a moving groove (53), and the moving groove (53) is slidably connected with the moving plate (54); one side of the moving plate (54) is threadedly connected with the transmission screw rod (52), and one side of the transmission screw rod (52) is fixedly connected with the transmission knob (51); the transmission screw rod (52) penetrates through and is rotatably connected to the middle part of one side of the packaging box (1); the other side of the moving plate (54) is fixedly connected with the connecting frame (61).

3. The new QFP lead frame with improved pin design according to claim 2, characterized in that: The other side of the packaging box (1) is provided with an auxiliary groove (55), and the auxiliary groove (55) is slidably connected with the sliding plate (56); one side of the sliding plate (56) is slidably connected with the limiting column (57), and the limiting column (57) is fixedly connected in one side of the packaging box (1).

4. The new QFP lead frame with improved pin design according to claim 3, characterized in that: The limiting column (57) is arranged in the auxiliary groove (55), and the other side of the sliding plate (56) is fixedly connected with the connecting frame (61).

5. The new QFP lead frame with improved pin design according to claim 4, characterized in that: One side of the connecting frame (61) is provided with a sliding groove (63), and the sliding groove (63) is slidably connected with the sliding block (66); one side of the sliding block (66) is fixedly connected with the spring (65); the sliding block (66) is slidably connected with the guide column (64); one side of the spring (65) is fixedly connected with the connecting frame (61); the spring (65) is sleeved on the guide column (64), and the guide column (64) is arranged in the sliding groove (63).

6. The new QFP lead frame with improved pin design according to claim 5, characterized in that: One side of the sliding block (66) is fixedly connected with the connecting plate (67), and both sides of the connecting plate (67) are fixedly connected with the extension plate (69); the middle part of the connecting plate (67) is fixedly connected with the pull ring (68).

7. The new QFP lead frame with improved pin design according to claim 6, characterized in that: The sliding groove (63), the guide column (64), the spring (65), the sliding block (66), the connecting plate (67) and the pull ring (68) are provided with two groups and are symmetrically arranged.

8. The new QFP lead frame with improved pin design according to claim 7, characterized in that: The connecting frame (61) is attached with a circuit board (8); one side of the circuit board (8) is provided with a pin (9), and the pin (9) is placed in the foot hole (62); one side of the packaging box (1) is fixedly connected with a protective sleeve (7); the pin (9) is arranged in the protective sleeve (7); and the extension plate (69) is attached to the upper surface of the circuit board (8).

Citation Information

Patent Citations

  • Lead framework structure

    CN204732400U