High-density multi-layer PCB structure

By introducing insert rods and clamping devices into the multilayer PCB structure, and utilizing the cooperation of slide rods and bumps, the problem of spacing error during stacking is solved, achieving stable connection and reducing wear, thus extending the service life of the multilayer PCB.

CN223528271UActive Publication Date: 2025-11-07QIEPU ELECTRONICS (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202422979955.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-11-07
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

Existing multilayer PCB structures require precise control of spacing during stacking. Errors can cause wear between the connector rods and the connector slots, resulting in gaps after prolonged use and affecting stability.

Method used

It adopts a structure of insert rod, clamping device and slide rod. The slide rod drives the protrusion to squeeze the expansion of the trapezoidal block to achieve clamping. The rectangular block is locked in the rectangular groove to avoid wear and ensure stable connection.

Benefits of technology

This improves the fixation effect after stacking, avoids wear caused by gaps, and enhances the stability and service life of multilayer PCBs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a high-density multi-layer PCB structure, which comprises a mounting bottom plate layer, a PCB main body, an insulating frame layer, an inserting rod, a through groove and a trapezoidal block, a pressure spring is fixedly connected to the upper surface of the inserting rod, a pressing plate is fixedly connected to the top end of the pressure spring, a sliding rod is fixedly connected to the lower surface of the pressing plate, and the upper surface of the sliding rod is fixedly connected with the insulating frame layer. The bottom ends of the sliding rods are fixedly connected with protruding blocks, a plurality of inserting holes are formed in the upper surface of the insulating frame layer and the upper surface of the PCB body in a penetrating mode, and the inner walls of the inserting holes are in sliding connection with the surfaces of the corresponding inserting rods in a matched mode. According to the utility model, through the arranged inserting rod and the internally arranged pressing device, the fixing effect after stacking can be improved, and the problems that the spacing during stacking needs to be accurately controlled, abrasion is easily caused by errors, a gap exists between the inserting rod and the inserting through groove due to long-time use, and upward and downward moving power is generated in the prior art are solved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of PCB circuit board, especially a high density multilayer PCB board structure. BACKGROUND

[0002] PCB board, namely circuit board, also be called printed circuit board or printed circuit board, needs using PCB board to provide electrical connection in electronic components.

[0003] In the prior art, such as the Chinese patent with the announcement number CN221448648U, a multilayer PCB circuit board structure is disclosed, the butt joint plate is moved through the buckle groove, then the PCB circuit board body, the insulating frame layer and the installation bottom plate layer are stacked, the plug-in rod needs to be inserted into the inner wall of the plug-in through slot during this period, when the three are completely stacked, the force on the butt joint plate is loosened, the butt joint plate will drive the limiting plug-in rod to reset at this time, so that the end of the limiting plug-in rod is inserted into the inner wall of the limiting insertion hole, the quick limiting effect after the connection of the three is completed, and when splitting is needed in the later period, the butt joint plate only needs to be moved again.

[0004] In the above technical scheme, the plug-in rod needs to be inserted into the plug-in through slot after the PCB circuit board body, the insulating frame layer and the installation bottom plate layer are stacked, and then fixed, and in order to ensure the stability of the plug-in effect, the size of the plug-in rod and the plug-in through slot needs to be matched, therefore, the distance between the PCB circuit board body, the insulating frame layer and the installation bottom plate layer needs to be accurately controlled when they are stacked, if the distance gap after stacking has an error, the plug-in rod and the plug-in through slot will be abraded, and long-term use will cause a gap between the plug-in rod and the plug-in through slot, so that the up and down moving force is generated.

[0005] Therefore, a high density multilayer PCB board structure is proposed. UTILITY MODEL CONTENTS

[0006] In order to solve the above technical problems, the utility model provides a high density multilayer PCB board structure, the plug-in rod and the internal setting compression device can improve the fixed effect after stacking.

[0007] The technical scheme for realizing the purpose of the utility model is as follows: a high-density multilayer PCB structure, which comprises a PCB main body arranged above a mounting base layer, a plurality of screw hole blocks are fixedly connected to the surface of the mounting base layer, an insulating frame layer is arranged above the mounting base layer, a plurality of insertion rods are fixedly connected to the upper surface of the mounting base layer, installation grooves are formed in the inner wall of the insertion rods, two through grooves are formed in the inner wall of the installation grooves, two trapezoidal blocks are slidably arranged on the inner bottom wall of the installation grooves, the surfaces of the two trapezoidal blocks are slidably connected to the inner walls of the corresponding two through grooves, compression springs are fixedly connected to the upper surfaces of the insertion rods, pressing plates are fixedly connected to the top ends of the compression springs, slide rods are fixedly connected to the lower surfaces of the pressing plates, protruding blocks are fixedly connected to the bottom ends of the slide rods, a plurality of insertion holes are formed in the upper surfaces of the insulating frame layer and the PCB main body, and the inner walls of the plurality of insertion holes are slidably connected to the surfaces of the corresponding plurality of insertion rods.

[0008] In some embodiments, a rectangular groove is formed in the upper surface of the insertion rod, and the surface of the slide rod is slidably connected to the inner wall of the rectangular groove.

[0009] In some embodiments, two rectangular blocks are fixedly connected to the surface of the slide rod, and the size of the rectangular groove is greater than the size of the two rectangular blocks.

[0010] In some embodiments, a sliding groove is formed in the inner bottom wall of the installation groove, a fixing rod is fixedly connected to the inner wall of the sliding groove, two sliding blocks are slidably connected to the surface of the fixing rod, and the upper surfaces of the two sliding blocks are fixedly connected to the lower surfaces of the corresponding two trapezoidal blocks.

[0011] In some embodiments, the surfaces of the two sliding blocks are slidably connected to the inner wall of the sliding groove, two springs are sleeved on the surface of the fixing rod, one end of each of the two springs is fixedly connected to one side of the corresponding sliding block, and the other end of each of the two springs, which is away from the sliding block, is fixedly connected to the inner wall of the sliding groove.

[0012] Compared with the prior art, the utility model has the following advantages:

[0013] The pressing plate drives the slide rod to descend, the slide rod can drive the protruding block to descend and extrude the two trapezoidal blocks, the two trapezoidal blocks are extruded and move outward to realize the compression of the upper surface of the PCB main body, in the process of descending of the slide rod, the slide rod drives the two rectangular blocks to descend and pass through the inside of the rectangular groove on the upper surface of the insertion rod, since the size of the rectangular groove is greater than that of the rectangular block, the edge of the rectangular block can avoid contact and abrasion during the descending, when the trapezoidal blocks are extended, the rectangular blocks enter the inside of the rectangular groove, at this time, the rectangular blocks can be rotated synchronously by rotating the pressing plate, so that the rectangular blocks are vertically arranged with the rectangular groove, the rectangular blocks can lock the slide rod, and the compression operation is realized.

[0014] Solve the existing need for precise control in the superposition interval, easy to cause wear and tear, long time, will lead to the existence of gap between the plug-in rod and plug-in slot, thereby generating the problem of up and down movement force. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model is further explained below in combination with the drawings and examples:

[0016] Figure 1 It is the three-dimensional structure schematic diagram provided in an embodiment of the utility model;

[0017] Figure 2 It is the whole explosion structure schematic diagram provided in an embodiment of the utility model;

[0018] Figure 3 It is the compression device structure schematic diagram provided in an embodiment of the utility model;

[0019] Figure 4 It is the compression device partial structure schematic diagram provided in an embodiment of the utility model.

[0020] Explanation of reference signs:

[0021] 1, installation bottom plate layer, 2, insulating frame layer, 3, PCB circuit board main body, 4, screw hole block, 5, jack, 6, plug-in rod, 7, through slot, 8, trapezoidal block, 9, sliding slot, 10, fixed rod, 11, spring, 12, sliding block, 13, sliding rod, 14, protruding block, 15, pressing plate, 16, compression spring, 17, rectangular groove, 18, rectangular block. DETAILED DESCRIPTION

[0022] The utility model is described in detail below, and the technical scheme in the embodiment of the utility model is clearly and completely described. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope of the utility model protection.

[0023] The utility model provides a kind of high-density multilayer PCB structure by improvement, and the technical scheme of the utility model is:

[0024] As Figures 1-4As shown, a high-density multi-layer PCB board structure includes a PCB circuit board body 3 arranged above a mounting base layer 1, a plurality of threaded hole blocks 4 are fixedly connected to the surface of the mounting base layer 1, an insulating frame layer 2 is arranged above the mounting base layer 1, a plurality of insertion rods 6 are fixedly connected to the upper surface of the mounting base layer 1, an installation slot is formed in the inner wall of the insertion rod 6, two through slots 7 are formed in the inner bottom wall of the installation slot, and two trapezoidal blocks 8 are slidably arranged on the inner bottom wall of the installation slot. After being stacked, the upper surface of the PCB circuit board body 3 is flush with the bottom wall of the through slot 7, so that the trapezoidal blocks 8 can press the PCB circuit board body 3 when they are extended. The surfaces of the two trapezoidal blocks 8 are slidably connected to the inner walls of the corresponding two through slots 7, a compression spring 16 is fixedly connected to the upper surface of the insertion rod 6, a pressing plate 15 is fixedly connected to the top end of the compression spring 16, a sliding rod 13 is fixedly connected to the lower surface of the pressing plate 15, a protruding block 14 is fixedly connected to the bottom end of the sliding rod 13, the protruding block 14 can simultaneously extrude the two trapezoidal blocks 8, a plurality of insertion holes 5 are formed in the upper surfaces of the insulating frame layer 2 and the PCB circuit board body 3, and the inner walls of the plurality of insertion holes 5 are slidably connected to the surfaces of the corresponding plurality of insertion rods 6.

[0025] As shown in Figure 3 and Figure 4 In an embodiment, a rectangular slot 17 is formed in the upper surface of the insertion rod 6, the surface of the sliding rod 13 is slidably connected to the inner wall of the rectangular slot 17, a through hole is formed in the middle position of the rectangular slot 17 and is adapted to the surface of the sliding rod 13 to accommodate the sliding of the sliding rod 13.

[0026] The surface of the sliding rod 13 is fixedly connected to two rectangular blocks 18, and the size of the rectangular slot 17 is greater than the size of the two rectangular blocks 18. Since the size of the rectangular slot 17 is greater than the size of the rectangular block 18, the edge can be avoided from being contacted and worn when the rectangular block 18 is lowered.

[0027] As shown in Figure 3 In an embodiment, a sliding groove 9 is formed in the inner bottom wall of the installation slot, a fixed rod 10 is fixedly connected to the inner wall of the sliding groove 9, two sliding blocks 12 are slidably connected to the surface of the fixed rod 10, the upper surfaces of the two sliding blocks 12 are fixedly connected to the lower surfaces of the corresponding two trapezoidal blocks 8, and the sliding groove 9, the fixed rod 10 and the sliding blocks 12 can limit the sliding of the trapezoidal blocks 8.

[0028] The surfaces of the two sliding blocks 12 are slidably connected to the inner walls of the sliding groove 9, the surface of the fixed rod 10 is sleeved with two springs 11, one end of each of the two springs 11 is fixedly connected to one side of the corresponding sliding block 12, and the other end of each of the two springs 11 away from the sliding block 12 is fixedly connected to the inner wall of the sliding groove 9 on the side. The two springs 11 can realize the resetting of the trapezoidal blocks 8 driven by the sliding blocks 12.

[0029] The specific working method is: when the multi-layer PCB circuit board structure is used, firstly, the insertion hole 5 on the insulating frame layer 2 and the PCB circuit board body 3 is sequentially threaded through the surface of the insertion rod 6, the insulating frame layer 2 and the PCB circuit board body 3 can be stacked above the mounting bottom plate layer 1, after stacking, the pressing plate 15 above the insertion rod 6 is pressed, the pressing plate 15 drives the slide rod 13 to descend, the slide rod 13 descending can drive the protruding block 14 to descend and extrude the two trapezoidal blocks 8, the two trapezoidal blocks 8 are extruded and expanded outward to move, thereby realizing the compression of the upper part of the PCB circuit board body 3, in the process of the slide rod 13 descending, the slide rod 13 drives the two rectangular blocks 18 to synchronously descend and pass through the inside of the rectangular groove 17 on the upper surface of the insertion rod 6, since the size of the rectangular groove 17 is greater than that of the rectangular block 18, the edge can be avoided to be contacted and abraded during descending, when the trapezoidal block 8 is stretched out, the rectangular block 18 is entirely entered into the inside of the rectangular groove 17, at this time, the pressing plate 15 can be rotated to drive the rectangular block 18 to synchronously rotate, so that the rectangular block 18 is vertically arranged with the rectangular groove 17, the rectangular block 18 can realize the locking of the slide rod 13 and realize the compression operation, the remaining corners can be sequentially and similarly operated.

[0030] The technical means disclosed by the utility model scheme is not only limited to the technical means disclosed by the above technical means, but also includes the technical scheme composed by the above technical features and equivalent replacement. The unfinished matters of the utility model belong to the common knowledge of the person skilled in the art.

Claims

1. A high-density multi-layer PCB structure, comprising a PCB circuit board body (3) arranged above a mounting base plate layer (1), a plurality of threaded hole blocks (4) are fixedly connected to the surface of the mounting base plate layer (1), characterized in that: The upper surface of the installation bottom plate layer (1) is fixedly connected with a plurality of insertion rods (6), the inner wall of the insertion rod (6) is provided with an installation slot, the inner wall of the installation slot is provided with two through grooves (7), the inner bottom wall of the installation slot is slidably provided with two trapezoidal blocks (8), the surfaces of the two trapezoidal blocks (8) are respectively slidably connected with the inner walls of the corresponding two through grooves (7), the upper surface of the insertion rod (6) is fixedly connected with a compression spring (16), the top end of the compression spring (16) is fixedly connected with a pressing plate (15), the lower surface of the pressing plate (15) is fixedly connected with a sliding rod (13), the bottom end of the sliding rod (13) is fixedly connected with a protruding block (14), the upper surfaces of the insulation frame layer (2) and the PCB circuit board body (3) are both provided with a plurality of insertion holes (5), and the inner walls of the plurality of insertion holes (5) are respectively slidably connected with the surfaces of the corresponding plurality of insertion rods (6).

2. The high density multi-layer PCB structure of claim 1, wherein: The upper surface of the insertion rod (6) is provided with a rectangular groove (17), and the surface of the sliding rod (13) is slidably connected with the inner wall of the rectangular groove (17).

3. The high density multi-layer PCB structure of claim 2, wherein: The surface of the sliding rod (13) is fixedly connected with two rectangular blocks (18), and the size of the rectangular groove (17) is greater than the size of the two rectangular blocks (18).

4. The high density multi-layer PCB structure of claim 1, wherein: The inner bottom wall of the installation slot is provided with a sliding groove (9), the inner wall of the sliding groove (9) is fixedly connected with a fixed rod (10), the surface of the fixed rod (10) is slidably connected with two sliding blocks (12), and the upper surfaces of the two sliding blocks (12) are respectively fixedly connected with the lower surfaces of the corresponding two trapezoidal blocks (8).

5. The high density multi-layer PCB structure of claim 4, wherein: The surfaces of the two sliding blocks (12) are respectively slidably connected with the inner walls of the sliding grooves (9), the surface of the fixed rod (10) is sleeved with two springs (11), one end of each of the two springs (11) is fixedly connected with one side of the corresponding sliding block (12), and the other end of each of the two springs (11) away from the sliding block (12) is fixedly connected with the inner walls of the two sides of the sliding groove (9).

Citation Information

Patent Citations

  • Multi-layer PCB circuit board structure

    CN221448648U