Ultrathin laser and additive manufacturing equipment

By designing an ultra-thin laser, employing a chassis partition structure and embedded piping, and combining it with an ultra-thin power supply module, the problem of excessively large equipment caused by existing lasers is solved, achieving compactness and ease of maintenance of the equipment.

CN223533007UActive Publication Date: 2025-11-11SHENZHEN BAOCHENXIN LASER TECH CO LTD
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Patent Information

Application Number
CN202422735263.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-11-11
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

Existing ultra-thick lasers result in excessively large overall sizes in multi-channel printing equipment, making it impossible to meet the multi-channel printing needs of consumer products.

Method used

Design an ultrathin laser by adopting a chassis partition structure and water-cooled plate with embedded pipeline, combined with an ultrathin power supply module, to reduce the space occupied by the laser in the height direction, and improve maintainability through detachable connection.

Benefits of technology

This achievement reduces the overall thickness of the laser, meeting the compact requirements of multi-channel printing equipment and improving the maintainability and sealing of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an ultra-thin laser and additive manufacturing equipment, the ultra-thin laser comprises a cabinet, a water cooling plate, a cover plate, a pump source, an optical fiber, a control board, a driving board, a driving power supply and a control board power supply, the cabinet comprises a first installation cavity and a second installation cavity, the first installation cavity and the second installation cavity are arranged at an interval, and the water cooling plate is arranged on the water cooling plate. The driving power supply and the control panel power supply are mounted in the first mounting cavity, the water cooling plate is mounted in the second mounting cavity and fixedly connected with the case, the pumping source, the optical fiber, the control panel and the driving plate are mounted on the water cooling plate in the second mounting cavity, and the cover plate is detachably connected with the case, so that the occupied space of the case in the height direction is reduced; and meanwhile, each module adopts an ultrathin structure, so that the overall thickness of the ultrathin laser can be further reduced, and the problem that the overall equipment is oversized due to the existing ultra-thick laser in multi-path printing equipment is solved.
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Description

Technical Field

[0001] This utility model relates to the field of additive manufacturing technology, and in particular to an ultrathin laser and additive manufacturing equipment. Background Technology

[0002] 3D printing, also known as additive manufacturing, is a technology that uses slicing software to plan the path of a three-dimensional digital model and then uses materials such as powder, filament, or liquid to build up a three-dimensional solid model layer by layer. Compared with traditional processing methods, 3D printing technology has the advantages of not requiring molds, high material utilization, short product realization cycle, and the ability to create high-performance, complex structural parts without molds, quickly, and with full density, gradually becoming the best technical approach to address technological challenges in many fields. In recent years, 3D printing applications have gradually expanded from industrial applications to consumer products. Faced with the huge demand for consumer products, traditional single-channel printing cannot meet the needs, requiring the development of multi-channel printing equipment. This necessitates the integration of the laser, the core material of the printing equipment, to address the problem of the excessively large overall size of the existing ultra-thick laser in multi-channel printing equipment. Utility Model Content

[0003] The purpose of this utility model is to provide an ultrathin laser. The preferred technical solutions among the many technical solutions provided by this utility model can produce various technical effects, which are described in detail below.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] In a first aspect, this utility model provides an ultrathin laser, comprising a chassis, a water-cooled plate, a cover plate, a pump source, an optical fiber, a control board, a driver board, a driver power supply, and a control board power supply, wherein...

[0006] The chassis includes a first mounting cavity and a second mounting cavity, which are spaced apart. The drive power supply and the control board power supply are installed in the first mounting cavity. The water-cooled plate is installed in the second mounting cavity and fixedly connected to the chassis. The pump source, the optical fiber, the control board, and the drive board are installed on the water-cooled plate in the second mounting cavity. The cover plate is detachably connected to the chassis.

[0007] Optionally, the chassis includes four side panels and a bottom plate; the four side panels and the bottom plate together form an opening, the cover plate is placed over the opening, a first partition plate is provided between the first mounting cavity and the second mounting cavity, the lower end of the first partition plate is fixedly connected to the bottom plate of the chassis, and the upper end of the first partition plate is in sealing contact with the cover plate.

[0008] Optionally, the water-cooled plate includes a base plate and embedded pipes. The embedded pipes are embedded in the base plate, and both ends of the embedded pipes are connected to an inlet connector and an outlet connector, respectively. The inlet connector and the outlet connector are both connected to the same side wall of the chassis.

[0009] The buried pipeline includes a first meandering section, a second meandering section, and a straight section, and the water inlet connector, the first meandering section, the second meandering section, the straight section, and the water outlet connector are connected in sequence.

[0010] Optionally, there are multiple pump sources, each pump source having a tail and a head, with the heads of adjacent pump sources facing different sides, the pump sources being installed in the front region of the second mounting cavity, and each pump source corresponding to at least two pipes on the second meandering portion.

[0011] Optionally, a fiber optic groove is provided in the central region of the substrate, and the optical fiber is placed in the fiber optic groove, the optical fiber corresponding to the first meandering portion and the straight portion.

[0012] Optionally, the control board and the drive board are mounted in the rear region of the second mounting cavity.

[0013] Optionally, the driving power supply is an ultra-thin power supply with a thickness of 41±1mm.

[0014] Optionally, the upper side of the chassis is provided with an indicator light panel, a handle, and a push-button switch.

[0015] Optionally, the thickness of the ultrathin laser is 44±1mm.

[0016] Secondly, this utility model also provides an additive manufacturing apparatus, which includes a plurality of ultrathin lasers according to any of the above embodiments.

[0017] This utility model provides an ultrathin laser, comprising a chassis, a water-cooled plate, a cover plate, a pump source, an optical fiber, a control board, a driver board, a driver power supply, and a control board power supply.

[0018] The chassis includes a first mounting cavity and a second mounting cavity, which are spaced apart. The drive power supply and control board power supply are installed in the first mounting cavity. The water-cooled plate is installed in the second mounting cavity and fixedly connected to the chassis. The pump source, the optical fiber, the control board, and the drive board are installed on the water-cooled plate in the second mounting cavity. The cover plate is detachably connected to the chassis, thereby reducing the space occupied by the chassis in the height direction. At the same time, each module adopts an ultra-thin structure, which can further reduce the overall thickness of the ultra-thin laser and solve the problem that the existing ultra-thick laser will cause the overall equipment to be too large in multi-channel printing equipment. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the internal structure of an ultrathin laser provided in an embodiment of this utility model;

[0021] Figure 2 This is an exploded view of an ultrathin laser provided in an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of the internal structure of a water-cooled plate for an ultrathin laser provided in an embodiment of this utility model.

[0023] In the diagram: 1. Chassis; 11. Second mounting cavity; 12. First partition plate; 13. First mounting cavity; 14. Handle; 15. Push-button switch;

[0024] 2. Water-cooled plate; 21. Embedded piping; 211. First bend; 212. Second bend; 213. Straight section; 22. Water inlet connector; 23. Water outlet connector; 24. Substrate;

[0025] 3. Cover plate;

[0026] 4. Indicator light panel;

[0027] 5. Pump source;

[0028] 6. Optical fiber;

[0029] 7. Control panel;

[0030] 8. Driver board;

[0031] 9. Drive power supply;

[0032] 10. Control board power supply. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0034] In the description of this utility model, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] Specifically, Figure 1 The right part of the middle refers to the right side or the right end. Figure 1 The left part refers to the left side or the left end. Figure 1 The upper part is the front side or front end. Figure 1 The lower part is the rear or back end.

[0036] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] This invention provides an ultrathin laser, characterized by comprising a chassis 1, a water-cooled plate 2, a cover plate 3, a pump source 5, an optical fiber 6, a control board 7, a drive board 8, a drive power supply 9, and a control board power supply 10. The chassis 1 includes a first mounting cavity 13 and a second mounting cavity 11, spaced apart. The drive power supply 9 and the control board power supply 10 are installed in the first mounting cavity 13. The water-cooled plate 2 is installed in the second mounting cavity 11 and fixedly connected to the chassis 1. The pump source 5, optical fiber 6, control board 7, and drive board 8 are installed on the water-cooled plate 2 in the second mounting cavity 11. The cover plate 3 is detachably connected to the chassis 1. The pump source 5, optical fiber 6, control board 7, drive board 8, drive power supply 9, and control board power supply 10 are arranged in a single plane, reducing the space occupied by the chassis 1 in the height direction. Furthermore, the ultrathin structure of each module further reduces the overall thickness of the ultrathin laser, solving the problem of excessively large overall equipment caused by existing ultrathin lasers in multi-channel printing devices.

[0038] As an optional implementation, the chassis 1 includes four side plates and a bottom plate; the four side plates and the bottom plate together form an opening, and a cover plate 3 is placed over the opening. A first partition plate 12 is provided between the first mounting cavity 13 and the second mounting cavity 11. The lower end of the first partition plate 12 is fixedly connected to the bottom plate of the chassis 1, and the upper end of the first partition plate 12 is in sealing contact with the cover plate 3.

[0039] A first partition plate 12 is provided between the first mounting cavity 13 and the second mounting cavity 11. The lower end of the first partition plate 12 is sealed to the bottom of the chassis 1, and the upper end of the first partition plate 12 is sealed to the cover plate 3, so that the first mounting cavity 13 and the second mounting cavity 11 are closed, isolating the power module from the optical module and the power module from the circuit module, so as not to affect the sealing and anti-condensation design, and also to ensure the separation of strong and weak.

[0040] The first partition plate 12 is made of a non-thermal-conducting material, which prevents heat transfer between the first mounting cavity 13 and the second mounting cavity 11. The length direction of the first partition plate 12 is consistent with the length direction of the chassis 1, and the position of the first partition plate 12 is closer to the right side panel of the chassis 1. The space of the second mounting cavity 11 is larger than the space of the first mounting cavity 13.

[0041] The chassis 1 includes four side panels and a bottom plate. After the four side panels and the bottom plate are closed, an opening will be left. This opening is covered by a cover plate 3 to protect the internal components from external influences.

[0042] As an optional implementation, the chassis 1 is fully welded, and at least one gap in the chassis 1 is sealed with sealant. It is not necessary to seal individual panels on the chassis 1, which further simplifies the chassis structure and ensures the airtightness of the chassis 1.

[0043] As an optional implementation, the four side plates, the bottom plate, and the cover plate 3 are all detachably connected. This allows for easy disassembly or replacement of any components inside the laser when they malfunction, significantly improving its maintainability.

[0044] As an optional implementation, the four side plates are fixedly connected to form a mounting bracket, which is detachably connected to the base plate and the cover plate 3, thereby improving the airtightness of the chassis 1 and the maintainability of the chassis 1.

[0045] As an optional implementation, the left and right ends of the first partition plate 12 are fixedly connected to the front and rear end plates of the chassis 1, respectively.

[0046] As an optional implementation, the water-cooled plate 2 adopts an embedded pipe design, thereby reducing the thickness of the water-cooled plate 2. The water-cooled plate 2 includes a substrate 24 and an embedded pipe 21. The embedded pipe 21 is embedded in the substrate 24. The embedded pipe 21 has a meandering structure and is concentrated below the pump source 5, optical fiber 6, control board 7 and drive board 8. This is to dissipate heat for the optical module and circuit module. The embedded pipe 21 uses a 10mm diameter copper tube with a thermal conductivity of 390W (mk). The pipe layout is combined with the actual processing limits and heat dissipation requirements.

[0047] The two ends of the embedded pipe 21 are respectively connected to an inlet connector 22 and an outlet connector 23. The inlet connector 22 and the outlet connector 23 are both connected to the same side wall of the casing 1. The inlet connector 22 and the outlet connector 23 are located at the rear end of the casing 1.

[0048] As an optional implementation, such as Figure 3 As shown, the embedded pipeline 21 includes a first meandering section 211, a second meandering section 212, and a straight section 213. The water inlet connector 22, the first meandering section 211, the second meandering section 212, the straight section 213, and the water outlet connector 23 are connected in sequence. The first meandering section 211 is located in the rear half of the second mounting cavity 11, the second meandering section 212 is located in the front half of the second mounting cavity 11, and the straight section 213 is located in the left side of the second mounting cavity 11.

[0049] The first meandering section 211 and the second meandering section 212 have an S-shaped structure. The first meandering section 211 is set in a straight line, that is, the overall flow direction of the water is from right to left. The second meandering section 212 is set in a vertical line, that is, the overall flow direction of the water is from back to front.

[0050] As an optional implementation, the optical module includes a pump source 5, which is installed in the front half of the second mounting cavity 11 and corresponds to the second meandering portion 212.

[0051] There are multiple pump sources 5, each having a tail and a head. The heads of adjacent pump sources face different sides. All pump sources 5 are distributed in a crisscross pattern from front to back. The heads of the pump sources 5 on the left face right, and the heads of the pump sources 5 on the right face left. Each pump source 5 corresponds to at least two pipes on the second meandering section 212, ensuring that the pump sources 5 are arranged compactly while ensuring heat dissipation.

[0052] As an optional implementation, a fiber optic groove is provided in the middle region of the substrate 24, and the optical fiber 6 is placed in the fiber optic groove so that the optical fiber 6 does not occupy height space. The optical fiber 6 is located in the rear left side region of the second mounting cavity 11, and the optical fiber 6 corresponds to the first meandering part 211 and the straight part 213 to ensure heat dissipation of the optical fiber.

[0053] As an optional implementation, the control board 7 is installed in the rear side region of the second mounting cavity 11, and the drive board 8 is installed in the right rear region of the second mounting cavity 11, with the control board 7 and the drive board 8 forming an L-shaped structure.

[0054] As an optional implementation, the control board 7 and the drive board 8 are installed in the rear side area of ​​the second mounting cavity 11, and the control board 7 and the drive board 8 form a straight line structure.

[0055] As an optional implementation, the control board 7 and the drive board 8 are installed in the right side region of the second mounting cavity 11, and the control board 7 and the drive board 8 form a straight line structure.

[0056] As an optional implementation, the drive power supply 9 is installed in the front half of the first mounting cavity 13, and the control board power supply 10 is installed in the rear half of the first mounting cavity 13. The drive power supply 9 is an ultra-thin power supply with a thickness of 41±1mm.

[0057] As an optional implementation, the front end of the chassis 1 is provided with an indicator light panel 4, a handle 14 and a push-button switch 15.

[0058] As an optional implementation, a sealing ring is provided between the chassis 1 and the cover plate 3 to further reduce the thickness of the chassis 1 while ensuring the sealing of the chassis. The sealing ring can be selected from EPDM with a compression of 50-70% or other commonly used sealing ring materials.

[0059] As an optional implementation, the overall thickness of the ultrathin laser is 44±1mm, and the overall design meets the 1U thickness standard and complies with EU safety regulations.

[0060] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. An ultrathin laser, characterized in that, The components include a chassis (1), a water-cooled plate (2), a cover plate (3), a pump source (5), an optical fiber (6), a control board (7), a drive board (8), a drive power supply (9), and a control board power supply (10). The chassis (1) includes a first mounting cavity (13) and a second mounting cavity (11), which are spaced apart. The drive power supply (9) and the control board power supply (10) are installed in the first mounting cavity (13). The water-cooled plate (2) is installed in the second mounting cavity (11) and fixedly connected to the chassis (1). The pump source (5), the optical fiber (6), the control board (7) and the drive board (8) are installed on the water-cooled plate (2) in the second mounting cavity (11). The cover plate (3) is detachably connected to the chassis (1).

2. The ultrathin laser according to claim 1, characterized in that, The chassis (1) includes four side plates and a bottom plate; the four side plates and the bottom plate together form an opening, and the cover plate (3) covers the opening. A first partition plate (12) is provided between the first mounting cavity (13) and the second mounting cavity (11). The lower end of the first partition plate (12) is fixedly connected to the bottom plate of the chassis (1), and the upper end of the first partition plate (12) is in sealed contact with the cover plate (3).

3. The ultrathin laser according to claim 1, characterized in that, The water-cooled plate (2) includes a base plate (24) and an embedded pipe (21). The embedded pipe (21) is embedded in the base plate (24). The two ends of the embedded pipe (21) are respectively connected to an inlet connector (22) and an outlet connector (23). Both the inlet connector (22) and the outlet connector (23) are connected to the same side wall of the chassis (1). The embedded pipeline (21) includes a first meandering section (211), a second meandering section (212), and a straight section (213). The water inlet connector (22), the first meandering section (211), the second meandering section (212), the straight section (213), and the water outlet connector (23) are connected in sequence.

4. The ultrathin laser according to claim 3, characterized in that, The number of pump sources (5) is multiple, each pump source (5) has a tail and a head, the heads of adjacent pump sources (5) face different sides, the pump sources (5) are installed in the front area of ​​the second mounting cavity (11), and each pump source (5) corresponds to at least two pipes on the second meandering part (212).

5. An ultrathin laser according to claim 3, characterized in that, A fiber optic groove is provided in the middle region of the substrate (24), and the optical fiber (6) is placed in the fiber optic groove. The optical fiber (6) corresponds to the first meandering part (211) and the straight part (213).

6. The ultrathin laser according to claim 1, characterized in that, The control board (7) and the drive board (8) are installed in the rear region of the second mounting cavity (11).

7. An ultrathin laser according to claim 1, characterized in that, The driving power supply (9) is an ultra-thin power supply with a thickness of 41±1mm.

8. An ultrathin laser according to claim 1, characterized in that, The front end of the chassis (1) is provided with an indicator light panel (4), a handle (14) and a push-button switch (15).

9. An ultrathin laser according to claim 1, characterized in that, The thickness of the ultrathin laser is 44±1mm.

10. An additive manufacturing apparatus, characterized in that, It includes multiple ultrathin lasers as described in any one of claims 1 to 9.