Structure for enhancing heat dissipation capability of electronic water pump

Abstract

The utility model provides a structure for enhancing heat dissipation capability of electronic water pump, which comprises a plastic rear cover, a controller PCBA (printed circuit board assembly), heat-conducting glue, a plastic base, a water pump motor, an impeller and a plastic shell, a containing cavity is formed in the plastic rear cover and the plastic shell, and the controller PCBA, the heat-conducting glue, the plastic base, the water pump motor and the impeller are arranged in the containing cavity. The front face of the controller PCBA faces the plastic rear cover, the back face of the controller PCBA is connected to the plastic base through heat-conducting glue, a cooling channel is formed between the other side of the plastic base and the water pump motor, and circulating cooling liquid is arranged in the cooling channel. The PCBA of the controller is connected to the plastic base by changing the placement direction of the PCBA of the controller, a cooling channel is formed in the other side of the plastic base, and the controller is cooled through cooling liquid. And an aluminum fin metal rear cover is improved into a plastic rear cover, so that the heat dissipation capability is ensured, the cost is reduced, the axial size is also reduced, and the comprehensive competitiveness is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic water pump technology, and in particular to a structure for enhancing the heat dissipation capacity of electronic water pumps. Background Technology

[0002] The controller PCBA of the existing axial flux electronic water pump (eAX electronic water pump) is attached to the back of the aluminum fin metal back cover (such as...). Figure 1 As shown, due to aluminum's low thermal resistance and good heat dissipation capacity, an aluminum-finned metal back cover is used as a heat conduction radiator for the controller PCBA. This is a common heat dissipation method on the market and widely used in the industry. However, this heat dissipation method is relatively expensive because it involves aluminum. Furthermore, aluminum can oxidize and develop white rust, which increases thermal resistance, continuously weakens its heat dissipation capacity, exacerbates corrosion of the entire vehicle, and affects its appearance. Additionally, the aluminum-finned metal back cover increases the axial height of the water pump, increasing its assembly requirements. Utility Model Content

[0003] The technical problem to be solved by this utility model is: in order to overcome the shortcomings of the prior art, this utility model provides a structure for enhancing the heat dissipation capacity of an electronic water pump.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a structure for enhancing the heat dissipation capacity of an electronic water pump, including a plastic back cover, a controller PCBA, thermally conductive adhesive, a plastic base, a water pump motor, an impeller, and a plastic outer shell. The plastic back cover and the plastic outer shell are connected to each other, forming an internal cavity. The controller PCBA, thermally conductive adhesive, plastic base, water pump motor, and impeller are sequentially arranged in the cavity. The back of the controller PCBA is connected to one side of the plastic base. The thermally conductive adhesive is disposed between the controller PCBA and the plastic base. The other side of the plastic base forms a cooling channel with the water pump motor, and the cooling channel contains circulating coolant.

[0005] Furthermore, the controller PCBA is attached to the plastic base using thermally conductive adhesive.

[0006] In the prior art, the height of the aluminum finned metal back cover is approximately 19mm. To reduce the axial dimension of the water pump and lower costs, the aluminum finned metal back cover is further improved by replacing it with a plastic back cover, and the height of the plastic back cover is reduced. Preferably, the height of the plastic back cover is approximately 10mm.

[0007] Preferably, the thickness of the plastic back cover is approximately 2 mm.

[0008] Simply fixing the controller PCBA with thermally conductive adhesive will cause it to detach from the plastic base under vibration during long-term use, affecting heat dissipation and controller stability. Therefore, in order to improve the stability of the controller PCBA, a PCBA positioning structure is also included. The PCBA positioning structure includes positioning posts set on the plastic base and positioning grooves set on the controller PCBA. When the controller PCBA is pasted on the plastic base, the positioning posts are embedded in the positioning grooves.

[0009] Furthermore, the plastic back cover is provided with a connector integrally injection molded therewith. By abandoning the aluminum finned metal back cover, the connector can be injection molded together with the plastic back cover, eliminating the need for two mounting bolts, thus optimizing the process and reducing manufacturing costs.

[0010] The beneficial effects of this utility model are as follows: This utility model provides a structure for enhancing the heat dissipation capacity of an electronic water pump. By changing the placement direction of the controller and connecting it to a plastic base, a cooling channel is formed on the other side of the plastic base, and the controller is cooled by the coolant. The aluminum fin metal back cover is improved to a plastic back cover, which ensures heat dissipation capacity while reducing cost and axial dimension, thereby enhancing its overall competitiveness. Attached Figure Description

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the aluminum finned metal back cover of an axial flux electronic water pump in the prior art.

[0013] Figure 2 This is an exploded view of the structure of this utility model used to enhance the heat dissipation capacity of an electronic water pump.

[0014] Figure 3 This is a cross-sectional schematic diagram of the structure of this utility model used to enhance the heat dissipation capacity of an electronic water pump.

[0015] Figure 4 This is a schematic diagram of the PCBA positioning structure.

[0016] In the diagram: 1. Plastic back cover, 2. Controller PCBA, 2.1. Positioning groove, 3. Thermal conductive adhesive, 4. Plastic base, 4.1. Positioning post, 5. Water pump motor, 6. Impeller, 7. Plastic housing, 8. Cooling channel, 9. Screw, 10. Magnet. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention. Therefore, they only show the components, orientations, and references (e.g., up, down, left, right, etc.) relevant to the present invention and are intended only to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be restrictive, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0018] like Figure 2 and Figure 3 As shown, this utility model discloses a structure for enhancing the heat dissipation capacity of an electronic water pump, comprising a plastic back cover 1, a controller PCBA 2, thermally conductive adhesive 3, a plastic base 4 (red component in the figure), a water pump motor 5, an impeller 6, and a plastic housing 7. The outer edges of the plastic back cover 1 and the plastic housing 7 are connected to each other by screws 9, forming an internal receiving cavity. The screws 9 pass through the plastic back cover 1, the plastic base 4, and the plastic housing 7 in sequence and are then locked with nuts. The plastic back cover 1 is provided with a connector integrally injection molded therewith. The controller PCBA 2, thermally conductive adhesive 3, plastic base 4, water pump motor 5, and impeller 6 are sequentially arranged within the receiving cavity. The back of the controller PCBA 2 is connected to one side of the plastic base 4. The thermally conductive adhesive 3 is disposed between the controller PCBA 2 and the plastic base 4. A cooling channel 8 is formed between the other side of the plastic base 4 and the water pump motor 5, and a circulating coolant is contained within the cooling channel 8. The controller PCBA 2 is attached to the plastic base 4 by the thermally conductive adhesive 3. The aluminum fin metal back cover is improved to a plastic back cover 1, and the height of the plastic back cover 1 is reduced. Preferably, the height of the plastic back cover is about 10mm; the thickness of the plastic back cover 1 is about 1mm-2mm; a magnet 10 (green part in the figure) is also provided around the cooling channel to enhance the electromagnetic force of the electric water pump 5 and provide stronger power.

[0019] like Figure 4 As shown, to improve the stability of the controller PCBA 2, a PCBA positioning structure is also included. This positioning structure includes positioning posts 4.1 on the plastic base 4 and positioning slots 2.1 on the controller PCBA 2. When the controller PCBA 2 is attached to the plastic base 4, the positioning posts 4.1 are embedded in the positioning slots 2.1. In this embodiment, there are four positioning posts 4.1 and four positioning slots 2.1, distributed along the edges of the controller PCBA 2.

[0020] Working principle:

[0021] The back of the controller PCBA 2 is attached to the plastic base 4 between the water pump motor 5 and the controller using thermally conductive adhesive 3 (thermal interface material). The plastic base 4 acts as an isolation layer between the controller PCBA 2 and the water pump motor 5. The heat from the controller is transferred to the plastic isolation layer through the thermally conductive adhesive 3 (thermal interface material). The water pump motor 5 on the other side of the isolation layer is immersed in coolant. Utilizing the characteristic of the axial flux water pump motor 5 being immersed in coolant, the flowing coolant continuously carries away the heat from the controller, thereby cooling the controller PCBA 2. In addition, the original aluminum fin metal back cover is directly replaced with a thin plastic back cover 1 to reduce the axial height, thus avoiding the problem of oxidation and white rust on the aluminum fin metal back cover.

[0022] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the scope of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A structure for enhancing the heat dissipation capacity of an electronic water pump, characterized in that: The device includes a plastic back cover, a controller PCBA, thermally conductive adhesive, a plastic base, a water pump motor, an impeller, and a plastic outer shell. The plastic back cover and the plastic outer shell are connected to each other, forming an internal cavity. The controller PCBA, thermally conductive adhesive, plastic base, water pump motor, and impeller are sequentially arranged within the cavity. The front of the controller PCBA faces the plastic back cover, and its back is connected to one side of the plastic base. The thermally conductive adhesive is disposed between the controller PCBA and the plastic base. The other side of the plastic base forms a cooling channel with the water pump motor, and the cooling channel contains circulating coolant.

2. The structure for enhancing the heat dissipation capacity of an electronic water pump as described in claim 1, characterized in that: The controller PCBA is attached to the plastic base with thermally conductive adhesive.

3. The structure for enhancing the heat dissipation capacity of an electronic water pump as described in claim 1, characterized in that: The height of the plastic back cover is approximately 10mm.

4. The structure for enhancing the heat dissipation capacity of an electronic water pump as described in claim 1, characterized in that: The thickness of the plastic back cover is approximately 2 mm.

5. The structure for enhancing the heat dissipation capacity of an electronic water pump as described in claim 1, characterized in that: The overall axial height decreased by approximately 7.5 mm.

6. The structure for enhancing the heat dissipation capacity of an electronic water pump as described in claim 1, characterized in that: It also includes a PCBA positioning structure, which includes a positioning post set on a plastic base and a positioning groove set on the controller PCBA. When the controller PCBA is pasted on the plastic base, the positioning post is embedded in the positioning groove.

7. The structure for enhancing the heat dissipation capacity of an electronic water pump as described in claim 1, characterized in that: The plastic back cover is provided with a connector integrally injection molded therewith.

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