Single-sided four-layer thermoelectric separation copper substrate

Abstract

The utility model provides a single-sided four-layer thermoelectric separation copper substrate comprising a copper-based heat dissipation bottom layer, and the top surface of the copper-based heat dissipation bottom layer is sequentially provided with a third insulating layer, a fourth circuit layer, a second insulating layer, a third circuit layer, a base material layer, a second circuit layer, a first insulating layer, a first circuit layer and a solder mask white oil layer from bottom to top. A via hole is arranged between the first circuit layer and the fourth circuit layer, the solder mask white oil layer is provided with a plurality of hollow mounting areas, the part, exposed out of the solder mask white oil layer, of the first circuit layer forms a bonding pad, and the top of the copper-based heat dissipation bottom layer extends to the bottom of the same hollow mounting area to form a heat conduction disc. The LED lamp beads are attached to the hollowed-out attaching areas, the heat dissipation bonding pads of the lamp beads are welded to the heat conduction disc, the positive electrodes and the negative electrodes of the lamp beads are welded to the two bonding pads respectively, power-on control over different areas of the lamp beads on the surface layer can be achieved by conducting circuits on different layers, the function that part of the lamp beads can be controlled to emit light is achieved, the application range is wider, and the good heat dissipation effect is achieved; the popularization and use are worthy.

Description

Technical Field

[0001] This utility model relates to the field of copper substrates, and more particularly to a single-sided four-layer thermoelectric separation copper substrate. Background Technology

[0002] Copper substrates are a type of substrate widely used in LED lighting due to their good heat dissipation. (See attached image.) Figure 3 As shown, this is an existing copper substrate structure. Because it only has one layer of circuitry, it is impossible to complete the circuit layout on a single copper foil when the circuits intersect. This type of substrate can only accommodate simple circuits, which greatly limits the routing and distribution of the circuits. It cannot achieve power control of LED beads in different areas, cannot meet the needs of complex circuit designs, and has significant limitations in its use. Summary of the Invention

[0003] The problem to be solved by this utility model is to provide a single-sided four-layer thermoelectric separation copper substrate, which facilitates the power supply control of LED beads in different areas and has wider applicability.

[0004] To solve the above technical problems, a single-sided four-layer thermoelectric separation copper substrate provided by this utility model is provided, comprising a copper-based heat dissipation bottom layer. The top surface of the copper-based heat dissipation bottom layer is provided with a third insulating layer, a fourth circuit layer, a second insulating layer, a third circuit layer, a substrate layer, a second circuit layer, a first insulating layer, a first circuit layer, and a solder resist white layer from bottom to top. A through hole is provided between the first circuit layer and the fourth circuit layer. Several hollow mounting areas are formed on the solder resist white layer. The part of the first circuit layer exposed from the solder resist white layer forms a pad. The top of the copper-based heat dissipation bottom layer extends to the bottom of the same hollow mounting area to form a heat conduction pad.

[0005] Preferably, the substrate layer is an FR-4 glass substrate.

[0006] Preferably, the first insulating layer, the second insulating layer, and the third insulating layer are all made of PP.

[0007] The beneficial effects of this utility model are as follows: This utility model provides a single-sided four-layer thermoelectric separation copper substrate with four circuit layers: a first circuit layer, a second circuit layer, a third circuit layer, and a fourth circuit layer. This allows for the design of more complex circuit layouts. Through copper plating in the vias, conductivity between the first and second circuit layers, between the first and third circuit layers, and between the first and fourth circuit layers can be achieved. LED beads are mounted on the hollow mounting area, with the heat dissipation pads of the beads soldered to the heat-conducting pads. The positive and negative terminals of the beads are soldered to two separate pads. By enabling conductivity between different layers, different areas of the surface LED beads can be electrically controlled, allowing for the controllable illumination of specific LED beads. This invention can be used in stage and photography applications, offering enhanced functionality, a wider range of applications, and excellent heat dissipation, making it worthy of widespread adoption. Attached Figure Description

[0008] Figure 1 A cross-sectional view of the present invention is shown.

[0009] Figure 2 A top view of the present invention is shown.

[0010] Figure 3 A cross-sectional view of the prior art of this utility model is shown.

[0011] The reference numerals are as follows: 1. Copper-based heat dissipation bottom layer; 2. Third insulating layer; 3. Fourth circuit layer; 4. Second insulating layer; 5. Third circuit layer; 6. Substrate layer; 7. Second circuit layer; 8. First insulating layer; 9. First circuit layer; 90. Solder pad; 10. Solder resist layer; 100. Hole; 11. Heat transfer pad. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure.

[0013] Based on the embodiments described in this disclosure, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this disclosure.

[0014] refer to Figure 1-3 .

[0015] This utility model provides a single-sided four-layer thermoelectric separation copper substrate, comprising a copper-based heat dissipation bottom layer 1. The top surface of the copper-based heat dissipation bottom layer 1 is provided with, from bottom to top, a third insulating layer 2, a fourth circuit layer 3, a second insulating layer 4, a third circuit layer 5, a substrate layer 6, a second circuit layer 7, a first insulating layer 8, a first circuit layer 9, and a solder resist white layer 10. A through hole 11 is provided between the first circuit layer 9 and the fourth circuit layer 3. A plurality of hollow mounting areas 100 are formed on the solder resist white layer 10. The portion of the first circuit layer 9 exposed from the solder resist white layer 10 forms a pad 90. The top of the copper-based heat dissipation bottom layer 1 extends to the bottom of the same hollow mounting area 100 to form a heat conduction pad 12.

[0016] Its operating principle is as follows: it has four circuit layers: a first circuit layer 9, a second circuit layer 7, a third circuit layer 5, and a fourth circuit layer 3. This allows for the design of more complex circuit layouts. Through copper plating in the vias 11, the first circuit layer 9 can be connected to the second circuit layer 7, the first circuit layer 9 to the third circuit layer 5, and the first circuit layer 9 to the fourth circuit layer 3. The LED beads are mounted on the hollow mounting area 100, and the heat dissipation pads of the beads are soldered to the heat conduction pads 12. The positive and negative terminals of the beads are soldered to two pads 90 respectively. By making the circuits of different layers conductive, different areas of the surface beads can be powered and controlled, enabling the controllable illumination of some beads. It can be used in stage and photography fields, offering enhanced functionality, a wider range of applications, and excellent heat dissipation, making it worthy of widespread use.

[0017] Based on the above embodiments, the substrate layer 6 is an FR-4 glass substrate. FR-4 glass substrate has good mechanical strength and good flame retardancy.

[0018] Based on the above embodiments, the first insulating layer 8, the second insulating layer 4, and the third insulating layer 2 are all made of PP. PP has the advantages of being lightweight, having good heat resistance, and high insulation strength.

[0019] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A single-sided four-layer thermoelectrically separated copper substrate, comprising a copper-based heat dissipation underlayer, characterized in that, The top surface of the copper-based heat dissipation substrate is provided with, from bottom to top, a third insulating layer, a fourth circuit layer, a second insulating layer, a third circuit layer, a substrate layer, a second circuit layer, a first insulating layer, a first circuit layer, and a solder resist layer. A via is provided between the first circuit layer and the fourth circuit layer. Several hollow mounting areas are formed on the solder resist layer. The portion of the first circuit layer exposed from the solder resist layer forms a pad. The top of the copper-based heat dissipation substrate extends to the bottom of the same hollow mounting area to form a heat conduction pad.

2. The single-sided four-layer thermoelectrically separated copper substrate according to claim 1, characterized in that, The substrate layer is an FR-4 glass substrate.

3. The single-sided four-layer thermoelectrically separated copper substrate according to claim 1, characterized in that, The first insulating layer, the second insulating layer, and the third insulating layer are all made of PP.

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