Vibration electroplating device and vibration electroplating system

Abstract

The utility model provides a vibration electroplating device and a vibration electroplating system. The device comprises a rotating shaft, a vibration disc and a plurality of groups of cathode columns, the rotating shaft is connected with a vibration source; the side wall of the vibration disc is arranged on the bottom plate in a surrounding mode to form a containing cavity, and the rotating shaft extends into the containing cavity and is connected with the bottom plate. Screen holes are formed in a bottom plate and / or the side wall of the vibration disc. The bottom plate comprises a low-position area, a transition area and a high-position area which are sequentially arranged in the spiral direction of the vibration source. A material distributing piece of the vibration disc is arranged in the containing cavity and located above the low-position area, and the two ends of an arc-shaped bridge surface of the material distributing piece communicate with the high-position area and the transition area correspondingly; the cathode column extends into the containing cavity and is exposed out of the bottom plate. The flow amount of the electroplating liquid can be increased, the risk of an oxidation phenomenon in the deposition process is reduced, the exchangeability of a product and an electroplating medium in the vibration disc is improved, and the quality of a plating layer and the product is improved.

Description

Technical Field

[0001] This application relates to the field of vibration electroplating technology, specifically to a vibration electroplating device and a vibration electroplating system. Background Technology

[0002] In the production of ceramic components such as MLCCs (multilayer ceramic chip capacitors), electroplating is required on certain areas of their surface to form a corresponding coating. Currently, the industry generally uses vibratory electroplating, where the product is placed in a vibratory plater, which is then immersed in the electroplating solution. A vibration source drives the plater to vibrate, causing the electroplating solution to flow across the product surface and depositing anolyte metal ions, thus forming the coating. However, in existing vibratory electroplating equipment, the vibratory plater has few sieve holes, and some manufacturers' plates even lack sieve holes, exchanging electrolyte only through an opening at the top. This results in fewer flow channels for the electroplating solution inside and outside the plater, a smaller flow rate of the electroplating solution, a slower deposition rate of anolyte metal ions on the product surface, and a higher likelihood of insufficient deposition. In particular, oxidation is prone to occur during the deposition process, leading to poor coating quality, reduced solderability, and a serious threat to product quality. Utility Model Content

[0003] In view of this, this application provides a vibration electroplating apparatus and a vibration electroplating system, which can improve the problems of small flow rate of electroplating solution in existing vibration electroplating apparatuses, and the resulting slow deposition of anode metal ions and easy oxidation during the deposition process, resulting in poor coating quality.

[0004] This application provides a vibration electroplating apparatus, comprising:

[0005] A rotating shaft, one end of which is used to connect a vibration source;

[0006] A vibratory feeder includes a base plate, side walls, and a distribution component with an arc-shaped bridge surface; the side walls surround the base plate to form a receiving cavity, and the other end of the rotating shaft extends into the receiving cavity and is connected to the base plate; the base plate and / or the side walls are provided with screen holes; the base plate includes a low-position area, a transition area, and a high-position area arranged sequentially along the helical direction of the vibration source; the distribution component is disposed in the receiving cavity and located above the low-position area, and the two ends of the arc-shaped bridge surface are respectively connected to the high-position area and the transition area to form a channel passing through the bottom of the distribution component and connecting the high-position area and the transition area;

[0007] Multiple sets of cathode columns extend into the receiving cavity and are exposed to the base plate.

[0008] Optionally, at least one of the following must be satisfied:

[0009] The diameter of the sieve holes provided on the side wall is larger than the diameter of the sieve holes provided on the bottom plate;

[0010] The sieve holes provided on the side wall are arranged in a spiral shape along the spiral direction on the side wall;

[0011] The sieve holes provided on the side wall are arranged in an array and uniformly distributed on the side wall.

[0012] Optionally, the material distribution component is provided with an inner baffle, located on the side of the arc-shaped bridge surface near the rotating shaft, and the end facing the transition zone is arranged opposite to the rotating shaft to form a notch; the vibration electroplating device further includes a first stop block, which blocks the notch.

[0013] Optionally, along a direction perpendicular to the base plate, the side of the first stop block facing away from the rotation axis has the same curvature as the inner baffle.

[0014] Optionally, at the radius of the oscillating disk where the entrance of the channel is located, the width of the entrance of the channel is d1, and the length from the sidewall to the channel is d2, and d1... <d2。

[0015] Optionally, the material distribution component is provided with an inner baffle located on the side of the arc-shaped bridge surface near the rotating shaft, and the end of the inner baffle facing the transition zone is connected to the rotating shaft.

[0016] Optionally, the material distribution component is provided with an outer baffle located on the side of the arc-shaped bridge surface near the side wall; the vibration electroplating device further includes a second baffle located at the connection between the outer baffle and the side wall but not blocking the channel.

[0017] Optionally, the second stop is flush with the top of the outer baffle, or the top surface of the second stop is an inclined surface, the height of which gradually decreases along the side wall toward the rotation axis.

[0018] Optionally, one end of the arc-shaped bridge surface that connects to the transition zone is suspended relative to the transition zone; and / or, one end of the high-level zone that connects to the channel is suspended relative to the low-level zone.

[0019] Optionally, the cantilever height of one end of the curved bridge deck connecting to the transition zone relative to the transition zone is H1, and 2cm.

[0020] This application also provides a vibration electroplating system, including a vibration source, an anode, and the vibration electroplating device described in any of the above. The vibration source is connected to the rotating shaft, and the anode can extend to the electroplating solution in the receiving cavity and form a closed-loop circuit with the cathode column through the electroplating solution. ​

[0021] As described above, this application increases the flow channels of the electroplating solution inside and outside the vibratory plate by providing sieve holes in the bottom plate and / or side wall of the vibratory plate, thereby increasing the flow rate of the electroplating solution, thereby improving the deposition rate and amount of anode metal ions on the product surface, reducing the risk of oxidation during the deposition process, and thus helping to improve the quality of the coating and the electroplated product.

[0022] Furthermore, by forming a channel through the material distribution component inside the vibratory plate, when the product passes through the material distribution component, the products in the inner ring of the vibratory plate and the products in the outer ring of the vibratory plate are uniformly exchanged. The plating of the product is uniform and the plating at the end of the product is complete, which can further improve the quality of the plating and the electroplated product.

[0023] In addition, by setting a first stop to block the gap between the inner baffle of the material separating component and the rotating shaft, or by connecting the inner baffle of the material separating component to the rotating shaft, dead angles between the inner baffle of the material separating component and the rotating shaft can be avoided, thereby preventing products from being stuck in the dead angle and affecting the electroplating quality. Attached Figure Description

[0024] Figure 1 A top view of the structure of a vibration electroplating apparatus provided in an embodiment of this application;

[0025] Figures 2 to 4 Three structural side views of a vibration electroplating apparatus provided in this application embodiment;

[0026] Figure 5 This is a top view of another vibration electroplating apparatus provided in an embodiment of this application.

[0027] First direction x, second direction y, and third direction z

[0028] Vibration electroplating device 1

[0029] Rotating shaft 11

[0030] Flange ring 111

[0031] 12 oscillating discs

[0032] 120 mesh size; 121 bottom plate; 122 side wall; 123 material distribution component.

[0033] Inner baffle 124, outer baffle 125, first stop 126, second stop 127

[0034] Support block 128

[0035] 12a Low-level zone 12b Transition zone 12c High-level zone 12c Curved bridge deck 12d Passage 12e

[0036] Multiple cathode columns 13

[0037] First group of cathode columns 131; Second group of cathode columns 132; Third group of cathode columns 133 Detailed Implementation

[0038] To address the aforementioned problems in the prior art, this application provides a vibration electroplating apparatus and a vibration electroplating system. These two protected subjects are based on the same concept, and their problem-solving principles are essentially the same or similar. The implementation methods of each protected subject can be referred to mutually, and repeated details will not be elaborated upon.

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only a part of the embodiments of this application, and not all of them. Unless otherwise specified, the following embodiments and their technical features can be combined with each other, and also belong to the technical solutions of this application.

[0040] In the description of the embodiments of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solutions of the corresponding embodiments, and are not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limitations on this application.

[0041] Please refer to the following: Figures 1 to 4 As shown in the figure, the vibration electroplating device 1 provided in this application embodiment includes a rotating shaft 11, a vibrating plate 12 and multiple sets of cathode columns 13.

[0042] The rotating shaft 11 is a columnar or elongated structural component extending along the second direction y. Its cross-sectional shape (i.e., the xz section) is not limited to the circle shown in the figure; it can also be an ellipse, trapezoid, or other polygonal shape. The rotating shaft 11 includes two opposite ends along the second direction y, one end (the upper end shown in the figure) for connecting to the vibration source, and the other end (the lower end shown in the figure) extending towards the vibrating plate 12. In practical applications, flange rings 111 can be provided at both ends of the rotating shaft 11, and the shaft can be connected to the vibration source and the vibrating plate 12 respectively through the corresponding flange rings 111. This flange ring connection method improves the stability and sealing of the connection and facilitates subsequent replacement and maintenance of the connected structural components.

[0043] The second direction y can be considered as the height direction of the rotating shaft 11 and the vibratory electroplating device 1. The length direction of the rotating shaft 11 and the vibratory electroplating device 1 is the first direction x, and the width direction of the rotating shaft 11 and the vibratory electroplating device 1 is the third direction z. The first direction x, the second direction y, and the third direction z are mutually perpendicular and can be considered as two coordinate axes of a three-dimensional rectangular coordinate system. For the rotating shaft 11 and the vibratory plate 12, both of which have circular cross-sections, the first direction x and the third direction z can be considered as their radial directions. It should be understood that the term "perpendicular" in this application does not require that the angle between the two directions must be 90°, but allows for a deviation of ±10°, that is, the angle between two perpendicular directions is 80° to 100°; similarly, the term "parallel" does not require that the angle between the two directions must be 0° or 180°, but allows for a deviation of ±10°, that is, the angle between two parallel directions is 0° to 10° or 170° to 190°.

[0044] The vibratory feeder 12 includes a base plate 121, a side wall 122, and a material distribution component 123.

[0045] The sidewall 122 surrounds the base plate 121 to form a receiving cavity, in which the vibrating plate 12 can also be called a vibrating basket or vibrating cage. The lower end of the rotating shaft 11 extends from the opening at the upper end of the vibrating plate 12 into the receiving cavity and is connected to the base plate 121, thereby driving the base plate 121 to drive the vibrating plate 12 to vibrate.

[0046] For a scenario where the cross-section of the vibratory plate 12 is circular, the sidewall 122 and the base plate 121 cooperate to form a structural component with an opening at the top and the bottom end passing through the base plate 121 as a support plate. The base plate 121 includes a low-position region 12a, a transition region 12b, and a high-position region 12c arranged sequentially along the helical direction of the vibration source (which can be regarded as the rotation direction of the rotating shaft 11 in the electroplating process). Along the second direction y, the height of these three regions gradually increases, thereby forming a spiral surface spiraling upward within the vibratory plate 12. This spiral surface spirals upward around the rotating shaft 11. Optionally, the low-position region 12a, the transition region 12b, and the high-position region 12c each occupy 1 / 3 of the bottom area of ​​the vibratory plate (specifically, the orthographic projection of the base plate 121 along the second direction y). The material distribution component 123 is disposed within the receiving cavity and is provided with an arc-shaped bridge surface 12d. Specifically, the material distribution component 123 is located above the low position area 12a, and the two ends of the arc-shaped bridge surface 12d are respectively connected to the high position area 12c and the transition area 12b to form a channel 12e that passes through the lower part of the material distribution component 123 and connects the high position area 12c and the transition area 12b.

[0047] In one example, one end of the curved bridge surface 12d that connects to the transition zone 12b is suspended relative to the transition zone 12b. This suspension allows the curved bridge surface 12d to drop vertically downwards, thus preventing the product from clogging at this point when the vibrating plate 12 vibrates; and / or, one end of the high-level zone 12c that connects to the channel 12e is suspended relative to the low-level zone 12a. This suspension allows the product passing through the high-level zone 12c to be dropped vertically and enter the channel 12e, thereby preventing the product from clogging at this point.

[0048] The base plate 121 and side wall 122 are respectively provided with sieve holes 120. It should be understood that in other examples, this application may only provide sieve holes 120 on the base plate 121 and not provide sieve holes 120 on the side wall 122, or only provide sieve holes 120 on the side wall 122 and not provide sieve holes 120 on the base plate 121. The sieve holes 120 are through holes, which can allow the electroplating solution and the anolyte metal ions in the electroplating solution to pass through. For example, the sieve holes 120 may include: drainage holes for allowing the electroplating solution to pass through in the base plate 121 and side wall 122, and a filter screen covering the drainage holes, which at least allows the anolyte metal ions in the electroplating solution to pass through.

[0049] It should be understood that the sieve holes 120 on the base plate 121 allow only the electroplating solution and anolyte metal ions in the solution to pass through, but do not allow the product to leak out. The main function of the sieve holes 120 here is to increase the effective electroplating efficiency and enhance conductivity. As for the sieve holes 120 on the side wall 122, whether or not product leakage is allowed while fulfilling this main function can be adaptively set according to actual needs. When product leakage is allowed, the sieve holes 120 are just through holes and no filter screen is provided covering the through holes.

[0050] Multiple sets of cathode posts 13 are disposed within a receiving cavity, including embodiments that extend at least into the receiving cavity. Along the helical direction, the height of each set of cathode posts 13 gradually increases, and the ends of each set of cathode posts 13 extend to expose the helical surface, such that the product at the location of each set of cathode posts 13 vibrating to the helical surface can contact the corresponding cathode post 13 for conductive connection.

[0051] In one implementation scenario, the cathode post 13 and the base plate 121 of the vibrating plate 12 are connected by a threaded fastening. For example, the lower end of the cathode post 13 is provided with a thread, the base plate 121 of the vibrating plate 12 is provided with a threaded hole, and the lower end of the cathode post 13 is inserted into the threaded hole and connected by threaded fastening. Furthermore, the lower end of the cathode post 13 extends out of the base plate 121 to extend outside the vibrating plate 12 and is connected to electricity.

[0052] exist Figures 1 to 4In this scenario, the same group of cathode columns 13 are arranged along the radial direction of the vibrating plate 12. The number of cathode columns 13 in each group can be determined according to the adaptability of the actual scenario. The figure shows that each group contains 3 cathode columns 13, which is only an example. The more cathode columns 13 in each group, the stronger the conductivity and the better the electroplating effect. When viewed along the line of sight perpendicular to the base plate 121, the included angle between any two adjacent groups of cathode columns 13 is equal. The uniform distribution of cathode columns 13 is conducive to better conductive connection of the cathode in the product.

[0053] To accommodate the inclined arrangement of the helical surface, the heights of the cathode columns 13 within the same group can vary; for example, the cathode columns 13 closer to the rotation axis 11 have smaller heights. Of course, the heights of the cathode columns 13 within the same group can also be the same. Figures 1 to 4 As shown, the maximum height of the first group of cathode columns 131 is lower than the minimum height of the second group of cathode columns 132, and the maximum height of the second group of cathode columns 132 is lower than the minimum height of the third group of cathode columns 133. Therefore, the first group of cathode columns 131 can also be called the low-position cathode columns 131, the second group of cathode columns 132 can be called the middle-position cathode columns 132, and the third group of cathode columns 133 can be called the high-position cathode columns 133. The included angle α between the helical surface of each group of cathode columns 13 and the rotation axis 11 can be adaptively designed. For example, the included angle α corresponding to the low-position cathode column 131 is 92°, the included angle α corresponding to the middle-position cathode column 132 is 90°, and the included angle α corresponding to the high-position cathode column 133 is 88°. The uniform reduction of the included angle α is beneficial to the uniform thickness of the coating formed by the deposition of anolyte metal ions, and the product is less prone to accumulation.

[0054] Optionally, the angle between the helical surface and the rotating shaft 11 remains constant along the helical direction, that is, the inclination angle of the helical surface remains constant from bottom to top. Alternatively, the angle between the helical surface and the rotating shaft 11 gradually decreases along the helical direction, that is, the inclination angle of the helical surface toward the rotating shaft 11 gradually decreases from bottom to top. This allows the number of products carried on the helical surface to gradually decrease from bottom to top, and the width of the movable path of the products decreases as they go up. This helps to slow down the movement of the products, and the products are less likely to accumulate, resulting in phenomena such as sticking, black unplated ends, and rough ends. Anode metal ions can be better deposited on the product surface, resulting in a more uniform coating thickness.

[0055] The anode used in the electroplating process is not limited in its structure, material, or relative position to any of the aforementioned structural elements of the vibratory electroplating apparatus 1. For example, the anode and cathode post 13 can be connected to the same power source as the vibration source. During the electroplating process, the anode extends into the electroplating solution within the receiving cavity of the vibratory plate 12 and forms a closed-loop circuit with the cathode post 13 through the electroplating solution.

[0056] The working principle and process of the vibration electroplating device 1 are exemplarily described below:

[0057] First, the product to be electroplated is placed into the receiving cavity of the vibratory plate 12, and the vibratory plate 12 containing the product is immersed in a device containing electroplating solution. This product includes, but is not limited to, coupling elements such as MLCCs. In scenarios where the product to be electroplated is a small coupling element such as an MLCC, optionally, an electroplating medium, such as conductive particles like steel balls, can be placed in the receiving cavity of the cathode post 13. The mixing of the electroplating medium with the product ensures a good electrical connection between the product and the cathode post 13. The electroplating medium is used to increase the conductivity and agitation of the product. Because MLCC products are particularly small (millimeter-scale), it is difficult for each product to contact the cathode post 13. Therefore, after adding the electroplating medium, the electroplating medium and the cathode post 13 form a large cathode. Products only need to contact the electroplating medium to be electroplated, and the current is distributed to many products, thereby improving electroplating efficiency and quality. It should be understood that electroplating media can also include zirconium balls (i.e., spherical particles made of ZrO2) and aluminum balls (i.e., spherical particles made of Al2O3), etc. The particle size is generally 5-10cm, which is relatively large compared to conductive particles such as MLCC products and steel balls. The main purpose is to stir and break up the products that stick together, so that even if the product size is small, it is not easy for the products to stick together.

[0058] Then, the vibration source is activated, which drives the rotating shaft 11 to vibrate, thereby causing the vibrating plate 12 to vibrate. Through the spiral surface formed by the material distribution component 123, the product and electroplating solution move along the spiral surface during the vibration of the vibrating plate 12, i.e., rotate relative to the rotating shaft 11, thus increasing the flow rate of the electroplating solution. Furthermore, the increased number of electroplating solution flow channels inside and outside the vibrating plate 12 through the sieve holes 120 also increases the flow rate of the electroplating solution and reduces the resistance encountered by the product during movement, preventing product accumulation. Therefore, this application can improve the deposition rate and amount of anolyte metal ions on the product surface, resulting in a more uniform coating thickness and reducing the risk of oxidation during deposition, thereby improving the quality of the coating and the electroplated product. For example, research and experimental results show that improved coating quality leads to improved solderability, increasing the welding yield from 90% in the prior art to 99.9% or higher. In addition, by increasing the flow rate of the electroplating solution, the number of products that can be electroplated in a single operation by the vibration electroplating apparatus 1 of this application can be increased from 3,500,000 in the prior art to 4,500,000.

[0059] For ease of distinction, the sieve holes 120 disposed on the side wall 122 may be referred to as the first sieve holes 120, and the sieve holes 120 disposed on the bottom plate 121 may be referred to as the second sieve holes 120. Optionally, the diameter of the first sieve holes 120 may be larger than the diameter of the second sieve holes 120. During the vibration electroplating process, the flow rate of the electroplating solution is larger in the direction passing through the first sieve holes 120, while the flow rate is smaller in the direction passing through the second sieve holes 120 (i.e., the second direction y). Therefore, by setting the diameter of the first sieve holes 120 to be larger, the internal and external exchange requirements of the electroplating solution when the product rotates along the spiral surface can be met.

[0060] The shape and arrangement of the various sieve holes 120 on the sidewall 122 and the bottom plate 121 are not limited in this application. For example, the first sieve hole 120 can be arranged spirally on the sidewall 122 along the spiral direction, so that the first sieve hole 120 is located in the direction of the centrifugal force generated by the rotation of the electroplating solution along the spiral direction, resulting in less resistance to the exchange of electroplating solution between the inside and outside of the electroplating solution, which is beneficial to the exchange of electroplating solution between the inside and outside of the vibrating plate 12. For another example, in... Figures 1 to 5 In the scenario, the first sieve holes 120 are evenly arranged in an array on the side wall 122, that is, forming columns along the second direction y and rows along the radial direction.

[0061] In the working principle and process of the aforementioned vibratory electroplating device 1, the product in the outer ring area (the area near the side wall 122, also known as the "vibratory plate outer ring area") moves to the transition zone 12b via the arc-shaped bridge surface 12d of the material distribution component 123, thereby entering the inner ring area (the area near the rotating shaft 11, also known as the "vibratory plate inner ring area"), combined with Figure 1 and Figure 5 As indicated by the thick arrow, the product in the inner ring area passes through the high-position zone 12c and reaches the entrance of channel 12e. This entrance is suspended, allowing the product to be fed vertically downwards without easily clogging. It then enters the low-position zone 12a and channel 12e, and then passes through channel 12e and its exit to reach the transition zone 12b, before re-entering the outer ring area. This process is repeated cyclically. Each time the product completes one cycle within the vibratory plate 12, the products in the outer and inner ring areas are exchanged. Through channel 12e, the products in the outer and inner ring areas are uniformly exchanged, resulting in a uniform plating layer and complete plating at the product ends, further improving the quality of the plating layer and the electroplated product. In this electroplating process, the purpose of the arc-shaped bridge surface 12d is to improve the exchangeability of the product and the electroplating medium. The arc-shaped bridge surface 12d transports the product in the outer ring area of ​​the vibrating plate 12 to the inner ring area of ​​the vibrating plate 12. At the same time, the lower channel of the arc-shaped bridge surface 12d transports the product in the inner ring area of ​​the vibrating plate 12 to the outer ring area of ​​the vibrating plate 12 through the lower channel of the arc-shaped bridge surface, thereby realizing the exchange of product positions inside and outside, making the overall electroplating film thickness and crystallization of the product more uniform.

[0062] In one example, when observing along the line of sight from top to bottom, on the same radius of the vibrating disk 12 (i.e., the radius where the entrance of the channel 12e is located), the width of the entrance of the channel 12e is smaller than the width of the outer ring area (i.e., the length between the side wall 122 and the entrance of the channel 12e). In other words, on the radius of the vibrating disk where the entrance of the channel 12e (the straight line formed by the orthographic projection) is located, the width of the entrance of the channel 12e is d1, and the length from the side wall 122 to the channel 12e (the straight line formed by the orthographic projection) is d2, and d1 < d2, which is equivalent to the outer ring diameter being larger than the inner ring diameter. Since the rotational speed of the outer ring is faster than that of the inner ring, the smaller inner ring diameter can reduce the occurrence of material blockage in the inner ring area, improve the exchangeability of the products and the electroplating medium in the vibrating disk 12, and thus ensure that the exchangeability of the products in the inner and outer ring areas is within the expected range. In this regard, in an actual scenario, the width d2 of the outer ring area can be 60 mm, and the width d1 of the entrance of the channel 12e can be 38 mm.

[0063] Please continue to refer to Figure 1 , the material distributing member 123 can be provided with inner baffle 124 and outer baffle 125 which are oppositely arranged (for example, parallel). The inner baffle 124 is located on the side of the arc-shaped bridge surface 12d close to the rotating shaft 11. The outer baffle 125 is located on the side of the arc-shaped bridge surface 12d close to the side wall 122. One end of the inner baffle 124 facing the transition area 12b is oppositely arranged (i.e., not in contact) with the rotating shaft 11 to form a notch.

[0064] Adaptively, the vibration electroplating device 1 can further include a first stopper 126, and the first stopper 126 blocks the notch. By providing the first stopper 126 to block the notch between the inner baffle 124 of the material distributing member 123 and the rotating shaft 11, it is possible to avoid dead corners between the inner baffle 124 of the material distributing member 123 and the rotating shaft 11, thereby preventing products from staying in this dead corner and affecting the electroplating quality. In addition, one end of the inner baffle 124 facing the transition area 12b is oppositely arranged with the rotating shaft 11 to form a notch. For the material distributing member 1 after injection molding, when installing the material distributing member, for example, it is not necessary to precisely limit the position of the material distributing member 123, which makes the installation of the material distributing member 123 convenient; in addition, if the inner baffle 124 is directly bent and connected (for example, welded) to the rotating shaft 11, not only is it easy to have problems with insecure welding, and it is prone to cracking under the influence of vibration after welding, but also the welding cannot be made flat, and it is difficult to achieve the accuracy required for use.

[0065] In one example, along the direction perpendicular to the bottom plate 121 (i.e., along the second direction y), the side of the first stopper 126 facing away from the rotating shaft 11 has the same curvature as the inner baffle 124, that is, the side and the surface of the inner baffle 124 form a smoothly transitioning arc surface, which is beneficial for the products to be transported along the spiral direction.

[0066] In another example, such as Figure 5 As shown, the end of the inner baffle 124 facing the transition zone 12b is connected to the rotating shaft 11, that is, no gap is formed between the inner baffle 124 and the rotating shaft 11. In this case, the vibration electroplating device 1 does not need to be equipped with the first stop 126, and a dead angle between the inner baffle 124 of the material distribution component 123 and the rotating shaft 11 can be avoided, thus preventing products from remaining in this dead angle and affecting the electroplating quality. To ensure a firm connection between the inner baffle 124 and the rotating shaft 11, a more robust welding process can be used, or... Figure 5 The structure shown is suitable for electroplating scenarios with minimal vibration.

[0067] Please continue reading. Figure 1 The outer baffle 125 and the side wall 122 form a natural arc transition, allowing for better product flow in the outer area and preventing material buildup. The vibratory electroplating device 1 may also include a second stop 127, positioned at the connection between the outer baffle 125 and the side wall 122, but not blocking the channel 12e. For example, the second stop 127 extends below the arc-shaped bridge surface 12d (shown by the dotted line) to define the left side of the channel 12e as a straight baffle wall. This second stop 127 prevents dead angles between the outer baffle 125 and the side wall 122 of the material distribution component 123, thus preventing product buildup in these dead angles and affecting electroplating quality.

[0068] In one example, the second stop 127 is flush with the top of the outer baffle 125. Alternatively, the top surface of the second stop 127 is an inclined surface, the height of which gradually decreases along the side wall 122 toward the rotation axis 11. That is, the inclined surface is an inwardly inclined surface, so that even if the product is thrown onto the inclined surface by centrifugal force during the electroplating process, it will slide onto the curved bridge surface 12d due to gravity.

[0069] A support block 128 (i.e.,) can be provided below the material distribution component 123. Figure 1 The support block (shown by the dashed line) is located below the material distribution member 123 near the inner ring area, for example, adjacent to the first stop 126. In one example, the support block 128 can be an extension of the first stop 126, which is equivalent to extending the blocking position of the first stop 126.

[0070] The support block 128, while supporting and ensuring the strength of the material distribution component 123, will not affect the uniform exchange of products between the outer and inner ring areas. Specifically, in combination with Figure 1As shown, the first stop block 126 and the support block 128 form a straight barrier facing the outer ring area. Products running within the channel 12e are forced to move towards the outer ring area due to the obstruction of the straight barrier. Here, the support block 128 has a guiding function, transferring all products towards the outer ring area without allowing any products to move around the rotation axis 11. In one example, the support block 128 can evenly divide the proportions of the inner and outer ring areas, resulting in a more balanced number of products performing inner and outer ring exchanges, which is beneficial for improving electroplating quality.

[0071] It should be understood that the specific position, shape, and other parameters of the support block 128 can be determined according to the requirements. For example, the side of the support block 128 adjacent to the channel 12e (which can be referred to as the "outer side of the support block") can be an arc with the same curvature as the outer baffle 125; or, for example, the end of the support block 128 facing the transition area 12b and the end of the arc-shaped bridge surface 12d connecting to the transition area 12b are flush with each other, so as to ensure that the material distribution component 123 is suspended at the end facing the transition area 12b to achieve vertical material feeding and avoid material blockage.

[0072] In the vibration electroplating apparatus 1 provided in the embodiments of this application, the dimensions of each structural component can be determined according to the adaptability required by the actual scenario, and this application does not limit them.

[0073] For example, the height (i.e., the length along the second direction y) of the rotating shaft 11 (including the flange ring 111 set at the top) is 450 mm; the diameter of the flange ring 111 is 125 mm and the thickness is 8 mm; the diameter of the rotating shaft 11 is 90 mm, and the diameter of the vibrating plate 12 can be between 290 mm and 300 mm; the area of ​​the spiral surface where the low-position cathode column 131 is located is the starting position of the spiral surface. When viewed along the second direction y, the area of ​​the spiral surface where the low-position cathode column 131 is located can also be the ending position of the spiral surface. Within the same group of cathode columns 13, the distance between the centers of any two adjacent cathode columns 13 is 30 mm.

[0074] For example, in a scenario where one end of the arc-shaped bridge surface 12d is suspended relative to the transition zone 12b (i.e., the outlet of the material distribution component 123 is suspended), the suspension height (relative to the lowest point of the base plate 121) should ensure smooth product flow in the channel below the arc-shaped bridge surface 12d (i.e., the cathode head adhesion and the adhesion rate are within the expected range) while avoiding excessive suspension height that could cause the product to fall and get damaged. This suspension height is H1.

[0075] Input (products + electroplating media) <![CDATA[Suspension height H1 (cm)]]> Product Operation Porcelain damage Cathode head adhesive Sorting adhesion rate 1000cc 1.5 Slow operation 400ppm 5 / 9 0.10％ 1000cc 2.0 Slightly slower 150ppm 2 / 9 0.10％ 1000cc 2.5 Smooth operation 110ppm 1 / 9 0.10％ 1000cc 2.8 Smooth operation 100ppm 1 / 9 0.10％ 1000cc 3.0 Smooth operation 100ppm 1 / 9 0.10％ 1000cc 3.5 Smooth operation 160ppm 1 / 9 0.10％ 1000cc 4.0 Smooth operation 320ppm 1 / 9 0.10％

[0076] Example 1

[0077] In Example 1, the suspended height at the entrance of Channel 12e is H2. To ensure that the product will not be damaged due to excessive falling height and to have a certain height conducive to product dispersion to prevent poor product sticking to the wafer, in this Example 1, the value of H2 is selected as 0.5 cm; and the values of the suspended height H1 are respectively 1.5 cm, 2.0 cm, 2.5 cm, 2.8 cm, 3 cm, 3.5 cm, 4.0 cm, and the input amounts of MLCC products and electroplating media are 1000 cc. According to the verification results shown in the above table, when the suspended height H1 is 2.0 cm or less (taking 1.5 cm as an example), the products in the channel under the arc-shaped bridge deck 12d are piled up and squeezed, resulting in slow product operation, increased porcelain damage, and more serious sticking of the cathode head; when the suspended height H1 is 3.5 cm or more (taking 4.0 cm as an example), the product operation is smooth, but the porcelain damage increases, and as the suspended height increases, the porcelain damage becomes serious; when the suspended height H1 satisfies 2 cm < H1 ≤ 3.5 cm, the product operation is smooth, and the porcelain damage and cathode head sticking are less than those at other values of the suspended height H1. Considering comprehensively, it is more reasonable that the suspended height H1 satisfies 2 cm < H1 ≤ 3.5 cm, and the preferred suspended height H1 is 2.8 cm.

[0078] <![CDATA[Drop height H2 (cm)]]> Product Operation Porcelain damage Cathode head adhesive Sorting adhesion rate 0.0 Smooth operation 95ppm 1 / 9 0.20％ 0.2 Smooth operation 95ppm 1 / 9 0.12％ 0.5 Smooth operation 95ppm 1 / 9 0.10％ 1.0 Smooth operation 100ppm 1 / 9 0.10％ 1.2 Smooth operation 180ppm 1 / 9 0.10％

[0079] Example 2

[0080] In Example 2, the input amounts of MLCC products and electroplating media are 1000 cc, the suspended height H1 is taken as 2.8 cm and verified under the conditions of this example, and the values of the suspended height H2 are respectively 0.0 cm, 0.2 cm, 0.5 cm, 1.0 cm, 1.2 cm. According to the verification results shown in the above table, when the suspended height H2 is 0.0 cm and 0.2 cm, the product operation is smooth, but the sticking rate has an increasing trend and the product dispersion effect is poor; when the suspended height H2 is 0.5 cm and 1.0 cm, the product operation is smooth, and at the same time, the porcelain damage, cathode head sticking and sticking rate are better; when the suspended height H2 is 1.2 cm, the product operation is smooth, but the porcelain damage has an increasing trend. Considering comprehensively, the suspended height H2 satisfies 0 < H2 ≤ 1 cm, and the preferred value is equal to 0.5 cm, so as to ensure that the product will not be damaged due to excessive falling height and to have a certain height conducive to product dispersion to prevent poor product sticking to the wafer. In addition, the width of the material separating part 123 (including the width of the outlet) is 55.5 mm; the heights of the inner baffle 124 and the outer baffle 125 are both 30 mm.

[0081] This application also provides a vibration electroplating system, including a vibration source, an anode, and a vibration electroplating device 1 as described in any of the preceding embodiments, thus possessing the beneficial effects that the corresponding embodiments can produce. The vibration source is connected to the rotating shaft 11. During the electroplating process, the anode can extend into the electroplating solution in the receiving cavity of the vibrating plate 12, and form a closed-loop circuit with the cathode column 13 through the electroplating solution.

[0082] It should be understood that the vibration electroplating system provided in this application embodiment is a complete vibration electroplating system, and also has the structure of known vibration electroplating systems. Here, only the components of the vibration electroplating system involving the rotating shaft 11, the vibrating plate 12 and the multiple sets of cathode columns 13 are described, and other components are not described in detail.

[0083] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. For those skilled in the art, any equivalent structural transformations made using the content of this specification and drawings are similarly included within the patent protection scope of this application.

[0084] Although this document uses terms such as "first," "second," etc., to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. Furthermore, the singular forms "a," "an," and "the" are intended to also include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or meaning either one or any combination thereof. Exceptions to this definition only arise when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

Claims

1. A vibration electroplating apparatus, characterized in that, include: A rotating shaft, one end of which is used to connect a vibration source; Vibrating plate, including base plate, side walls and material distribution component with curved bridge surface; The sidewalls surround the base plate to form a receiving cavity, and the other end of the rotating shaft extends into the receiving cavity and is connected to the base plate; the base plate and / or the sidewalls are provided with sieve holes; the base plate includes a low-position area, a transition area and a high-position area arranged sequentially along the spiral direction of the vibration source; the material distribution component is disposed in the receiving cavity and located above the low-position area, and the two ends of the arc-shaped bridge surface are respectively connected to the high-position area and the transition area to form a channel passing through the bottom of the material distribution component and connecting the high-position area and the transition area; Multiple sets of cathode columns extend into the receiving cavity and are exposed to the base plate.

2. The vibration electroplating apparatus according to claim 1, characterized in that, At least one of the following must be met: The diameter of the sieve holes provided on the side wall is larger than the diameter of the sieve holes provided on the bottom plate; The sieve holes provided on the side wall are arranged in a spiral shape along the spiral direction on the side wall; The sieve holes provided on the side wall are arranged in an array and uniformly distributed on the side wall.

3. The vibration electroplating apparatus according to claim 1, characterized in that, The material distribution component is provided with an inner baffle, which is located on the side of the arc-shaped bridge surface near the rotating shaft, and the end facing the transition area is arranged opposite to the rotating shaft to form a notch; The vibration electroplating device further includes a first stop block, which blocks the notch.

4. The vibration electroplating apparatus according to claim 3, characterized in that, Along a direction perpendicular to the base plate, the side of the first stop block facing away from the rotation axis has the same curvature as the inner baffle.

5. The vibration electroplating apparatus according to claim 1, characterized in that, At the radius of the oscillating disk where the entrance of the channel is located, the width of the entrance of the channel is d1, and the length from the sidewall to the channel is d2, and d1 <d2。 6. The vibration electroplating apparatus according to any one of claims 3 to 5, characterized in that, The material distribution component is equipped with an outer baffle, located on the side of the arc-shaped bridge surface near the side wall; The vibration electroplating device also includes a second stop, which is located at the connection between the outer baffle and the side wall but does not block the channel.

7. The vibration electroplating apparatus according to claim 6, characterized in that, The second stop is flush with the top of the outer baffle, or the top surface of the second stop is an inclined surface, and the height of the inclined surface gradually decreases along the side wall toward the rotation axis.

8. The vibration electroplating apparatus according to claim 1, characterized in that, One end of the curved bridge deck that connects to the transition zone is suspended relative to the transition zone; and / or, one end of the high-level zone that connects to the channel is suspended relative to the low-level zone.

9. The vibration electroplating apparatus according to claim 8, characterized in that, The end of the curved bridge deck that connects to the transition zone has a suspension height of H1 relative to the transition zone, and is 2cm. <H1≤3.5cm; And / or, the suspension height of one end of the high-position region connected to the channel relative to the low-position region is H2, and 0 <H2≤1cm。 10. A vibration electroplating system, characterized in that, The device includes a vibration source, an anode, and a vibration electroplating apparatus as described in any one of claims 1 to 9, wherein the vibration source is connected to the rotating shaft, and the anode extends to the electroplating solution in the receiving cavity and forms a closed-loop circuit with the cathode column through the electroplating solution.

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