Liquid cooling assembly and test board card mechanism

Abstract

The utility model relates to a liquid cooling assembly and a test board card mechanism. The liquid cooling assembly comprises a liquid cooling plate and a heat dissipation plate. The cooling medium can flow along the liquid inlet flow channel and the liquid outlet flow channel, exchanges heat with the high heating part of the test circuit board through the first cooling area, and exchanges heat with the low heating part of the test circuit board through the second cooling area. A cooling medium flows to the first cooling area along the liquid inlet flow channel, then can be jetted to the jet flow cavity through the jet flow hole, and finally flows back to the liquid outlet flow channel through the backflow hole to achieve circulation. The cooling medium sprayed out of the jet holes forms turbulent flow, and the flow direction of the cooling medium tends to be consistent with the heat exchange direction of the first cooling area, so that the heat exchange resistance of the cooling medium can be greatly reduced, the heat exchange efficiency of the first cooling area is higher than that of the second cooling area, and the heat dissipation requirement of the high heating part of the test circuit board is well met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor testing, especially relates to a liquid cooling assembly and test board card mechanism. BACKGROUND

[0002] The board card mechanism of the test machine needs to be cooled and radiated during the testing process to avoid high temperature. The liquid cooling plate is usually arranged in the board card mechanism, and the cooling flow channel is arranged in the liquid cooling plate. The cooling medium flowing through the cooling flow channel can take away the heat. With the development of the semiconductor industry, the power consumption and heat generation of the board card mechanism during the working process also increase sharply, so higher requirements are put forward for the heat dissipation performance. Generally, the heat dissipation performance of the board card mechanism can be improved by machining fins and turbulence structures in the cooling flow channel. However, due to the limitation of the space and structure in the flow channel, the effect of reducing the thermal resistance of the fins and turbulence structures is limited, and the heat exchange efficiency is difficult to further improve. For some working conditions with huge heat generation, the heat dissipation demand cannot be met. SUMMARY

[0003] Therefore, it is necessary to provide a liquid cooling assembly and test board card mechanism capable of significantly improving the heat dissipation performance in view of the above problems.

[0004] A liquid cooling assembly comprises a plate body structure, an inlet flow channel and an outlet flow channel are formed in the inside of the plate body structure, the plate body structure has a first cooling area and a second cooling area, a jet flow cavity is formed in the inside of the first cooling area and stacked with the inlet flow channel and the outlet flow channel, the jet flow cavity is distributed on at least one side of the inlet flow channel and the outlet flow channel along the thickness direction of the plate body structure, the jet flow cavity is communicated with the inlet flow channel through a jet flow hole and communicated with the outlet flow channel through a backflow hole.

[0005] In one of the embodiments, the inlet flow channel comprises a plurality of branch flow channels in the first cooling area, and the plurality of branch flow channels are parallelly connected with each other and communicated with the jet flow hole.

[0006] In one of the embodiments, the inner wall of the jet flow cavity is formed with a plurality of jet flow grooves arranged side by side, and the plate body structure is provided with the jet flow hole corresponding to the position of each jet flow groove.

[0007] In one of the embodiments, a turbulence fin is arranged in each jet flow groove.

[0008] In one of the embodiments, the inner wall of the jet flow cavity is further formed with a backflow groove in the shape of a long strip, the backflow groove extends along the parallel direction of the plurality of jet flow grooves and communicated with one end of the plurality of jet flow grooves, the backflow groove faces the backflow hole, and the backflow hole is in the shape of a long strip and extends along the length direction of the backflow groove.

[0009] In one of the embodiments, the liquid outlet channel comprises a backflow section located in the first cooling area, the backflow section is in a strip shape and extends along the length direction of the backflow hole.

[0010] In one of the embodiments, the plate body structure comprises a cooling plate and a heat dissipation plate, the heat dissipation plate is arranged on at least one side of the liquid cooling plate; the liquid cooling plate comprises a first heat exchange part and a second heat exchange part corresponding to the first cooling area and the second cooling area respectively, the liquid cooling plate is internally formed with the liquid inlet channel and the liquid outlet channel, at least one side of the first heat exchange part is provided with the jet hole communicating with the liquid inlet channel and the backflow hole communicating with the liquid outlet channel; the heat dissipation plate is provided with a first heat dissipation part and a second heat dissipation part corresponding to the first heat exchange part and the second heat exchange part respectively, and the first heat dissipation part and the first heat exchange part form the jet cavity.

[0011] In one of the embodiments, a plurality of heat dissipation blocks are arranged on the side of the first heat dissipation part away from the liquid cooling plate.

[0012] In one of the embodiments, the jet hole and the backflow hole are arranged on both sides of the first heat exchange part, and the heat dissipation plate is arranged on both sides of the liquid cooling plate.

[0013] A test board card mechanism comprises:

[0014] The liquid cooling assembly as described in any one of the above preferred embodiments; and

[0015] A test circuit board is arranged on at least one side of the plate body structure, and the high heat generating part and the low heat generating part of the test circuit board are respectively thermally coupled with the first cooling area and the second cooling area.

[0016] The liquid cooling assembly and the test board card mechanism, the cooling medium can flow along the liquid inlet channel and the liquid outlet channel, exchange heat with the high heat generating part of the test circuit board through the first cooling area, and exchange heat with the low heat generating part of the test circuit board through the second cooling area. The cooling medium can be sprayed from the jet hole to the jet cavity after flowing along the liquid inlet channel to the first cooling area, and finally backflow to the liquid outlet channel through the backflow hole to realize circulation. The cooling medium sprayed from the jet hole forms a turbulent flow, and its flow direction is consistent with the heat exchange direction of the first cooling area, which can greatly reduce the heat exchange resistance of the cooling medium, so the heat exchange efficiency of the first cooling area is higher than that of the second cooling area, thereby better meeting the heat dissipation demand of the high heat generating part of the test circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0018] Figure 1 The structural schematic diagram of the test board card mechanism in an embodiment of the present application is shown in the figure.

[0019] Figure 2 The exploded view of the test board card mechanism is shown in the figure. Figure 1

[0020] Figure 3 The exploded view of the liquid cooling assembly in the test board card mechanism is shown in the figure. Figure 2

[0021] The structural schematic diagram of the liquid cooling plate in the liquid cooling assembly is shown in the figure. Figure 4 Figure 3 The structural schematic diagram of one side of the heat dissipation plate in the liquid cooling assembly is shown in the figure.

[0022] Figure 5 Figure 3 The structural schematic diagram of the other side of the heat dissipation plate is shown in the figure.

[0023] Figure 6 The structural schematic diagram of the other side of the heat dissipation plate is shown in the figure. Figure 5 DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0025] ​​​​In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0026] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0027] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements, unless otherwise specifically limited. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0028] In the utility model, unless otherwise specifically defined and limited, the first feature "on" or "under" the second feature can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0029] It is to be understood that when an element such as a layer, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. It will be understood that, when a term is used in this specification and / or claims - such as "including", "containing", "comprising", "having" and / or the like - there are no limitations thereof and such terms are intended to permit the presence of other elements.

[0030] Referring to Figure 1 and Figure 2 The utility model provides a kind of test board card mechanism 10 and liquid cooling assembly 100.Therein, above-mentioned test board card mechanism 10 includes liquid cooling assembly 100 and test circuit board 200.

[0031] Test board card mechanism 10 can be inserted into the slot of test machine, for the chip to be measured loaded into test machine is relevant functional test.Test circuit board 200 can generate test signal for functional test, and it will heat during working.Test circuit board 200 has high heat-generating part and low heat-generating part, and its high heat-generating part is generally the part of several test chips, and low heat-generating part is the part of conventional circuit.It needs to be explained that above-mentioned high heat-generating part and low heat-generating part are relative concept, and do not specify certain specific heat range.Liquid cooling assembly 100 can cool test circuit board 200 to avoid that test circuit board 200 temperature rise is too high and influences normal function.

[0032] In addition, test board card mechanism 10 generally also includes power board 300 and shell 400.Power board 300 is used to realize the input of electric signal or the output of test signal, and shell 400 is used to accommodate liquid cooling assembly 100, test circuit board 200 and power board 300 to protect each element.Liquid cooling assembly 100 can also cool power board 300 since power board 300 also heats during working.Shell 400 generally includes frame 410 and cover plate 420 on both sides of frame 410, and frame 410 is used to support liquid cooling assembly 100, test circuit board 200 and power board 300, and cover plate 420 covers both sides.

[0033] Specifically in the embodiment, liquid cooling assembly 100 is provided with test circuit board 200 on both sides, so that liquid cooling assembly 100 can cool two test circuit boards 200 simultaneously.

[0034] Referring to Figure 3 and Figure 4In one embodiment of the utility model, the liquid cooling assembly 100 includes a plate structure, and the plate structure has a first cooling area and a second cooling area. Moreover, the heat exchange efficiency of the first cooling area is higher than that of the second cooling area. Therefore, the high-heat-emitting part and the low-heat-emitting part of the test circuit board 200 are respectively coupled with the first cooling area and the second cooling area.

[0035] More specifically, the plate structure has an inlet flow channel 111 and an outlet flow channel 112 formed inside for the cooling medium to flow. Moreover, a jet cavity (not shown in the figure) is formed inside the first cooling area and stacked with the inlet flow channel 111 and the outlet flow channel 112. The jet cavity is distributed on at least one side of the plate structure along the thickness direction of the plate structure, and the jet cavity is communicated with the inlet flow channel 111 through a jet hole 101 and communicated with the outlet flow channel 112 through a backflow hole 102.

[0036] The cooling medium can be sprayed into the jet cavity through the jet hole 101 after flowing along the inlet flow channel 111 to the first cooling area, and finally backflows to the outlet flow channel 112 through the backflow hole 102 to realize circulation. The cooling medium sprayed by the jet hole 101 forms a turbulent flow, and its flow direction is consistent with the heat exchange direction of the first cooling area, which can greatly reduce the heat exchange resistance of the cooling medium, so the heat exchange efficiency of the first cooling area is higher than that of the second cooling area. In order to make the liquid cooling assembly 100 have better cooling effect on the test circuit board 200 on both sides, the inlet flow channel 111 and the outlet flow channel 112 are distributed with jet cavities on both sides along the thickness direction of the plate structure.

[0037] The above-mentioned plate structure can be an integrally formed structure, and the flow channel and the hole structure are processed inside. In addition, the above-mentioned plate structure can also be assembled by several parts. Specifically, in the embodiment, the above-mentioned plate structure includes a liquid cooling plate 110 and a heat dissipation plate 120.

[0038] The liquid cooling plate 110 has an inlet flow channel 111 and an outlet flow channel 112 formed inside for the cooling medium to flow. The liquid cooling plate 110 is generally formed by a good conductor such as metal, and the channel for the cooling medium to flow can be processed by milling, drilling, stamping and the like. Specifically, the liquid cooling plate 110 includes a plate body 110a and a sealing surface plate 110b, and the plate body 110a has an inlet flow channel 111 and an outlet flow channel 112 formed on one side, and the sealing surface plate 110b is connected to one side of the plate body 110a and covers the inlet flow channel 111 and the outlet flow channel 112. In addition, the inlet end and the outlet end of the liquid cooling plate 110 are generally provided with a joint (not marked in the figure), and the joint can be connected with the circulation system of the test machine to make the cooling medium circulate.

[0039] The liquid cooling plate 110 comprises a first heat exchange part and a second heat exchange part, which are two regions with different positions on the liquid cooling plate 110, corresponding to the first cooling area and the second cooling area respectively, and the inlet flow channel 111 and the outlet flow channel 112 pass through the first heat exchange part and the second heat exchange part. Moreover, the inlet flow channel 111 and the outlet flow channel 112 are not directly connected, so that the cooling medium flowing along the inlet flow channel 111 cannot directly enter the outlet flow channel 112 and flow out.

[0040] The first heat exchange part is provided with at least one jet hole 101 and a backflow hole 102 on one side. The jet hole 101 is connected with the inlet flow channel 111, and the backflow hole 102 is connected with the outlet flow channel 112. The jet hole 101 has a small diameter, which can be a circular hole, a square hole, etc. In order to cool two test circuit boards 200 at the same time, in this embodiment, jet holes 101 and backflow holes 102 are provided on both sides of the first heat exchange part. More specifically, the jet hole 101 and the backflow hole 102 on one side are provided on the sealing panel 110b, and the jet hole 101 and the backflow hole 102 on the other side are provided on the bottom of the plate body 110a.

[0041] The heat dissipation plate 120 is generally made of a good thermal conductor such as metal, which can be connected with the liquid cooling plate 110 by brazing or the like. Moreover, the heat dissipation plate 120 is arranged on at least one side of the liquid cooling plate 110 provided with the jet hole 101 and the backflow hole 102. In this embodiment, two heat dissipation plates 120 are provided, which are arranged on opposite sides of the liquid cooling plate 110.

[0042] Further, the heat dissipation plate 120 is provided with a first heat dissipation part and a second heat dissipation part corresponding to the first heat exchange part and the second heat exchange part respectively. The first heat dissipation part and the first heat exchange part form a jet cavity (not shown in the figure), which is connected with the backflow hole 102 and the jet hole 101, and the second heat dissipation part is in close contact with the second heat exchange part.

[0043] In the test board card mechanism 10, the test circuit board 200 is arranged on the side of the heat dissipation plate 120 away from the liquid cooling plate 110, and the high heat generating part and the low heat generating part of the test circuit board 200 are respectively in thermal coupling with the first heat dissipation part and the second heat dissipation part. Therefore, the cooling medium can exchange heat with the high heat generating part of the test circuit board 200 through the cooperation of the first heat exchange part and the first heat dissipation part, and exchange heat with the low heat generating part of the test circuit board 200 through the cooperation of the second heat exchange part and the second heat dissipation part. Further, the power board 300 can guide heat to the liquid cooling plate 110 through a heat dissipation block structure (not labeled in the figure), which is generally fixed on the liquid cooling plate 110 by screws and thermal grease, and generally has a heat pipe embedded in the inside to enhance the heat dissipation capacity.

[0044] The cooling medium entering the liquid cooling plate 110 flows along the inlet flow channel 111 to the first heat exchange part, and can be sprayed into the jet cavity by the jet hole 101. The cooling medium in the jet cavity flows back to the outlet flow channel 112 through the backflow hole 102, and finally flows out of the liquid cooling plate 110 along the outlet flow channel 112. Because the jet hole 101 has a small diameter, the flow rate of the cooling medium will increase when passing through the jet hole 101, thereby forming a turbulent flow, which helps to improve the heat exchange efficiency between the cooling medium and the first heat dissipation part. Moreover, the flow direction of the cooling medium sprayed by the jet hole 101 is approximately the same as the thickness direction of the liquid cooling plate 110, so the heat exchange direction between the first heat exchange part and the first heat dissipation part also tends to be consistent, which can greatly reduce the heat exchange resistance between the cooling medium and the first heat dissipation part. Therefore, the heat exchange efficiency of the first heat dissipation part is higher than that of the second heat dissipation part, thereby better meeting the heat dissipation requirements of the high heat generating part of the test circuit board 200.

[0045] When the cooling medium flows through the second heat exchange part, the second heat dissipation part indirectly exchanges heat with the second heat exchange part, so the heat exchange efficiency of the second heat dissipation part is lower than that of the first heat dissipation part. Moreover, the inlet flow channel 111 and the outlet flow channel 112 in the second heat exchange part can be arranged conventionally, which has a simple structure and low processing cost, so as to reduce the cost while meeting the heat dissipation requirements of the low heat generating part of the test circuit board 200.

[0046] In the present embodiment, the inlet flow channel 111 includes a plurality of branch flow channels 1111 located in the first heat exchange part, i.e., the first cooling zone. The plurality of branch flow channels 1111 are connected in parallel with each other and communicate with the jet hole 101.

[0047] By arranging a plurality of parallel branch flow channels 1111, the flow of the cooling medium entering the first heat exchange part can be increased, so the amount of cooling medium sprayed into the jet cavity for heat exchange with the first heat dissipation part is increased, thereby helping to further improve the heat dissipation efficiency of the first heat dissipation part. Moreover, the cooling medium flowing along the inlet flow channel 111 can be uniformly distributed into the plurality of branch flow channels 1111 and sprayed out through the respective jet holes 101, so the uniformity of the cooling medium sprayed into the jet cavity is better, thereby also helping to improve the heat dissipation uniformity of the first heat dissipation part.

[0048] Please refer to Figure 6 In the present embodiment, the inner wall of the jet cavity, i.e., the side of the first heat dissipation part facing the jet cavity, is formed with a plurality of jet grooves 121 arranged side by side, and the first heat exchange part is provided with a jet hole 101 corresponding to the position of each jet groove 121. It can be seen that the cooling medium sprayed by the jet hole 101 will directly impact the jet groove 121.

[0049] Under the guidance of the jet grooves 121, the cooling medium can be rapidly diffused, so as to realize the directional movement of the cooling medium in the jet cavity, greatly reduce the flow resistance of the cooling medium, and accelerate the flow speed of the cooling medium. Therefore, the setting of the jet grooves 121 can further improve the heat exchange efficiency between the cooling medium and the first heat dissipation part, thereby improving the heat dissipation efficiency of the first heat dissipation part.

[0050] Specifically, a plurality of rows of jet holes 101 are arranged on each side of the first heat exchange part, each jet groove 121 corresponds to at least one row of jet holes 101, and the plurality of jet holes 101 in each row are arranged in the extension direction of the jet groove 121. In this way, the uniformity of the cooling medium sprayed into each jet groove 121 can be improved.

[0051] Specifically, in the embodiment, a turbulence fin 1211 is arranged in each jet groove 121. The turbulence fin 1211 can increase the turbulence degree of the cooling medium flowing through the jet groove 121, thereby further improving the heat exchange efficiency between the cooling medium and the first heat dissipation part.

[0052] Further, in the embodiment, the inner wall of the jet cavity is further formed with a long strip-shaped backflow groove 122, the backflow groove 122 extends along the parallel direction of the plurality of jet grooves 121 and communicates with one end of the plurality of jet grooves 121. Moreover, the backflow groove 122 is towards the backflow hole 102, and the backflow hole 102 is long strip-shaped and extends along the length direction of the backflow groove 122.

[0053] The cooling medium flowing along the plurality of jet grooves 121 first collects in the backflow groove 122, and then flows back to the liquid outlet channel 112 through the backflow hole 102. Moreover, the long strip-shaped backflow hole 102 and the long strip-shaped backflow groove 122 have a large flow area, which can make the cooling medium quickly flow back to the liquid outlet channel 112, thereby further reducing the flow resistance of the cooling medium.

[0054] In addition, in the embodiment, the liquid outlet channel 112 includes a backflow section 1121 located in the first cooling area, specifically in the first heat exchange part, and the backflow section 1121 is long strip-shaped and extends along the length direction of the backflow hole 102. In this way, the backflow hole 102 and the backflow section 1121 also have a large flow area, which can also reduce the flow resistance of the cooling medium, and the cooling medium can quickly flow back to the liquid outlet channel 112 through the backflow hole 102 and be discharged.

[0055] Please refer to Figure 5In the embodiment, the first heat dissipation part is provided with a plurality of heat dissipation blocks 123 on the side facing away from the liquid cooling plate 110. The heat dissipation blocks 123 are generally formed of metal and have good heat conduction performance. The external profile of the heat dissipation blocks 123 can be rectangular, circular, or the like, and is matched with the shape of the test chip. When the test circuit board 200 is installed, the plurality of test chips are respectively attached to the plurality of heat dissipation blocks 123. In this way, the heat dissipation blocks 123 can quickly conduct the heat generated by the test chips to the first heat dissipation part to exchange heat with the cooling medium, thereby helping to quickly cool the test chips.

[0056] Further, in the embodiment, the top surface of the heat dissipation block 123 is provided with a separation ring 124, and a graphene heat conduction pad (not shown in the figure) is accommodated in the separation ring 124.

[0057] After the test circuit board 200 is installed, the graphene heat conduction pad is clamped between each test chip and the corresponding heat dissipation block 123. The graphene heat conduction pad can improve the heat exchange efficiency between the heat dissipation block 123 and the test chip. The separation ring 124 can be formed of foam or the like and is arranged along the circumference of the test chip. The separation ring 124 can protect the graphene heat conduction pad, thereby preventing it from falling onto the surface of the test circuit board 200 and causing a short circuit after breaking.

[0058] The liquid cooling assembly 100 and the test board card mechanism 10 described above, the cooling medium can flow along the liquid inlet flow channel 111 and the liquid outlet flow channel 112, exchange heat with the high heat generating part of the test circuit board 200 through the first cooling area, and exchange heat with the low heat generating part of the test circuit board 200 through the second cooling area. The cooling medium can be sprayed from the jet flow hole 101 to the jet flow cavity after flowing along the liquid inlet flow channel 111 to the first cooling area, and finally flows back to the liquid outlet flow channel 112 through the backflow hole 102 to realize circulation. The cooling medium sprayed from the jet flow hole 101 forms a turbulent flow, and its flow direction is consistent with the heat exchange direction of the first cooling area, which can greatly reduce the heat exchange resistance of the cooling medium. Therefore, the heat exchange efficiency of the first cooling area is higher than that of the second cooling area, thereby better meeting the heat dissipation requirements of the high heat generating part of the test circuit board 200.

[0059] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present disclosure.

[0060] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several modifications and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. A liquid-cooled assembly comprising a plate body structure, characterized by, The plate body structure has a first cooling area and a second cooling area, and a jet flow cavity is formed in the first cooling area and stacked with the liquid inlet flow channel and the liquid outlet flow channel.

2. The liquid-cooling assembly of claim 1, wherein, The liquid inlet flow channel includes a plurality of branch flow channels in the first cooling area, and the plurality of branch flow channels are parallel to each other and communicate with the jet flow holes.

3. The liquid-cooling assembly of claim 1, wherein, The inner wall of the jet flow cavity is formed with a plurality of jet flow grooves arranged side by side, and the plate body structure is provided with the jet flow holes corresponding to the positions of each jet flow groove.

4. The liquid cooling assembly of claim 3, wherein, Each jet flow groove is provided with a turbulence fin.

5. The liquid cooling assembly of claim 3, wherein, The inner wall of the jet flow cavity is also formed with an elongated backflow groove, which extends along the parallel direction of the plurality of jet flow grooves and communicates with one end of the plurality of jet flow grooves, and the backflow groove faces the backflow hole, which is elongated and extends along the length direction of the backflow groove.

6. The liquid cooling assembly of claim 5, wherein, The liquid outlet flow channel includes a backflow section in the first cooling area, which is elongated and extends along the length direction of the backflow hole.

7. The liquid cooling assembly of any one of claims 1 to 6, wherein, The plate body structure includes a liquid cooling plate and a heat dissipation plate, and the heat dissipation plate is arranged on at least one side of the liquid cooling plate; the liquid cooling plate includes a first heat exchange part and a second heat exchange part corresponding to the first cooling area and the second cooling area respectively, and the liquid cooling plate is internally formed with the liquid inlet flow channel and the liquid outlet flow channel; at least one side of the first heat exchange part is provided with the jet flow hole communicating with the liquid inlet flow channel and the backflow hole communicating with the liquid outlet flow channel; the heat dissipation plate is provided with a first heat dissipation part and a second heat dissipation part corresponding to the first heat exchange part and the second heat exchange part respectively, and the jet flow cavity is formed between the first heat dissipation part and the first heat exchange part.

8. The liquid cooling assembly of claim 7, wherein, The first heat dissipation part is provided with a plurality of heat dissipation blocks on the side away from the liquid cooling plate.

9. The liquid cooling assembly of claim 7, wherein, Both sides of the first heat exchange part are provided with the jet flow hole and the backflow hole, and both sides of the liquid cooling plate are provided with the heat dissipation plate.

10. A test board card mechanism characterized by, Comprise: The liquid cooling assembly according to any one of claims 1 to 9; And A test circuit board is arranged on at least one side of the plate body structure, and the high heat generating part and the low heat generating part of the test circuit board are respectively thermally coupled with the first cooling area and the second cooling area.

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