Device for rapidly detecting temperature of sensor

Abstract

The utility model relates to a device for rapidly detecting the temperature of a sensor, and belongs to the technical field of sensor testing. The device comprises a test probe, the test probe comprises an environment temperature probe and a tested sensor probe, and the tested sensor probe is connected with a tested sensor; the sensor processing unit is connected with the environment temperature probe and the detected sensor probe and used for comparing the temperature collected by the detected sensor probe with the temperature collected by the environment temperature probe; the display unit is connected with the sensor processing unit and is used for displaying the comparison result; and the power supply unit is connected with the sensor processing unit and the display unit and is used for supplying power. According to the device, the temperature of the tested sensor can be rapidly tested and compared with the internal reference temperature, and the quality of the sensor can be judged more visually. The operation is convenient and fast, and errors are not easy to occur.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor test technical field, concretely relates to a device of fast detection sensor temperature. BACKGROUND

[0002] The intelligence of weapon equipment is the development trend of future combat weapon. The airborne display module is the "eyes" of weapon equipment. The sensor inside the display module is the main component for the module to perceive the external environment. With the rapid development of modern military technology, the performance requirements of weapon equipment are getting higher and higher, especially the stability and reliability in extreme environment become the key. Therefore, temperature monitoring and control technology, as one of the key technologies to ensure the normal work of weapon equipment, has attracted widespread attention and research. The original detection method of NST1001 sensor is to use an oscilloscope to test the sensor output waveform and calculate the temperature manually. Or use a simple tool to test, which needs manual power supply through serial port output 16 hexadecimal value and then calculate the temperature. The professional quality of the test operator is required to be high and it is not easy to measure. UTILITY MODEL CONTENT

[0003] The utility model aims at providing a device of fast detection sensor temperature, which can realize fast test of the temperature of the measured sensor and comparison with the internal reference temperature, and more intuitively judge the quality of the sensor. It is simple to use, convenient and fast to operate, and not easy to make mistakes.

[0004] In order to realize the above purpose, the utility model provides a device of fast detection sensor temperature, which comprises:

[0005] A test probe, which comprises an environmental temperature probe and a measured sensor probe, and the measured sensor probe is connected with the measured sensor;

[0006] A sensor processing unit, which is connected with the environmental temperature probe and the measured sensor probe, and is used for comparing the temperature collected by the measured sensor probe with the temperature collected by the environmental temperature probe;

[0007] A display unit, which is connected with the sensor processing unit, and is used for displaying the comparison result;

[0008] A power supply unit, which is connected with the sensor processing unit and the display unit, and is used for power supply.

[0009] Optionally, the sensor processing unit comprises:

[0010] A first chip, the VSS-1 pin, VSS-2 pin VSS-3 pin and VSSA pin of the first chip are grounded, and the VDD-2 pin and VDD-3 pin of the first chip are connected with a 3V3 power supply;

[0011] a second capacitor, one end of which is connected to the VBAT pin of the first chip, and the other end of which is grounded;

[0012] a fourth resistor, one end of which is connected to the BOOT0 pin of the first chip, and the other end of which is grounded;

[0013] a seventh resistor, one end of which is connected to the PB2 pin of the first chip, and the other end of which is grounded;

[0014] a first light-emitting diode, the positive electrode of which is connected to the 3V3 power supply;

[0015] a sixth resistor, one end of which is connected to the negative electrode of the first light-emitting diode, and the other end of which is grounded.

[0016] Optionally, the sensor processing unit further comprises:

[0017] a first USB interface, the GND pin of which is grounded;

[0018] a first resistor, one end of which is connected to the CC2 pin of the first USB interface, and the other end of which is grounded;

[0019] a second resistor, one end of which is connected to the CC1 pin of the first USB interface, and the other end of which is grounded;

[0020] a first voltage stabilizing diode, the negative electrode of which is connected to the 5V power supply, and the positive electrode of which is connected to the VBUS pin of the first USB interface;

[0021] a fifth chip, the GND pin of which is grounded, the RST# pin of which is connected to the NRST pin of the first chip, the RXD pin of which is connected to the PA9 pin of the first chip, the TXD pin of which is connected to the PA10 pin of the first chip, the TNOW / DTR# pin of which is connected to the BOOT0 pin of the first chip, and the V3 pin and the VCC pin of which are connected to the 3V3 power supply;

[0022] a first capacitor, one end of which is connected to the VCC pin of the fifth chip, and the other end of which is grounded;

[0023] a fourteenth capacitor, one end of which is connected to the V3 pin of the fifth chip, and the other end of which is grounded.

[0024] Optionally, the sensor processing unit further comprises:

[0025] a fourth chip, the GND pin of which is grounded, the VIN pin and the CE pin of which are connected to the 5V power supply, and the VOUT pin of which is connected to the 3V3 power supply;

[0026] a twelfth capacitor, one end of which is connected to the VOUT pin of the fourth chip, and the other end of which is grounded;

[0027] a thirteenth capacitor, one end of which is connected to the VIN pin of the fourth chip, and the other end of which is grounded.

[0028] Optionally, the sensor processing unit further comprises:

[0029] a second light-emitting diode, the positive electrode of which is connected to the 3V3 power supply;

[0030] a fifth resistor, one end of which is connected to the negative electrode of the second light-emitting diode, and the other end of which is connected to the PC13 pin of the first chip.

[0031] Optionally, the sensor processing unit further comprises:

[0032] a press switch, the second pin of which is grounded;

[0033] a third resistor, one end of which is connected to the 3V3 power supply, and the other end of which is connected to the third pin of the press switch;

[0034] a seventh capacitor, one end of which is connected to the fourth pin of the press switch, and the other end of which is grounded.

[0035] Optionally, the sensor processing unit further comprises:

[0036] a fifth crystal oscillator, the first pin of which is connected to the PD0-OSC_IN pin of the first chip, and the third pin of which is connected to the PD1-OSC_OUT pin of the first chip;

[0037] an eighth capacitor, one end of which is connected to the PD0-OSC_IN pin of the first chip, and the other end of which is grounded;

[0038] a ninth capacitor, one end of which is connected to the PD1-OSC_OUT pin of the first chip, and the other end of which is grounded.

[0039] Optionally, the sensor processing unit further comprises:

[0040] a third capacitor, one end of which is connected to the 3V3 power supply, and the other end of which is grounded;

[0041] a fourth capacitor, one end of which is connected to the 3V3 power supply, and the other end of which is grounded;

[0042] a fifth capacitor, one end of which is connected to the 3V3 power supply, and the other end of which is grounded;

[0043] a first inductor, one end of which is connected to the 3V3 power supply;

[0044] a sixth capacitor, one end of which is connected to the other end of the first inductor, and the other end of which is grounded.

[0045] Optionally, the sensor processing unit further comprises:

[0046] a sixth crystal oscillator, one end of which is connected with the PC14-OSC32_IN pin of the first chip, and the other end of which is connected with the PC15-OSC32_OUT pin of the first chip;

[0047] a tenth capacitor, one end of which is connected with the PC14-OSC32_IN pin of the first chip, and the other end of which is grounded;

[0048] an eleventh capacitor, one end of which is connected with the PC15-OSC32_OUT pin of the first chip, and the other end of which is grounded.

[0049] By the above technical solution, the device for quickly detecting sensor temperature is provided, the environment temperature and the measured sensor temperature are detected by the test probe, the measured sensor probe is connected with the measured sensor, the sensor processing unit is connected with the environment temperature probe and the measured sensor probe, and is used for comparing the temperature collected by the measured sensor probe with the temperature collected by the environment temperature probe; the display unit is connected with the sensor processing unit, and is used for displaying the comparison result; and the power supply unit is connected with the sensor processing unit and the display unit, and is used for power supply. The device can realize the comparison between the measured sensor temperature and the internal reference temperature, and can more intuitively judge the quality of the sensor. The device is simple, easy to use, convenient and fast to operate, and is not prone to errors.

[0050] Other features and advantages of the embodiments of the present application will be described in detail in the following specific implementation part. BRIEF DESCRIPTION OF DRAWINGS

[0051] The accompanying drawings are included to provide a further understanding of the embodiments of the present application, and constitute a part of the specification, and are used together with the following specific implementation part to explain the embodiments of the present application, but do not constitute a limitation on the embodiments of the present application. In the drawings:

[0052] Figure 1 is a device for quickly detecting sensor temperature of an embodiment of the present application;

[0053] Figure 2 is a first chip circuit diagram of a sensor processing unit of an embodiment of the present application;

[0054] Figure 3 is a first USB interface circuit diagram of a sensor processing unit of an embodiment of the present application;

[0055] Figure 4 is a circuit diagram of a power supply of a sensor processing unit of an embodiment of the present application;

[0056] Figure 5 is a second light emitting diode circuit diagram of a sensor processing unit of an embodiment of the present application;

[0057] Figure 6 is a reset circuit diagram of a sensor processing unit of an embodiment of the present application;

[0058] Figure 7 is a fifth crystal oscillator circuit diagram of a sensor processing unit of an embodiment of the present application;

[0059] Figure 8 is a filter circuit diagram of a sensor processing unit of an embodiment of the present application;

[0060] Figure 9 is a sixth crystal oscillator circuit diagram of a sensor processing unit of an embodiment of the present application;

[0061] Figure 10 is a first PIN interface and a second PIN interface schematic diagram of a sensor processing unit of an embodiment of the present application;

[0062] Figure 11 is a SWD interface schematic diagram of a sensor processing unit of an embodiment of the present application.

[0063] BRIEF DESCRIPTION OF DRAWINGS

[0064] U1, first chip C2, second capacitor

[0065] R4, fourth resistor R7, seventh resistor

[0066] LED1, first light emitting diode R6, sixth resistor

[0067] USB1, first USB interface R1, first resistor

[0068] R2, second resistor D1, first voltage stabilizing diode

[0069] U5, fifth chip C1, first capacitor

[0070] C14, fourteenth capacitor U4, fourth chip

[0071] C12, twelfth capacitor C13, thirteenth capacitor

[0072] LED2, second light emitting diode R5, fifth resistor

[0073] R3, third resistor C7, seventh capacitor

[0074] X5, fifth crystal oscillator X6, sixth crystal oscillator

[0075] C8, eighth capacitor C9, ninth capacitor

[0076] C3, third capacitor C4, fourth capacitor

[0077] C5, fifth capacitor L1, first inductor

[0078] C6, sixth capacitor C10, tenth capacitor

[0079] C11, eleventh capacitor PIN1, first PIN interface

[0080] PIN2, second PIN interface DETAILED DESCRIPTION

[0081] The specific embodiments of the utility model embodiments will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the utility model embodiments, and are not used to limit the utility model embodiments.

[0082] In the utility model embodiments, the orientation words such as 'up, down, top, bottom' are generally used for the direction shown in the drawings or the position relationship description of the components in the vertical, perpendicular or gravity direction, unless otherwise stated.

[0083] In addition, if the description of 'first','second' and the like is involved in the utility model embodiments, the description of 'first','second' and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by 'first','second' can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0084] As Figure 1 The device for rapidly detecting sensor temperature of an embodiment of the utility model is shown in the figure. In the Figure 1The device comprises a test probe, a sensor processing unit, a display unit and a power supply unit. Specifically, the test probe comprises an ambient temperature probe and a measured sensor probe, the measured sensor probe is connected with the measured sensor, the sensor processing unit is connected with the ambient temperature probe and the measured sensor probe, and is used for comparing the temperature collected by the measured sensor probe with the temperature collected by the ambient temperature probe; the display unit is connected with the sensor processing unit, and is used for displaying the comparison result; and the power supply unit is connected with the sensor processing unit and the display unit, and is used for power supply. The real-time ambient temperature tested by the ambient temperature probe can be used as a reference temperature, the temperature of the sensor is detected by the measured sensor probe, and whether the sensor is damaged is judged by comparing the temperature tested by the ambient temperature probe with the temperature of the sensor detected by the measured sensor probe. The device can realize rapid testing of the measured sensor temperature and comparison with the internal reference temperature, and can more directly judge the quality of the sensor. The device is simple to use, convenient to operate and less prone to errors.

[0085] In the embodiment, the sensor processing unit comprises a first chip U1, a VSS-1 pin, a VSS-2 pin, a VSS-3 pin and a VSSA pin of the first chip U1 are grounded, a VDD-2 pin and a VDD-3 pin of the first chip U1 are connected with a 3V3 power supply, one end of a second capacitor C2 is connected with a VBAT pin of the first chip U1, and the other end is grounded, one end of a fourth resistor R4 is connected with a BOOT0 pin of the first chip U1, and the other end is grounded, one end of a seventh resistor R7 is connected with a PB2 pin of the first chip U1, and the other end is grounded, a positive electrode of a first light-emitting diode LED1 is connected with the 3V3 power supply, one end of a sixth resistor R6 is connected with a negative electrode of the first light-emitting diode LED1, and the other end is grounded. As shown in the figure. Figure 2

[0086] ​In the embodiment, the sensor processing unit further comprises a first USB interface USB1, a GND pin of the first USB interface USB1 is grounded, one end of a first resistor R1 is connected with a CC2 pin of the first USB interface USB1, and the other end is grounded, one end of a second resistor R2 is connected with a CC1 pin of the first USB interface USB1, and the other end is grounded, a negative electrode of a first voltage stabilizing diode is connected with a 5V power supply, a positive electrode is connected with a VBUS pin of the first USB interface USB1, a GND pin of the fifth chip is grounded, a RST# pin of the fifth chip is connected with a NRST pin of the first chip U1, a RXD pin of the fifth chip is connected with a PA9 pin of the first chip U1, a TXD pin of the fifth chip is connected with a PA10 pin of the first chip U1, a TNOW / DTR# pin of the fifth chip is connected with a BOOT0 pin of the first chip U1, a V3 pin and a VCC pin of the fifth chip are connected with a 3V3 power supply, one end of a first capacitor C1 is connected with the VCC pin of the fifth chip, and the other end is grounded, one end of a fourteenth capacitor C14 is connected with the V3 pin of the fifth chip, and the other end is grounded. As shown in Figure 3 .

[0087] In the embodiment, the sensor processing unit further comprises a fourth chip U4, a GND pin of the fourth chip U4 is grounded, a VIN pin and a CE pin of the fourth chip U4 are connected with a 5V power supply, a VOUT pin of the fourth chip U4 is connected with a 3V3 power supply, one end of a twelfth capacitor C12 is connected with the VOUT pin of the fourth chip U4, and the other end is grounded, one end of a thirteenth capacitor C13 is connected with the VIN pin of the fourth chip U4, and the other end is grounded. As shown in Figure 4 .

[0088] In the embodiment, the sensor processing unit further comprises a second light emitting diode LED2, a positive electrode is connected with a 3V3 power supply, one end of a fifth resistor R5 is connected with a negative electrode of the second light emitting diode LED2, and the other end is connected with a PC13 pin of the first chip U1. As shown in Figure 5 .

[0089] In the embodiment, the sensor processing unit further comprises a press switch, a second pin of the press switch is grounded, one end of a third resistor R3 is connected with a 3V3 power supply, and the other end is connected with a third pin of the press switch, one end of a seventh capacitor C7 is connected with a fourth pin of the press switch, and the other end is grounded. As shown in Figure 6 .

[0090] In this embodiment, the sensor processing unit further comprises a fifth crystal oscillator X5, the first pin of the fifth crystal oscillator X5 is connected with the PD0-OSC_IN pin of the first chip U1, the third pin is connected with the PD1-OSC_OUT pin of the first chip U1, one end of the eighth capacitor CC8 is connected with the PD0-OSC_IN pin of the first chip U1, and the other end is grounded, one end of the ninth capacitor C9 is connected with the PD1-OSC_OUT pin of the first chip U1, and the other end is grounded. As shown in Figure 7 .

[0091] In this embodiment, the sensor processing unit further comprises a third capacitor C3, one end of which is connected with the 3V3 power supply, and the other end is grounded, a fourth capacitor C4, one end of which is connected with the 3V3 power supply, and the other end is grounded, a fifth capacitor C5, one end of which is connected with the 3V3 power supply, and the other end is grounded, a first inductor L1, one end of which is connected with the 3V3 power supply, and a sixth capacitor C6, one end of which is connected with the other end of the first inductor L1, and the other end is grounded. As shown in Figure 8 .

[0092] In this embodiment, the sensor processing unit further comprises a sixth crystal oscillator X6, one end of which is connected with the PC14-OSC32_IN pin of the first chip U1, and the other end is connected with the PC15-OSC32_OUT pin of the first chip U1, a tenth capacitor C10, one end of which is connected with the PC14-OSC32_IN pin of the first chip U1, and the other end is grounded, and an eleventh capacitor C11, one end of which is connected with the PC15-OSC32_OUT pin of the first chip U1, and the other end is grounded. As shown in Figure 9 .

[0093] In this embodiment, the sensor processing unit further comprises a first PIN interface PIN1, a first pin of the first PIN interface PIN1 is grounded, a second pin is connected with a 3V3 power supply, a third pin is connected with a PB14 pin of the first chip U1, a fourth pin is connected with a PB15 pin of the first chip U1, a fifth pin is connected with a PB12 pin of the first chip U1, a sixth pin is connected with a PB13 pin of the first chip U1, a seventh pin is connected with a PB10 pin of the first chip U1, an eighth pin is connected with a PB11 pin of the first chip U1, a ninth pin is connected with a PB1 pin of the first chip U1, a tenth pin is connected with a PB2 pin of the first chip U1, an eleventh pin is connected with a PB0 pin of the first chip U1, a twelfth pin is connected with a NRST pin of the first chip U1, a thirteenth pin is connected with a PA7 pin of the first chip U1, a fourteenth pin is connected with a PA6 pin of the first chip U1, a fifteenth pin is connected with a PA5 pin of the first chip U1, a sixteenth pin is connected with a PA4 pin of the first chip U1, a seventeenth pin is connected with a PA3 pin of the first chip U1, an eighteenth pin is connected with a PA2 pin of the first chip U1, a nineteenth pin is connected with a PA1 pin of the first chip U1, a twentieth pin is connected with a PA0 pin of the first chip U1. A second PIN interface PIN2, a first pin of the second PIN interface PIN2 is connected with a 5V power supply, a second pin is grounded, a third pin is connected with a PA8 pin of the first chip U1, a fourth pin is connected with a PA9 pin of the first chip U1, a fifth pin is connected with a PA10 pin of the first chip U1, a sixth pin is connected with a PA11 pin of the first chip U1, a seventh pin is connected with a PA11 pin of the first chip U1, an eighth pin is connected with a PA13 pin of the first chip U1, a ninth pin is connected with a PA14 pin of the first chip U1, a tenth pin is connected with a PA15 pin of the first chip U1, an eleventh pin is connected with a PB4 pin of the first chip U1, a twelfth pin is connected with a PB3 pin of the first chip U1, a thirteenth pin is connected with a PA6 pin of the first chip U1, a fourteenth pin is connected with a PB5 pin of the first chip U1, a fifteenth pin is connected with a BOOT0 pin of the first chip U1, a sixteenth pin is connected with a PB7 pin of the first chip U1, a seventeenth pin is connected with a PB9 pin of the first chip U1, an eighteenth pin is connected with a PB8 pin of the first chip U1, a nineteenth pin is connected with a PC13 pin of the first chip U1, a twentieth pin is connected with a VBAT pin of the first chip U1. A SWD interface, a first pin of the SWD interface is connected with a PA14 pin of the first chip U1, a second pin is connected with a PA13 pin of the first chip U1, a third pin is grounded, a fourth pin is connected with a 3V3 power supply. Specifically, as shown in Figure 10 and Figure 11 .

[0094] Through the above technical scheme, the device for quickly detecting sensor temperature is provided, the environmental temperature and the measured sensor temperature are detected through the test probe, the measured sensor probe is connected with the measured sensor, the sensor processing unit is connected with the environmental temperature probe and the measured sensor probe, is used for comparing the temperature collected by the measured sensor probe with the temperature collected by the environmental temperature probe, the display unit is connected with the sensor processing unit, is used for displaying the comparison result, the power supply unit is connected with the sensor processing unit and the display unit for power supply. The device can realize the comparison of the measured sensor temperature and the internal reference temperature, and more intuitively judge the good and bad of the sensor. It is simple to use, convenient and fast to operate, and not easy to make mistakes.

[0095] The preferred embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to this. Within the technical concept range of the utility model, the technical scheme of the utility model can be subjected to various simple modifications. Including various specific technical features are combined in any suitable way, in order to avoid unnecessary repetition, the utility model does not further illustrate various possible combination ways. But these simple modifications and combinations should also be regarded as the disclosed content of the utility model, and all belong to the protection range of the utility model.

Claims

1. A device for rapidly detecting a sensor temperature, characterized by, The device comprises: a test probe, the test probe comprising an ambient temperature probe and a measured sensor probe connected with the measured sensor; a sensor processing unit connected with the ambient temperature probe and the measured sensor probe, for comparing the temperature collected by the measured sensor probe with the temperature collected by the ambient temperature probe; a display unit connected with the sensor processing unit, for displaying the comparison result; a power supply unit connected with the sensor processing unit and the display unit, for power supply.

2. The apparatus of claim 1, wherein, The sensor processing unit comprises: a first chip, VSS-1 pin, VSS-2 pin, VSS-3 pin and VSSA pin of the first chip are grounded, VDD-2 pin and VDD-3 pin of the first chip are connected with 3V3 power supply; a second capacitor, one end of the second capacitor is connected with VBAT pin of the first chip, and the other end is grounded; a fourth resistor, one end of the fourth resistor is connected with BOOT0 pin of the first chip, and the other end is grounded; a seventh resistor, one end of the seventh resistor is connected with PB2 pin of the first chip, and the other end is grounded; a first light emitting diode, the positive electrode of the first light emitting diode is connected with 3V3 power supply; a sixth resistor, one end of the sixth resistor is connected with the negative electrode of the first light emitting diode, and the other end is grounded.

3. The apparatus of claim 2, wherein, The sensor processing unit further comprises: a first USB interface, GND pin of the first USB interface is grounded; a first resistor, one end of the first resistor is connected with CC2 pin of the first USB interface, and the other end is grounded; a second resistor, one end of the second resistor is connected with CC1 pin of the first USB interface, and the other end is grounded; a first voltage stabilizing diode, the negative electrode of the first voltage stabilizing diode is connected with 5V power supply, and the positive electrode is connected with VBUS pin of the first USB interface; a fifth chip, GND pin of the fifth chip is grounded, RST# pin of the fifth chip is connected with NRST pin of the first chip, RXD pin of the fifth chip is connected with PA9 pin of the first chip, TXD pin of the fifth chip is connected with PA10 pin of the first chip, TNOW / DTR# pin of the fifth chip is connected with BOOT0 pin of the first chip, V3 pin and VCC pin of the fifth chip are connected with 3V3 power supply; a first capacitor, one end of the first capacitor is connected with VCC pin of the fifth chip, and the other end is grounded; a fourteenth capacitor, one end of the fourteenth capacitor is connected with V3 pin of the fifth chip, and the other end is grounded.

4. The apparatus of claim 3, wherein, The sensor processing unit further comprises: a fourth chip, GND pin of the fourth chip is grounded, VIN pin and CE pin of the fourth chip are connected with 5V power supply, VOUT pin of the fourth chip is connected with 3V3 power supply; a twelfth capacitor, one end of the twelfth capacitor is connected with VOUT pin of the fourth chip, and the other end is grounded; a thirteenth capacitor, one end of the thirteenth capacitor is connected with VIN pin of the fourth chip, and the other end is grounded.

5. The apparatus of claim 4, wherein, The sensor processing unit further comprises: a second light emitting diode, the positive electrode of the second light emitting diode is connected with 3V3 power supply; a fifth resistor, one end of the fifth resistor is connected with the negative electrode of the second light emitting diode, and the other end is connected with PC13 pin of the first chip.

6. The apparatus of claim 5, wherein, The sensor processing unit further comprises: a press switch, a second pin of the press switch being grounded; a third resistor, one end of the third resistor being connected with the 3V3 power supply, and the other end of the third resistor being connected with a third pin of the press switch; a seventh capacitor, one end of the seventh capacitor being connected with a fourth pin of the press switch, and the other end of the seventh capacitor being grounded.

7. The apparatus of claim 6, wherein, The sensor processing unit further comprises: a fifth crystal oscillator, a first pin of the fifth crystal oscillator being connected with a PD0-OSC_IN pin of the first chip, and a third pin of the fifth crystal oscillator being connected with a PD1-OSC_OUT pin of the first chip; an eighth capacitor, one end of the eighth capacitor being connected with the PD0-OSC_IN pin of the first chip, and the other end of the eighth capacitor being grounded; a ninth capacitor, one end of the ninth capacitor being connected with the PD1-OSC_OUT pin of the first chip, and the other end of the ninth capacitor being grounded.

8. The apparatus of claim 7, wherein, The sensor processing unit further comprises: a third capacitor, one end of the third capacitor being connected with the 3V3 power supply, and the other end of the third capacitor being grounded; a fourth capacitor, one end of the fourth capacitor being connected with the 3V3 power supply, and the other end of the fourth capacitor being grounded; a fifth capacitor, one end of the fifth capacitor being connected with the 3V3 power supply, and the other end of the fifth capacitor being grounded; a first inductor, one end of the first inductor being connected with the 3V3 power supply; a sixth capacitor, one end of the sixth capacitor being connected with the other end of the first inductor, and the other end of the sixth capacitor being grounded.

9. The apparatus of claim 8, wherein, The sensor processing unit further comprises: a sixth crystal oscillator, one end of the sixth crystal oscillator being connected with a PC14-OSC32_IN pin of the first chip, and the other end of the sixth crystal oscillator being connected with a PC15-OSC32_OUT pin of the first chip; a tenth capacitor, one end of the tenth capacitor being connected with the PC14-OSC32_IN pin of the first chip, and the other end of the tenth capacitor being grounded; an eleventh capacitor, one end of the eleventh capacitor being connected with the PC15-OSC32_OUT pin of the first chip, and the other end of the eleventh capacitor being grounded.

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