Film cutting device of wafer film sticking machine
By designing an adjustable wafer dicing device, the applicability problem of fixed-size traditional devices has been solved, enabling flexible dicing of wafers of different sizes, reducing equipment replacement and maintenance costs, and improving equipment applicability and operational efficiency.
Patent Information
- Application Number
- CN202423014091.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-07
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-07
AI Technical Summary
Traditional wafer laminating machines have fixed-size cutting devices with low applicability, resulting in high equipment replacement and maintenance costs and making it difficult to adapt to the cutting needs of wafers of different sizes.
An adjustable wafer film-coating and cutting device was designed. Through the combination of a limiting component and a cutting device, flexible cutting of wafers of different sizes can be achieved. This includes the coordinated work of a limiting plate, a torsion spring, a film feeding roller, and a cutting device to adapt to the film cutting requirements of wafers of different sizes.
It has improved the applicability and flexibility of the equipment, reduced the cost of equipment replacement and maintenance, and simplified the wafer dicing process.
Smart Images
Figure CN223617817U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of wafer lamination and cutting equipment, specifically referring to the lamination and cutting device of a wafer lamination machine. Background Technology
[0002] With the rapid development of semiconductor technology, the precision requirements of chip manufacturing processes are becoming increasingly stringent. Wafer lamination is a crucial step in chip manufacturing, used to protect the wafer surface from physical damage, chemical corrosion, and other adverse effects. The precision and efficiency of the lamination and dicing equipment directly affect the quality of wafer lamination and the smooth progress of subsequent chip manufacturing processes.
[0003] Traditional wafer laminating machines have fixed-size cutting devices with low applicability and low equipment utilization. When it is necessary to switch from producing wafers of one size to another, large-scale modifications or replacement of the equipment are required. Different sizes of devices may require different spare parts and maintenance techniques, which increases the workload and technical difficulty of maintenance personnel, and also increases maintenance costs. Utility Model Content
[0004] To solve the problem of fixed dimensions of the cutting device in traditional wafer laminating machines mentioned above, this utility model provides a wafer laminating and cutting device.
[0005] To achieve the above functions, the technical solution adopted by this utility model is as follows: a wafer laminating and cutting device for a wafer laminating machine includes a worktable and a cover. A slot is provided on the worktable, and a wafer placement tray with a circular groove is installed on the slot. A limiting component is provided on the slot, and the wafer placement tray is fixedly installed on the slot by the limiting component. A film feeding roller is rotatably provided on the worktable, and the cover is rotatably provided on the worktable. A cutting device is rotatably provided on the cover.
[0006] As a preferred embodiment of this utility model, the cutting device includes a rotating rod rotatably passing through the middle of the cover, a turntable rotatably disposed on the side wall of the cover, a bidirectional parallel rod fixedly passing through the bottom of the turntable, a slider, and a cutter body. The turntable is fixedly connected to the end of the rotating rod. Through slots are correspondingly opened at both ends of the bidirectional parallel rod. Through holes are evenly opened on the through slots. The slider is movably disposed on the through slots. Locking bolts are inserted into the through holes and are fitted to the through holes. The locking bolts fix the slider on the bidirectional parallel rod. A horizontal fixing shaft is fixed on the slider, and the cutter body is fixedly sleeved on the fixing shaft.
[0007] As a preferred embodiment of this utility model, a rotating wheel is rotatably provided at the end of the fixed shaft.
[0008] As a preferred technical solution of this utility model, the limiting component includes a rotating shaft, a limiting plate, and a torsion spring sleeved on the rotating shaft, which are vertically arranged on both sides of the wafer placement disk. The rotating shaft is rotatably arranged on the slot, the limiting plate is horizontally fixed on the top of the rotating shaft, one end of the torsion spring is fixed on the slot, and the other end of the torsion spring is fixed on the bottom of the limiting plate.
[0009] As a preferred embodiment of this utility model, a telescopic cylinder is hinged to the inner wall of the cover, and the movable end of the telescopic cylinder is hinged to the slot.
[0010] As a preferred embodiment of this utility model, a fixing block is fixedly provided on the slot, and the end of the cover is hinged to the fixing block.
[0011] Compared with the prior art, the present invention achieves the following beneficial effects by adopting the above structure:
[0012] 1. By setting up the cutting device, according to the required wafer size, the slider is fixed to the matching through hole position on the bidirectional parallel rod with locking bolts, so that the cutter body is aligned with the circular groove of the wafer placement disk. The cover is closed, and the rotating rod is rotated, thereby driving the turntable and the bidirectional parallel rod to rotate synchronously. Combined with the rotating wheel, the wafer cutting work is completed. By adjusting the position of the slider, wafer cutting work of different sizes can be achieved, which greatly improves the applicability and flexibility of the film cutting device.
[0013] 2. By setting the limiting component, rotating the limiting plate causes the rotating shaft to rotate, which in turn causes the torsion spring to twist, placing the wafer placement tray of the required size inside the slot. The tray can be finely adjusted to the appropriate placement position by manual operation. When the limiting rod is released, the restoring force of the torsion spring pushes the limiting plate back to the initial position, thereby tightly clamping and firmly limiting the wafer placement tray on the slot, which facilitates the quick installation and removal of wafer placement trays of different sizes. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of the wafer laminating and cutting device for the wafer laminating machine proposed in this utility model. Figure 1 ;
[0015] Figure 2 This is a partial structural schematic diagram of the wafer laminating and cutting device of the wafer laminating machine proposed in this utility model;
[0016] Figure 3 This is a schematic diagram of the overall structure of the wafer laminating and cutting device for the wafer laminating machine proposed in this utility model. Figure 2 ;
[0017] Figure 4 This is a schematic diagram of the overall structure of the wafer laminating and cutting device for the wafer laminating machine proposed in this utility model. Figure 3;
[0018] Figure 5 for Figure 4 Enlarged view of a portion of point A in the middle.
[0019] The components are as follows: 1. Workbench; 2. Cover; 3. Slot; 4. Wafer placement tray; 5. Limiting component; 6. Film feeding roller; 7. Cutting device; 8. Rotating rod; 9. Turntable; 10. Bidirectional parallel rod; 11. Slider; 12. Cutting blade body; 13. Through slot; 14. Through hole; 15. Locking bolt; 16. Rotating wheel; 17. Rotating shaft; 18. Limiting plate; 19. Torsion spring; 20. Telescopic cylinder; 21. Fixing block; 22. Fixing shaft. Detailed Implementation
[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.
[0022] like Figure 1-5 As shown, the wafer laminating and cutting device of this utility model includes a worktable 1 and a cover 2. The worktable 1 has a slot 3, and a wafer placement tray 4 with a circular groove is installed on the slot 3. Different sizes of wafer placement trays 4, such as 4 inches, 6 inches, 8 inches, and 12 inches, can be installed on the slot 3 according to the needs of use. A limiting component 5 is provided on the slot 3, and the wafer placement tray 4 is fixedly installed on the slot 3 by the limiting component 5. A film feeding roller 6 is rotatably arranged on the worktable 1, and the cover 2 is rotatably arranged on the worktable 1. A cutting device 7 is rotatably arranged on the cover 2. The wafer is placed on the wafer placement tray 4, and the film on the film feeding roller 6 is pulled to adhere to the wafer surface. The cover 2 is closed, and the cutting device 7 is used to perform the wafer laminating and cutting work, which facilitates the simple and quick completion of wafer laminating and cutting work.
[0023] like Figure 1-4 As shown, the cutting device 7 includes a rotating rod 8 that rotatably passes through the middle of the cover 2, a turntable 9 that rotatably moves on the side wall of the cover 2, a bidirectional parallel rod 10 that is fixedly passed through the bottom of the turntable 9, a slider 11, and a cutter body 12. The turntable 9 is fixedly connected to the end of the rotating rod 8. The two ends of the bidirectional parallel rod 10 are respectively provided with through slots 13, and through holes 14 are evenly provided on the through slots 13. The slider 11 is movably disposed on the through slots 13. Locking bolts 15 are inserted into the through holes 14 and are fitted to fix the slider 11 on the bidirectional parallel rod 10. A horizontal fixing shaft 22 is fixed on the slider 11, and the cutter body 12 is fixedly sleeved on the fixing shaft 22. 2. A rotating wheel 16 is rotatably mounted on the end of the fixed shaft 22. According to the required wafer size, the slider 11 is fixed to the matching through hole 14 on the bidirectional parallel rod 10 by means of the locking bolt 15. At this time, the cutter body 12 is just aligned with the circular groove on the wafer placement tray 4. The cover 2 is closed, the rotating rod 8 is rotated, and the rotating rod 8 drives the turntable 9, which in turn drives the bidirectional parallel rod 10 to rotate synchronously. Under the cooperative auxiliary rotation of the rotating wheel 16, the wafer is cut. By adjusting the position of the slider 11, wafer cutting of different sizes can be achieved, which greatly improves the applicability and flexibility of the film cutting device 7.
[0024] like Figure 1 , 3 As shown in Figure 5, the limiting assembly 5 includes a rotating shaft 17, a limiting plate 18, and a torsion spring 19 sleeved on the rotating shaft 17, which are vertically arranged on both sides of the wafer placement tray 4. The rotating shaft 17 is rotatably mounted on the slot 3. The limiting plate 18 is horizontally fixed to the top of the rotating shaft 17. One end of the torsion spring 19 is fixed to the slot 3, and the other end of the torsion spring 19 is fixed to the bottom of the limiting plate 18. When the limiting plate 18 is rotated, the limiting plate 18 drives the rotating shaft 17 to rotate, and the torsion spring 19 undergoes torsional deformation, so that the wafer placement tray 4 of the required size is stably placed inside the slot 3. It can be finely adjusted to the appropriate placement position by manual operation. Then the limiting rod is released. At this time, the torsion spring 19 generates a restoring force due to its own restoring characteristics. This restoring force pushes the limiting plate 18 back to the initial position, thereby tightly clamping and firmly limiting the wafer placement tray 4 on the slot 3, which facilitates the quick installation and removal of wafer placement trays 4 of different sizes.
[0025] like Figure 1 and 4As shown, a telescopic cylinder 20 is hinged to the inner wall of the cover 2, and the movable end of the telescopic cylinder 20 is hinged to the slot 3. A fixing block 21 is fixed on the slot 3, and the end of the cover 2 is hinged to the fixing block 21. When the movable end of the telescopic cylinder 20 extends or retracts, since its two ends are hinged to the cover 2 and the slot 3 respectively, based on the lever principle and the interaction of forces, it can pull the cover 2 to rotate around the hinge point with the fixing block 21, so that it can flexibly adjust the opening and closing angle and position according to the actual working requirements, thereby providing a strong structural and functional guarantee for the efficient and stable operation of the entire wafer lamination and cutting device 7.
[0026] In practical use, the telescopic cylinder 20 is opened, and the extension and retraction of its movable end pulls the cover 2 to rotate around the hinge point with the fixed block 21, adjusting the cover 2 to the required opening and closing angle and position. The limiting plate 18 is manually rotated, which drives the rotating shaft 17 to rotate, and the torsion spring 19 to twist, placing the wafer placement tray 4 of the required size inside the slot 3. The tray is then finely adjusted to the appropriate placement position by manual operation. The limiting rod is released, and the restoring force of the torsion spring 19 pushes the limiting plate 18 back to its initial position, thereby placing the wafer placement tray 4... The wafer is tightly clamped and securely positioned on the slot 3. The wafer is placed on the wafer placement tray 4. The film on the film feeding roller 6 is pulled to adhere to the wafer surface. According to the required wafer cutting size, the slider 11 is fixed to the matching through hole 14 on the bidirectional parallel rod 10 with the locking bolt 15. The cover 2 is put on, so that the cutter body 12 is aligned with the circular groove of the wafer placement tray 4. The rotating rod 8 is rotated, thereby driving the synchronous rotation of the turntable 9 and the bidirectional parallel rod 10. The rotating wheel 16 assists in completing the wafer cutting work.
[0027] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.
Claims
1. A wafer laminating and cutting device for a wafer laminating machine, comprising a worktable (1) and a cover (2), characterized in that: The workbench (1) has a slot (3) and a wafer placement tray (4) with a circular groove is installed on the slot (3). A limiting component (5) is provided on the slot (3). The wafer placement tray (4) is fixedly installed on the slot (3) by the limiting component (5). A film feeding roller (6) is rotatably arranged on the workbench (1). The cover (2) is rotatably arranged on the workbench (1). A cutting device (7) is rotatably arranged on the cover (2).
2. The wafer laminating and cutting device for a wafer laminating machine according to claim 1, characterized in that: The cutting device (7) includes a rotating rod (8) that rotates through the middle of the cover (2), a rotating disk (9) that rotates on the side wall of the cover (2), a bidirectional parallel rod (10) that is fixedly inserted through the bottom of the rotating disk (9), a slider (11), and a cutter body (12). The rotating disk (9) is fixedly connected to the end of the rotating rod (8). The two ends of the bidirectional parallel rod (10) are respectively provided with through slots (13). Through holes (14) are evenly provided on the through slots (13). The slider (11) is movably disposed on the through slots (13). A locking bolt (15) is inserted into the through hole (14). The locking bolt (15) fixes the slider (11) on the bidirectional parallel rod (10). A horizontal fixing shaft (22) is fixed on the slider (11). The cutter body (12) is fixedly sleeved on the fixing shaft (22).
3. The wafer laminating and cutting device for a wafer laminating machine according to claim 2, characterized in that: The fixed shaft (22) is rotatably provided with a rotating wheel (16) at its end.
4. The wafer laminating and cutting device for a wafer laminating machine according to claim 1, characterized in that: The limiting component (5) includes a rotating shaft (17), a limiting plate (18), and a torsion spring (19) sleeved on the rotating shaft (17), which are vertically arranged on both sides of the wafer placement disk (4). The rotating shaft (17) is rotatably arranged on the slot (3). The limiting plate (18) is horizontally fixed on the top of the rotating shaft (17). One end of the torsion spring (19) is fixed on the slot (3), and the other end of the torsion spring (19) is fixed on the bottom of the limiting plate (18).
5. The wafer laminating and cutting device for a wafer laminating machine according to claim 4, characterized in that: A telescopic cylinder (20) is hinged to the inner wall of the cover (2), and the movable end of the telescopic cylinder (20) is hinged to the slot (3).
6. The wafer laminating and cutting device for a wafer laminating machine according to claim 5, characterized in that: A fixing block (21) is fixed on the slot (3), and the end of the cover (2) is hinged to the fixing block (21).