Film pasting quality detection tool for film pasting wafer

Abstract

The utility model discloses a film pasting quality detection tool for a film pasting wafer, which relates to the technical field of semiconductor device production and comprises a supporting plate, a limiting assembly, a positioning assembly and a marking groove. The supporting plate is used for placing the wafer and the annular bracket after film pasting; the limiting assembly is arranged on the plate surface of the supporting plate, and the limiting assembly can abut against the two opposite sides of the annular support in the radial direction of the wafer; the positioning assembly is arranged on the plate face of the supporting plate and can transversely abut against the two positions of the annular support. The marking groove is an annular groove with the radius equal to that of the to-be-cut face of the wafer and is matched with the position of the positioning assembly. According to the utility model, whether the concentricity of the film is lower or the deviation exceeds the standard can be quickly judged, a vernier caliper is not needed to test the ring diameter of the base film, whether the film quality of the wafer is qualified can be judged by observing once, the film quality detection efficiency of the film-coated wafer is high, errors of detection data do not exist, and the detection accuracy is high.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device manufacturing technology, and in particular to a tooling for inspecting the quality of film-coated wafers. Background Technology

[0002] A wafer is a circular silicon wafer used in semiconductor manufacturing. It is the basic material for manufacturing integrated circuits and various semiconductor devices. The diameter of a wafer is usually measured in inches, with common sizes being six inches, eight inches, and twelve inches. The larger the diameter of a wafer, the more chips can be manufactured on a single wafer, but the higher the requirements for the manufacturing process.

[0003] During semiconductor manufacturing, wafers undergo multiple steps including photolithography, etching, ion implantation, chemical vapor deposition, and physical vapor deposition to ultimately form complex circuit structures. Wafer lamination is a crucial step in semiconductor manufacturing. For example, before dicing, a film is adhered to the back of the wafer. This film serves to hold the chip in place, maintaining the integrity of the die during dicing and reducing issues such as chipping, displacement, and chipping. In actual production, UV or blue films are typically used. The outer ring of these films needs to be attached to a ring-shaped support to support and secure the wafer within the support.

[0004] The quality of wafer film bonding affects subsequent dicing processes. For example, if the concentricity between the film bonding and the wafer is low or the film bonding offset exceeds the standard, during the laser grooving process, the laser trace may extend beyond the dicing film and burn through the base film, or the dicing film may not be completely burned due to the inward offset of the base film, resulting in damage to the subsequent dicing blades. Therefore, the detection of the concentricity between the dicing film bonding and the wafer surface to be diced is particularly important.

[0005] Currently, the traditional tool for testing the concentricity of cut films is mainly a vernier caliper. The vernier caliper's probe is aligned with the edge of the cut film, and the circumference from the outer edge of the cut film to the outer edge of the base film is measured. If the circumference of the base film after film application meets the original circumference requirement of the base film, then the film application has not exceeded the standard deviation, and the concentricity is qualified. However, this type of film application concentricity test requires manual measurement around the wafer after film application using a vernier caliper multiple times, and the vernier caliper's probe is not easily perpendicular to the edge of the cut film, resulting in low testing efficiency or large testing errors. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing wafer film-coated quality inspection technologies, which require manual measurement around the wafer using vernier calipers. Furthermore, the vernier caliper probe is not always accurately perpendicular to the edge of the film, leading to low inspection efficiency or large errors, and also causing scratches on the wafer surface. This invention provides a wafer film-coated quality inspection fixture, comprising: a support plate, a limiting component, a positioning component, and a marking groove. The support plate holds the coated wafer and an annular support. The limiting component is located on the surface of the support plate and can abut against two opposite sides of the annular support along the radial direction of the wafer. The positioning component is located on the surface of the support plate and can abut against two points on the annular support laterally. The marking groove is an annular groove with a radius equal to the radius of the surface to be cut on the wafer and is adapted to the position of the positioning component.

[0007] In this invention, the outer side of the wafer to be cut after film application is a viewing ring of the wafer body, and the outer side of the viewing ring is an outer ring with a base film applied. The outer edge of the wafer with the base film applied is fixed to an annular support. The solution described in this invention, by setting a support plate, allows the wafer and annular support to be placed on the support plate. Then, limiting and positioning components are used to limit and position the annular support, allowing the annular support and wafer to be temporarily fixed to the surface of the support plate. Furthermore, by setting a marking groove with a radius equal to that of the wafer and the annular support to be cut, after the annular support is limited by the limiting components, the wafer to be cut is appropriately positioned... The edges of the cut surface and the marking grooves coincide. If the concentricity of the wafer film is low or the offset exceeds the standard, the base film will exceed the edge limit of the surface to be cut due to the offset. The marking grooves will be partially obscured by the base film or the cutting film. The inspector can quickly determine whether the film is concentric or the offset exceeds the standard simply by observing whether the marking grooves are fully displayed in the viewing circle. There is no need to use calipers to test the ring diameter of the base film. The quality of the wafer film can be determined with just one observation, which improves the efficiency of wafer film film inspection and eliminates errors in the inspection data, thus improving the accuracy of the inspection.

[0008] Preferably, in the wafer lamination quality inspection fixture of the present invention, the positioning component includes at least two pins fixed to the support plate; the outer side of the annular bracket is provided with a notch that can abut against each of the pins.

[0009] As a preferred embodiment of this utility model, by using the positioning effect of the notch and the pin, after the ring bracket is placed on the support plate and limited, the notch is aligned and abuts against the pin. Due to the abutting effect of the two pins, the ring surface of the ring bracket cannot rotate or move laterally because of the two positioning points. This further facilitates the picking and placing of the wafer and the iron ring without the need for additional operations, further improving the efficiency of the inspection and making the inspection fixture more convenient to use.

[0010] Preferably, in the wafer lamination quality inspection fixture of the present invention, the limiting component includes a first stop and a second stop; the first stop and the second stop are symmetrically arranged with the diameter of the marking groove as the axis of symmetry; the first stop is fixed to the support plate; the second stop is slidably connected to the support plate along the radial direction of the marking groove; the second stop is provided with a fixing member.

[0011] As a preferred embodiment of this utility model, by setting the first and second stops, the second stop can be pulled out radially to release its limiting function, allowing the annular bracket to be quickly placed on the support plate and its edge to be pressed against the first stop, or the annular bracket and wafer to be quickly removed; by sliding the second stop forward radially, the second stop can be pressed against the outer side of the annular bracket opposite to the first stop, achieving rapid limiting of the wafer and the annular bracket, further improving the efficiency of wafer film bonding quality inspection and enhancing the ease of use of the tooling.

[0012] Preferably, in the wafer bonding quality inspection fixture of the present invention, the support plate is provided with two inner notches on two opposite sides adjacent to the limiting component.

[0013] As a preferred embodiment of this utility model, by providing inner notches on two opposite sides of the support plate near the limiting component, the inner notches allow the hands to pass through when the ring bracket is picked up with both hands, avoiding the hands from touching the support plate and causing the support plate to tilt or move, thus avoiding detection errors. This further facilitates the picking up of the ring bracket and improves the safety of the tooling.

[0014] Preferably, in the wafer lamination quality inspection fixture of the present invention, the inner notch is a square groove; the two opposite sides of the edge of the annular support are respectively provided with straight cutting edges; the length of the straight cutting edges is equal to the length of the bottom edge of the square groove.

[0015] As a preferred embodiment of this utility model, by setting the inner notch to a square groove and providing straight cut edges on both sides of the edge of the annular support, the annular support and the wafer can be quickly aligned by aligning the straight cut edges with the bottom edge of the square groove when placing the annular support. This allows the wafer quality inspection operation to be standardized through the picking action and picking position, reducing the inspection time occupied by adjusting the alignment and further improving the efficiency of wafer quality inspection.

[0016] Preferably, the marking groove is provided with a marking color that is darker than the color of the cutting film and the base film.

[0017] As a preferred embodiment of this utility model, by setting the marking color, it is possible to quickly see whether the marking groove is fully displayed after the ring bracket is placed, limited, and positioned, which facilitates the observation of the testing personnel and further improves the testing efficiency.

[0018] Preferably, in the wafer bonding quality inspection fixture of the present invention, the bottom of the support plate is provided with at least four support corners arrayed with the marking groove as the center.

[0019] As a preferred embodiment of this utility model, by setting support corners, the support plate can be fixed or supported, thereby enabling the support plate to be placed stably and preventing the wafer from moving or falling due to tilting or movement, thus enhancing the safety and stability of the tooling.

[0020] Preferably, in the wafer lamination quality inspection fixture of the present invention, the support plate is a square plate surface; the center of the marking groove coincides with the center of the support plate.

[0021] As a preferred embodiment of this utility model, by setting the support plate to a square plate surface and aligning the center of the marking groove with the center of the support plate, the force is more balanced after placing the wafer and the ring support, further enhancing the stability of the plate surface support.

[0022] Preferably, in the wafer lamination quality inspection fixture of the present invention, the four corners of the support plate are all rounded chamfers.

[0023] As a preferred embodiment of this utility model, by having rounded chamfers at all four corners of the support plate, the risk of the support plate being damaged by collision can be reduced, further improving the safety of the tooling.

[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0025] After the ring support is limited by the limiting component, it adapts to make the edge of the wafer to be cut and the edge of the marking groove coincide. If the concentricity of the wafer film is low or the offset exceeds the standard, the part with the base film will exceed the edge limit of the wafer to be cut due to the film offset. The marking groove will be blocked by the base film part or the cutting film part. The inspector can quickly determine whether the film is low in concentricity or excessive in offset simply by observing whether the marking groove is fully displayed in the viewing ring. There is no need to use calipers to test the ring diameter of the base film. The quality of the wafer film can be judged by one observation, which improves the efficiency of film film inspection of film-coated wafers. There is no error in the inspection data, which improves the accuracy of the inspection. Attached Figure Description

[0026] Figure 1 This is a top view schematic diagram of the structure of this utility model;

[0027] Figure 2 This is a schematic diagram of the usage state of this utility model;

[0028] Figure 3 This is a three-dimensional structural schematic diagram of the present invention;

[0029] Figure 4 This is a side view schematic diagram of the structure of this utility model;

[0030] Figure 5 This is the book Figure 2 A magnified view of a portion of coil A;

[0031] Icons: 1. Support plate; 11. Inner notch; 2. Limiting component; 21. First stop bar; 22. Second stop bar; 221. Fixing component; 3. Positioning component; 31. Pin; 4. Marking groove; 5. Support corner; 100. Wafer; 101. Annular support; 1011. Notch; 1012. Straight cut edge; 102. Base film part; 103. Cut film part. Detailed Implementation

[0032] The present invention will now be described in detail with reference to the accompanying drawings.

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0034] Example 1:

[0035] like Figure 1 As shown, this embodiment provides a film-coated wafer 100 film-coated quality inspection fixture, including: a support plate 1, a limiting component 2, a positioning component 3, and a marking groove 4; the support plate 1 is used to place the film-coated wafer 100 and the annular support 101; the limiting component 2 is disposed on the surface of the support plate 1, and the limiting component 2 can abut against two opposite sides of the annular support 101 along the radial direction of the wafer 100; the positioning component 3 is disposed on the surface of the support plate 1, and can abut against two points of the annular support 101 laterally; the marking groove 4 is configured as an annular groove with the same radius as the surface to be cut on the wafer 100, and is adapted to the position of the positioning component 3.

[0036] It should be noted that the limiting component 2 functions to cooperate with the wafer 100 after film application and the annular support 101, and can abut against the components on both sides of the annular support 101 along the radial direction of the wafer 100; specifically, refer to Figure 1-2As shown, the limiting component 2 includes a first stop bar 21 and a second stop bar 22; the first stop bar 21 and the second stop bar 22 are symmetrically arranged with the diameter of the marking groove 4 as the axis of symmetry; the first stop bar 21 is fixed to the support plate 1; the second stop bar 22 is slidably connected to the support plate 1 along the radial direction of the marking groove 4; the second stop bar 22 is provided with a fixing member 221. Both the first stop bar and the second stop bar can be fixed to the support plate 1 by bolts. By setting a groove in the support plate 1, the shape of the groove matches the shape of the second stop bar. By vertically loosening the bolt, the second stop bar can be slid out radially, thereby releasing the limitation on the annular bracket 101. The fixing member 221 is understood as a fixing component that can fix the second stop bar to the support plate 1 after the second stop bar is slidably pushed into the groove, so as to prevent relative sliding. For example, the bolt used can be vertically loosened or tightened. Tightening it completes the fixation of the second stop bar.

[0037] It should be noted that the annular support 101 is understood as a support connecting to the outermost ring of the wafer 100 after film application, protecting the wafer 100, for example... Figure 2 The iron ring shown has its inner ring fixedly connected to the part of the wafer 100 with the base film after film application. The outer ring of the iron ring is easy to hold or support during transportation, avoiding damage to the wafer 100 during transport or handling.

[0038] In this embodiment, the positioning component 3 is understood to be fixed at two specific positions on the surface of the support plate 1, and further, by providing mutually cooperating components on the annular surface of the annular bracket 101 that can be fixed by the positioning component 3. For example, specifically, refer to... Figure 2 As shown, the positioning component 3 includes at least two pins 31 fixed to the support plate 1; the outer side of the annular bracket 101 is provided with notches 1011 that can abut against each pin 31. When the annular bracket 101 and the wafer 100 are placed on the support plate 1, the positions of the marking groove 4, the positioning component 3, and the annular bracket 101 can be aligned. This alignment can be achieved using conventional dimensions and the position settings of the positioning component 3. After the two pins 31 are respectively abutted against the two notches 1011, the fixing bolts of the limiting component 2 are tightened to achieve positioning and limiting. More specifically, refer to... Figure 2 and Figure 5 As shown, the notch 1011 is triangular and gradually expands radially from the inside to the outside.

[0039] It should be noted that the reference Figure 1 and Figure 2As shown, the marking groove 4 is understood as an annular groove that is vertically recessed downwards relative to the surface of the support plate 1. After the wafer 100 and the annular support 101 are placed on the support plate 1, the inspection personnel can see the marking groove 4 from above the wafer 100 through the viewing ring of the wafer 100, thus enabling the inspection of the film quality on the surface of the wafer 100 to be cut. Furthermore, since the annular groove is recessed relative to the plate surface, it will not affect or rub against the lower surface of the wafer 100, reducing any adverse effects on the wafer 100 product. More specifically, to make the marking groove 4 more conspicuously visible to the inspection personnel, the marking groove 4 is provided with a marking color that is darker than the color of the cutting film and the base film, for example, a red marking groove 4.

[0040] In this embodiment, specifically, refer to... Figure 1 and Figure 3 As shown, the support plate 1 has two inner notches 11 on each of the two opposite sides of the limiting component 2. More specifically, the inner notches 11 are square grooves; the two opposite sides of the edge of the annular bracket 101 are respectively provided with straight cut edges 1012; the length of the straight cut edges 1012 is equal to the length of the bottom edge of the square groove.

[0041] In this embodiment, specifically, refer to... Figure 3 and Figure 4 As shown, the bottom of the support plate 1 is provided with at least four support corners 5 arranged in an array with the marking groove 4 as the center.

[0042] It should be noted that, in this embodiment, the wafer 100 can be positioned or accurately placed not only through the conventional position matching of the limiting component 2 and the positioning component 3, but also by using a square plate as the support plate 1; the center of the marking groove 4 coincides with the center of the support plate 1, and the wafer 100 is placed in the center with the four sides aligned, thus completing the placement and alignment. More specifically, all four corners of the support plate 1 are rounded chamfers.

[0043] The working principle of this utility model is as follows: When the limiting component 2 is in the released limiting state, the wafer 100 after film application and the annular support 101 are placed on the support plate 1. Since the wafer 100 after film application includes the part to be cut with the cutting film, the viewing ring, and the outer ring base film part 102, the outer ring base film part 102 is fixed to the inner ring of the annular support 101. By setting the radius of the marking groove 4 to be equal to the radius of the part to be cut, as long as the center of the wafer 100 after film application and the center of the marking groove 4 are placed in the same position, if the film application is offset or not concentric, the marking groove 4 will be blocked by the inner or outer offset base film part 102 or cutting film part 103, so that the marking groove 4 cannot be fully displayed in the viewing ring. The marking groove 4 can be quickly observed to conclude that the film application of the wafer 100 is unqualified. Conversely, if the marking groove 4 is fully displayed in the viewing ring of the wafer 100, the film application of the wafer 100 is qualified.

[0044] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A fixture for inspecting the quality of film-coated wafers, characterized in that, include: The support plate (1), the limiting component (2), the positioning component (3), and the marking groove (4) are used to place the wafer (100) after film application and the annular support (101). The limiting component (2) is disposed on the surface of the support plate (1) and can abut against two opposite sides of the annular support (101) along the radial direction of the wafer (100). The positioning component (3) is disposed on the surface of the support plate (1) and can abut against two points of the annular support (101) laterally. The marking groove (4) is configured as an annular groove with the same radius as the surface to be cut of the wafer (100) and is adapted to the position of the positioning component (3).

2. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The positioning component (3) includes at least two pins (31) fixed to the support plate (1); the outer side of the annular bracket (101) is provided with a notch (1011) that can abut against each of the pins (31).

3. The wafer lamination quality inspection fixture according to claim 2, characterized in that, The notch (1011) is triangular and gradually widens radially from the inside to the outside.

4. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The limiting component (2) includes a first stop bar (21) and a second stop bar (22); the first stop bar (21) and the second stop bar (22) are symmetrically arranged with the diameter of the marking groove (4) as the axis of symmetry; the first stop bar (21) is fixed to the support plate (1); the second stop bar (22) is slidably connected to the support plate (1) along the radial direction of the marking groove (4); the second stop bar (22) is provided with a fixing member (221).

5. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The support plate (1) has two inner notches (11) on each of its two opposite sides adjacent to the limiting component (2).

6. The wafer lamination quality inspection fixture according to claim 5, characterized in that, The inner notch (11) is a square groove; the two opposite sides of the edge of the annular bracket (101) are respectively provided with straight cutting edges (1012); the length of the straight cutting edges (1012) is equal to the length of the bottom edge of the square groove.

7. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The marking groove (4) is provided with a marking color that is darker than the color of the cutting film and the base film.

8. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The bottom of the support plate (1) is provided with at least four support corners (5) arranged in an array with the marking groove (4) as the center.

9. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The support plate (1) is a square plate; the center of the marking groove (4) coincides with the center of the support plate (1).

10. The wafer lamination quality inspection fixture according to claim 1, characterized in that, The four corners of the support plate (1) are all rounded chamfers.

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