Laser de-bonding all-in-one machine
By setting up multiple feeding ports and a robotic arm clamping structure in the laser debonding machine, the problem of continuous wafer chip feeding in the existing technology has been solved, realizing automated continuous feeding and efficient processing of multiple wafer chips.
Patent Information
- Application Number
- CN202520274876.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing laser debonding machines cannot continuously feed multiple wafer chips, resulting in low processing efficiency.
A laser debonding machine was designed. Multiple feeding ports are set on the outer side wall of the main body, and multiple wafer chips are layered and continuously fed by a robotic arm and clamping plate structure. The wafer chips are automatically transported by a motor and lead screw system.
This enables the continuous feeding of multiple wafer chips, improving the feeding speed and processing efficiency, avoiding interference between chips, and ensuring a highly efficient processing flow.
Smart Images
Figure CN223624944U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser debonding and bonding integrated machine technology, specifically a laser debonding and bonding integrated machine. Background Technology
[0002] A laser debonding machine is a device that uses laser technology to debond wafers to components or glass substrates. It can adapt to the debonding requirements of different temporary bonding adhesives and is widely used in the semiconductor field. It can significantly improve process efficiency, reduce material damage, and ensure high yield.
[0003] When using a laser debonding machine to perform laser debonding on wafer chips, the wafer chip to be processed needs to be fed into the machine body through the feed port for laser debonding. However, the existing feeding method can only pick up one wafer chip at a time, and cannot feed multiple wafer chips continuously, resulting in low processing efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a laser debonding machine to solve the problems mentioned in the background art.
[0005] The objective of this utility model can be achieved through the following technical solutions:
[0006] A laser debonding and bonding integrated machine includes a main body. Several feeding ports are provided on the outer wall of the main body. Conveyor tables are fixedly connected to the outer wall of the main body at the lower edges of each feeding port. A support plate is fixedly connected to the outer wall of the main body near its bottom surface. A transverse groove is formed through the upper surface of the support plate. A reciprocating screw is rotatably connected inside the transverse groove. A movable block is sleeved outside the reciprocating screw. A mounting plate is fixedly connected to the upper end of the movable block. A mounting seat is rotatably connected to the upper surface of the mounting plate via a shaft. A robotic arm is rotatably connected to the mounting seat via a shaft. A robotic arm is rotatably connected to one end of the robotic arm via a shaft. A fixing plate is fixedly connected to the end of the robotic arm away from the robotic arm. A clamping plate and a clamping plate are slidably connected to the bottom surface of the fixing plate.
[0007] Preferably, both the first clamp and the second clamp have several insert plates movably inserted into their outer side walls, and both the first clamp and the second clamp have two L-shaped connecting plates fixedly connected to their outer side walls.
[0008] Preferably, the outer walls of both L-shaped connecting plates are provided with a plurality of sliding grooves, each of which is fixedly connected to a sliding rod. Each of the sliding rods is fitted with a slider, one end of which is fixedly connected to the insert plate. A return spring is fitted on the outside of the sliding rod, located between the slider and the inner wall of the sliding groove.
[0009] Preferably, an electric telescopic rod is installed on the inner wall of each of the two L-shaped connecting plates. A push plate is fixedly connected to one end of the electric telescopic rod. Two threaded screws are rotatably connected to the outer walls of the first clamping plate and the second clamping plate. An L-shaped sliding plate is sleeved on the outside of each of the two threaded screws. A stop bar is fixedly connected between the two L-shaped sliding plates.
[0010] Two motors are mounted on the bottom surfaces of both clamping plates one and two clamping plates two respectively, and the output ends of the two motors are connected to two threaded screws.
[0011] Preferably, the bottom surface of the fixing plate is rotatably connected to two double-ended threaded rods, and both the first clamping plate and the second clamping plate are movably sleeved on the outside of the two double-ended threaded rods. Two second motors are installed on the outer wall of the fixing plate, and the output ends of the two second motors are respectively connected to the two double-ended threaded rods.
[0012] Preferably, a motor is installed on the outer wall of the bearing plate, and the output end of the motor is connected to a reciprocating lead screw; a motor is installed on the outer wall of the mounting base, and the output end of the motor is connected to a robotic arm; a motor is installed on the outer wall of the robotic arm at a position away from the mounting base, and the output end of the motor is connected to the robotic arm; and a motor is installed on the bottom surface of the mounting plate, and the output end of the motor is connected to the mounting base.
[0013] The beneficial effects of this utility model are:
[0014] 1. In this utility model, by moving the baffle upward, the obstruction of the bottommost insert plate is released, and the load-bearing limit of the bottommost wafer chip is released, so that the bottommost wafer chip automatically falls onto the conveyor table under the action of gravity. Similarly, the remaining wafer chips are moved to the next conveyor table, and the load-bearing limit of the next insert plate on the wafer chip is released. The wafer chips can be placed on each conveyor table in sequence, and finally enter the main body through the feeding port. With the cooperation of robotic arm one and robotic arm two, the clamped wafer chips can be moved to the top of each conveyor table in sequence, so that multiple wafer chips can be placed continuously at one time, improving the feeding speed and thus improving the processing efficiency of wafer chips.
[0015] 2. In this utility model, robotic arms one and two drive the fixed plate to move to the position of the neatly stacked wafer chip stack, and clamping plates one and two approach each other to clamp the wafer chip stack. Each insert plate is inserted between the two stacked wafer chips, which can clamp multiple wafer chips at one time, and the wafer chips are clamped in layers, so that each wafer chip does not interfere with each other, avoiding mutual interference between chips and affecting subsequent feeding operations. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0018] Figure 2 This is a partial structural schematic diagram of the present invention;
[0019] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;
[0020] Figure 4 This is a schematic diagram of the structure of the fixing plate, clamping plate 1 and robotic arm 1 in this utility model;
[0021] Figure 5 This is a structural schematic diagram of the clamping plate and the L-shaped connecting plate in this utility model.
[0022] The attached figures are labeled as follows:
[0023] 1. Main body; 2. Conveyor table; 3. Feeding port; 4. Bearing plate; 5. Reciprocating screw; 6. Movable block; 7. Mounting plate; 8. Mounting base; 9. Robotic arm one; 10. Robotic arm two; 11. Fixing plate; 12. Clamping plate one; 13. Insert plate; 14. L-shaped connecting plate; 15. Slide rod; 16. Slider; 17. Electric telescopic rod; 18. Push plate; 19. Stop bar; 20. Threaded screw; 21. L-shaped sliding plate; 23. Double-ended threaded rod; 25. Clamping plate two. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0025] A laser debonding machine, such as Figures 1-5As shown, the device includes a main body 1. Several feeding ports 3 are provided on the outer wall of the main body 1. Conveyor tables 2 are fixedly connected to the outer wall of the main body 1 at the lower edge of the feeding ports 3. A bearing plate 4 is fixedly connected to the outer wall of the main body 1 near the bottom. A transverse groove is provided through the upper surface of the bearing plate 4. A reciprocating screw 5 is rotatably connected inside the transverse groove. A movable block 6 is sleeved on the outside of the reciprocating screw 5. An installation plate 7 is fixedly connected to the upper end of the movable block 6. An installation seat 8 is rotatably connected to the upper surface of the installation plate 7 via a shaft. A robotic arm 9 is rotatably connected to the installation seat 8 via a shaft. A robotic arm 10 is rotatably connected to one end of the robotic arm 9 via a shaft. A fixing plate 11 is fixedly connected to the end of the robotic arm 10 away from the robotic arm 9. A clamping plate 12 and a clamping plate 25 are slidably connected to the bottom surface of the fixing plate 11.
[0026] The bottom surface of the fixed plate 11 is rotatably connected to two double-ended threaded rods 23, and the first clamping plate 12 and the second clamping plate 25 are movably sleeved on the outside of the two double-ended threaded rods 23. Two motors 2 are installed on the outer wall of the fixed plate 11, and the output ends of the two motors 2 are respectively connected to the two double-ended threaded rods 23.
[0027] In use, robotic arms 19 and 10 move the fixing plate 11 to the position of the neatly stacked wafer chip pile, so that clamping plates 12 and 25 are located on both sides of the wafer chip pile. Then, motor 2 drives the double-headed threaded rod 23 to rotate, so that clamping plates 12 and 25 move closer to each other to clamp the wafer chip pile. Each insert plate 13 is inserted between the two stacked wafer chips, so that multiple wafer chips can be clamped at one time, and the wafer chips are clamped in layers so that the wafer chips do not interfere with each other.
[0028] Motor 1 is installed on the outer wall of the bearing plate 4, and the output end of motor 1 is connected to the reciprocating screw 5. Motor 2 is installed on the outer wall of the mounting base 8, and the output end of motor 2 is connected to the robotic arm 9. Motor 3 is installed on the outer wall of robotic arm 9 at the end away from the mounting base 8, and the output end of motor 3 is connected to the robotic arm 10. Motor 4 is installed on the bottom surface of the mounting plate 7, and the output end of motor 4 is connected to the mounting base 8. Motor 2 can drive one end of robotic arm 9 to rotate, and motor 3 can drive one end of robotic arm 10 to rotate, thereby flexibly adjusting the positions of the fixing plate 11, clamping plate 12 and clamping plate 25.
[0029] Specifically, after clamping, the motor on the bottom of the mounting plate 7 drives the mounting base 8 to rotate, which in turn drives the robotic arm 9 and robotic arm 10, as well as the fixing plate 11, to rotate. This causes the clamped wafer chip to rotate closer to the conveyor 2. The motor then drives the reciprocating screw 5 to rotate, which in turn moves the movable block 6 within the transverse groove. Together with the robotic arm 9 and robotic arm 10, the clamped wafer chip can be moved sequentially to the top of each conveyor 2, allowing multiple wafer chips to be placed continuously at once, increasing the loading speed and thus improving the processing efficiency of the wafer chip.
[0030] Several insert plates 13 are movably inserted into the outer walls of both clamp plate 12 and clamp plate 25. Two L-shaped connecting plates 14 are fixedly connected to the outer walls of both clamp plate 12 and clamp plate 25. Several sliding grooves are opened through the outer walls of the two L-shaped connecting plates 14. Sliding rods 15 are fixedly connected inside the sliding grooves. Sliding sliders 16 are sleeved on the outside of the sliding rods 15. One end of the sliding slider 16 is fixedly connected to the insert plate 13. A return spring is sleeved on the outside of the sliding rod 15 and located between the sliding slider 16 and the inner wall of the sliding groove. One end of the return spring is fixedly connected to the sliding slider 16, and the other end of the return spring is fixedly connected to the inner wall of the sliding groove. The initial state is a stretched state.
[0031] Both L-shaped connecting plates 14 have electric telescopic rods 17 installed on their inner walls. A push plate 18 is fixedly connected to one end of each electric telescopic rod 17. Two threaded screws 20 are rotatably connected to the outer walls of clamping plate 12 and clamping plate 25. L-shaped sliding plates 21 are fitted over each of the two threaded screws 20, and a stop bar 19 is fixedly connected between the two L-shaped sliding plates 21. Two motors 1 are installed on the bottom surfaces of clamping plate 12 and clamping plate 25, and the output ends of the two motors 1 are respectively connected to the two threaded screws 20. After a set of wafer chips is placed, the electric telescopic rods... The retractor 17 drives the pusher 18 to move, which can push each insert plate 13 to the initial position. At this time, the motor drives the threaded screw 20 to reverse, which drives the stop bar 19 to move down, which can re-block and limit the position of each insert plate 13. The L-shaped slide plate 21 and the threaded screw 20 are fitted with threads that fit with the threaded screw 20. When the threaded screw 20 rotates, the L-shaped slide plate 21 can be vertically displaced under the cooperation of the threads. Similarly, the clamping plate 12 and the clamping plate 25 can be horizontally displaced when the double-headed threaded rod 23 rotates.
[0032] Specifically, when the clamped wafer chip is moved to the conveyor 2, the screw 20 can be rotated by the motor to move the L-shaped slide plate 21 upward, thereby moving the stop bar 19 upward and releasing the obstruction of the bottom insert plate 13. At this time, under the action of the return spring, the slider 16 moves along the slide groove, moving the insert plate 13 into the L-shaped connecting plate 14, releasing the load limit on the bottom wafer chip. Under the action of gravity, the bottom wafer chip automatically falls onto the conveyor 2. Similarly, the remaining wafer chips are moved to the next conveyor 2, and the load on the wafer chip is released from the next insert plate 13. The wafer chips can be placed on each conveyor 2 in sequence, and finally enter the main body 1 through the feeding port 3 for processing.
[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A laser debonding and bonding integrated machine, comprising a main body (1), characterized in that, The outer wall of the main body (1) has several feeding ports (3). A conveyor table (2) is fixedly connected to the outer wall of the main body (1) at the lower edge of each feeding port (3). A bearing plate (4) is fixedly connected to the outer wall of the main body (1) near the bottom. A transverse groove is opened through the upper surface of the bearing plate (4). A reciprocating screw (5) is rotatably connected inside the transverse groove. A movable block (6) is sleeved on the outside of the reciprocating screw (5). The upper end of the movable block (6) is fixed. A mounting plate (7) is fixedly connected. A mounting base (8) is rotatably connected to the upper surface of the mounting plate (7) via a shaft. A mechanical arm (9) is rotatably connected inside the mounting base (8) via a shaft. A mechanical arm (10) is rotatably connected to one end of the mechanical arm (9) via a shaft. A fixing plate (11) is fixedly connected to the end of the mechanical arm (10) away from the mechanical arm (9). A clamping plate (12) and a clamping plate (25) are slidably connected to the bottom surface of the fixing plate (11).
2. The laser debonding and bonding integrated machine according to claim 1, characterized in that, Both the first clamp (12) and the second clamp (25) have several insert plates (13) movably inserted into their outer walls, and both the first clamp (12) and the second clamp (25) have two L-shaped connecting plates (14) fixedly connected to their outer walls.
3. The laser debonding and bonding integrated machine according to claim 2, characterized in that, The outer walls of the two L-shaped connecting plates (14) are provided with several sliding grooves, and a sliding rod (15) is fixedly connected inside each of the sliding grooves. A slider (16) is sleeved on the outside of each of the sliding rods (15), and one end of the slider (16) is fixedly connected to the insert plate (13). A return spring is sleeved on the outside of the sliding rod (15) and located between the slider (16) and the inner wall of the sliding groove.
4. The laser debonding and bonding integrated machine according to claim 2, characterized in that, Electric telescopic rods (17) are installed on the inner walls of the two L-shaped connecting plates (14). A push plate (18) is fixedly connected to one end of the electric telescopic rod (17). Two threaded screws (20) are rotatably connected to the outer walls of the first clamping plate (12) and the second clamping plate (25). An L-shaped sliding plate (21) is sleeved on the outside of the two threaded screws (20). A stop bar (19) is fixedly connected between the two L-shaped sliding plates (21). Two motors are installed on the bottom surfaces of the clamping plate one (12) and the clamping plate two (25), and the output ends of the two motors are respectively connected to two threaded screws (20).
5. A laser debonding and bonding integrated machine according to claim 4, characterized in that, The bottom surface of the fixed plate (11) is rotatably connected to two double-headed threaded rods (23), and the first clamping plate (12) and the second clamping plate (25) are movably sleeved on the outside of the two double-headed threaded rods (23). Two motors are installed on the outer wall of the fixed plate (11), and the output ends of the two motors are respectively connected to the two double-headed threaded rods (23).
6. A laser debonding and bonding integrated machine according to claim 1, characterized in that, Motor 1 is installed on the outer wall of the bearing plate (4), and the output end of motor 1 is connected to the reciprocating screw (5). Motor 2 is installed on the outer wall of the mounting base (8), and the output end of motor 2 is connected to the robotic arm 1 (9). Motor 3 is installed on the outer wall of the robotic arm 1 (9) at a position away from the mounting base (8), and the output end of motor 3 is connected to the robotic arm 2 (10). Motor 4 is installed on the bottom surface of the mounting plate (7), and the output end of motor 4 is connected to the mounting base (8).