Bearing device

Abstract

The utility model relates to the technical field of wafer testing, and particularly discloses a bearing device which comprises a bearing disc, a heating piece, a controller and a plurality of first temperature detection pieces. Wherein the bearing disc is provided with a first end face and a second end face which are oppositely arranged, and the first end face is used for bearing a wafer; the heating piece is arranged on the second end face of the bearing disc and provided with a plurality of independent heating parts. The first temperature detection pieces are arranged in the bearing disc, detection parts of the first temperature detection pieces can penetrate out of the first end face so as to abut against the wafer and detect the temperature of the wafer, and the first temperature detection pieces and the heating parts are arranged in a one-to-one correspondence mode; and the controller is in communication connection with each first temperature detection piece and each heating part. According to the above arrangement, each heating part can be controlled to carry out heating or cooling, so that the temperatures of all parts of the bearing disc are kept consistent, finally, the temperatures of all parts of the wafer are uniform, and the accuracy of a wafer test result is ensured.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a carrier device. Background Technology

[0002] The current probe station's carrier plate surface temperature ranges from -55℃ to 150℃, with surface temperature uniformity within ±1℃. To achieve uniform temperature control, the carrier plate typically consists of a heating element, a flow channel plate, and a suction cup. The flow channel plate is positioned between the heating element and the suction cup. The heating element heats the suction cup, and the flow channel plate connects to an external chiller, allowing a cryogenic liquid to circulate within its channels, thus cooling the suction cup. The suction cup is usually equipped with a temperature sensor to monitor the internal temperature of the carrier plate in real time, and a temperature controller is used for real-time temperature control.

[0003] The heat generated at each part of the heating element is uniform, which heats the entire chuck. However, due to the structural differences at different parts of the flow channel and the chuck, the heat transfer is uneven, resulting in uneven temperature of the wafer supported on the surface of the chuck, which ultimately affects the test results of the wafer.

[0004] Therefore, it is urgent to study a support device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a support device to solve the problem in the prior art where the temperature of the wafer supported on the surface of the suction cup is uneven, thus affecting the test results.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] The support device includes:

[0008] A carrier disk having a first end face and a second end face disposed opposite to each other, the first end face being used to carry a wafer;

[0009] A heating element is disposed on the second end face of the bearing plate, and the heating element has a plurality of independent heating parts;

[0010] A plurality of first temperature detection elements are disposed inside the carrier disk; the detection part of the first temperature detection element can extend out of the first end face to abut against the wafer and detect the temperature of the wafer; each first temperature detection element is arranged in a one-to-one correspondence with each heating element.

[0011] The controller is communicatively connected to each of the first temperature sensors and to each of the heating elements.

[0012] As an optional technical solution for the support device, the support plate has a plurality of first receiving slots, and the unidirectional end of each first receiving slot penetrates the first end face; each first temperature detection element is correspondingly disposed in each first receiving slot, and can reciprocate relative to the support plate along its own axis, so that the detection part of each first temperature detection element extends out of the first end face or retracts into the first receiving slot.

[0013] As an optional technical solution for a support device, the first temperature sensing element is provided with a first elastic element at one end along its own axis and a sensing part for detecting the temperature of the wafer at the other end; if a wafer is placed on the first end face, the sensing part of the first temperature sensing element contacts the wafer surface and is forced to retract into the first receiving groove, and the first elastic element is compressed.

[0014] As an optional technical solution for the bearing device, the other end of the first receiving groove penetrates through the second end face to form a first opening. The bearing device also includes a stop member, which is disposed on the second end face of the bearing plate and is used to block the first opening of the first receiving groove. The first elastic member is disposed in the first receiving groove, and its two ends along its own axis are respectively connected to the first temperature detection member and the stop member.

[0015] As an optional technical solution for the support device, the support device further includes a plurality of second temperature detection elements, each of which is communicatively connected to the controller. Each second temperature detection element is disposed inside the support plate and is configured to correspond one-to-one with each of the heating parts. The support plate is divided into heating areas corresponding one-to-one with each of the heating parts. Each second temperature detection element is configured to detect the temperature of each of the heating areas of the support plate.

[0016] As an optional technical solution for the support device, the support plate has a second receiving groove, the second opening of the second receiving groove penetrates the second end face, and the second temperature detection element is placed in the second receiving groove.

[0017] As an optional technical solution for the bearing device, the bearing device further includes a stop member, which is disposed on the second end face of the bearing plate and is used to block the second opening of the second receiving groove.

[0018] As an optional technical solution for the bearing device, the second accommodating groove is provided with a second elastic element, and the two ends of the second elastic element along its own axis are respectively connected to the second temperature detection element and the stop element.

[0019] As an optional technical solution for a support device, the support plate includes a suction cup and a flow channel plate arranged in layers. The suction cup and the flow channel plate are integrally formed, and the heating element is located on the side of the flow channel plate opposite to the suction cup.

[0020] The flow channel plate has a flow channel for refrigerant to flow inside, and a refrigerant inlet and a refrigerant outlet are opened on the circumferential side of the flow channel plate for refrigerant to enter and exit. The refrigerant inlet and the refrigerant outlet are both connected to the flow channel.

[0021] As an optional technical solution for the carrier device, the suction cup has a first adsorption part and a second adsorption part, the outer diameter of the first adsorption part is larger than the outer diameter of the second adsorption part, and the first adsorption part and the second adsorption part are used to adsorb wafers of different diameters respectively; the suction cup also has a first channel and a second channel inside, the first channel is connected between the first adsorption part and the external vacuum passage, and the second channel is connected between the second adsorption part and the external vacuum passage.

[0022] The beneficial effects of this utility model are as follows:

[0023] This utility model provides a carrier device, which includes a carrier plate, a heating element, and a plurality of first temperature testing elements. The first end face of the carrier plate is used to support the wafer. The heating element is disposed on the second end face of the carrier plate and includes a plurality of heating sections, each of which can individually heat a corresponding heating area of ​​the carrier plate. The plurality of first temperature testing elements are disposed inside the carrier plate and their testing sections can extend out of the first end face to contact the wafer and detect its temperature, thereby detecting the temperature at various points on the wafer. Each first temperature testing element is configured in a one-to-one correspondence with each heating section. In use, each first temperature testing element transmits its detected temperature signal to a controller, which can control each heating section to heat up or cool down, thereby achieving a consistent temperature across the carrier plate and ultimately ensuring uniform temperature across the wafer surface, thus guaranteeing the accuracy of the wafer testing results. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0025] Figure 1 This is an exploded structural diagram of the bearing device in an embodiment of this utility model;

[0026] Figure 2This is a schematic diagram of the internal structure of the bearing device from a first-view perspective in an embodiment of this utility model;

[0027] Figure 3 This is a schematic diagram of the internal structure of the supporting device from a second perspective in an embodiment of this utility model.

[0028] In the picture:

[0029] 100, Support plate; 101, Flow channel plate; 102, Suction cup; 110, First end face; 120, Second end face; 130, Flow channel; 131, Refrigerant inlet; 132, Refrigerant outlet; 140, First adsorption section; 141, First channel; 150, Second adsorption section; 151, Second channel;

[0030] 200. Heating element; 210. Heating section;

[0031] 310. First temperature sensing element; 320. Second temperature sensing element;

[0032] 400. Stop components;

[0033] 510. First elastic element; 520. Second elastic element. Detailed Implementation

[0034] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0035] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0036] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0037] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0038] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0039] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0040] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0041] like Figures 1 to 3As shown, this embodiment provides a carrier device, which includes a carrier plate 100, a heating element 200, a controller, and a plurality of first temperature detection elements 310. The carrier plate 100 has a first end face 110 and a second end face 120 disposed opposite to each other. The first end face 110 is used to carry a wafer. The heating element 200 is disposed on the second end face 120 of the carrier plate 100, and the heating element 200 has a plurality of independent heating parts 210, each of which can generate heat and transfer heat to the carrier plate 100. The first temperature detection elements 310 are disposed inside the carrier plate 100, and their detection parts can extend out of the first end face 110 to contact the wafer and detect the temperature of the wafer surface. Each first temperature detection element 310 is arranged in a one-to-one correspondence with each heating part 210. The controller is communicatively connected to each first temperature detection element 310 and to each heating part 210.

[0042] With the above setup, during use, each first temperature sensor 310 transmits its detected temperature signal to the controller, which can then control each heating element 210 to heat up or cool down, thereby ensuring that the temperature remains consistent throughout the carrier disk 100, ultimately resulting in uniform temperature across the wafer surface and guaranteeing the accuracy of the wafer test results.

[0043] To prevent damage to the wafer when the first temperature sensing element 310 supports it, in some embodiments, the carrier disk 100 has a plurality of first receiving grooves, each with a co-directional end penetrating the first end face 110. Each first temperature sensing element 310 is correspondingly disposed within its respective first receiving groove and can reciprocate relative to the carrier disk 100 along its own axis, allowing the sensing portion of each first temperature sensing element 310 to extend out of the first end face 110 or retract into the first receiving groove. When the wafer is placed on the first end face 110, the first temperature sensing element 310 is compressed back until its sensing portion is flush with the first end face 110, thus allowing it to simultaneously support the wafer and detect its surface temperature, effectively preventing damage to the wafer.

[0044] To avoid hard contact between the first temperature sensing element 310 and the wafer, in some embodiments, the first temperature sensing element 310 has a first elastic element 510 at one end along its own axis and a sensing part for detecting the wafer temperature at the other end. When a wafer is placed on the first end face 110, the sensing part of the first temperature sensing element 310 contacts the wafer surface and is forced back into the first receiving groove, and the first elastic element 510 is compressed. When no wafer is placed on the first end face 110, the first elastic element 510 relaxes, causing the sensing part of the first temperature sensing element 310 to extend out of the first end face 110 and protrude from the first end face 110, so as to avoid a gap between the wafer and the sensing part when the wafer is placed.

[0045] Regarding the installation of the first elastic element 510 and the first temperature sensing element 310, in some embodiments, the other end of the first receiving groove penetrates through the second end face 120 to form a first opening. The supporting device also includes a stop 400, which is disposed on the second end face 120 of the supporting plate 100 and used to block the first opening of the first receiving groove. The first elastic element 510 is disposed in the first receiving groove, and its two ends along its own axis are respectively connected to the first temperature sensing element 310 and the stop 400. The above arrangement improves the installation efficiency of the first temperature sensing element 310 and the first elastic element 510. In addition, the arrangement of the first elastic element 510 leaves more gaps between the stop 400 and the first temperature sensing element 310, thereby reducing the influence of the temperature of the stop 400 on the first temperature sensing element 310 and ensuring the accuracy of the first temperature sensing element 310 in detecting the wafer temperature. Finally, it also helps to simplify the structure and reduce processing costs. Among them, the stop 400 is a plate-shaped structure, and the stop 400 and the bearing plate 100 are screwed or snapped together.

[0046] To limit the length of the detection portion of the first temperature sensing element 310 extending beyond the first end face 110, in some embodiments, the first receiving groove includes a receiving portion and a through portion that are connected. The cross-sectional diameter of the receiving portion is larger than the cross-sectional diameter of the through portion. The end of the receiving portion away from the through portion extends through the second end face 120, and the end of the through portion away from the receiving portion extends through the first end face 110. The first temperature sensing element 310 includes a sensing body and a sensing rod disposed on the sensing body. The end of the sensing rod away from the sensing body forms a sensing portion. The outer diameter of the sensing body is larger than the outer diameter of the sensing rod and larger than the cross-sectional diameter of the through portion. The sensing body is located in the receiving portion, and the sensing rod is located in the through portion. This arrangement achieves hard limiting through the stepped surface between the receiving portion and the through portion, and the stepped surface between the sensing body and the sensing rod, thereby limiting the maximum distance of the sensing portion extending beyond the first end face 110.

[0047] In other embodiments, the first receiving groove can also be configured as a structure with the same cross-sectional diameter at all locations, and the distance by which the detection part extends out of the first end face 110 is limited only by the length of the first elastic member 510 in the free state, so as to reduce the processing difficulty of the first receiving groove and reduce the cost.

[0048] In some embodiments, the heating element 200 has nine heating sections 210, eight of which surround the outer periphery of one of the heating sections 210. Nine first temperature sensing elements 310 are also provided and arranged corresponding to the nine heating sections 210. To achieve control of the wafer temperature, the heating element 200 can be divided into even more independently controllable heating sections 210.

[0049] The carrier device also includes several second temperature detection elements 320, each communicatively connected to the controller. Each second temperature detection element 320 is located inside the carrier disk 100 and corresponds one-to-one with each heating element 210. The carrier disk 100 is divided into multiple heating areas, each corresponding to one heating element 210, allowing for individual heating of the corresponding heating area of ​​the carrier disk 200 by a heating element 210. Each second temperature detection element 320 is configured to detect the temperature of its corresponding heating area on the carrier disk 100. In use, the temperature of the carrier disk 100 is first controlled by the second temperature detection elements 320 and the heating elements 210, ensuring a uniform temperature across the carrier disk 100. Then, the wafer is placed on the first end face 110, ensuring a uniform heating rate throughout the wafer heating process.

[0050] To facilitate the installation of the second temperature sensor 320, the carrier plate 100 has a second receiving groove, the second opening of the second receiving groove penetrates the second end face 120, the second temperature sensor 320 is placed in the second receiving groove, and the carrier device also includes a stop 400, which is provided on the second end face 120 of the carrier plate 100 and is used to block the second opening of the second receiving groove and support the second temperature sensor 320.

[0051] If the length of the second temperature sensing element 320 is less than the length of the second receiving groove, the second temperature sensing element 320 may move. To avoid this, in some embodiments, the supporting device further includes a second elastic element 520. The second elastic element 520 is disposed in the second receiving groove, and its two ends along its own axis are respectively connected to the second temperature sensing element 320 and the stop element 400. The provision of the second elastic element 520 reduces the processing difficulty of the second temperature sensing element 320 and the second receiving groove. In addition, the provision of the second elastic element 520 allows for a larger gap between the stop element 400 and the second temperature sensing element 320, thereby reducing the influence of the temperature of the stop element 400 on the second temperature sensing element 320, thus ensuring the accuracy of the second temperature sensing element 320 in detecting the temperature of the supporting plate 100.

[0052] To accelerate the heating rate of the support plate 100, the temperature of the heating element 200 needs to be appropriately increased. However, a high-temperature heating element 200 can easily cause the support plate 100 to exceed its preset temperature. Therefore, it is also necessary to cool the support plate 100 promptly after its temperature rises. For this purpose, in this embodiment, the support plate 100 includes a suction cup 102 and a flow channel plate 101 arranged in layers. The suction cup 102 and the flow channel plate 101 are integrally formed, and the heating element 200 is located on the side of the flow channel plate 101 facing away from the suction cup 102. The flow channel plate 101 has a flow channel 130 inside for refrigerant flow, and a refrigerant inlet 131 and a refrigerant outlet 132 are opened on the circumferential side of the flow channel plate 101 for refrigerant entry and exit. Both the refrigerant inlet 131 and the refrigerant outlet 132 are connected to the flow channel 130. The refrigerant inlet 131 and the refrigerant outlet 132 are configured to connect to an external refrigeration unit. The refrigeration unit and the controller are communicatively connected. By introducing a low-temperature refrigerant (such as chilled water) into the flow channel plate 101 through an external refrigeration unit, the temperature of the support plate 100 can be reduced in a timely manner, thereby bringing it to the preset temperature. This configuration helps improve the temperature control efficiency of the support plate 100; at the same time, avoiding the need for a sandwich structure between the heating element 200 and the support plate 100 also improves heat transfer efficiency and shortens the temperature control time to some extent.

[0053] In some embodiments, the suction cup 102 has a first adsorption portion 140 and a second adsorption portion 150. The outer diameter of the first adsorption portion 140 is larger than the outer diameter of the second adsorption portion 150. The first adsorption portion 140 and the second adsorption portion 150 are used to adsorb wafers of different diameters, respectively. The suction cup 102 also has a first channel 141 and a second channel 151 inside. The first channel 141 connects the first adsorption portion 140 and the external vacuum passage, and the second channel 151 connects the second adsorption portion 150 and the external vacuum passage, thereby realizing the adsorption of wafers of different types (such as 8-inch wafers and 12-inch wafers). Specifically, the first adsorption portion 140 includes a plurality of first annular grooves of different diameters and concentrically arranged, recessed in the first end face 110. The bottom of each first annular groove is connected to the first channel 141. The second adsorption portion 150 includes a plurality of second annular grooves of different diameters and concentrically arranged, recessed in the second end face 120. The bottom of each second annular groove is connected to the second channel 151.

[0054] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A bearing device, characterized in that, include: A carrier disk (100) has a first end face (110) and a second end face (120) disposed opposite to each other, the first end face (110) being used to carry a wafer; A heating element (200) is disposed on the second end face (120) of the support plate (100), and the heating element (200) has a plurality of independent heating parts (210); A plurality of first temperature detection elements (310) are disposed inside the carrier disk (100); the detection part of the first temperature detection element (310) can extend out of the first end face (110) to abut against the wafer and detect the temperature of the wafer; each first temperature detection element (310) is arranged in a one-to-one correspondence with each heating part (210); The controller is communicatively connected to each of the first temperature detection elements (310) and to each of the heating elements (210).

2. The bearing device according to claim 1, characterized in that, The carrier plate (100) has a plurality of first receiving slots, and the co-directional end of each first receiving slot penetrates the first end face (110); each first temperature detection element (310) is correspondingly disposed in each first receiving slot, and can reciprocate relative to the carrier plate (100) along its own axis, so that the detection part of each first temperature detection element (310) extends out of the first end face (110) or retracts into the first receiving slot.

3. The bearing device according to claim 2, characterized in that, The first temperature sensing element (310) has a first elastic element (510) at one end along its own axis and a sensing part for detecting the temperature of the wafer at the other end. If a wafer is placed on the first end face (110), the sensing part of the first temperature sensing element (310) contacts the wafer surface and is forced to retract into the first receiving groove, and the first elastic element (510) is compressed.

4. The bearing device according to claim 3, characterized in that, The other end of the first receiving groove penetrates the second end face (120) to form a first opening. The bearing device also includes a stop (400), which is disposed on the second end face (120) of the bearing plate (100) and is used to block the first opening of the first receiving groove. The first elastic member (510) is disposed in the first receiving groove, and its two ends along its own axis are respectively connected to the first temperature detection member (310) and the stop (400).

5. The bearing device according to claim 1, characterized in that, The support device further includes a plurality of second temperature detection elements (320) that are all communicatively connected to the controller. Each second temperature detection element (320) is disposed inside the support plate (100) and is arranged in a one-to-one correspondence with each of the heating parts (210). The support plate (100) is divided into heating areas that correspond one-to-one with each of the heating parts (210). Each second temperature detection element (320) is configured to detect the temperature of each of the heating areas of the support plate (100).

6. The bearing device according to claim 5, characterized in that, The carrier plate (100) has a second receiving groove, the second opening of the second receiving groove penetrates the second end face (120), and the second temperature detection element (320) is placed in the second receiving groove.

7. The bearing device according to claim 6, characterized in that, The bearing device further includes a stop (400), which is disposed on the second end face (120) of the bearing plate (100) and is used to block the second opening of the second receiving groove.

8. The bearing device according to claim 7, characterized in that, The second accommodating groove is provided with a second elastic element (520), and the two ends of the second elastic element (520) along its own axis are respectively connected to the second temperature detection element (320) and the stop element (400).

9. The bearing device according to claim 1, characterized in that, The carrier plate (100) includes a suction cup (102) and a flow channel plate (101) arranged in layers. The suction cup (102) and the flow channel plate (101) are integrally formed, and the heating element (200) is located on the side of the flow channel plate (101) away from the suction cup (102). The flow channel plate (101) is provided with a flow channel (130) for refrigerant flow inside, and a refrigerant inlet (131) and a refrigerant outlet (132) are provided on the circumferential side of the flow channel plate (101) for refrigerant to enter and exit. The refrigerant inlet (131) and the refrigerant outlet (132) are both connected to the flow channel (130).

10. The bearing device according to claim 9, characterized in that, The suction cup (102) has a first adsorption part (140) and a second adsorption part (150). The outer diameter of the first adsorption part (140) is larger than the outer diameter of the second adsorption part (150). The first adsorption part (140) and the second adsorption part (150) are used to adsorb wafers of different diameters, respectively. The suction cup (102) also has a first channel (141) and a second channel (151) inside. The first channel (141) is connected between the first adsorption part (140) and the external vacuum passage, and the second channel (151) is connected between the second adsorption part (150) and the external vacuum passage.

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