Wafer grabbing and transplanting device

Abstract

The utility model discloses a wafer grabbing and transplanting device which comprises a rack, a sliding block is arranged on the rack, and the sliding block can slide up and down under the driving of a driving assembly; fixing rods are symmetrically arranged on the sliding block, a supporting plate is quickly connected to the fixing rods, and a grabbing device used for grabbing the flower basket is fixedly arranged on the supporting plate; the rack is further provided with a gear meshed with a rack on a machine tool, and the gear can be driven by a driving source to slide on the rack along the central axis of the rack. The wafer transfer device has the main beneficial effects that the design is exquisite, the batch transfer of wafers can be realized, and meanwhile, the lead screw transmission is adopted by utilizing the characteristics of high precision and stable movement of the lead screw transmission, so that the precision requirement of wafer transfer can be met. In addition, the operation is stable and reliable, disassembly, replacement and maintenance are convenient, and the working efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more particularly to a wafer gripping and transfer device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Currently, domestic wafer production lines mainly use 8-inch and 12-inch wafers, and transfer equipment is needed to move the wafers during inspection and etching.

[0003] For example, patent publication number CN 215680644 U discloses a contactless wafer transfer device, including a transfer bracket. A suction mechanism is mounted on one side of the transfer bracket for contactless wafer suction and fixation. The suction mechanism includes a Y-shaped gripper mounted on one side of the transfer bracket. High-pressure air chambers are formed on both sides of the Y-shaped gripper, and jet holes are uniformly formed at the top of the high-pressure air chambers. Deflecting columns are provided inside the jet holes, and a guide plate is mounted on one side of the top of the deflecting columns. A transfer mechanism is provided between the Y-shaped gripper and the transfer bracket. However, this device can only pick up and transfer wafers one by one, resulting in low efficiency, complex structure, and high cost, which is not conducive to mass production and has significant limitations. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a wafer gripping and transfer device.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A wafer gripping and transfer device includes a frame with a sliding block that can slide up and down under the drive of a drive assembly; symmetrically arranged fixed rods are provided on the sliding block, and a support plate is quickly connected to the fixed rod; a gripping device for gripping a basket is fixed on the support plate; the frame is also provided with a gear that meshes with a rack on a machine tool, and the gear can be driven by a drive source to slide along its central axis on the rack.

[0007] Preferably, the drive assembly includes at least a guide rail fixed on the frame, a guide block adapted to the guide rail, a drive block fixed on the guide block, symmetrically arranged support rods fixed on the drive block, and a sliding block fixed on the support rods.

[0008] Preferably, the frame is fixedly provided with a transmission block, the transmission block is provided with a transmission screw adapted to it, the transmission screw is provided with a transmission nut adapted to it, and the drive block is fixedly provided on the transmission nut.

[0009] Preferably, a drive motor is also fixed on the frame, the drive motor is located on one side of the transmission lead screw, and the motor shaft of the drive motor is parallel to the transmission lead screw; a driving wheel is fixed on the motor shaft of the drive motor, a driven wheel is fixed on the transmission lead screw, and the driven wheel and the driving wheel are connected by a transmission belt.

[0010] Preferably, the drive source includes at least a conveyor motor fixed on the frame, a reducer fixed on the motor shaft of the conveyor motor, the conveyor shaft fixed on the reducer, and a gear fixed on the conveyor shaft.

[0011] Preferably, a guide block is also fixed on the frame, and the guide block is adapted to the guide rail fixed on the machine tool.

[0012] Preferably, the gripping device includes at least gripping cylinders fixed on both sides of the support plate, and grippers are fixed on the cylinder shaft of the gripping cylinder.

[0013] The beneficial effects of this utility model are mainly reflected in:

[0014] 1. With its ingenious design, this device enables batch wafer transfer. Furthermore, the use of a lead screw drive leverages its high precision and stable movement to meet the accuracy requirements of wafer transfer. In addition, the operation is stable and reliable, and it is easy to disassemble, replace, and maintain, greatly improving work efficiency.

[0015] 2. The drive motor is located on one side of the transmission screw, which can reduce the overall axial dimension of the device, achieve high integration, reduce the space occupied, and make the layout more reasonable and compact, which is convenient for reasonable layout. Attached Figure Description

[0016] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0017] Figure 1 : A perspective view of the preferred embodiment of this utility model in the first direction;

[0018] Figure 2 : A perspective view of the preferred embodiment of this utility model in the second direction. Detailed Implementation

[0019] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments are not limited to the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the protection scope of the present invention.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] like Figures 1 to 2 As shown, this utility model discloses a wafer gripping and transfer device, including a frame 1. A sliding block 2 is provided on the frame 1, and the sliding block 2 can slide up and down under the drive of a driving assembly 3. The driving assembly 3 includes at least a guide rail 31 fixed on the frame 1. A guide block 32 adapted to the guide rail 31 is provided on the guide rail 31. A driving block 33 is fixed on the guide block 32, and symmetrically arranged support rods 34 are fixed on the driving block 33. The sliding block 2 is fixed on the support rods 34.

[0023] In the above-described configuration, the frame 1 is fixedly equipped with a transmission block 35, and the transmission block 35 is equipped with a transmission screw 36 adapted to it. The transmission screw 36 is equipped with a transmission nut adapted to it, and the drive block 33 is fixedly mounted on the transmission nut. The use of screw drive leverages its high precision and stable movement characteristics, meeting the precision requirements of wafer transfer. This operation is stable and reliable, and facilitates disassembly, replacement, and maintenance, greatly improving work efficiency.

[0024] A drive motor 37 is also fixedly mounted on the frame 1. The drive motor 37 is located on one side of the transmission screw 36, and the motor shaft of the drive motor 37 is parallel to the transmission screw 36. A drive wheel is fixedly mounted on the motor shaft of the drive motor 37, and a driven wheel is fixedly mounted on the transmission screw 36. The driven wheel and the drive wheel are connected by a transmission belt 38. The fact that the drive motor 37 is located on one side of the transmission screw 36 can reduce the overall axial dimension of the device, achieve high integration, reduce the space occupied, and make the layout more reasonable and compact, facilitating a rational layout.

[0025] The sliding block 2 is provided with symmetrically arranged fixed rods 4, and a support plate 5 is quickly connected to the fixed rods 4. A gripping device 6 for gripping the flower basket is fixed on the support plate 5. The gripping device 6 includes at least gripping cylinders 61 fixed on both sides of the support plate 5. A gripper 62 is fixed on the cylinder shaft of the gripping cylinder 61.

[0026] The frame 1 is also provided with a gear 7 that meshes with a rack 100 on the machine tool. The gear 7 can be driven by a drive source 8 to slide along its central axis on the rack 100. The drive source 8 includes at least a conveyor motor 81 fixed on the frame 1. A reducer 82 is fixed on the motor shaft of the conveyor motor 81. The conveyor shaft is fixed on the reducer 82, and the gear 7 is fixed on the conveyor shaft. A guide block 11 is also fixed on the frame 1, and the guide block 11 is adapted to the guide rail 101 fixed on the machine tool.

[0027] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0028] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer gripping and transfer device, comprising a frame (1), characterized in that: The frame (1) is provided with a sliding block (2), which can slide up and down under the drive of the drive assembly (3); the sliding block (2) is provided with a symmetrically arranged fixed rod (4), and a support plate (5) is quickly connected to the fixed rod (4). A gripping device (6) for gripping the flower basket is fixed on the support plate (5); the frame (1) is also provided with a gear (7) that meshes with the rack (100) on the machine tool. The gear (7) can be driven by the drive source (8) to slide along the central axis of the rack (100).

2. The wafer gripping and transfer device according to claim 1, characterized in that: The drive assembly (3) includes at least a guide rail (31) fixed on the frame (1), a guide block (32) adapted to the guide rail (31), a drive block (33) fixed on the guide block (32), a symmetrically arranged support rod (34) fixed on the drive block (33), and a sliding block (2) fixed on the support rod (34).

3. The wafer gripping and transfer device according to claim 2, characterized in that: The frame (1) is fixedly provided with a transmission block (35), the transmission block (35) is provided with a transmission screw (36) adapted to it, the transmission screw (36) is provided with a transmission nut adapted to it, and the drive block (33) is fixedly provided on the transmission nut.

4. The wafer gripping and transfer device according to claim 3, characterized in that: A drive motor (37) is also fixed on the frame (1). The drive motor (37) is located on one side of the transmission screw (36), and the motor shaft of the drive motor (37) is parallel to the transmission screw (36). A drive wheel is fixed on the motor shaft of the drive motor (37), and a driven wheel is fixed on the transmission screw (36). The driven wheel and the drive wheel are connected by a transmission belt (38).

5. The wafer gripping and transfer device according to claim 4, characterized in that: The drive source (8) includes at least a conveyor motor (81) fixed on the frame (1), a reducer (82) fixed on the motor shaft of the conveyor motor (81), a conveyor shaft fixed on the reducer (82), and a gear (7) fixed on the conveyor shaft.

6. The wafer gripping and transfer device according to claim 5, characterized in that: The frame (1) is also fixed with a guide block (11), which is adapted to the guide rail (101) fixed on the machine tool.

7. The wafer gripping and transfer device according to claim 6, characterized in that: The gripping device (6) includes at least gripping cylinders (61) fixed on both sides of the support plate (5), and grippers (62) are fixed on the cylinder shaft of the gripping cylinder (61).

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