Permanent magnet synchronous motor
By introducing a combination structure of semiconductor cooling chip and finned heat conduction block into the permanent magnet synchronous motor, the problem of insufficient heat dissipation performance under high temperature environment is solved, and the motor can operate stably at high temperature.
Patent Information
- Application Number
- CN202522190763.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-16
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2035-10-16
AI Technical Summary
In high-temperature environments, the heat dissipation performance of existing permanent magnet synchronous motors is affected by the high-temperature airflow flowing through the motor body, resulting in unstable operation of the motor at high temperatures.
Introducing a semiconductor cooling chip into a permanent magnet synchronous motor, which is connected between the motor body and the air guide shroud via an mounting sleeve, utilizes the heat-conducting fins on the cooling and heat dissipation surfaces of the semiconductor cooling chip to form an air guide channel, reducing the airflow temperature and improving heat exchange efficiency.
It improves the heat dissipation and stability of permanent magnet synchronous motors in high-temperature environments, ensuring that the motor can operate normally for a long time under high-temperature conditions.
Smart Images

Figure CN223625686U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of motor technology, and in particular to a permanent magnet synchronous motor. Background Technology
[0002] A permanent magnet synchronous motor (PMSM) is a synchronous motor that uses permanent magnets to generate a magnetic field. Its rotor speed is consistent with the current frequency of the stator winding. It has advantages such as high efficiency, good dynamic response performance, and low noise. In order to ensure the heat dissipation performance of the PMSM, a shroud is generally set at the rear end of the motor body. A cooling fan connected to the shaft is installed inside the shroud. The airflow generated by the cooling fan from the rear end to the front end of the motor body, together with the heat dissipation fins formed on the motor body, provides forced air cooling for the PMSM. However, in high-temperature environments, the high temperature of the airflow flowing through the motor body will have a certain impact on the heat dissipation performance of the PMSM, thus affecting the normal operation of the PMSM.
[0003] To address the aforementioned problems, this utility model provides improvements. Utility Model Content
[0004] This invention proposes a permanent magnet synchronous motor, which solves the aforementioned problems existing in the use of the prior art.
[0005] The technical solution of this utility model is implemented as follows:
[0006] A permanent magnet synchronous motor includes a body, a shroud, and a cooling fan. A plurality of first heat dissipation fins are formed on the outer wall of the body, and a heat dissipation airflow channel is formed between adjacent first heat dissipation fins. The shroud is fixedly connected to the rear end of the body. The cooling fan is connected to the rotating shaft of the body and located inside the shroud. The port of the shroud extends towards the front end of the body and covers the first heat dissipation fins. A mounting sleeve located inside the shroud and covering the first heat dissipation fins is fitted onto the body. A plurality of semiconductor cooling chips are arranged in a ring along the axis of the mounting sleeve. The cooling surface of the semiconductor cooling chips is located between the inner wall of the mounting sleeve and the outer wall of the body, and the heat dissipation surface of the semiconductor cooling chips is located between the outer wall of the mounting sleeve and the inner wall of the shroud.
[0007] Preferably, a first fin heat-conducting block and a second fin heat-conducting block are respectively provided on the cooling surface and the heat dissipation surface of the semiconductor cooling chip. The mounting sleeve has a plurality of mounting holes. The first fin heat-conducting block is placed on the outer wall of the mounting sleeve so that the fins of the first fin heat-conducting block pass through the mounting holes and are located on one side of the heat dissipation air duct port. A first bolt passes through the first fin heat-conducting block and is screwed onto the mounting sleeve.
[0008] Preferably, a plurality of first support plates are formed on the inner wall of the mounting sleeve, each located between two adjacent first fin heat-conducting blocks, and the first support plates abut against the outer wall of the machine body and are connected to the first heat dissipation fins.
[0009] Preferably, a plurality of first positioning grooves matching the first support plate are formed on the outer wall of the machine body, and the end of the first support plate is inserted into the first positioning groove.
[0010] Preferably, a plurality of second support plates are formed on the inner wall of the air guide shroud, each located between two adjacent second fin heat-conducting blocks. The second support plates abut against the outer wall of the mounting sleeve. A plurality of second bolts are threaded through the mounting sleeve and screwed onto the machine body on the air guide shroud.
[0011] Preferably, the outer wall of the mounting sleeve has a plurality of second positioning grooves that match the second support plate, and the end of the second support plate is inserted into the second positioning groove.
[0012] Preferably, a plurality of second heat dissipation fins are formed on the outer wall of the air guide shroud.
[0013] Preferably, the outer wall of the mounting sleeve is coated with a heat-insulating coating.
[0014] In summary, the beneficial effects of this utility model are as follows: by using the semiconductor cooling chip to reduce the temperature of the airflow entering the heat dissipation duct, the heat exchange efficiency of the airflow when it flows through the heat dissipation duct is improved, thereby improving the heat dissipation effect of this permanent magnet synchronous motor and ensuring that the permanent magnet synchronous motor can work stably for a long time in a high-temperature environment. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the structure of this utility model;
[0017] Figure 2 This is a cross-sectional schematic diagram of the present invention;
[0018] Figure 3 This is an exploded view of the present invention;
[0019] Figure 4 This is a schematic diagram of the structure of the air guide shroud in this utility model;
[0020] Figure 5 This is a schematic diagram of the structure of the mounting sleeve in this utility model;
[0021] Figure 6 This is a schematic diagram of the structure of the semiconductor cooling chip in this utility model.
[0022] In the diagram: 1. Body; 11. First heat dissipation fin; 12. Heat dissipation duct; 13. First positioning groove; 2. Air guide cover; 21. Second support plate; 22. Second bolt; 23. Second heat dissipation fin; 3. Cooling fan; 4. Mounting sleeve; 41. Mounting port; 42. First support plate; 43. Second positioning groove; 5. Semiconductor cooling chip; 51. First fin heat conduction block; 52. Second fin heat conduction block; 53. First bolt. Detailed Implementation
[0023] The following will refer to the appendix in the embodiments of this utility model. Figure 1-6 The technical solutions in the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0024] As shown in the figure, a permanent magnet synchronous motor includes a body 1, a shroud 2, and a cooling fan 3. A plurality of first heat dissipation fins 11 are formed on the outer wall of the body 1, and a heat dissipation air duct 12 is formed between two adjacent first heat dissipation fins 11. The shroud 2 is fixedly connected to the rear end of the body 1. The cooling fan 3 is connected to the rotating shaft of the body 1 and located inside the shroud 2. The port of the shroud 2 extends towards the front end of the body 1 and covers the first heat dissipation fins 11. A mounting sleeve 4, located inside the shroud 2 and covering the first heat dissipation fins 11, is fitted onto the body 1. A plurality of semiconductor cooling chips 5 are arranged in a ring along the axis of the mounting sleeve 4. The cooling surface of the semiconductor cooling chip 5 is located between the inner wall of the mounting sleeve 4 and the outer wall of the body 1, and the heat dissipation surface of the semiconductor cooling chip 5 is located between the outer wall of the mounting sleeve 4 and the inner wall of the shroud 2.
[0025] Specifically, the structure of the semiconductor cooling chip 5 mounted on the mounting sleeve 4 is as follows: a first fin heat-conducting block 51 and a second fin heat-conducting block 52 are respectively provided on the cooling surface and the heat dissipation surface of the semiconductor cooling chip 5. The mounting sleeve 4 has several mounting holes 41. The first fin heat-conducting block 51 is placed on the outer wall of the mounting sleeve 4 such that the fins of the first fin heat-conducting block 51 pass through the mounting holes 41 and are located on one side of the heat dissipation air duct 12 port. The second fin heat-conducting block 52 is threaded through the first fin heat-conducting block 51 and screwed onto the mounting sleeve 4. The first bolt 53 tightens the first fin heat-conducting block 51 and the second fin heat-conducting block 52, clamping the semiconductor cooling chip 5 between them and making them fit tightly together. The first bolt 53 also secures the first fin heat-conducting block 51 to the mounting sleeve 4, thus fixing the first fin heat-conducting block 51, the semiconductor cooling chip 5, and the second fin heat-conducting block 52 on the mounting sleeve 4. The fins of the first fin heat-conducting block 51 and the second fin heat-conducting block 52 are located between the body 1 and the mounting sleeve 4 and between the mounting sleeve 4 and the air guide shroud 2, respectively.
[0026] In the above structure, the heat dissipation airflow duct 12 formed between two adjacent first heat dissipation fins 11 is located within the first airflow channel formed by the outer wall of the body 1 and the inner wall of the mounting sleeve 4. The fins of the first fin heat-conducting block 51 penetrate into the first airflow channel, and the fins of the second fin heat-conducting block 52 are located within the second airflow channel formed between the outer wall of the mounting sleeve 4 and the inner wall of the air guide cover 2. When the body 1 is working, the cooling fan 3 is driven to rotate by the rotating shaft, so that the cooling fan 3 continuously sends air into the first and second airflow channels. The airflow entering the first airflow channel first passes through the fins of the first fin heat-conducting block 51. Since the first fin heat-conducting block 51 is in close contact with the cooling surface of the semiconductor cooling chip 5, the first fin heat-conducting block 51 has a lower temperature, which reduces the temperature of the airflow flowing through the first fin heat-conducting block 51. The airflow with the reduced temperature continues to flow into the heat dissipation airflow duct 12 to carry away the heat generated by the body 1 during operation, thus achieving heat dissipation. Heat is generated, and at the same time, the airflow entering the second air guide channel flows through the fins of the second fin heat conduction block 52, carrying away the heat from the heat dissipation surface of the semiconductor cooling chip 5 to the second fin heat conduction block 52. This achieves heat dissipation of the semiconductor cooling chip 5 and ensures the stability of the semiconductor cooling chip 5 during long-term operation. Through the above structure and method, the temperature of the airflow entering the heat dissipation channel 12 is reduced by the semiconductor cooling chip 5, and the heat exchange efficiency of the airflow flowing through the heat dissipation channel 12 is improved, thereby improving the heat dissipation effect of this permanent magnet synchronous motor and ensuring the long-term stable operation of the permanent magnet synchronous motor in high-temperature environments. The working principle of the semiconductor cooling chip 5 is existing technology and will not be elaborated here. When setting the working state of the semiconductor cooling chip 5, the opening and closing of the semiconductor cooling chip 5 can be controlled by a manual switch, or the opening and closing of the semiconductor cooling chip 5 can be controlled by the cooperation of a temperature sensor and an automatic switch. The latter method can better solve resource issues.
[0027] Furthermore, based on the above structure, a plurality of first support plates 42 are formed on the inner wall of the mounting sleeve 4, each located between two adjacent first fin heat-conducting blocks 51. The first support plates 42 abut against the outer wall of the body 1 and connect with the first heat dissipation fins 11. The plurality of first support plates 42 arranged in a ring along the axis of the mounting sleeve 4 abut against the outer wall of the body 1 to provide radial support for the mounting sleeve 4. At the same time, the inner wall of the mounting sleeve 4 abuts against the first heat dissipation fins 11 so that the first heat dissipation fins 11 provide radial support for the mounting sleeve 4, so that the mounting sleeve 4 is stably held on the body 1. Meanwhile, the two adjacent first support plates 42 located on both sides of the first fin heat-conducting blocks 51 form a first airflow channel that connects with the heat dissipation channel 12, so that the airflow after the fins of the first fin heat-conducting blocks 51 have been cooled accurately and stably flow into the heat dissipation channel 12 to dissipate heat from the body 1.
[0028] Furthermore, based on the above structure, a plurality of first positioning grooves 13 matching the first support plate 42 are formed on the outer wall of the body 1. The end of the first support plate 42 is inserted into the first positioning groove 13. The first positioning groove 13 limits the rotation of the first support plate 42 relative to the body 1, which also limits the rotation of the mounting sleeve 4 relative to the body 1, ensuring the stability of the mounting sleeve 4 on the body 1, thus strengthening the stability of the semiconductor cooling chip 5. In addition, the cooperation between the first support plate 42 and the first positioning groove 13 provides a positioning function for the installation of the mounting sleeve 4, making it easier to install the mounting sleeve 4.
[0029] Furthermore, based on the above structure, a plurality of second support plates 21 are formed on the inner wall of the air guide shroud 2, each located between two adjacent second fin heat-conducting blocks 52. The second support plates 21 abut against the outer wall of the mounting sleeve 4. A plurality of second bolts 22 are threaded through the mounting sleeve 4 and screwed onto the body 1, serving the same function as the first support plate 42 on the mounting sleeve 4. The second support plates 21 provide radial support for the air guide shroud 2, ensuring the stability of the air guide shroud 2 after installation, while the second bolts 22 provide radial support for the air guide shroud 2 and the mounting sleeve 4. The mounting sleeve 4 limits the axial movement of the machine body 1, ensuring the stability of the air guide shroud 2 and the mounting sleeve 4 after installation. It also facilitates the installation and disassembly of the mounting sleeve 4 and the air guide shroud 2 on the machine body 1, making it easy to disassemble and maintain during installation and use. The process of installing the mounting sleeve 4 and the air guide shroud 2 on the machine body 1 is as follows: insert the mounting sleeve 4 into the air guide shroud 2 so that the second support plate 21 abuts against the mounting sleeve 4, then insert the mounting sleeve 4 and the air guide shroud 2 into the machine body 1 so that the first support plate 42 abuts against the machine body 1, and then insert the second bolt 22.
[0030] Furthermore, based on the above structure, a plurality of second positioning grooves 43 matching the second support plate 21 are formed on the outer wall of the mounting sleeve 4. The end of the second support plate 21 is inserted into the second positioning groove 43. The second positioning groove 43 cooperates with the second support plate 21 to limit the rotation of the air guide shroud 2 relative to the mounting sleeve 4, thereby enhancing the stability of the air guide shroud 2 after installation. At the same time, the second positioning groove 43 plays a guiding role when the mounting sleeve 4 is inserted into the air guide shroud 2, which facilitates the installation of the mounting sleeve and the air guide shroud 2.
[0031] In addition, based on the above structure, a plurality of second heat dissipation fins 23 are formed on the outer wall of the air guide shroud 2. The heat dissipation performance of the air guide shroud 2 is enhanced by the second heat dissipation fins 23, thereby enhancing the heat dissipation performance of the second fin heat conduction block 52 and ensuring the stability of the semiconductor cooling chip 5 during long-term operation.
[0032] In addition, based on the above structure, the outer wall of the mounting sleeve 4 is coated with a heat insulation coating. The heat insulation coating blocks the heat transfer from the second air guide channel to the first air guide channel, thereby ensuring that the airflow in the first air guide channel maintains a lower temperature and plays a better role in heat dissipation for the body 1.
[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A permanent magnet synchronous motor, comprising a body (1), a shroud (2), and a cooling fan (3), wherein a plurality of first heat dissipation fins (11) are formed on the outer wall of the body (1), and a heat dissipation air duct (12) is formed between two adjacent first heat dissipation fins (11); the shroud (2) is fixedly connected to the rear end of the body (1); and the cooling fan (3) is connected to the rotating shaft of the body (1) and located inside the shroud (2), characterized in that: The port of the air guide shroud (2) extends towards the front end of the body (1) and covers the first heat dissipation fin (11). The body (1) is fitted with an installation sleeve (4) located inside the air guide shroud (2) and covering the first heat dissipation fin (11). The installation sleeve (4) is provided with a plurality of semiconductor cooling chips (5) arranged in a ring along the axis of the installation sleeve (4). The cooling surface of the semiconductor cooling chip (5) is located between the inner wall of the installation sleeve (4) and the outer wall of the body (1), and the heat dissipation surface of the semiconductor cooling chip (5) is located between the outer wall of the installation sleeve (4) and the inner wall of the air guide shroud (2).
2. The permanent magnet synchronous motor according to claim 1, characterized in that: The semiconductor cooling chip (5) has a first fin heat-conducting block (51) and a second fin heat-conducting block (52) respectively provided on its cooling surface and heat dissipation surface. The mounting sleeve (4) has a plurality of mounting holes (41). The first fin heat-conducting block (51) is placed on the outer wall of the mounting sleeve (4) so that the fins of the first fin heat-conducting block (51) pass through the mounting hole (41) and are located on one side of the heat dissipation duct (12) port. The second fin heat-conducting block (52) is provided with a first bolt (53) that passes through the first fin heat-conducting block (51) and is screwed onto the mounting sleeve (4).
3. The permanent magnet synchronous motor according to claim 2, characterized in that: The inner wall of the mounting sleeve (4) has a plurality of first support plates (42) located between two adjacent first fin heat conduction blocks (51), and the first support plates (42) abut against the outer wall of the body (1) and are connected to the first heat dissipation fins (11).
4. The permanent magnet synchronous motor according to claim 3, characterized in that: The outer wall of the body (1) has a plurality of first positioning grooves (13) that match the first support plate (42), and the end of the first support plate (42) is inserted into the first positioning groove (13).
5. The permanent magnet synchronous motor according to claim 3, characterized in that: The inner wall of the air guide shroud (2) has a plurality of second support plates (21) located between two adjacent second fin heat conduction blocks (52). The second support plates (21) abut against the outer wall of the mounting sleeve (4). The air guide shroud (2) is provided with a plurality of second bolts (22) that pass through the mounting sleeve (4) and are screwed onto the body (1).
6. The permanent magnet synchronous motor according to claim 5, characterized in that: The outer wall of the mounting sleeve (4) has a plurality of second positioning grooves (43) that match the second support plate (21), and the end of the second support plate (21) is inserted into the second positioning grooves (43).
7. The permanent magnet synchronous motor according to claim 5, characterized in that: Several second heat dissipation fins (23) are formed on the outer wall of the air guide shroud (2).
8. The permanent magnet synchronous motor according to claim 5, characterized in that: The outer wall of the mounting sleeve (4) is coated with a heat-insulating coating.