Power supply IC chip packaging protective shell

Abstract

The utility model relates to the technical field of power supply IC chip protective shells, in particular to a power supply IC chip packaging protective shell, which comprises a bottom plate. The device comprises a bottom plate, and further comprises an air inlet fan, an exhaust fan, a vibration buffering pad, a buffering pad, a spring, a heat dissipation table and a damper, the upper end of the bottom plate is fixedly connected with an upper shell, the surfaces of the front side and the rear side of the upper shell are fixedly connected with mounting frames correspondingly, filter screens are mounted in the two mounting frames correspondingly, and the air inlet fan is mounted in the mounting frame on the front side; an exhaust fan is mounted in the rear side mounting frame; according to the utility model, the vibration caused by the operation of the fan can be absorbed and dispersed through the vibration buffering pad, the influence of the fan operation and the possible resonance on the power supply IC is effectively reduced through multiple vibration damping mechanisms of the vibration buffering pad, the buffering pad, the spring and the damper, the sensitive element is protected from being damaged by mechanical vibration, the heat dissipation efficiency of the device is improved, and the service life of the device is prolonged. And the vibration influence caused by heat dissipation is also solved.

Description

Technical Field

[0001] This utility model relates to the field of power IC chip protective shell technology, and in particular to power IC chip packaging protective shell. Background Technology

[0002] A power IC refers to the pulse width control integrated circuit of a switching power supply. The power supply relies on it to adjust the stability of the output voltage and current. The protective case can prevent external mechanical damage, such as collisions and scratches, thereby protecting the fragile internal electronic components. It can also prevent moisture, dust and other contaminants from entering, which may cause short circuits or corrosion, affecting the working performance and lifespan.

[0003] In common chip packaging protective case designs, since the chip generates heat during operation, a heat dissipation mechanism is needed to ensure its normal operation. If the heat dissipation mechanism is directly installed on the case, the resonance generated by the fan operation will cause vibration damage to the power IC. The common method is to separate the case from the heat dissipation mechanism. This method can reduce vibration transmission, but it also brings additional costs, not only increasing the installation complexity, but also increasing the space required for device installation.

[0004] Therefore, for the aforementioned chip packaging protective shell, it is necessary to separate the shell from the heat dissipation mechanism, which not only increases the installation complexity but also increases the space required for device installation. A power IC chip packaging protective shell can be designed that can absorb and disperse the vibration caused by fan operation through damping pads. Through multiple vibration reduction mechanisms such as damping pads, buffer pads, springs, and dampers, the impact of fan operation and possible resonance on the power IC is effectively reduced, protecting sensitive components from mechanical vibration damage. This not only improves the heat dissipation efficiency of the device but also solves the vibration impact caused by heat dissipation, thus solving the above problems. Utility Model Content

[0005] To overcome the common problem of chip packaging protective shells, the shell needs to be separated from the heat dissipation mechanism, which not only increases the complexity of installation but also increases the space required for device installation.

[0006] The technical solution of this utility model is as follows: a protective shell for a power IC chip package, including a base plate; it also includes an intake fan, an exhaust fan, a vibration damping pad, a buffer pad, a spring, a heat sink, and a damper. An upper shell is fixedly connected to the upper end of the base plate. Mounting frames are fixedly connected to the front and rear surfaces of the upper shell, respectively. A filter screen is installed inside each of the two mounting frames. An intake fan is installed inside the front mounting frame, and an exhaust fan is installed inside the rear mounting frame. A buffer pad is installed at the upper end of the base plate. Two dampers are fixedly connected to the upper end of the base plate. A spring is movably sleeved on the outer surface of the damper. A heat sink is fixedly connected to the upper end of the two dampers. A screw is threaded into the groove of the upper shell. A mounting plate is rotatably connected to the lower end of the screw. A vibration damping pad is installed at the lower end of the mounting plate.

[0007] Preferably, the mechanism uses an intake fan to draw in cool air from the outside for heat dissipation, and an exhaust fan to expel hot air from the inside. The combination of intake and exhaust fans accelerates airflow and improves the device's heat dissipation efficiency. The heat sink can dissipate the heat generated by the chip. The operation of the intake and exhaust fans generates periodic airflow changes, which can cause vibration. At the same time, when the operating frequency of the power IC or the frequency of other internal signals matches the natural frequency of the housing structure, a resonance amplification effect may occur, significantly increasing the vibration amplitude. The damping pads can absorb and disperse the vibration caused by the fan operation, and the buffer pads further reduce the vibration transmitted to the chip. The springs alleviate vibration through elastic deformation and provide a certain floating space. The springs and dampers work together. The springs are responsible for storing and releasing energy, while the dampers are used to control the speed of this process to prevent excessive vibration or rapid movement. Through the multiple vibration reduction mechanisms of the damping pads, buffer pads, and springs, the impact of fan operation and possible resonance on the power IC is effectively reduced, protecting sensitive components from mechanical vibration damage. This not only improves the device's heat dissipation efficiency but also solves the vibration impact caused by heat dissipation.

[0008] Preferably, a knob is fixedly connected to the upper end of the screw, and an anti-slip sleeve is fitted on the outer surface of the knob.

[0009] Preferably, the surface of the vibration damping pad has multiple heat dissipation holes, and the mounting plate at the upper end of the vibration damping pad is slidably connected to the upper housing.

[0010] Preferably, the upper surface of the heat sink has two mounting slots, and a mounting component is installed inside each of the two mounting slots.

[0011] Preferably, the upper end of the mounting component is fixedly connected to a base layer, the chip body is installed in a groove on the upper surface of the base layer, and a heat dissipation pad is provided at the lower end of the base layer.

[0012] Preferably, a packaging shell is fixedly connected to the upper end of the base layer, and the interior of the packaging shell is divided into a sealing layer, a thermally conductive layer, and a waterproof layer.

[0013] Preferably, the waterproof layer is the outermost layer, the inside of the waterproof layer is wrapped with a heat-conducting layer, and the inside of the heat-conducting layer is wrapped with a sealing layer.

[0014] The beneficial effects of this utility model are:

[0015] 1. This mechanism uses an intake fan to draw in cool air from the outside for heat dissipation, and an exhaust fan to expel hot air from the inside. The combined use of the intake and exhaust fans accelerates airflow and improves the device's heat dissipation efficiency. The heat sink can dissipate the heat generated by the chip. However, the operation of the intake and exhaust fans generates periodic airflow changes, which can cause vibration. At the same time, when the operating frequency of the power IC or the frequency of other internal signals matches the natural frequency of the housing structure, a resonance amplification effect may occur, significantly increasing the vibration amplitude. The damping pads absorb and disperse the vibration caused by the fan operation, and the buffer pads further reduce the vibration transmitted to the chip. The springs alleviate vibration through elastic deformation and provide a certain floating space. The springs and dampers work together. The springs are responsible for storing and releasing energy, while the dampers are used to control the speed of this process to prevent excessive vibration or rapid movement. Through the multiple vibration reduction mechanisms of the damping pads, buffer pads, and springs, the impact of fan operation and possible resonance on the power IC is effectively reduced, protecting sensitive components from mechanical vibration damage. This not only improves the device's heat dissipation efficiency but also solves the vibration impact caused by heat dissipation. Attached Figure Description

[0016] Figure 1 The diagram shown is a three-dimensional structural schematic of the power IC chip packaging protective shell of this utility model.

[0017] Figure 2 The diagram shows a three-dimensional disassembled structure of the vibration damping pad in the power IC chip packaging protective shell of this utility model.

[0018] Figure 3 The diagram shows a three-dimensional disassembled structure of the heat sink of the power IC chip packaging protective shell of this utility model.

[0019] Figure 4 The diagram shows a three-dimensional structural representation of the base layer of the power IC chip packaging protective shell of this utility model.

[0020] Figure 5 The diagram shown is a three-dimensional cross-sectional view of the protective shell for the power IC chip of this utility model.

[0021] Explanation of reference numerals in the attached drawings: 1. Base plate; 2. Upper housing; 3. Mounting frame; 4. Filter screen; 5. Intake fan; 6. Exhaust fan; 7. Screw; 8. Knob; 9. Vibration damping pad; 10. Heat dissipation hole; 11. Spring; 12. Buffer pad; 13. Heat sink; 14. Mounting slot; 15. Mounting component; 16. Base layer; 17. Heat dissipation pad; 18. Package shell; 19. Chip body; 20. Sealing layer; 21. Thermally conductive layer; 22. Waterproof layer; 23. Damper. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Please see Figures 1-5 This utility model provides an embodiment of a power IC chip packaging protective shell, including a base plate 1; it also includes an intake fan 5, an exhaust fan 6, a vibration damping pad 9, a buffer pad 12, a spring 11, a heat sink 13, and a damper 23. The upper end of the base plate 1 is fixedly connected to an upper shell 2. Mounting frames 3 are fixedly connected to the front and rear surfaces of the upper shell 2, respectively. Filter screens 4 are installed inside both mounting frames 3. The intake fan 5 is installed inside the front mounting frame 3, and the exhaust fan 6 is installed inside the rear mounting frame 3. The buffer pad 12 is installed at the upper end of the base plate 1. Two dampers 23 are fixedly connected to the upper end of the base plate 1. Springs 11 are movably sleeved on the outer surface of the dampers 23. The heat sink 13 is fixedly connected to the upper end of the two dampers 23. A screw 7 is threadedly connected to the groove of the upper shell 2. A mounting plate is rotatably connected to the lower end of the screw 7. The vibration damping pad 9 is installed at the lower end of the mounting plate.

[0024] Please see Figures 1-4 In this embodiment, a knob 8 is fixedly connected to the upper end of the screw 7. An anti-slip sleeve is fitted onto the outer surface of the knob 8. By rotating the knob 8, the screw 7 can be rotated, allowing it to move up and down, thereby adjusting the mounting plate and the damping pad 9. The anti-slip sleeve increases friction, making the adjustment more stable and comfortable for the user. Multiple heat dissipation holes 10 are provided on the surface of the damping pad 9. The mounting plate at the upper end of the damping pad 9 is slidably connected to the upper housing 2. The heat dissipation holes 10 on the surface of the damping pad 9 not only help dissipate heat but also reduce vibration. The weight of the damping pad 9 itself reduces vibration transmission. The sliding connection between the mounting plate and the upper housing 2 prevents the damping pad 9 from rotating. Two mounting slots 14 are provided on the upper surface of the heat sink 13. A mounting component 15 is installed in the interior of each of the two mounting slots 14. The mounting slots 14 are provided on the upper surface of the heat sink 13 to fix the mounting component 15. The mounting component 15 is used to connect and fix the mounting base of the power IC chip, ensuring that the power IC chip can be firmly installed on the heat sink 13 and heat can be quickly transferred to the heat sink 13 through thermal conduction.

[0025] Please see Figures 2-5 In this embodiment, a base layer 16 is fixedly connected to the upper end of the mounting component 15. A chip body 19 is installed in a groove on the upper surface of the base layer 16. A heat dissipation pad 17 is provided at the lower end of the base layer 16. The base layer 16 is an extension of the mounting component 15, providing direct support and protection for the chip body 19. The heat dissipation pad 17 is located at the lower end of the base layer 16, directly contacting the heat sink 13 to form an efficient heat conduction path, helping to quickly dissipate the heat generated by the chip body 19. A package shell 18 is fixedly connected to the upper end of the base layer 16. The interior of the package shell 18 is divided into a sealing layer 20, a thermally conductive layer 21, and a waterproof layer 22. The sealing layer 20 is made of epoxy resin, the thermally conductive layer 21 is made of thermally conductive pad material, and the waterproof layer 22 is made of acrylic coating material. The waterproof layer 22 is the outermost layer, and the thermally conductive layer 21 is wrapped inside the waterproof layer 22. The sealing layer 20 is wrapped inside the thermally conductive layer 21. The sealing layer 20 is located on the innermost side to prevent moisture and other contaminants from entering the chip and to ensure its long-term stability. The thermally conductive layer 21 is wrapped around the sealing layer 20 and has good thermal conductivity, which can quickly conduct heat from the chip to the outside. The waterproof layer 22, as the outermost layer, provides additional protection and ensures that good electrical insulation and physical integrity are maintained even in humid environments.

[0026] During operation, the mechanism uses intake fan 5 to draw in cool outside air for heat dissipation, and exhaust fan 6 to expel hot air. The combined operation of intake and exhaust fans 5 and 6 accelerates airflow and improves heat dissipation efficiency. However, the operation of these fans generates periodic airflow changes, which can cause vibration. Furthermore, when the operating frequency of the power IC or other internal signals matches the inherent frequency of the housing structure, a resonance amplification effect may occur, significantly increasing the vibration amplitude. The damping pad 9 absorbs and disperses the vibration caused by the fans, and the buffer pad 12 further reduces the vibration transmitted to the chip. The spring 11... Vibration is mitigated through elastic deformation, providing a certain floating space. Spring 11 and damper 23 work together. Spring 11 is responsible for storing and releasing energy, while damper 23 is used to control the speed of this process, preventing excessive vibration or rapid movement. Through the multiple vibration damping mechanisms of damping pad 9, buffer pad 12, and spring 11, the impact of fan operation and possible resonance on the power IC is effectively reduced, protecting sensitive components from mechanical vibration damage. This not only improves the heat dissipation efficiency of the device but also solves the vibration impact caused by heat dissipation. By rotating knob 8, screw 7 can be rotated, allowing screw 7 to move up and down, thereby adjusting the mounting plate and damping pad 9 up and down. Anti-slip sleeve This increases friction, making rotation and adjustment more stable and comfortable for the user. The heat dissipation holes 10 on the surface of the damping pad 9 not only help dissipate heat but also reduce the weight of the damping pad 9 itself, thereby reducing vibration transmission. The sliding connection between the mounting plate and the upper housing 2 prevents the damping pad 9 from rotating. Two mounting slots 14 are formed on the upper surface of the heat sink 13 for fixing the mounting component 15. The mounting component 15 is used to connect and fix the mounting base of the power IC chip, ensuring that the power IC chip can be firmly mounted on the heat sink 13 and that heat is quickly transferred to the heat sink 13 through thermal conduction. The base layer 16 is an extension of the mounting component 15, providing direct contact with the chip body 19. For support and protection, the heat dissipation pad 17 is located at the lower end of the base layer 16, directly contacting the heat sink 13 to form an efficient heat conduction path, helping to quickly dissipate the heat generated by the chip body 19. The sealing layer 20 is made of epoxy resin, the thermally conductive layer 21 is made of thermally conductive pad material, and the waterproof layer 22 is made of acrylic coating material. The sealing layer 20 is located on the innermost side to prevent moisture and other contaminants from entering the chip and ensure its long-term stability. The thermally conductive layer 21 wraps around the sealing layer 20 and has good thermal conductivity, which can quickly conduct heat from the chip to the outside. The waterproof layer 22, as the outermost layer, provides additional protection to ensure good electrical insulation and physical integrity even in humid environments.

[0027] Through the above steps, the mechanism uses intake fan 5 to introduce cool air from the outside into the housing for heat dissipation, and exhaust fan 6 to expel hot air from the inside. The cooperation of intake fan 5 and exhaust fan 6 can accelerate the airflow speed and improve the heat dissipation efficiency of the device. The heat sink 13 can dissipate the heat generated by the chip. The operation of intake fan 5 and exhaust fan 6 will generate periodic airflow changes, which will cause vibration. At the same time, when the operating frequency of the power IC or the frequency of other internal signals matches the natural frequency of the housing structure, a resonance amplification effect may occur, which will significantly increase the vibration amplitude. The damping pad 9 can absorb and disperse the vibration caused by the operation of the fan, and the buffer pad 12 further reduces the vibration transmitted to the chip. The spring 11 alleviates vibration through elastic deformation, providing a certain floating space. The spring 11 and the damper 23 work together. The spring 11 is responsible for storing and releasing energy, while the damper 23 is used to control the speed of this process to prevent excessive vibration or rapid movement. Through the multiple vibration reduction mechanisms of the damping pad 9, the buffer pad 12, and the spring 11, the impact of fan operation and possible resonance on the power IC is effectively reduced, protecting sensitive components from mechanical vibration damage. This not only improves the heat dissipation efficiency of the device, but also solves the vibration impact caused by heat dissipation. This addresses the common problem of separating the shell from the heat dissipation mechanism in common chip packaging protective shells, which not only increases the complexity of installation, but also increases the space required for device installation.

Claims

1. A protective casing for a power IC chip, comprising a base plate (1); characterized in that: It also includes an intake fan (5), an exhaust fan (6), a damping pad (9), a buffer pad (12), a spring (11), a heat sink (13), and a damper (23). The upper end of the base plate (1) is fixedly connected to the upper housing (2). The front and rear surfaces of the upper housing (2) are respectively fixedly connected to the mounting frames (3). The interior of the two mounting frames (3) is equipped with a filter screen (4). The interior of the front mounting frame (3) is equipped with an intake fan (5), and the interior of the rear mounting frame (3) is equipped with an exhaust fan (6). The upper end of the base plate (1) is equipped with a buffer pad (12). The upper end of the base plate (1) is fixedly connected to two dampers (23). The outer surface of the damper (23) is movably fitted with a spring (11). The upper end of the two dampers (23) is fixedly connected to the heat sink (13). The groove of the upper housing (2) is threaded with a screw (7). The lower end of the screw (7) is rotatably connected to a mounting plate. The lower end of the mounting plate is equipped with a damping pad (9).

2. The power IC chip packaging protective case according to claim 1, characterized in that: A knob (8) is fixedly connected to the upper end of the screw (7), and an anti-slip sleeve is fitted on the outer surface of the knob (8).

3. The power IC chip packaging protective case according to claim 1, characterized in that: Multiple heat dissipation holes (10) are provided on the surface of the vibration damping pad (9), and the mounting plate at the upper end of the vibration damping pad (9) is slidably connected to the upper shell (2).

4. The power IC chip packaging protective case according to claim 1, characterized in that: Two mounting slots (14) are provided on the upper surface of the heat sink (13), and a mounting component (15) is installed in the interior of each of the two mounting slots (14).

5. The power IC chip packaging protective case according to claim 4, characterized in that: The upper end of the mounting component (15) is fixedly connected to the base layer (16), the chip body (19) is installed in the groove on the upper surface of the base layer (16), and the lower end of the base layer (16) is provided with a heat dissipation pad (17).

6. The power IC chip packaging protective case according to claim 5, characterized in that: The upper end of the base layer (16) is fixedly connected to the encapsulation shell (18), and the interior of the encapsulation shell (18) is divided into a sealing layer (20), a heat-conducting layer (21), and a waterproof layer (22).

7. The power IC chip packaging protective case according to claim 6, characterized in that: The waterproof layer (22) is the outermost layer, and the interior of the waterproof layer (22) is wrapped with a heat-conducting layer (21), and the interior of the heat-conducting layer (21) is wrapped with a sealing layer (20).

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