Wafer laser cutting cleaning mechanism and equipment

Abstract

The utility model provides a wafer laser cutting cleaning mechanism which comprises a machine table, an annular carrying disc, a moving platform, a cleaning swing arm and a blocking cover, the annular carrying disc, the moving platform, the cleaning swing arm and the blocking cover are arranged on the machine table, the annular carrying disc is movably arranged in the blocking cover through the moving platform, and the cleaning swing arm is erected on the periphery of the blocking cover. A plurality of supporting rods are distributed on the annular carrying disc along the radius, a plurality of adsorption assemblies are arranged on the supporting rods, and each adsorption assembly comprises a stand column, a suction nozzle and a positioning block, and the suction nozzle and the positioning block are arranged on the two sides of the top of the stand column respectively. The mechanism can effectively improve the production efficiency, reduce the reject ratio and save the cost, and is flexibly compatible with products of various sizes.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of laser equipment especially relates to a wafer laser cutting cleaning mechanism and equipment. BACKGROUND

[0002] TGV (Through Glass Via) three-dimensional interconnection technology can be applied to chip packaging, Mini-LED / Micro-LED display, biological medicine, consumer electronics and other fields, and the principle of manufacturing TGV via holes by laser-induced denaturation is to induce continuous denaturation area in glass by pulse laser, and the denaturation glass has a faster etching rate in hydrofluoric acid than the glass in the non-denaturation area. Based on this phenomenon, a via hole / blind hole can be made on the glass. The TGV laser processing equipment and punching method can cut and punch glass, EMC and silicon wafer, and is mainly widely used in integrated circuits, semiconductors and photovoltaic industries to drill holes, groove and other products such as wafer, solar thin film battery glass, glass cover plate, optical lens, liquid crystal panel and LCD screen.

[0003] With the improvement of production quality requirements, the process of laser cutting and punching of products is deeply explored and researched, and it is found that there are problems of low efficiency, low yield and high cost in the laser processing process. One of the reasons is that the dust and other attachments on the surface of the product after laser cutting cannot be completely removed, and the products are easy to pollute or damage each other after unloading, increasing the risk of defects and subsequent workload, seriously affecting the overall product processing efficiency. The existing cleaning wafer product equipment has complex structure, high cost and poor applicability, so it is urgent to deepen technical reform to solve the above problems and influences. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a wafer laser cutting cleaning mechanism and equipment, which can effectively improve production efficiency, reduce defective rate and save cost, and is flexible and compatible with various sizes of products.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a wafer laser cutting cleaning mechanism, comprising a machine table, an annular loading disc arranged on the machine table, a moving platform, a cleaning swing arm and a shield, the annular loading disc is movably arranged in the shield through the moving platform, the cleaning swing arm is arranged on the periphery of the shield, the annular loading disc is provided with a plurality of supporting rods distributed along the radius, a plurality of suction assemblies are arranged on the supporting rods, each suction assembly comprises a stand and a suction nozzle and a positioning block arranged on the top of the stand.

[0006] As a further improved technical scheme of the utility model, the plurality of suction assemblies on the supporting rods are arranged in rows from the middle to the edge of the annular loading disc, and the height increases.

[0007] As a further improved technical scheme of the utility model, the positioning block includes a pressing plate and a rotating block, the rotating block is below the pressing plate, the pressing plate is hollow, the pressing plate is movably connected to one side of the upright column away from the center of the annular loading disc through a rotating shaft, a counterweight is embedded below the rotating block, and the center of gravity of the positioning block is concentrated in the lower part of the rotating block.

[0008] As a further improved technical scheme of the utility model, the side close to the suction nozzle of the pressing plate is an arc surface.

[0009] As a further improved technical scheme of the utility model, the adsorption assembly further includes an adsorption column, and the adsorption column is at the same horizontal height as the top of the suction nozzle.

[0010] As a further improved technical scheme of the utility model, the cleaning swing arm is provided with a plurality of swing arms and rotary motors, the swing arm is hollow, and one or more rows of water spraying ports are uniformly arranged on the swing arm.

[0011] As a further improved technical scheme of the utility model, the swing arm is movably arranged above the baffle cover through the rotary motor.

[0012] As a further improved technical scheme of the utility model, a water collecting chamber is arranged below the baffle cover.

[0013] As a further improved technical scheme of the utility model, the movement platform includes a rotating platform and a lifting motor, the rotating platform is arranged on the lifting motor and is driven to move up and down, and the annular loading disc is arranged on the rotating platform and is driven to rotate.

[0014] A wafer laser cutting device includes a feeding bin, a cutting bin and a cleaning bin, the cleaning mechanism in any of the above technical schemes is arranged in the cleaning bin, the feeding bin includes a moving manipulator, and the cutting bin includes a product moving adsorption platform, a laser cutting module, a visual positioning mechanism and a measuring mechanism.

[0015] The wafer laser cutting cleaning mechanism and the device have the following technical effects.

[0016] 1. The wafer laser cutting device integrates feeding, cutting and cleaning, and each part works in coordination, has high automation, realizes rapid circulation of products by the feeding manipulator, cleans and dries the products after cutting, improves the cleanliness of the products, avoids mutual pollution or damage of the products during discharging, improves the yield, reduces subsequent workload, effectively reduces the cost of production enterprises and improves the processing efficiency.

[0017] 2、The wafer laser cutting cleaning mechanism is provided with a ring-shaped carrier disc, a moving platform and a cleaning swing arm, the ring-shaped carrier disc is provided with a plurality of supporting rods and adsorption assemblies, is used for bearing and fixing the products to be cleaned and is not prone to water storage, the cleaning swing arm performs water spraying cleaning work on the products without dead angle, removes the attachments on the surfaces of the products, the rotating platform drives the ring-shaped carrier disc to rotate, performs spin-drying on the products after cleaning, avoids residual, has high cleaning efficiency and good cleaning effect.

[0018] 3、The positioning block provided with the self-adjusting structure on the stand of the adsorption assembly can simplify the overall mechanical design structure, because it does not need a complex locking mechanism or other fixing device, reduces manufacturing cost, reduces maintenance demand, improves the operation efficiency of the whole system, reduces the need for human intervention and improves the automation level.

[0019] 4、The ring-shaped carrier disc is provided with a plurality of groups of adsorption assemblies with different heights, effectively compatible with products of various sizes, and enhances the adaptability and flexibility of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a schematic view of the wafer laser cutting cleaning mechanism.

[0021] Figure 2 It is a schematic view of the ring-shaped carrier disc structure.

[0022] Figure 3 It is a top view of the ring-shaped carrier disc.

[0023] Figure 4 It is a schematic view of the positioning block.

[0024] Figure 5 It is a top view of the internal structure of the wafer laser cutting device. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model is described in detail below in combination with the drawings and specific embodiments. Embodiment 1

[0026] Reference Figures 1-2The wafer laser cutting cleaning mechanism of the embodiment comprises a machine table 1, an annular carrier disc 2, a moving platform 3, a cleaning swing arm 4 and a shield 5 arranged on the machine table 1, the cleaning swing arm 4 is arranged on the periphery of the shield 5, the annular carrier disc 2 is movably arranged in the shield 5 through the moving platform 3, and the moving platform 3 drives the annular carrier disc 2 to move up and down and rotate. The annular carrier disc 2 is provided with a plurality of supporting rods 6 distributed along the radius, the supporting rods 6 are symmetrically distributed on the annular carrier disc 2, and the structure is more stable in supporting and fixing products. A plurality of adsorption assemblies 7 are arranged on the supporting rods 6 and used for adsorbing and fixing products, each adsorption assembly 7 comprises a stand 71 and a suction nozzle 72 and a positioning block 73 separately arranged on both sides of the top of the stand 71, the suction nozzle 72 is used for adsorbing and fixing products, and the positioning hole 73 is used for positioning and pressing the products.

[0027] Specifically, the plurality of adsorption assemblies 7 on the supporting rods 6 are arranged in rows from the middle to the edge of the annular carrier disc 2 and have increasing heights, the plurality of adsorption assemblies 7 on each supporting rod 6 are arranged in the same way, so that the adsorption assemblies 7 are arranged in a circle on the annular carrier disc 2, that is, on the supporting rods 6 of the annular carrier disc 2, the adsorption assemblies 7 in the inner circle have low heights, and the adsorption assemblies 7 in the outer circle have high heights, and each circle of adsorption assemblies 7 can correspondingly fix a product of a certain specification size, so that the annular carrier disc 2 can accommodate products of various specification sizes, and the products of large sizes are fixed by the adsorption assemblies 7 in the outer circle, because the adsorption assemblies 7 in the inner circle are lower than the adsorption assemblies 7 in the outer circle, so the products of large sizes adsorbed on the annular carrier disc 2 will not touch the adsorption assemblies 7 in the inner circle, thereby reducing unnecessary contact with the products.

[0028] Referring to Figures 3-4The positioning block 73 includes a pressing plate 731 and a rotating block 732. The rotating block 732 is located below the pressing plate 731. The pressing plate 731 is movably connected to the column 71 through a rotating shaft 734 and is away from the top of the side of the center of the annular tray 2. The rotating block 732 is embedded with a counterweight 733 at the lower part of the inside. The pressing plate 731 is hollow. The pressing plate 731 and the rotating block 732 are integrally connected. The aluminum alloy material is selected. The center of gravity of the positioning block 73 is concentrated at the lower part of the rotating block 732. Thus, the positioning block 73 can automatically change the state on the column 71 to improve the operation efficiency of the whole system. When the annular tray 2 is static, the rotating block 732 is attached to the side of the column 71 under the action of gravity. At this time, the positioning block 73 is in a vertical state under the action of gravity and does not affect the placement of the product. The product is positioned on the adsorption assembly 7 of the same circle of the support rod 6 and is adsorbed and fixed. When the annular tray 2 rotates, the rotating block 732 is thrown away from the column 71 under the action of centrifugal force. The positioning block 73 tilts around the rotating shaft 734. The pressing plate 731 tilts towards the suction nozzle 72 and is pressed on the edge of the product. At the same time, the side of the pressing plate 731 close to the suction nozzle 72 is an arc surface. Thus, the pressing plate 731 is in point contact with the product and blocks the edge of the product to prevent the product from deviating or flying. When the rotation is stopped, the positioning block 73 is automatically returned to the normal position under the action of gravity. The positioning block 73 under the action of centrifugal force can provide stronger gripping force than the static system. The enhanced gripping force ensures that the product can be kept in the correct position even in a high-vibration or impact environment, which is particularly important for precision instruments and sensitive equipment.

[0029] The adsorption assembly 7 can further include an adsorption column 74. The adsorption column 74 is closer to the center of the annular tray 2 than the column 71 in each adsorption assembly 7. The adsorption column 74 is at the same horizontal level as the top of the suction nozzle 72. The adsorption column 74 further improves the ability to adsorb and fix the product. In the embodiment, the plurality of adsorption assemblies 7 on one support rod 6 all include the adsorption column 74, the column 71, the suction nozzle 72, and the positioning block 73, as shown in the A area in FIG. 6A. One adsorption assembly 7 on another support rod 6 all includes the adsorption column 74, the column 71, the suction nozzle 72, and the positioning block 73. Another adsorption assembly 7 only includes the column 71, the suction nozzle 72, and the positioning block 73, as shown in the B area in FIG. 6B. Figure 3 Figure 3 The column 71 is provided with an air passage in communication with the suction nozzle 71. The air passage is connected to a pipeline. The bottom of the adsorption column 74 is also connected to the pipeline. The pipeline is connected to a vacuum pump to provide adsorption force for the adsorption column 74 and the suction nozzle 72. In other embodiments, the adsorption assembly 7 can not have the adsorption column 74. Only the column 71 and the suction nozzle 72 and the positioning block 73 separately arranged at the top of the two sides of the column 71 are provided. Or all the adsorption assemblies 7 include the adsorption column 74, the column 71, the suction nozzle 72, and the positioning block 73.

[0030] ​Further, two cleaning swing arms 4 are arranged on the machine table 1, symmetrically arranged at the end corners of the machine table 1. The cleaning swing arm 4 comprises a swing arm 41 and a rotary motor 42. The swing arm 41 is hollow and can pass water. A row or multiple rows of water spraying ports are evenly arranged on the swing arm 41. A baffle 5 is arranged at the outer ring of the annular carrier disc 2, which can block water when the water is rotated and sprayed. The swing arm 41 is movably arranged above the baffle 5 by the rotary motor 42. The rotary motor 42 drives the swing arm 41 to swing above the product and spray water. The swing area is fan-shaped. The swing arm 41 can clean the dust and powder attached to the product. The swing range of the swing arm 41 can fully cover the products of various sizes on the annular carrier disc 2, and the cleaning and water spraying work can be performed without dead angle. When the product is taken and placed, the rotary motor 42 turns the swing arm 41 away from the area above the baffle 5, so as to avoid blocking the movement arm of the moving manipulator to take and place the product. A water collecting bin is arranged below the baffle 5. The water for cleaning the product, the water falling from the product, and the water blocked by the baffle 5 all flow into the water collecting bin below for centralized treatment.

[0031] The movement platform 3 comprises a rotary platform and a lifting motor. The rotary platform is arranged on the lifting motor and is driven to move up and down. The annular carrier disc 2 is arranged on the rotary platform through a connecting column and is driven to rotate by the rotary platform. In use, the annular carrier disc 2 is driven to rise by the lifting motor and is higher than the surrounding baffle 5, so that the movement arm of the moving manipulator can extend into the suction assembly 7 on the annular carrier disc 2 to fix the product. After the movement arm of the moving manipulator moves away, the annular carrier disc 2 is lowered into the baffle 5. The rotary motor 42 drives the swing arm 41 to swing above the product and spray water. The swing arm 41 can clean the dust and powder attached to the product. After the cleaning is completed, the swing arm stops spraying water. The rotary platform drives the annular carrier disc 2 and the product thereon to rotate, so as to dry the water on the product. After the product is dry and clean, the rotation is stopped. The annular carrier disc 2 is driven to rise by the lifting motor again. The movement arm of the moving manipulator extends into the cleaning mechanism again, supports and sucks the product, and moves out to be transferred to the material box at the unloading station. The product waits for unloading. Example 2

[0032] Reference Figure 5The wafer laser cutting device comprises a feeding bin 100, a cutting bin 200 and a cleaning bin 300, the cleaning bin 300 is provided with the cleaning mechanism of embodiment 1, the feeding bin 100 comprises a moving manipulator 110, the cutting bin 200 comprises a product moving adsorption platform 210, a laser cutting module 220, a visual positioning mechanism 230 and a measuring mechanism, the product moving adsorption platform 210 comprises an adsorption platform and a linear module moving in the X-axis direction and the Y-axis direction, is used for fixing the product and moving with the product, the laser cutting module 220 cuts and punches the product, the visual positioning mechanism 230 comprises a visual camera and is used for positioning the product, the measuring mechanism comprises an altimeter and is used for detecting the surface height of the product, the feeding bin 100 is provided with a feeding station 120 and a discharging station 130, full boxes and empty boxes are respectively placed on the two stations, the moving manipulator 110 transfers the product in the feeding station 120 to the cutting bin 200 to cut and punch, then transfers the product to the cleaning bin 300 to clean and spin dry, and finally moves the clean product to the box in the discharging station 130.

[0033] The drawings of the embodiments of the utility model are only used for example description, and the representation is only a schematic diagram, not a real object drawing, and cannot be understood as the limitation of the patent; in order to better illustrate the embodiments of the utility model, some components of the drawings can be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some known structures and their descriptions in the drawings can be omitted.

[0034] The same or similar reference numerals in the drawings of the embodiments of the utility model correspond to the same or similar components; in the description of the utility model, it should be understood that if the terms such as 'upper', 'lower' and the like indicate the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the indicated device or element must have a particular orientation, structure and operation, therefore the positional relationship description in the drawings is only used for example description, and cannot be understood as the limitation of the patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific situation.

[0035] In the utility model, any reference to 'the embodiment', 'other embodiments' and the like means that the specific components, structures or features described in conjunction with the embodiment are contained in at least one embodiment of the utility model. The above description does not necessarily refer to the same embodiment. Moreover, when the specific components, structures or features are described in conjunction with any embodiment, it is claimed that it is within the scope of those skilled in the art to realize such components, structures or features in conjunction with other embodiments.

[0036] In addition, the above embodiments are only used to illustrate the present application and are not intended to limit the technical solutions described in the present application. The understanding of the present application should be based on the skilled in the art, although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the skilled in the art can still modify or equivalently replace the present application, and all technical solutions and improvements which do not deviate from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims

1. A wafer laser cutting cleaning mechanism, characterized by: Including machine table and annular carrier disc, motion platform, cleaning swing arm and shield arranged on the machine table, the annular carrier disc is movably arranged in the shield through the motion platform, the cleaning swing arm is arranged on the periphery of the shield, the annular carrier disc is provided with a plurality of support rods distributed along the radius, a plurality of suction assemblies are arranged on the support rods, each suction assembly comprises a stand and a suction nozzle and a positioning block arranged on both sides of the top of the stand.

2. The wafer laser dicing cleaning mechanism of claim 1, wherein: The plurality of suction assemblies on the support rods are arranged in rows from the middle to the edge of the annular carrier disc, and the height increases.

3. The wafer laser dicing cleaning mechanism of claim 1, wherein: The positioning block comprises a pressing plate and a rotating block, the rotating block is located below the pressing plate, the pressing plate is hollow, the pressing plate is movably connected to the stand through a rotating shaft away from one side of the center of the annular carrier disc, a counterweight is embedded in the lower part of the rotating block, so that the center of gravity of the positioning block is concentrated in the lower part of the rotating block.

4. The wafer laser dicing cleaning mechanism of claim 3, wherein: The side of the pressing plate close to the suction nozzle is arc-shaped.

5. The wafer laser dicing cleaning mechanism of claim 1, wherein: The suction assembly further comprises a suction column, and the top of the suction column is at the same horizontal height as the top of the suction nozzle.

6. The wafer laser dicing cleaning mechanism of claim 1, wherein: The cleaning swing arm is provided with a plurality of swing arms, which are symmetrically arranged at the end corners of the machine table, the cleaning swing arm comprises a swing arm and a rotating motor, the swing arm is hollow, and one or more rows of water spraying ports are uniformly arranged on the swing arm.

7. The wafer laser dicing cleaning mechanism of claim 6, wherein: The swing arm is movably arranged above the shield through the rotating motor.

8. The wafer laser dicing cleaning mechanism of claim 1, wherein: A water collecting chamber is arranged below the shield.

9. The wafer laser dicing cleaning mechanism of claim 1, wherein: The motion platform comprises a rotating platform and a lifting motor, the rotating platform is arranged on the lifting motor and driven to move up and down by the lifting motor, and the annular carrier disc is arranged on the rotating platform and driven to rotate by the rotating platform.

10. A wafer laser cutting apparatus, characterized by: The cleaning mechanism comprises a feeding bin, a cutting bin and a cleaning bin, the cleaning bin is provided with the cleaning mechanism according to any one of claims 1-9, the feeding bin comprises a moving manipulator, the cutting bin comprises a product moving and suction platform, a laser cutting module, a visual positioning mechanism and a measuring mechanism.

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